ES399317A1 - Procedimiento para la fabricacion de foto-resistores. - Google Patents

Procedimiento para la fabricacion de foto-resistores.

Info

Publication number
ES399317A1
ES399317A1 ES399317A ES399317A ES399317A1 ES 399317 A1 ES399317 A1 ES 399317A1 ES 399317 A ES399317 A ES 399317A ES 399317 A ES399317 A ES 399317A ES 399317 A1 ES399317 A1 ES 399317A1
Authority
ES
Spain
Prior art keywords
monomer
photopolymerizable layer
addition
binding agent
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES399317A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynachem Corp
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of ES399317A1 publication Critical patent/ES399317A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124Heterocyclic organic compounds, e.g. azole, furan
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
ES399317A 1971-02-04 1972-01-29 Procedimiento para la fabricacion de foto-resistores. Expired ES399317A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11279771A 1971-02-04 1971-02-04

Publications (1)

Publication Number Publication Date
ES399317A1 true ES399317A1 (es) 1974-12-16

Family

ID=22345895

Family Applications (1)

Application Number Title Priority Date Filing Date
ES399317A Expired ES399317A1 (es) 1971-02-04 1972-01-29 Procedimiento para la fabricacion de foto-resistores.

Country Status (23)

Country Link
JP (2) JPS5538961B1 (es)
AU (1) AU461461B2 (es)
BE (1) BE778729A (es)
BG (1) BG26673A3 (es)
CA (1) CA965291A (es)
CH (1) CH592322A5 (es)
DD (1) DD101035A5 (es)
DE (1) DE2205146C2 (es)
DK (2) DK142623B (es)
ES (1) ES399317A1 (es)
FI (1) FI57429C (es)
FR (1) FR2124974A5 (es)
GB (1) GB1361298A (es)
HK (1) HK28382A (es)
IL (1) IL38677A (es)
IT (1) IT949005B (es)
LU (1) LU64712A1 (es)
NL (1) NL176021C (es)
NO (1) NO141804C (es)
PL (1) PL83391B1 (es)
RO (1) RO64896A (es)
SE (1) SE390218B (es)
ZA (1) ZA72345B (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1056189A (en) * 1974-04-23 1979-06-12 Ernst Leberzammer Polymeric binders for aqueous processable photopolymer compositions
ZA757984B (en) * 1974-10-04 1976-12-29 Dynachem Corp Polymers for aqueous processed photoresists
JPS5917414B2 (ja) * 1975-10-07 1984-04-21 村上スクリ−ン (株) スクリ−ン版用感光性組成物及び感光膜
JPS5944615B2 (ja) * 1976-02-16 1984-10-31 富士写真フイルム株式会社 感光性樹脂組成物及びそれを用いた金属画像形成材料
SU941918A1 (ru) * 1976-08-10 1982-07-07 Предприятие П/Я Г-4444 Сухой пленочный фоторезист
US4239849A (en) 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
WO1980001321A1 (en) * 1978-12-25 1980-06-26 N Smirnova Dry film photoresist
DE3034343A1 (de) * 1979-02-21 1981-04-09 Panelgraphic Corp Radiation curable cellulosic polyacrylic abrasion resistant coating
JPS5619752A (en) * 1979-07-27 1981-02-24 Hitachi Chemical Co Ltd Photosensitive resin composition laminate
DE3560654D1 (en) * 1984-02-18 1987-10-22 Basf Ag Photosensitive recording material
DD250593A1 (de) * 1984-04-03 1987-10-14 Wolfen Filmfab Veb Fotopolymerisierbares material
DE3504254A1 (de) 1985-02-08 1986-08-14 Basf Ag, 6700 Ludwigshafen Lichtempfindliches aufzeichnungselement
DE3619129A1 (de) * 1986-06-06 1987-12-10 Basf Ag Lichtempfindliches aufzeichnungselement
DE3841025A1 (de) * 1988-12-06 1990-06-07 Hoechst Ag Durch strahlung polymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
JP2613462B2 (ja) * 1988-12-28 1997-05-28 コニカ株式会社 画像形成材料及び画像形成方法
JP2515885Y2 (ja) * 1990-09-28 1996-10-30 アンリツ株式会社 測定装置の表示部
DE19638032A1 (de) * 1996-09-18 1998-03-19 Du Pont Deutschland Photopolymerisierbares Gemisch mit geringerer Sauerstoffempfindlichkeit zur Herstellung von Farbprüfdrucken
US7052824B2 (en) 2000-06-30 2006-05-30 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
US20100209843A1 (en) 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA614181A (en) * 1961-02-07 J. Mcgraw William Photopolymerizable compositions, elements and processes
US2893868A (en) * 1955-08-22 1959-07-07 Du Pont Polymerizable compositions
NL218803A (es) * 1956-07-09
GB835849A (en) * 1957-04-26 1960-05-25 Du Pont Photopolymerisable compositions and uses thereof
US3458311A (en) * 1966-06-27 1969-07-29 Du Pont Photopolymerizable elements with solvent removable protective layers
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists

