ES2527048T3 - Dispositivo de tratamiento de bombardeo de iones, y método para la limpieza de la superficie del material base usando el dispositivo de tratamiento - Google Patents

Dispositivo de tratamiento de bombardeo de iones, y método para la limpieza de la superficie del material base usando el dispositivo de tratamiento Download PDF

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Publication number
ES2527048T3
ES2527048T3 ES11789394.1T ES11789394T ES2527048T3 ES 2527048 T3 ES2527048 T3 ES 2527048T3 ES 11789394 T ES11789394 T ES 11789394T ES 2527048 T3 ES2527048 T3 ES 2527048T3
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Spain
Prior art keywords
heating
thermal electron
base material
vacuum chamber
power source
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES11789394.1T
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English (en)
Inventor
Naoyuki Goto
Homare Nomura
Shigeto Adachi
Koumei Fujioka
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Kobe Steel Ltd
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Kobe Steel Ltd
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Publication date
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Publication of ES2527048T3 publication Critical patent/ES2527048T3/es
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018Glow discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018Glow discharge
    • H01J37/32027DC powered
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means
    • H01J37/32669Particular magnets or magnet arrangements for controlling the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853Hygiene
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853Hygiene
    • H01J37/32862In situ cleaning of vessels and/or internal parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physical Vapour Deposition (AREA)
  • Cleaning In General (AREA)

Abstract

Un aparato (1) de tratamiento de bombardeo de iones para limpiar una superficie de un material (W) base colocado en una cámara (2) de vacío irradiando iones de gas generados en la cámara (2) de vacío, que comprende: un electrodo (3) de emisión de electrones térmicos de tipo de calentamiento colocado en una superficie interior de la cámara (2) de vacío y formado por un filamento; un ánodo (4) colocado en otra superficie interior de la cámara (2) de vacío, recibiendo el ánodo (4) un electrón térmico desde dicho electrodo (3) de emisión de electrones térmicos; una herramienta (11) 10 de retención de material base para retener el material (W) base de una manera tal que el material (W) base se coloca entre dicho electrodo (3) de emisión de electrones térmicos y dicho ánodo (4); una fuente (5) de alimentación de descarga para generar una descarga luminiscente tras la aplicación de una diferencia de potencial entre dicho electrodo (3) de emisión de electrones térmicos y dicho ánodo (4); una fuente (6) de alimentación de calentamiento para calentar dicho electrodo (3) de emisión de electrones térmicos con el fin de emitir el electrón térmico; y una fuente (12) de alimentación de polarización para aplicar potencial negativo con respecto a la cámara (12) de vacío al material (W) base, donde dicha fuente (6) de alimentación de calentamiento no está conectada a la cámara (2) de vacío, y los iones de gas generados por dicha fuente (5) de alimentación de descarga, dicha fuente (6) de alimentación de calentamiento, y dicha fuente (12) de alimentación de polarización se irradian a la superficie del material (W) base, caracterizado por un transformador (13) de aislamiento para conectar dicha fuente (6) de alimentación de calentamiento a dicho electrodo (3) de emisión de electrones térmicos en un estado de aislamiento eléctrico, donde una salida del lado negativo de dicha fuente (5) de alimentación de descarga está conectada a dicho electrodo (3) de emisión de electrones térmicos a través de una bobina (15) secundaria de dicho transformador (13) de aislamiento, y dicha fuente (5) de alimentación de descarga no está conectada a dicha fuente (6) de alimentación de calentamiento, y al mismo tiempo no está conectada a la cámara (2) de vacío.

Description

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Claims (1)

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ES11789394.1T 2010-06-01 2011-05-16 Dispositivo de tratamiento de bombardeo de iones, y método para la limpieza de la superficie del material base usando el dispositivo de tratamiento Active ES2527048T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010125830A JP5649333B2 (ja) 2010-06-01 2010-06-01 イオンボンバードメント装置及びこの装置を用いた基材表面のクリーニング方法
JP2010125830 2010-06-01
PCT/JP2011/002691 WO2011151979A1 (ja) 2010-06-01 2011-05-16 イオンボンバードメント処理装置およびこの処理装置を用いた基材表面のクリーニング方法

Publications (1)

Publication Number Publication Date
ES2527048T3 true ES2527048T3 (es) 2015-01-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
ES11789394.1T Active ES2527048T3 (es) 2010-06-01 2011-05-16 Dispositivo de tratamiento de bombardeo de iones, y método para la limpieza de la superficie del material base usando el dispositivo de tratamiento

Country Status (6)

Country Link
US (1) US9211570B2 (es)
EP (1) EP2578722B1 (es)
JP (1) JP5649333B2 (es)
ES (1) ES2527048T3 (es)
PT (1) PT2578722E (es)
WO (1) WO2011151979A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5689051B2 (ja) * 2011-11-25 2015-03-25 株式会社神戸製鋼所 イオンボンバードメント装置
JP6076112B2 (ja) * 2013-02-07 2017-02-08 株式会社神戸製鋼所 イオンボンバードメント装置及びこの装置を用いた基材の表面のクリーニング方法
CN104370473B (zh) 2013-08-12 2016-12-28 洛阳兰迪玻璃机器股份有限公司 玻璃板轰击除气装置
JP7302060B2 (ja) * 2017-08-18 2023-07-03 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置
JP7061049B2 (ja) * 2018-09-10 2022-04-27 株式会社神戸製鋼所 熱フィラメントcvd装置
CN109576652B (zh) * 2018-12-20 2024-04-30 江苏徐工工程机械研究院有限公司 一种电弧离子镀膜装置
CN115110041B (zh) * 2022-07-18 2024-05-31 洛阳微米光电技术有限公司 一种用于清除真空镀膜工件表面残留空气的装置及方法

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3661747A (en) * 1969-08-11 1972-05-09 Bell Telephone Labor Inc Method for etching thin film materials by direct cathodic back sputtering
US3654108A (en) * 1969-09-23 1972-04-04 Air Reduction Method for glow cleaning
JP2782383B2 (ja) 1990-11-30 1998-07-30 株式会社興人 N,n―ジアルキル(メタ)アクリルアミドの製造法
DE4125365C1 (es) * 1991-07-31 1992-05-21 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De
DE29615190U1 (de) 1996-03-11 1996-11-28 Balzers Verschleissschutz GmbH, 55411 Bingen Anlage zur Beschichtung von Werkstücken
DE10018143C5 (de) 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
JP2002088465A (ja) * 2000-09-11 2002-03-27 Matsushita Electric Ind Co Ltd 金属基材への硬質炭素膜の成膜方法
JP4401577B2 (ja) * 2001-01-15 2010-01-20 新明和工業株式会社 成膜方法
JP4756434B2 (ja) 2001-06-14 2011-08-24 日立金属株式会社 皮膜形成装置
JP2006022368A (ja) * 2004-07-07 2006-01-26 Shinko Seiki Co Ltd 表面処理装置および表面処理方法

Also Published As

Publication number Publication date
EP2578722B1 (en) 2014-12-17
US9211570B2 (en) 2015-12-15
EP2578722A4 (en) 2013-10-16
WO2011151979A1 (ja) 2011-12-08
US20130061872A1 (en) 2013-03-14
JP2011252193A (ja) 2011-12-15
EP2578722A1 (en) 2013-04-10
PT2578722E (pt) 2015-02-13
JP5649333B2 (ja) 2015-01-07

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