ES2144789T3 - Procedimiento para la deposicion electrolitica de capas metalicas. - Google Patents

Procedimiento para la deposicion electrolitica de capas metalicas.

Info

Publication number
ES2144789T3
ES2144789T3 ES96939882T ES96939882T ES2144789T3 ES 2144789 T3 ES2144789 T3 ES 2144789T3 ES 96939882 T ES96939882 T ES 96939882T ES 96939882 T ES96939882 T ES 96939882T ES 2144789 T3 ES2144789 T3 ES 2144789T3
Authority
ES
Spain
Prior art keywords
pct
anodes
coatings
metal
sec
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96939882T
Other languages
English (en)
Spanish (es)
Inventor
Wolfgang Dahms
Heinrich Meyer
Stefan Kretschmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2144789T3 publication Critical patent/ES2144789T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ES96939882T 1995-11-21 1996-11-21 Procedimiento para la deposicion electrolitica de capas metalicas. Expired - Lifetime ES2144789T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19545231A DE19545231A1 (de) 1995-11-21 1995-11-21 Verfahren zur elektrolytischen Abscheidung von Metallschichten

Publications (1)

Publication Number Publication Date
ES2144789T3 true ES2144789T3 (es) 2000-06-16

Family

ID=7779164

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96939882T Expired - Lifetime ES2144789T3 (es) 1995-11-21 1996-11-21 Procedimiento para la deposicion electrolitica de capas metalicas.

Country Status (9)

Country Link
US (1) US6099711A (2)
EP (1) EP0862665B1 (2)
JP (2) JP2000500529A (2)
AT (1) ATE190677T1 (2)
CA (1) CA2233329C (2)
DE (2) DE19545231A1 (2)
ES (1) ES2144789T3 (2)
TW (1) TW420728B (2)
WO (1) WO1997019206A1 (2)

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DE19736350C1 (de) * 1997-08-21 1999-08-05 Atotech Deutschland Gmbh Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6946065B1 (en) 1998-10-26 2005-09-20 Novellus Systems, Inc. Process for electroplating metal into microscopic recessed features
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
BR0007639A (pt) 1999-01-21 2001-11-06 Atotech Deutschland Gmbh Processo para formação galvânica de estruturas condutoras de cobre de alta pureza na produção de circuitos integrados
DE19925373B4 (de) * 1999-06-02 2006-04-06 Robert Bosch Gmbh Verfahren und Vorrichtung zum Galvanisieren
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
US6294060B1 (en) 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6491806B1 (en) 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
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DE10061186C1 (de) * 2000-12-07 2002-01-17 Astrium Gmbh Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens
US20040060728A1 (en) * 2001-01-04 2004-04-01 Philippe Steiert Method for producing electroconductive structures
JP2002235189A (ja) * 2001-02-05 2002-08-23 Sansha Electric Mfg Co Ltd めっき電流供給電源装置
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EP1475463B2 (en) † 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
US20040118691A1 (en) * 2002-12-23 2004-06-24 Shipley Company, L.L.C. Electroplating method
DE10261493A1 (de) * 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
KR20040073974A (ko) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 전기도금 조성물
US20050157475A1 (en) * 2004-01-15 2005-07-21 Endicott Interconnect Technologies, Inc. Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
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EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
US7329334B2 (en) * 2004-09-16 2008-02-12 Herdman Roderick D Controlling the hardness of electrodeposited copper coatings by variation of current profile
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
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JP5073736B2 (ja) * 2006-03-30 2012-11-14 アトテック・ドイチュラント・ゲーエムベーハー 孔及びキャビティの金属による電解充填法
US20070278107A1 (en) * 2006-05-30 2007-12-06 Northwest Aluminum Technologies Anode for use in aluminum producing electrolytic cell
JP2009167506A (ja) * 2008-01-21 2009-07-30 Ebara Udylite Kk 酸性電解銅めっき液およびこれを用いる微細配線回路の作製方法
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US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
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US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
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US11716819B2 (en) * 2018-06-21 2023-08-01 Averatek Corporation Asymmetrical electrolytic plating for a conductive pattern
JP7087759B2 (ja) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 銅張積層板
CN112210801A (zh) * 2019-07-09 2021-01-12 江西博泉化学有限公司 一种用于高纵横比电路板通孔电镀的电镀液及其电镀方法
JP2022545091A (ja) * 2019-08-19 2022-10-25 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法
EP4018790A1 (en) 2019-08-19 2022-06-29 Atotech Deutschland GmbH & Co. KG Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
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EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN113106527B (zh) * 2021-04-19 2024-09-10 深圳铱创科技有限公司 不溶性阳极及脉冲电镀设备
EP4400634A1 (en) * 2023-01-13 2024-07-17 Atotech Deutschland GmbH & Co. KG Process for producing copper foil by electrolytic deposition of copper
CN120239188B (zh) * 2025-05-29 2025-09-16 珠海市航达科技有限公司 一种pcb板铜电镀方法

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Also Published As

Publication number Publication date
DE59604701D1 (de) 2000-04-20
US6099711A (en) 2000-08-08
DE19545231A1 (de) 1997-05-22
JP2000500529A (ja) 2000-01-18
JP2009299195A (ja) 2009-12-24
WO1997019206A1 (de) 1997-05-29
JP5417112B2 (ja) 2014-02-12
CA2233329C (en) 2005-07-26
EP0862665B1 (de) 2000-03-15
CA2233329A1 (en) 1997-05-29
ATE190677T1 (de) 2000-04-15
TW420728B (en) 2001-02-01
EP0862665A1 (de) 1998-09-09

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