ATE158317T1 - Allyl-epoxy-ipn - Google Patents

Allyl-epoxy-ipn

Info

Publication number
ATE158317T1
ATE158317T1 AT94926176T AT94926176T ATE158317T1 AT E158317 T1 ATE158317 T1 AT E158317T1 AT 94926176 T AT94926176 T AT 94926176T AT 94926176 T AT94926176 T AT 94926176T AT E158317 T1 ATE158317 T1 AT E158317T1
Authority
AT
Austria
Prior art keywords
epoxy
compounds
epoxy resin
network forming
forming compounds
Prior art date
Application number
AT94926176T
Other languages
English (en)
Inventor
Jan Andre Jozef Schutyser
Antonius Johannes Wilhel Buser
Original Assignee
Akzo Nobel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel Nv filed Critical Akzo Nobel Nv
Application granted granted Critical
Publication of ATE158317T1 publication Critical patent/ATE158317T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • B32B2307/3065Flame resistant or retardant, fire resistant or retardant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00Epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT94926176T 1993-08-23 1994-08-10 Allyl-epoxy-ipn ATE158317T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9301456 1993-08-23

Publications (1)

Publication Number Publication Date
ATE158317T1 true ATE158317T1 (de) 1997-10-15

Family

ID=19862789

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94926176T ATE158317T1 (de) 1993-08-23 1994-08-10 Allyl-epoxy-ipn

Country Status (11)

Country Link
EP (1) EP0715636B1 (de)
JP (1) JPH09501724A (de)
KR (1) KR960703955A (de)
CN (1) CN1131955A (de)
AT (1) ATE158317T1 (de)
CA (1) CA2170033A1 (de)
DE (1) DE69405766T2 (de)
DK (1) DK0715636T3 (de)
ES (1) ES2107247T3 (de)
GR (1) GR3025317T3 (de)
WO (1) WO1995006075A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2124588T3 (es) * 1994-09-08 1999-02-01 Akzo Nobel Nv Composicion de resina epoxidica que contiene alilo que comprende un copolimero de un anhidrido etilenicamente insaturado y un compuesto vinilico.
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
SG176923A1 (en) 2009-06-22 2012-01-30 Dow Global Technologies Llc Hardener composition for epoxy resins
JP5579642B2 (ja) * 2011-03-14 2014-08-27 住友ベークライト株式会社 積層板の製造方法
KR101907713B1 (ko) * 2011-03-14 2018-10-12 스미토모 베이클리트 컴퍼니 리미티드 빌드업용 프리프레그
JP5547678B2 (ja) * 2011-03-14 2014-07-16 住友ベークライト株式会社 積層板の製造方法
KR20150054788A (ko) * 2012-09-07 2015-05-20 다우 글로벌 테크놀로지스 엘엘씨 강인화 에폭시 수지 제제

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
JPH04108860A (ja) * 1990-08-28 1992-04-09 Matsushita Electric Works Ltd 熱硬化性樹脂組成物
JP2823704B2 (ja) * 1990-12-14 1998-11-11 住友ベークライト株式会社 半導体封止用樹脂組成物

Also Published As

Publication number Publication date
DK0715636T3 (da) 1998-04-27
DE69405766D1 (en) 1997-10-23
DE69405766T2 (de) 1998-02-26
ES2107247T3 (es) 1997-11-16
GR3025317T3 (en) 1998-02-27
CN1131955A (zh) 1996-09-25
EP0715636B1 (de) 1997-09-17
KR960703955A (ko) 1996-08-31
CA2170033A1 (en) 1995-03-02
EP0715636A1 (de) 1996-06-12
JPH09501724A (ja) 1997-02-18
WO1995006075A1 (en) 1995-03-02

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee