MX2022000138A - Fuente de arco catodico. - Google Patents
Fuente de arco catodico.Info
- Publication number
- MX2022000138A MX2022000138A MX2022000138A MX2022000138A MX2022000138A MX 2022000138 A MX2022000138 A MX 2022000138A MX 2022000138 A MX2022000138 A MX 2022000138A MX 2022000138 A MX2022000138 A MX 2022000138A MX 2022000138 A MX2022000138 A MX 2022000138A
- Authority
- MX
- Mexico
- Prior art keywords
- target
- boarder
- target surface
- confinement
- electron receiving
- Prior art date
Links
- 230000001154 acute effect Effects 0.000 abstract 2
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0617—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0676—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/351—Sputtering by application of a magnetic field, e.g. magnetron sputtering using a magnetic field in close vicinity to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Prevention Of Electric Corrosion (AREA)
Abstract
La invención se refiere a un aparato de evaporación por arco catódico, el cual comprende: - un blanco (3) que tiene una superficie blanco (3') que comprende una superficie activa (3'') desde donde se puede evaporar el material en un proceso de arco catódico;- un confinamiento (4) que rodea a un borde exterior de la superficie blanco (3'); - un ánodo (2) que tiene una superficie receptora de electrones (2', 2'', 2'''), en donde el ánodo (2) abarca por lo menos uno del blanco (3) y el confinamiento (4) en por lo menos uno de un plano blanco y una distancia axial en frente de la superficie activa; - un sistema de guía magnética que se adapta de una forma tal como para proporcionar un campo magnético en la superficie blanco que está esencialmente en paralelo con por lo menos una región exterior de la superficie blanco, de un modo tal que las líneas del campo magnético están en paralelo con la superficie blanco o inclinadas hacia la misma en un ángulo agudo a, en donde se define una superficie activa (3'') en un área de superficie (3') en donde las líneas del campo magnético entran en la superficie blanco en un ángulo agudo a = 45 °; - un eje central Z o un plano central Z'; en donde el confinamiento (4) y el ánodo (2) se hacen ambos en una geometría cerrada y ambos se aíslan eléctricamente uno contra el otro y contra el blanco, en donde la distancia mínima de la superficie receptora de electrones (2', 2'', 2''') desde la superficie activa (3'') se define por lo menos por una de una distancia radial ?r14 de un borde exterior de la superficie blanco (3') hasta un borde interior de la superficie receptora de electrones, en donde el borde exterior de la superficie blanco (3') tiene una distancia radial r1 desde el centro del blanco, y el borde interior de la superficie receptora de electrones tiene una distancia radial r4 desde el centro del blanco, y una distancia axial h1 desde la superficie blanco (3') hasta un borde superior del confinamiento o una distancia axial h2 desde la superficie blanco (3') hasta un borde inferior de la superficie receptora de electrones (2', 2'', 2''').
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH8772019 | 2019-07-03 | ||
PCT/EP2020/068828 WO2021001536A1 (en) | 2019-07-03 | 2020-07-03 | Cathodic arc source |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022000138A true MX2022000138A (es) | 2022-02-17 |
Family
ID=71465361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022000138A MX2022000138A (es) | 2019-07-03 | 2020-07-03 | Fuente de arco catodico. |
Country Status (10)
Country | Link |
---|---|
US (1) | US20220307125A1 (es) |
EP (1) | EP3994717A1 (es) |
JP (1) | JP2022538641A (es) |
KR (1) | KR20220027172A (es) |
CN (1) | CN114341395A (es) |
BR (1) | BR112021026808A2 (es) |
CA (1) | CA3145458A1 (es) |
IL (1) | IL289483A (es) |
MX (1) | MX2022000138A (es) |
WO (1) | WO2021001536A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230078682A (ko) | 2020-09-29 | 2023-06-02 | 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 | 금속 타겟으로부터 PVD에 의해 제조된 Al-풍부한 AlTiN 코팅층 |
CN116457494A (zh) | 2020-09-30 | 2023-07-18 | 欧瑞康表面解决方案股份公司,普费菲孔 | 通过PVD由金属靶产生的富Al的AlCrN涂层 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298136A (en) * | 1987-08-18 | 1994-03-29 | Regents Of The University Of Minnesota | Steered arc coating with thick targets |
BR0116951B1 (pt) * | 2001-03-27 | 2011-06-14 | evaporador de arco com guia magnÉtico poderoso para alvos tendo uma grande Área de superfÍcie. | |
CH695807A5 (de) * | 2001-11-20 | 2006-08-31 | Unaxis Balzers Ag | Quelle für Vakuumbehandlungsprozess. |
WO2011021281A1 (ja) * | 2009-08-19 | 2011-02-24 | 日新電機株式会社 | アーク蒸発源及び真空蒸着装置 |
EP2585622B1 (de) | 2010-06-22 | 2018-01-17 | Oerlikon Surface Solutions AG, Pfäffikon | Arc-verdampfungsquelle mit definiertem elektrischem feld |
JP5318052B2 (ja) * | 2010-06-23 | 2013-10-16 | 株式会社神戸製鋼所 | 成膜速度が速いアーク式蒸発源、このアーク式蒸発源を用いた皮膜の製造方法及び成膜装置 |
MX2020004821A (es) * | 2017-10-03 | 2020-08-13 | Oerlikon Surface Solutions Ag Pfaeffikon | Fuente de arco con campo magnetico confinado. |
-
2020
- 2020-07-03 MX MX2022000138A patent/MX2022000138A/es unknown
- 2020-07-03 US US17/597,246 patent/US20220307125A1/en active Pending
- 2020-07-03 WO PCT/EP2020/068828 patent/WO2021001536A1/en unknown
- 2020-07-03 EP EP20736688.1A patent/EP3994717A1/en active Pending
- 2020-07-03 KR KR1020227002620A patent/KR20220027172A/ko unknown
- 2020-07-03 BR BR112021026808A patent/BR112021026808A2/pt unknown
- 2020-07-03 CA CA3145458A patent/CA3145458A1/en active Pending
- 2020-07-03 JP JP2021577624A patent/JP2022538641A/ja active Pending
- 2020-07-03 CN CN202080061854.4A patent/CN114341395A/zh active Pending
-
2021
- 2021-12-29 IL IL289483A patent/IL289483A/en unknown
Also Published As
Publication number | Publication date |
---|---|
IL289483A (en) | 2022-02-01 |
JP2022538641A (ja) | 2022-09-05 |
US20220307125A1 (en) | 2022-09-29 |
BR112021026808A2 (pt) | 2022-05-10 |
WO2021001536A1 (en) | 2021-01-07 |
CA3145458A1 (en) | 2021-01-07 |
CN114341395A (zh) | 2022-04-12 |
EP3994717A1 (en) | 2022-05-11 |
KR20220027172A (ko) | 2022-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MX2022000138A (es) | Fuente de arco catodico. | |
Svadkovski et al. | Characterisation parameters for unbalanced magnetron sputtering systems | |
US6179973B1 (en) | Apparatus and method for controlling plasma uniformity across a substrate | |
RU2168233C2 (ru) | Катод для распыления или электродугового испарения (варианты) и устройство для покрытия или ионной имплантации подложек | |
US10253407B2 (en) | Arc deposition source having a defined electric field | |
US6497796B1 (en) | Apparatus and method for controlling plasma uniformity across a substrate | |
EP2561540A1 (en) | Improved ion source | |
TR201901436T4 (tr) | Döndürülebilir hedefler ile katodu içeren püskürtme aparatı ve ilgili yöntem. | |
ES2602114T3 (es) | Fuentes de pulverización catódica a alta presión con blancos grandes y procedimiento de pulverización catódica | |
JPWO2019182111A1 (ja) | イオンガン | |
WO2010134259A1 (ja) | 電子銃 | |
JP2835265B2 (ja) | 磁界界浸型電子銃及び磁界界浸型電子銃操作方法 | |
US3530057A (en) | Sputtering | |
KR850008362A (ko) | 스퍼터코팅 장치 및 방법 | |
TW201812065A (zh) | 靶材裝置、濺鍍裝置 | |
JPS585504B2 (ja) | 加熱、溶解または蒸着用、偏向系を有する電子銃 | |
CN102296274B (zh) | 用于阴极弧金属离子源的屏蔽装置 | |
EP3156516B1 (en) | Arc evaporation source | |
RU2020113430A (ru) | Дуговой источник с ограниченным магнитным полем | |
UA113607C2 (xx) | Електронно-променевий прожектор з лінійним термокатодом | |
Maiti et al. | Note: Design of transverse electron gun for electron beam based reactive evaporation system | |
WO2001092595A1 (en) | Unbalanced plasma generating apparatus having cylindrical symmetry | |
JP6113841B2 (ja) | 基板上にスパッタリングされた材料の層をコーティングするための装置及び堆積システム | |
US20230106067A1 (en) | Neutralizer for an ion thruster of a spacecraft | |
GB747707A (en) | Improvements relating to electron guns |