ES2100513T3 - Composiciones fotosensibles. - Google Patents

Composiciones fotosensibles.

Info

Publication number
ES2100513T3
ES2100513T3 ES93810862T ES93810862T ES2100513T3 ES 2100513 T3 ES2100513 T3 ES 2100513T3 ES 93810862 T ES93810862 T ES 93810862T ES 93810862 T ES93810862 T ES 93810862T ES 2100513 T3 ES2100513 T3 ES 2100513T3
Authority
ES
Spain
Prior art keywords
weight
meth
acrylate
liquid
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93810862T
Other languages
English (en)
Spanish (es)
Inventor
Bettina Dr Steinmann
Jean-Pierre Dr Wolf
Adrian Dr Schulthess
Max Dr Hunziker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
BASF Schweiz AG
Original Assignee
Ciba Geigy AG
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4266050&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2100513(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ciba Geigy AG, Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2100513T3 publication Critical patent/ES2100513T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
ES93810862T 1992-12-21 1993-12-09 Composiciones fotosensibles. Expired - Lifetime ES2100513T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH390692 1992-12-21

Publications (1)

Publication Number Publication Date
ES2100513T3 true ES2100513T3 (es) 1997-06-16

Family

ID=4266050

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93810862T Expired - Lifetime ES2100513T3 (es) 1992-12-21 1993-12-09 Composiciones fotosensibles.

Country Status (10)

Country Link
US (1) US5476748A (en, 2012)
EP (1) EP0605361B1 (en, 2012)
JP (1) JP3203461B2 (en, 2012)
KR (1) KR100282273B1 (en, 2012)
AT (1) ATE151085T1 (en, 2012)
AU (1) AU658780B2 (en, 2012)
CA (1) CA2111718C (en, 2012)
DE (1) DE59306034D1 (en, 2012)
ES (1) ES2100513T3 (en, 2012)
TW (1) TW269017B (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018178423A2 (es) 2017-03-31 2018-10-04 Centro Tecnologico De Nanomateriales Avanzados, S.L. Composición de resina curable por radiación y procedimiento para su obtención

