ES2666234T3 - Fuente de deposición por arco con campo eléctrico definido - Google Patents

Fuente de deposición por arco con campo eléctrico definido Download PDF

Info

Publication number
ES2666234T3
ES2666234T3 ES11727116.3T ES11727116T ES2666234T3 ES 2666234 T3 ES2666234 T3 ES 2666234T3 ES 11727116 T ES11727116 T ES 11727116T ES 2666234 T3 ES2666234 T3 ES 2666234T3
Authority
ES
Spain
Prior art keywords
cathode
anode
magnetic field
electric field
deposition source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES11727116.3T
Other languages
English (en)
Inventor
Siegfried Krassnitzer
Juerg Hagmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Surface Solutions AG Pfaeffikon
Original Assignee
Oerlikon Surface Solutions AG Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions AG Pfaeffikon filed Critical Oerlikon Surface Solutions AG Pfaeffikon
Application granted granted Critical
Publication of ES2666234T3 publication Critical patent/ES2666234T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0089—Reactive sputtering in metallic mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)

Abstract

Dispositivo de evaporación por arco que comprende - un cátodo (309) que contiene una superficie con aquel material, que va a evaporarse - medios magnéticos (305) que llevan a un campo magnético a lo largo de la superficie del cátodo (309) - un ánodo (303) para la absorción de los electrones, que se extraen del cátodo (309) durante el proceso de evaporación - una fuente de tensión, que permite colocar en potencial positivo al menos durante cierto tiempo el ánodo (303) frente al cátodo (309) caracterizado por que el ánodo (303) está dispuesto en la proximidad inmediata del cátodo (309) y en combinación con el campo magnético generado por los medios magnéticos (305) de tal manera que las líneas del campo magnético se guían, con una conexión corta, desde la superficie del cátodo (309) hasta el ánodo (303), en donde las líneas del campo magnético que salen de la superficie del cátodo (309) inciden sobre el ánodo (303) en caso de que no entren en una zona central del cátodo (309) de la superficie del cátodo (309) y en donde en la zona central del cátodo (309) se tomaron precauciones que impiden esencialmente su erosión durante el funcionamiento del dispositivo de evaporación.

Description

imagen1
imagen2
imagen3
imagen4

Claims (1)

  1. imagen1
ES11727116.3T 2010-06-22 2011-06-03 Fuente de deposición por arco con campo eléctrico definido Active ES2666234T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35727210P 2010-06-22 2010-06-22
US357272P 2010-06-22
PCT/EP2011/002734 WO2011160766A1 (de) 2010-06-22 2011-06-03 Arc-verdampfungsquelle mit definiertem elektrischem feld

Publications (1)

Publication Number Publication Date
ES2666234T3 true ES2666234T3 (es) 2018-05-03

Family

ID=44487011

Family Applications (1)

Application Number Title Priority Date Filing Date
ES11727116.3T Active ES2666234T3 (es) 2010-06-22 2011-06-03 Fuente de deposición por arco con campo eléctrico definido

Country Status (17)

Country Link
US (1) US10253407B2 (es)
EP (1) EP2585622B1 (es)
JP (1) JP6095568B2 (es)
KR (1) KR101854936B1 (es)
CN (1) CN102947478B (es)
BR (1) BR112012033065B1 (es)
CA (1) CA2803087C (es)
ES (1) ES2666234T3 (es)
HU (1) HUE038729T2 (es)
MX (1) MX361608B (es)
MY (1) MY170012A (es)
PL (1) PL2585622T3 (es)
PT (1) PT2585622T (es)
SG (1) SG186722A1 (es)
SI (1) SI2585622T1 (es)
TW (1) TWI553132B (es)
WO (1) WO2011160766A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2726648B1 (en) 2011-06-30 2019-09-11 Oerlikon Surface Solutions AG, Pfäffikon Nano-layer coating for high performance tools
US9447488B2 (en) 2011-09-30 2016-09-20 Oerlikon Surface Solutions Ag, Pfaffikon Aluminum titanium nitride coating with adapted morphology for enhanced wear resistance in machining operations and method thereof
EP2607517A1 (en) * 2011-12-22 2013-06-26 Oerlikon Trading AG, Trübbach Low temperature arc ion plating coating
US9131893B2 (en) * 2012-10-26 2015-09-15 Pixie Scientific, Llc Health diagnostic systems and methods
JP6842233B2 (ja) * 2014-07-29 2021-03-17 サンドビック インテレクチュアル プロパティー アクティエボラーグ コーティングされた切削工具、及びコーティングされた切削工具の製造方法
US10383564B2 (en) 2015-05-22 2019-08-20 Pixie Scientific, Llc Indicator panels for incontinence products
EP3394312B1 (en) * 2015-12-22 2020-06-17 Sandvik Intellectual Property AB A coated cutting tool and method
WO2019136261A1 (en) * 2018-01-04 2019-07-11 Ih Ip Holdings Limited Gas phase co-deposition of hydrogen/deuterium loaded metallic structures
EP3556901B1 (en) * 2018-04-20 2021-03-31 Plansee Composite Materials Gmbh Vacuum arc source
MX2022000138A (es) 2019-07-03 2022-02-17 Oerlikon Surface Solutions Ag Pfaeffikon Fuente de arco catodico.
KR102667048B1 (ko) * 2021-07-20 2024-05-22 한국생산기술연구원 중앙부 함몰형 자기장을 가지는 아크 증발원 및 이를 포함하는 아크 이온 플레이팅 장치, 그리고 이를 이용한 금속 및 금속화합물의 증착방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625848A (en) 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
SU1040631A1 (ru) 1980-06-25 1983-09-07 Предприятие П/Я В-8851 Вакуумно-дуговое устройство
US4620913A (en) 1985-11-15 1986-11-04 Multi-Arc Vacuum Systems, Inc. Electric arc vapor deposition method and apparatus
ATE101661T1 (de) * 1989-06-27 1994-03-15 Hauzer Holding Verfahren und vorrichtung zur beschichtung von substraten.
US5380421A (en) * 1992-11-04 1995-01-10 Gorokhovsky; Vladimir I. Vacuum-arc plasma source
JP2002525431A (ja) * 1998-09-14 2002-08-13 ユナキス・トレーディング・アクチェンゲゼルシャフト アーク蒸化室用ターゲット配置
JP3917348B2 (ja) * 1999-05-26 2007-05-23 株式会社神戸製鋼所 アーク蒸発源、真空蒸着装置及び真空蒸着方法
JP4409015B2 (ja) * 1999-11-30 2010-02-03 株式会社神戸製鋼所 アークイオンプレーティング装置
CA2305938C (en) * 2000-04-10 2007-07-03 Vladimir I. Gorokhovsky Filtered cathodic arc deposition method and apparatus
DE10018143C5 (de) * 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
JP4000764B2 (ja) * 2000-09-18 2007-10-31 日新電機株式会社 真空アーク蒸発装置
JP4034563B2 (ja) * 2001-12-27 2008-01-16 株式会社神戸製鋼所 真空アーク蒸発源
JP4109503B2 (ja) * 2002-07-22 2008-07-02 日新電機株式会社 真空アーク蒸着装置
WO2007068768A1 (es) * 2005-12-16 2007-06-21 Fundacion Tekniker Máquina de evaporación catódica
NZ576185A (en) * 2006-10-10 2012-10-26 Oerlikon Trading Ag A PVD layer system for coating workpieces with a mixed crystal layer of a polyoxide

