ES2082486T3 - Baño acido para la deposicion galvanica de cobre y su utilizacion. - Google Patents

Baño acido para la deposicion galvanica de cobre y su utilizacion.

Info

Publication number
ES2082486T3
ES2082486T3 ES92916259T ES92916259T ES2082486T3 ES 2082486 T3 ES2082486 T3 ES 2082486T3 ES 92916259 T ES92916259 T ES 92916259T ES 92916259 T ES92916259 T ES 92916259T ES 2082486 T3 ES2082486 T3 ES 2082486T3
Authority
ES
Spain
Prior art keywords
pct
acid bath
sec
bath
date
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92916259T
Other languages
English (en)
Spanish (es)
Inventor
Wolfgang Dahms
Horst Westphal
Michael Jonat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2082486T3 publication Critical patent/ES2082486T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
ES92916259T 1991-08-07 1992-07-22 Baño acido para la deposicion galvanica de cobre y su utilizacion. Expired - Lifetime ES2082486T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4126502A DE4126502C1 (enExample) 1991-08-07 1991-08-07

Publications (1)

Publication Number Publication Date
ES2082486T3 true ES2082486T3 (es) 1996-03-16

Family

ID=6438067

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92916259T Expired - Lifetime ES2082486T3 (es) 1991-08-07 1992-07-22 Baño acido para la deposicion galvanica de cobre y su utilizacion.

Country Status (8)

Country Link
US (1) US5433840A (enExample)
EP (1) EP0598763B1 (enExample)
JP (1) JP3121346B2 (enExample)
AT (1) ATE131546T1 (enExample)
CA (1) CA2115062C (enExample)
DE (2) DE4126502C1 (enExample)
ES (1) ES2082486T3 (enExample)
WO (1) WO1993003204A1 (enExample)

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DE4126502C1 (enExample) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
RU2166567C2 (ru) * 1995-09-22 2001-05-10 Сиркюи Фуаль Люксембург Трейдинг С.А.Р.Л. Способ изготовления электроосажденной медной фольги и медная фольга, полученная этим способом
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
WO1998036042A1 (en) * 1997-02-14 1998-08-20 The Procter & Gamble Company Liquid hard-surface cleaning compositions based on specific dicapped polyalkylene glycols
US6460548B1 (en) * 1997-02-14 2002-10-08 The Procter & Gamble Company Liquid hard-surface cleaning compositions based on specific dicapped polyalkylene glycols
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
US7033463B1 (en) * 1998-08-11 2006-04-25 Ebara Corporation Substrate plating method and apparatus
WO2000014306A1 (fr) * 1998-09-03 2000-03-16 Ebara Corporation Procede et dispositif de revetement de substrat
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
EP1207730B1 (en) * 1999-08-06 2009-09-16 Ibiden Co., Ltd. Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
LU90532B1 (en) 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US6361673B1 (en) 2000-06-27 2002-03-26 Ga-Tek Inc. Electroforming cell
US6679983B2 (en) * 2000-10-13 2004-01-20 Shipley Company, L.L.C. Method of electrodepositing copper
US7074315B2 (en) 2000-10-19 2006-07-11 Atotech Deutschland Gmbh Copper bath and methods of depositing a matt copper coating
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
US6797146B2 (en) * 2000-11-02 2004-09-28 Shipley Company, L.L.C. Seed layer repair
US20020195351A1 (en) * 2001-04-12 2002-12-26 Chang Chun Plastics Co., Ltd. Copper electroplating composition for integrated circuit interconnection
JP2003105584A (ja) * 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6652731B2 (en) 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
EP1475463B2 (en) † 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
TWI400365B (zh) 2004-11-12 2013-07-01 Enthone 微電子裝置上的銅電沈積
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
US8784634B2 (en) 2006-03-30 2014-07-22 Atotech Deutschland Gmbh Electrolytic method for filling holes and cavities with metals
JP2007327127A (ja) * 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
MY156690A (en) * 2010-03-18 2016-03-15 Basf Se Composition for metal electroplating comprising leveling agent
US8691987B2 (en) 2010-09-24 2014-04-08 Andrew M. Krol Method of producing polymeric phenazonium compounds
US8735580B2 (en) 2010-09-24 2014-05-27 Andrew M. Krol Method of producing polymeric phenazonium compounds
CN103422079B (zh) * 2012-05-22 2016-04-13 比亚迪股份有限公司 一种化学镀铜液及其制备方法
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
WO2015077772A1 (en) * 2013-11-25 2015-05-28 Enthone Inc. Electrodeposition of copper
DE102014208733A1 (de) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten
JP6733314B2 (ja) * 2015-09-29 2020-07-29 三菱マテリアル株式会社 高純度銅電解精錬用添加剤と高純度銅製造方法
CA3119028A1 (en) * 2018-11-07 2020-05-14 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer

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NL291575A (enExample) * 1962-04-16
DE1293749B (de) * 1965-04-24 1969-04-30 Hoechst Ag Verfahren zur Aufarbeitung der bei der Herstellung von Sorbinsaeure durch thermische Polyesterspaltung entstandenen waessrigen Polyglykoldialkylaetherloesung
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
DE3722778A1 (de) * 1987-07-09 1989-03-09 Raschig Ag Polyalkylenglykol-naphthyl-3-sulfopropyl- diether und deren salze, verfahren zur herstellung dieser verbindungen und ihre verwendung als netzmittel in der galvanotechnik
DE3836521C2 (de) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE4126502C1 (enExample) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
JP5727189B2 (ja) 2010-10-01 2015-06-03 Ｎｅｃエンジニアリング株式会社 同期整流型電源回路
JP5752960B2 (ja) 2011-03-10 2015-07-22 ダイヤモンド電機株式会社 電磁式可変バルブタイミング装置用の制御装置
JP5838516B2 (ja) 2011-05-19 2016-01-06 株式会社ブイ・テクノロジー フォトマスク及び露光装置
JP6220278B2 (ja) 2014-01-31 2017-10-25 京葉瓦斯株式会社 テープ貼付け方法及びテープ貼付け冶具並びにテープ

Also Published As

Publication number Publication date
DE4126502C1 (enExample) 1993-02-11
WO1993003204A1 (de) 1993-02-18
EP0598763B1 (de) 1995-12-13
CA2115062C (en) 2005-11-22
JPH07505187A (ja) 1995-06-08
CA2115062A1 (en) 1993-02-18
ATE131546T1 (de) 1995-12-15
US5433840A (en) 1995-07-18
JP3121346B2 (ja) 2000-12-25
EP0598763A1 (de) 1994-06-01
DE59204703D1 (de) 1996-01-25

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