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187424A (ja) * 1988-01-22 1989-07-26 Toshiba Corp トルクセンサ
TW311923B (en, 2012) * 1992-01-27 1997-08-01 Ciba Sc Holding Ag
JPH07291673A (ja) * 1994-04-28 1995-11-07 Kobe Steel Ltd 可撓性を有する光ファイバーケーブル用複合強化材
JP3475528B2 (ja) * 1994-11-18 2003-12-08 東洋インキ製造株式会社 紫外線硬化型樹脂組成物およびこれを含む被覆剤
JP3117394B2 (ja) * 1994-11-29 2000-12-11 帝人製機株式会社 光学的立体造形用樹脂組成物
CN1122360C (zh) * 1994-12-09 2003-09-24 埃普科斯股份有限公司 表面波元件及制造用于它的衰减结构的方法
TW418215B (en) * 1995-03-13 2001-01-11 Ciba Sc Holding Ag A process for the production of three-dimensional articles in a stereolithography bath comprising the step of sequentially irradiating a plurality of layers of a liquid radiation-curable composition
US5639413A (en) * 1995-03-30 1997-06-17 Crivello; James Vincent Methods and compositions related to stereolithography
EP0831127B1 (en) * 1995-05-12 2003-09-03 Asahi Denka Kogyo Kabushiki Kaisha Stereolithographic resin composition and stereolithographic method
US5707780A (en) * 1995-06-07 1998-01-13 E. I. Du Pont De Nemours And Company Photohardenable epoxy composition
DE19630705A1 (de) * 1995-08-30 1997-03-20 Deutsche Telekom Ag Verfahren zur Herstellung von 3-dimensional strukturierten Polymerschichten für die integrierte Optik
DE19534594B4 (de) * 1995-09-19 2007-07-26 Delo Industrieklebstoffe Gmbh & Co. Kg Kationisch härtende, flexible Epoxidharzmassen und ihre Verwendung zum Auftragen dünner Schichten
DE19534664A1 (de) * 1995-09-19 1997-03-20 Thera Ges Fuer Patente Lichtinitiiert kationisch härtende, dauerflexible Epoxidharzmasse und ihre Verwendung
DE19534668A1 (de) * 1995-09-19 1997-03-20 Thera Ges Fuer Patente Kettenverlängerte Epoxidharze enthaltende, vorwiegend kationisch härtende Masse
DE19541075C1 (de) * 1995-11-03 1997-04-24 Siemens Ag Photohärtbares Harz mit geringem Schwund und dessen Verwendung in einem Stereolithographieverfahren
JP3626275B2 (ja) * 1996-04-09 2005-03-02 Ｊｓｒ株式会社 光硬化性樹脂組成物
EP0897558B1 (en) * 1996-05-09 2000-09-27 Dsm N.V. Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects
KR100491736B1 (ko) * 1996-07-29 2005-09-09 반티코 아게 입체리토그래피용방사선-경화성액체조성물
JP3825506B2 (ja) * 1996-09-02 2006-09-27 Ｊｓｒ株式会社 液状硬化性樹脂組成物
US5766277A (en) * 1996-09-20 1998-06-16 Minnesota Mining And Manufacturing Company Coated abrasive article and method of making same
JP3724893B2 (ja) * 1996-09-25 2005-12-07 ナブテスコ株式会社 光学的立体造形用樹脂組成物
JP3786480B2 (ja) * 1996-10-14 2006-06-14 Ｊｓｒ株式会社 光硬化性樹脂組成物
JP3844824B2 (ja) * 1996-11-26 2006-11-15 株式会社Ａｄｅｋａ エネルギー線硬化性エポキシ樹脂組成物、光学的立体造形用樹脂組成物及び光学的立体造形方法
JP3650238B2 (ja) * 1996-12-10 2005-05-18 Ｊｓｒ株式会社 光硬化性樹脂組成物
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
JP3765896B2 (ja) * 1996-12-13 2006-04-12 Ｊｓｒ株式会社 光学的立体造形用光硬化性樹脂組成物
FR2757530A1 (fr) * 1996-12-24 1998-06-26 Rhodia Chimie Sa Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques
EP0960354A1 (en) * 1997-02-14 1999-12-01 Alliedsignal Inc. High temperature performance polymers for stereolithography
US6054250A (en) * 1997-02-18 2000-04-25 Alliedsignal Inc. High temperature performance polymers for stereolithography
EP0887706A1 (en) * 1997-06-25 1998-12-30 Wako Pure Chemical Industries Ltd Resist composition containing specific cross-linking agent
EP0889360B1 (de) * 1997-06-30 2002-01-30 Siemens Aktiengesellschaft Reaktionsharzmischungen und deren Verwendung
US6287745B1 (en) 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
US6472129B2 (en) * 1998-03-10 2002-10-29 Canon Kabushiki Kaisha Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same
US6448346B1 (en) * 1998-03-10 2002-09-10 Canon Kabushiki Kaisha Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same
US6344526B1 (en) * 1998-03-10 2002-02-05 Canon Kabushiki Kaisha Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus using same
US6136497A (en) 1998-03-30 2000-10-24 Vantico, Inc. Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
JP3907144B2 (ja) * 1998-04-09 2007-04-18 富士フイルム株式会社 平版印刷版の製造方法、レーザ走査露光用平版印刷版原版、および光重合性組成物
