TR201901436T4 - Döndürülebilir hedefler ile katodu içeren püskürtme aparatı ve ilgili yöntem. - Google Patents
Döndürülebilir hedefler ile katodu içeren püskürtme aparatı ve ilgili yöntem. Download PDFInfo
- Publication number
- TR201901436T4 TR201901436T4 TR2019/01436T TR201901436T TR201901436T4 TR 201901436 T4 TR201901436 T4 TR 201901436T4 TR 2019/01436 T TR2019/01436 T TR 2019/01436T TR 201901436 T TR201901436 T TR 201901436T TR 201901436 T4 TR201901436 T4 TR 201901436T4
- Authority
- TR
- Turkey
- Prior art keywords
- targets
- target
- cathode
- related method
- spray apparatus
- Prior art date
Links
- 239000007921 spray Substances 0.000 title 1
- 238000004544 sputter deposition Methods 0.000 abstract 3
- 238000010884 ion-beam technique Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/3442—Applying energy to the substrate during sputtering using an ion beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3432—Target-material dispenser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Belirli örnek düzenlemeler, hedeften (hedefler) bir birinci hedef veya hedefler, bir birinci modda püskürtmeye yönelik olarak kullanılabilirken hedeften (hedefler) bir ikinci hedef veya hedeflerin, bir ikinci modda püskürtmeye yönelik olarak kullanılabildiği şekilde birçok hedefi (56a-d) içeren püskürtme aparatları ile ilgilidir. Modlar, örneğin kullanılacak bir veya daha fazla hedef (56a,56b), aparatın ana haznesi içine çıkıntı yaparken kullanılmayacak bir veya daha fazla hedefin (56c,56d), püskürtme aparatının bir katodunun (52) (örneğin bunun ile bütünsel olarak oluşturulmuştur) bir gövde kısmı içine girinti oluşturacağı şekilde hedeflerin pozisyonunu döndürerek belirli örnek düzenlemelerde değiştirilebilir. Hedefler, silindirik manyetik hedefler veya düzlemsel hedefler olabilir. En az bir hedef konum ayrıca, bir iyon ışın kaynağına yer sağlayacak şekilde yapılabilir.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/461,130 US10586689B2 (en) | 2009-07-31 | 2009-07-31 | Sputtering apparatus including cathode with rotatable targets, and related methods |
Publications (1)
Publication Number | Publication Date |
---|---|
TR201901436T4 true TR201901436T4 (tr) | 2019-02-21 |
Family
ID=43242628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TR2019/01436T TR201901436T4 (tr) | 2009-07-31 | 2010-07-26 | Döndürülebilir hedefler ile katodu içeren püskürtme aparatı ve ilgili yöntem. |
Country Status (5)
Country | Link |
---|---|
US (2) | US10586689B2 (tr) |
EP (1) | EP2280407B1 (tr) |
ES (1) | ES2707557T3 (tr) |
PL (1) | PL2280407T3 (tr) |
TR (1) | TR201901436T4 (tr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10586689B2 (en) * | 2009-07-31 | 2020-03-10 | Guardian Europe S.A.R.L. | Sputtering apparatus including cathode with rotatable targets, and related methods |
CN101988189B (zh) * | 2009-08-07 | 2012-10-10 | 鸿富锦精密工业(深圳)有限公司 | 磁控溅射靶及采用该磁控溅射靶的磁控溅射装置 |
CN103282542A (zh) * | 2011-04-12 | 2013-09-04 | 株式会社爱发科 | 靶及靶的制造方法 |
JP5882934B2 (ja) * | 2012-05-09 | 2016-03-09 | シーゲイト テクノロジー エルエルシー | スパッタリング装置 |
US9809876B2 (en) * | 2014-01-13 | 2017-11-07 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure |
CN109804455B (zh) * | 2016-10-14 | 2022-03-15 | 瑞士艾发科技 | 溅射源 |
DE102016125273A1 (de) * | 2016-12-14 | 2018-06-14 | Schneider Gmbh & Co. Kg | Anlage, Verfahren und Träger zur Beschichtung von Brillengläsern |
JP2019189913A (ja) * | 2018-04-26 | 2019-10-31 | 京浜ラムテック株式会社 | スパッタリングカソード、スパッタリングカソード集合体およびスパッタリング装置 |
CN116324014A (zh) * | 2020-10-14 | 2023-06-23 | 应用材料公司 | 溅射沉积源、沉积设备和涂覆基板的方法 |
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US10586689B2 (en) * | 2009-07-31 | 2020-03-10 | Guardian Europe S.A.R.L. | Sputtering apparatus including cathode with rotatable targets, and related methods |
-
2009
- 2009-07-31 US US12/461,130 patent/US10586689B2/en active Active
-
2010
- 2010-07-26 TR TR2019/01436T patent/TR201901436T4/tr unknown
- 2010-07-26 PL PL10170789T patent/PL2280407T3/pl unknown
- 2010-07-26 ES ES10170789T patent/ES2707557T3/es active Active
- 2010-07-26 EP EP10170789.1A patent/EP2280407B1/en active Active
-
2020
- 2020-02-18 US US16/792,910 patent/US11094513B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10586689B2 (en) | 2020-03-10 |
EP2280407A2 (en) | 2011-02-02 |
US20110024284A1 (en) | 2011-02-03 |
ES2707557T3 (es) | 2019-04-04 |
US20200185205A1 (en) | 2020-06-11 |
US11094513B2 (en) | 2021-08-17 |
EP2280407B1 (en) | 2018-11-07 |
PL2280407T3 (pl) | 2019-02-28 |
EP2280407A3 (en) | 2014-04-30 |
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