Also Published As

Publication number Publication date
JP2013533382A (ja) 2013-08-22
BR112012033065A2 (pt) 2020-08-11
EP2585622B1 (de) 2018-01-17
PT2585622T (pt) 2018-04-20
CA2803087A1 (en) 2011-12-29
KR101854936B1 (ko) 2018-06-14
EP2585622A1 (de) 2013-05-01
CN102947478A (zh) 2013-02-27
HUE038729T2 (hu) 2018-11-28
RU2013102585A (ru) 2014-08-10
MX361608B (es) 2018-12-07
TWI553132B (zh) 2016-10-11
SI2585622T1 (en) 2018-06-29
US10253407B2 (en) 2019-04-09
JP6095568B2 (ja) 2017-03-15
BR112012033065B1 (pt) 2022-04-05
WO2011160766A1 (de) 2011-12-29
CA2803087C (en) 2019-11-12
SG186722A1 (en) 2013-02-28
PL2585622T3 (pl) 2018-07-31
US20130126347A1 (en) 2013-05-23
CN102947478B (zh) 2016-02-17
TW201219582A (en) 2012-05-16
KR20130121078A (ko) 2013-11-05
MY170012A (en) 2019-06-20
MX2012015089A (es) 2013-05-28

Similar Documents

Publication Publication Date Title
ES2666234T3 (es) Fuente de deposición por arco con campo eléctrico definido
ES2648995T3 (es) Fuente de evaporación por arco voltaico al vacío, así como una cámara de evaporación por arco voltaico con una fuente de evaporación por arco voltaico al vacío
CL2016001093A1 (es) Procesos asistidos de plasma de descarga de arco a distancia
AR095602A1 (es) Sistema y método de recubrimiento de un sustrato
ES2527877T3 (es) Procedimiento para el depósito de capas eléctricamente aislantes
AR098225A1 (es) Disposición de recubrimiento al vacío y tratamiento con plasma, y método de recubrimiento de un sustrato
WO2015084466A3 (en) X-ray sources using linear accumulation
ES2625301T3 (es) Fuente de plasma
AR086942A1 (es) Disposicion de electrodo para una descarga de gas dielectricamente impedida
CL2011003094A1 (es) Composicion farmaceutica semi-solida libre de agua que comprende a) un ester del acido 5-aminolevulinico (5-ala) o una sal del mismo, b) uno o mas trigliceridos y c) opcionalmente uno o mas potenciadores de viscosidad; kit farmaceutico; y su uso en el tratamiento fotodinamico del cancer, condiciones pre-cancerosas y no cancerosas asociadas a hpv.
BR112015019027A8 (pt) dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato
BR112018072360A8 (pt) Dispositivo eletrocirúrgico com fonte de micro-ondas integrada
CL2019001222A1 (es) Generador de humo con deflector.
SA518391635B1 (ar) عنصر توجيه واستقبال إلكترون
BR112015023115A2 (pt) dispositivo comutador de catodo frio e conversor de potência
ES2527048T3 (es) Dispositivo de tratamiento de bombardeo de iones, y método para la limpieza de la superficie del material base usando el dispositivo de tratamiento
ES2611703T3 (es) Conmutador de potencia de alta tensión con un espacio de aislamiento entre contactos, equipado con elementos deflectores de gas de conmutación
ES2539975T3 (es) Procedimiento para la pasivación con hidrógeno de unas capas de semiconductores
AR095963A1 (es) Celda electrolítica para la extracción por vía electrolítica de metales
ES2630017T3 (es) Dispositivo y procedimiento para una mejor impresión directa de paneles decorativos
ES2525833T3 (es) Supresión del crecimiento del cáncer y la metástasis mediante el uso de derivados de ácido nordihidroguayarético con 7-hidroxiestaurosporina
ATE455358T1 (de) Feldemissionsvorrichtung
ES2646440T3 (es) Módulo de cubetas con portacubetas eléctricamente conductor
MX2020004821A (es) Fuente de arco con campo magnetico confinado.
AR103464A1 (es) Dispositivo para la desintegración eléctrica de agrupaciones de células, como también instalación y utilización de la instalación para la producción de productos forrajeros intermedios y productos forrajeros