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) * 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6379866B2 (en) * 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
KR100642167B1 (ko) 1998-09-18 2006-11-02 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 다층 회로의 제조방법
AU3023301A (en) * 2000-02-08 2001-08-20 Vantico Ag Liquid, radiation-curable composition, especially for stereolithography
US6350792B1 (en) * 2000-07-13 2002-02-26 Suncolor Corporation Radiation-curable compositions and cured articles
US6579914B1 (en) * 2000-07-14 2003-06-17 Alcatel Coating compositions for optical waveguides and optical waveguides coated therewith
JP4839525B2 (ja) * 2000-09-29 2011-12-21 大日本印刷株式会社 感光性樹脂組成物および液晶ディスプレイ用カラーフィルタ
US6811937B2 (en) * 2001-06-21 2004-11-02 Dsm Desotech, Inc. Radiation-curable resin composition and rapid prototyping process using the same
US20030149124A1 (en) * 2001-11-27 2003-08-07 Thommes Glen A. Radiation curable resin composition for making colored three dimensional objects
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles
EP2466378B1 (en) 2002-05-03 2014-01-08 DSM IP Assets B.V. Radiation curable resin composition and rapid prototyping process using the same
GB0212977D0 (en) * 2002-06-06 2002-07-17 Vantico Ag Actinic radiation curable compositions and their use
US6989225B2 (en) † 2002-07-18 2006-01-24 3D Systems, Inc. Stereolithographic resins with high temperature and high impact resistance
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040087687A1 (en) * 2002-10-30 2004-05-06 Vantico A&T Us Inc. Photocurable compositions with phosphite viscosity stabilizers
US20040170923A1 (en) * 2003-02-27 2004-09-02 3D Systems, Inc. Colored stereolithographic resins
US20040229002A1 (en) * 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20070149667A1 (en) * 2003-10-16 2007-06-28 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
DE10349394A1 (de) * 2003-10-21 2005-05-25 Marabuwerke Gmbh & Co. Kg UV-härtendes Bindemittel für Farben oder Lacke zur Bedruckung von Glas und Verfahren zur Bedruckung von Glassubstraten
US20050101684A1 (en) * 2003-11-06 2005-05-12 Xiaorong You Curable compositions and rapid prototyping process using the same
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
US20050158660A1 (en) * 2004-01-20 2005-07-21 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
WO2005070989A2 (en) * 2004-01-27 2005-08-04 Ciba Specialty Chemicals Holding Inc. Thermally stable cationic photocurable compositions
CA2557226A1 (en) * 2004-03-22 2005-10-06 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable compositions
WO2006029095A1 (en) * 2004-09-03 2006-03-16 Henkel Corporation Photoinitiated cationic epoxy compositions
US20110144271A1 (en) 2005-06-16 2011-06-16 Jsr Corporation Radioactive ray-curable liquid resin composition for use in optical stereolithography, and optically shaped article produced by curing the composition
JP4873239B2 (ja) * 2005-09-28 2012-02-08 Ｄｉｃ株式会社 紫外線硬化性樹脂組成物
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
DE102006000867A1 (de) * 2006-01-05 2007-07-12 Marabuwerke Gmbh & Co. Kg UV-härtende Glasdruckfarbe und UV-härtender Glasdrucklack sowie Verfahren zum Bedrucken von Glassubstraten
US20080103226A1 (en) 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
JP2008201913A (ja) 2007-02-20 2008-09-04 Fujifilm Corp 光重合性組成物
US9207373B2 (en) 2007-04-10 2015-12-08 Stoncor Group, Inc. Methods for fabrication and highway marking usage of agglomerated retroreflective beads
KR100959190B1 (ko) * 2007-12-21 2010-05-24 제일모직주식회사 현상액에 용해 가능한 근자외선 바닥 반사방지막 조성물 및이를 이용한 패턴화된 재료 형성 방법
CN102181099B (zh) * 2011-03-07 2013-03-27 黑龙江省润特科技有限公司 紫外光深度交联无卤阻燃乙丙橡胶电缆料及其绝缘或护套层的制备方法
CN102161801B (zh) * 2011-03-07 2013-03-27 沭阳优唯新材料有限公司 紫外光深度交联三元乙丙橡胶电缆料及其绝缘或护套层的制备方法
CN102153802B (zh) * 2011-03-07 2013-03-27 沭阳优唯新材料有限公司 紫外光深度交联无卤阻燃聚烯烃电缆料及其绝缘或护套层的制备方法
ES2853948T3 (es) 2012-02-17 2021-09-20 Huntsman Advanced Mat Americas Llc Mezcla de benzoxazina, epoxi y anhídrido
JP6083116B2 (ja) * 2012-02-29 2017-02-22 セイコーエプソン株式会社 光硬化型インクジェットインクセット及びこれを用いたインクジェット記録方法