Also Published As

Publication number Publication date
JPH0136924B2 (es) 1989-08-03
NO141804B (no) 1980-02-04
AU461461B2 (en) 1975-05-12
DK142623C (es) 1981-08-03
RO64896A (ro) 1980-01-15
NL176021C (nl) 1987-07-16
CA965291A (en) 1975-04-01
CH592322A5 (es) 1977-10-31
SE390218B (sv) 1976-12-06
DD101035A5 (es) 1973-10-12
FI57429B (fi) 1980-04-30
IL38677A (en) 1974-12-31
ZA72345B (en) 1973-03-28
LU64712A1 (es) 1973-09-04
NL176021B (nl) 1984-09-03
JPS5538961B1 (es) 1980-10-07
DK144184C (da) 1982-06-14
NO141804C (no) 1980-05-14
BE778729A (fr) 1972-07-31
FR2124974A5 (es) 1972-09-22
GB1361298A (en) 1974-07-24
DE2205146C2 (de) 1990-03-08
IT949005B (it) 1973-06-11
BG26673A3 (es) 1979-05-15
PL83391B1 (es) 1975-12-31
HK28382A (en) 1982-07-02
DK144184B (da) 1982-01-04
IL38677A0 (en) 1972-03-28
FI57429C (fi) 1980-08-11
NL7201460A (es) 1972-08-08
DE2205146A1 (de) 1972-11-23
DK142623B (da) 1980-12-01
AU3839272A (en) 1973-08-02
JPS58144824A (ja) 1983-08-29

Similar Documents

Publication Publication Date Title
ES399317A1 (es) Procedimiento para la fabricacion de foto-resistores.
US3887450A (en) Photopolymerizable compositions containing polymeric binding agents
US3615455A (en) Photopolymerization of ethylenically unsaturated organic compounds
ES302850A1 (es) Procedimiento de obtencion de un polimero de adicion.
GB931368A (en) Treatment of photopolymerisable elements
ES342356A1 (es) Metodo de produccion de una placa de imprimir litografica presensibilizada.
US2989455A (en) Process for converting acrylic compounds to a higher polymerization degree by photo-polymerization
US2927023A (en) Photopolymerizable compositions
ES296886A1 (es) Un método para preparar una composición de recubrimiento
KR860001139A (ko) 방사선 중합성 혼합물
JPS52129790A (en) Ultraviolet/curing composition
GB1507704A (en) Photopolymerisable compositions
JPS5235238A (en) Emulsion composition
US3650927A (en) Photopolymerization utilizing dye-sensitized sulfones
KR850001789A (ko) 방사- 중합성 혼합물 및 그로부터 제조된 복물
JPS5267318A (en) Increasing of photographic coating fluid viscosity
GB1042520A (en) Improvements relating to compositions for preparation of photosensitive films
ES321955A1 (es) Un procedimiento para la polimerizacion redox de monomeros de vinilo.
JPS5310648A (en) Photosensitive resin compositions
ES430442A1 (es) Procedimiento para preparar una composicion fotopolimeriza-ble.
ES288479A1 (es) Método para la preparación de una composición resinosa líquida
US3531282A (en) Photopolymer polymerization fixation process and products
ES234898A1 (es) PROCEDIMIENTO DE PREPARACIoN DE COPOLiMEROS INJERTADOS
GB1484873A (en) Delineating a pattern in a negative resist composition
US3617279A (en) Photopolymerization of ethylenically unsaturated organic compounds employing an oxido-oxazole, photopolymerizable coated element and method of using