DK0715636T3 - Allyl-epoxy-IPN - Google Patents

Allyl-epoxy-IPN

Info

Publication number
DK0715636T3
DK0715636T3 DK94926176.2T DK94926176T DK0715636T3 DK 0715636 T3 DK0715636 T3 DK 0715636T3 DK 94926176 T DK94926176 T DK 94926176T DK 0715636 T3 DK0715636 T3 DK 0715636T3
Authority
DK
Denmark
Prior art keywords
epoxy
compounds
epoxy resin
allyl
network forming
Prior art date
Application number
DK94926176.2T
Other languages
English (en)
Inventor
Jan Andre Jozef Schutyser
Antonius Johannes Wilhel Buser
Original Assignee
Akzo Nobel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel Nv filed Critical Akzo Nobel Nv
Application granted granted Critical
Publication of DK0715636T3 publication Critical patent/DK0715636T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
DK94926176.2T 1993-08-23 1994-08-10 Allyl-epoxy-IPN DK0715636T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9301456 1993-08-23

Publications (1)

Publication Number Publication Date
DK0715636T3 true DK0715636T3 (da) 1998-04-27

Family

ID=19862789

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94926176.2T DK0715636T3 (da) 1993-08-23 1994-08-10 Allyl-epoxy-IPN

Country Status (11)

Country Link
EP (1) EP0715636B1 (da)
JP (1) JPH09501724A (da)
KR (1) KR960703955A (da)
CN (1) CN1131955A (da)
AT (1) ATE158317T1 (da)
CA (1) CA2170033A1 (da)
DE (1) DE69405766T2 (da)
DK (1) DK0715636T3 (da)
ES (1) ES2107247T3 (da)
GR (1) GR3025317T3 (da)
WO (1) WO1995006075A1 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2199390A1 (en) * 1994-09-08 1996-03-14 Jan Andre Jozef Schutyser Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
WO2011005420A1 (en) 2009-06-22 2011-01-13 Dow Global Technologies Inc. Hardener composition for epoxy resins
JP5547678B2 (ja) * 2011-03-14 2014-07-16 住友ベークライト株式会社 積層板の製造方法
JP5579642B2 (ja) * 2011-03-14 2014-08-27 住友ベークライト株式会社 積層板の製造方法
CN103444276A (zh) * 2011-03-14 2013-12-11 住友电木株式会社 积层用预浸料
US20150166825A1 (en) * 2012-09-07 2015-06-18 Dow Global Technologies Llc Toughened epoxy resin formulations

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
JPH04108860A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Works Ltd 熱硬化性樹脂組成物
JP2823704B2 (ja) * 1990-12-14 1998-11-11 住友ベークライト株式会社 半導体封止用樹脂組成物

Also Published As

Publication number Publication date
DE69405766D1 (en) 1997-10-23
ES2107247T3 (es) 1997-11-16
KR960703955A (ko) 1996-08-31
WO1995006075A1 (en) 1995-03-02
EP0715636B1 (en) 1997-09-17
CA2170033A1 (en) 1995-03-02
GR3025317T3 (en) 1998-02-27
JPH09501724A (ja) 1997-02-18
ATE158317T1 (de) 1997-10-15
EP0715636A1 (en) 1996-06-12
DE69405766T2 (de) 1998-02-26
CN1131955A (zh) 1996-09-25

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