JP6414411B2 (ja) 2013-08-09 2018-10-31 ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． 積層造形用の低粘度液状放射線硬化型歯科アライナー成形型用樹脂組成物
US10414855B2 (en) 2014-05-14 2019-09-17 Huntsman Advanced Materials Americas Llc Multifunctional polyamides for protective coatings
CN106796392B (zh) 2014-06-23 2021-12-14 卡本有限公司 由具有多重硬化机制的材料制备聚氨酯三维物体的方法
JP6578660B2 (ja) * 2015-01-22 2019-09-25 富士ゼロックス株式会社 三次元造形用支持材、三次元造形用組成物セット、および三次元造形装置、三次元造形物の製造方法
KR101853387B1 (ko) * 2015-03-27 2018-04-30 동우 화인켐 주식회사 플렉서블 디스플레이용 하드코팅 필름
JP6372887B2 (ja) * 2015-05-14 2018-08-15 信越化学工業株式会社 有機膜材料、有機膜形成方法、パターン形成方法、及び化合物
WO2016193032A1 (en) 2015-06-02 2016-12-08 Basf Se Diglycidyl ethers of tetrahydrofuran diglycol derivatives and oligomers thereof as curable epoxy resins
JP6097815B1 (ja) 2015-12-18 2017-03-15 古河電気工業株式会社 接着剤組成物、これを用いた被着体の接合方法および積層体の製造方法
KR102364545B1 (ko) 2016-06-16 2022-02-21 헌츠만 페트로케미칼 엘엘씨 에폭시 수지 조성물을 경화시키기 위한 배합물
JP6977026B2 (ja) 2016-08-19 2021-12-08 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー 付加物及びその使用
WO2018087868A1 (ja) * 2016-11-10 2018-05-17 積水化学工業株式会社 エポキシフラン化合物、その製造方法、エポキシフラン化合物を含む硬化性組成物、及びその硬化物
CN109923145B (zh) 2017-02-06 2022-11-29 亨斯迈石油化学有限责任公司 用于环氧树脂的固化剂
WO2018144975A1 (en) 2017-02-06 2018-08-09 Huntsman Petrochemical Llc Curing agent for epoxy resins
US11945152B2 (en) * 2017-03-06 2024-04-02 Maxell, Ltd. Model material ink set, support material composition, ink set, three-dimensional shaped object, and method for manufacturing three-dimensional shaped object
CN110636912B (zh) 2017-06-12 2022-09-20 奥梅特电路股份有限公司 具良好工作寿命及热传导性的金属粘合性组合物、其制造方法及其用途
WO2019044803A1 (ja) * 2017-08-30 2019-03-07 Dic株式会社 エポキシ樹脂改質剤
CN112074395A (zh) * 2018-03-02 2020-12-11 福姆实验室公司 潜伏性固化树脂及相关方法
EP3597668A1 (en) 2018-07-20 2020-01-22 Clariant International Ltd Photo-curable resin composition for 3d printing
CN109897189B (zh) * 2019-02-27 2021-05-25 黑龙江省科学院石油化学研究院 一种原位接枝氧化石墨烯改性耐高温环氧树脂复合材料的制备方法
CN111072871A (zh) * 2019-12-24 2020-04-28 无锡市腰果新材料有限公司 一种耐高温sla型3d打印光固化材料及其制备方法
RU2757595C1 (ru) * 2020-08-31 2021-10-19 Федеральное государственное бюджетное образовательное учреждение высшего образования «Кабардино-Балкарский государственный университет им. Х.М. Бербекова» (КБГУ) Полимерный композиционный материал
US12325182B2 (en) 2020-10-13 2025-06-10 Cabot Corporation Conductive photo-curable compositions for additive manufacturing
EP4298145B1 (en) 2021-02-25 2025-02-19 Huntsman Advanced Materials (Switzerland) GmbH One component polymerizable composition for trickle impregnation
WO2022233736A1 (en) * 2021-05-07 2022-11-10 Basf Se Radiation-curable composition to produce support sub-structure for 3d photopolymer jetting
CN115947658B (zh) * 2022-12-28 2025-02-28 Tcl华星光电技术有限公司 配向膜添加剂、配向膜、液晶显示面板及其制作方法
WO2024203363A1 (ja) * 2023-03-24 2024-10-03 株式会社Adeka 抗菌性組成物、形成用材料、硬化物及び抗菌方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH490444A (de) * 1967-04-19 1970-05-15 Ciba Geigy Neue, heisshärtbare Mischungen aus Polyepoxydverbindungen, Polyestern und Polycarbonsäureanhydriden
CA1240439A (en) * 1983-02-07 1988-08-09 Union Carbide Corporation Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials having primary hydroxyl content
JPS61500974A (ja) * 1983-10-28 1986-05-15 ロクタイト．コ−ポレ−シヨン ２つの硬化タイプのプレポリマ−を含む光硬化性組成物
US4575330A (en) * 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
EP0222582B1 (en) * 1985-11-07 1990-05-09 Uvexs Incorporated Epoxy siloxy u.v. curable polymeric composition
DE3880642T2 (de) * 1987-12-08 1993-11-18 Mitsui Petrochemical Ind Zusammensetzung , mit aktiven Strahlen härtbar, und Medium für die optische Registrierung mit dieser gehärteten Zusammensetzung.
ATE161860T1 (de) * 1988-02-19 1998-01-15 Asahi Denka Kogyo Kk Kunststoffzusammensetzung für optisches modellieren
JPH07103218B2 (ja) * 1988-09-13 1995-11-08 旭電化工業株式会社 光学的造形用樹脂組成物
TW363999B (en) * 1991-06-04 1999-07-11 Vantico Ag Photosensitive compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018178423A2 (es) 2017-03-31 2018-10-04 Centro Tecnologico De Nanomateriales Avanzados, S.L. Composición de resina curable por radiación y procedimiento para su obtención

Also Published As

Publication number Publication date
ATE151085T1 (de) 1997-04-15
JP3203461B2 (ja) 2001-08-27
US5476748A (en) 1995-12-19
DE59306034D1 (de) 1997-05-07
CA2111718C (en) 2004-10-05
JPH06228413A (ja) 1994-08-16
CA2111718A1 (en) 1994-06-22
EP0605361A3 (de) 1995-02-22
EP0605361A2 (de) 1994-07-06
EP0605361B1 (de) 1997-04-02
TW269017B (en, 2012) 1996-01-21
KR940015712A (ko) 1994-07-21
AU5252493A (en) 1994-06-30
AU658780B2 (en) 1995-04-27
KR100282273B1 (ko) 2001-03-02

Similar Documents

Publication Publication Date Title
ES2100513T3 (es) Composiciones fotosensibles.
CA2063982A1 (en) Photosensitive composition based on acrylates
FI914969A0 (fi) Nestemäinen, säteilyn avulla kovettuva päällystysmassa lasipintojen päällystykseen
ATE187347T1 (de) Bindungssystem für gleitbretter, insbesondere snowbords
TW349988B (en) Adhesive compositions for electronic applications
MX166968B (es) Composiciones de revestimiento de componentes multiples que comprende un polimero que contiene anhidrido, un componente de glicidilo y un componente anhidrido monomerico u oligomerico
ES2085820T3 (es) Mezclas polimerizables que contienen tetraacrilatos.
ES2053997T3 (es) Composicion de revestimiento de multiples componentes que comprende un polimero que contiene anhidrido, un componente glicidilico y un catalizador de fosfonio.
BR9903416A (pt) Adesivos diluìveis na água para lacas "soft-feel".
KR950009363A (ko) 감광성 수지 조성물
ES2170753T3 (es) Composicion de resina epoxi y aplicaciones, en particular en las estructuras compuestas.
TW357180B (en) An epoxy resin composition and semiconductor device sealed with the above epoxy resin composition
EP0818511A3 (en) Curable liquid-form composition, cured product of the same, and electronic part
JPS56100817A (en) Photosetting resin composition
DK0715636T3 (da) Allyl-epoxy-IPN
HU9400477D0 (en) Hair spay compositions containing fluorosurfactant
EP0347800A3 (en) Toner for electrostatic images
EP0369527A3 (en) Curable resin compositions
AU4484785A (en) Photopolymerizable resins
EP0355926A3 (en) Alkenyl-modified polyimides
GR3020670T3 (en) Phosporous containing resin.
ES2073848T5 (es) Agente aglutinante endurecible y procedimiento para su preparacion.
KR920012370A (ko) 플렉시블 인쇄 배선판용 접착제 조성물
JPS56125429A (en) Curable resin composition
MY105717A (en) Adhesive composition.

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 605361

Country of ref document: ES