FI20041680A - Elektroniikkamoduuli ja menetelmä sen valmistamiseksi - Google Patents

Elektroniikkamoduuli ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20041680A
FI20041680A FI20041680A FI20041680A FI20041680A FI 20041680 A FI20041680 A FI 20041680A FI 20041680 A FI20041680 A FI 20041680A FI 20041680 A FI20041680 A FI 20041680A FI 20041680 A FI20041680 A FI 20041680A
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FI
Finland
Prior art keywords
manufacture
electronics module
electronics
module
Prior art date
Application number
FI20041680A
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English (en)
Swedish (sv)
Other versions
FI20041680A0 (fi
Inventor
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20040592A external-priority patent/FI20040592A/fi
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20041680A priority Critical patent/FI20041680A/fi
Publication of FI20041680A0 publication Critical patent/FI20041680A0/fi
Priority to GB0621918A priority patent/GB2429848B/en
Priority to US11/587,586 priority patent/US7719851B2/en
Priority to CN2005800133303A priority patent/CN101027948B/zh
Priority to JP2007510062A priority patent/JP5064210B2/ja
Priority to PCT/FI2005/000200 priority patent/WO2005104636A1/en
Priority to DE112005000952T priority patent/DE112005000952T5/de
Publication of FI20041680A publication Critical patent/FI20041680A/fi
Priority to US12/773,628 priority patent/US8351214B2/en

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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FI20041680A 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi FI20041680A (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20041680A FI20041680A (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
GB0621918A GB2429848B (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
US11/587,586 US7719851B2 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
CN2005800133303A CN101027948B (zh) 2004-04-27 2005-04-27 电子模块及其制造方法
JP2007510062A JP5064210B2 (ja) 2004-04-27 2005-04-27 電子モジュール及びその製造方法
PCT/FI2005/000200 WO2005104636A1 (en) 2004-04-27 2005-04-27 Electronics module and method for manufacturing the same
DE112005000952T DE112005000952T5 (de) 2004-04-27 2005-04-27 Elektronik-Modul und Verfahren zur Herstellung desselben
US12/773,628 US8351214B2 (en) 2004-04-27 2010-05-04 Electronics module comprising an embedded microcircuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040592A FI20040592A (fi) 2004-04-27 2004-04-27 Lämmön johtaminen upotetusta komponentista
FI20041680A FI20041680A (fi) 2004-04-27 2004-12-29 Elektroniikkamoduuli ja menetelmä sen valmistamiseksi

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FI20041680A true FI20041680A (fi) 2005-10-28

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JP (1) JP5064210B2 (fi)
CN (1) CN101027948B (fi)
DE (1) DE112005000952T5 (fi)
FI (1) FI20041680A (fi)
GB (1) GB2429848B (fi)
WO (1) WO2005104636A1 (fi)

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FI20041680A0 (fi) 2004-12-29
WO2005104636A1 (en) 2005-11-03
JP5064210B2 (ja) 2012-10-31
US8351214B2 (en) 2013-01-08
US20100214750A1 (en) 2010-08-26
CN101027948B (zh) 2011-08-03
US7719851B2 (en) 2010-05-18
GB2429848A (en) 2007-03-07
CN101027948A (zh) 2007-08-29
DE112005000952T5 (de) 2007-04-05
JP2007535157A (ja) 2007-11-29
GB2429848B (en) 2008-01-30
GB0621918D0 (en) 2006-12-27
US20080192450A1 (en) 2008-08-14

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