ATE158317T1 - Allyl-epoxy-ipn - Google Patents
Allyl-epoxy-ipnInfo
- Publication number
- ATE158317T1 ATE158317T1 AT94926176T AT94926176T ATE158317T1 AT E158317 T1 ATE158317 T1 AT E158317T1 AT 94926176 T AT94926176 T AT 94926176T AT 94926176 T AT94926176 T AT 94926176T AT E158317 T1 ATE158317 T1 AT E158317T1
- Authority
- AT
- Austria
- Prior art keywords
- epoxy
- compounds
- epoxy resin
- network forming
- forming compounds
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2363/00—Epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9301456 | 1993-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE158317T1 true ATE158317T1 (de) | 1997-10-15 |
Family
ID=19862789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94926176T ATE158317T1 (de) | 1993-08-23 | 1994-08-10 | Allyl-epoxy-ipn |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP0715636B1 (de) |
JP (1) | JPH09501724A (de) |
KR (1) | KR960703955A (de) |
CN (1) | CN1131955A (de) |
AT (1) | ATE158317T1 (de) |
CA (1) | CA2170033A1 (de) |
DE (1) | DE69405766T2 (de) |
DK (1) | DK0715636T3 (de) |
ES (1) | ES2107247T3 (de) |
GR (1) | GR3025317T3 (de) |
WO (1) | WO1995006075A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996007683A1 (en) * | 1994-09-08 | 1996-03-14 | Akzo Nobel N.V. | Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound |
US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
US20040101689A1 (en) | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
SG176923A1 (en) | 2009-06-22 | 2012-01-30 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
JP5547678B2 (ja) * | 2011-03-14 | 2014-07-16 | 住友ベークライト株式会社 | 積層板の製造方法 |
WO2012124307A1 (ja) * | 2011-03-14 | 2012-09-20 | 住友ベークライト株式会社 | ビルドアップ用プリプレグ |
JP5579642B2 (ja) * | 2011-03-14 | 2014-08-27 | 住友ベークライト株式会社 | 積層板の製造方法 |
SG11201501745VA (en) * | 2012-09-07 | 2015-04-29 | Dow Global Technologies Llc | Toughened epoxy resin formulations |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
JPH04108860A (ja) * | 1990-08-28 | 1992-04-09 | Matsushita Electric Works Ltd | 熱硬化性樹脂組成物 |
JP2823704B2 (ja) * | 1990-12-14 | 1998-11-11 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物 |
-
1994
- 1994-08-10 KR KR1019960700885A patent/KR960703955A/ko not_active Application Discontinuation
- 1994-08-10 JP JP7507310A patent/JPH09501724A/ja active Pending
- 1994-08-10 WO PCT/EP1994/002664 patent/WO1995006075A1/en active IP Right Grant
- 1994-08-10 EP EP94926176A patent/EP0715636B1/de not_active Expired - Lifetime
- 1994-08-10 CA CA002170033A patent/CA2170033A1/en not_active Abandoned
- 1994-08-10 ES ES94926176T patent/ES2107247T3/es not_active Expired - Lifetime
- 1994-08-10 CN CN94193551A patent/CN1131955A/zh active Pending
- 1994-08-10 DE DE69405766T patent/DE69405766T2/de not_active Expired - Fee Related
- 1994-08-10 AT AT94926176T patent/ATE158317T1/de not_active IP Right Cessation
- 1994-08-10 DK DK94926176.2T patent/DK0715636T3/da active
-
1997
- 1997-11-07 GR GR970402959T patent/GR3025317T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
WO1995006075A1 (en) | 1995-03-02 |
CA2170033A1 (en) | 1995-03-02 |
DK0715636T3 (da) | 1998-04-27 |
EP0715636B1 (de) | 1997-09-17 |
EP0715636A1 (de) | 1996-06-12 |
CN1131955A (zh) | 1996-09-25 |
DE69405766D1 (en) | 1997-10-23 |
JPH09501724A (ja) | 1997-02-18 |
DE69405766T2 (de) | 1998-02-26 |
GR3025317T3 (en) | 1998-02-27 |
ES2107247T3 (es) | 1997-11-16 |
KR960703955A (ko) | 1996-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |