KR850001933A - 무전해 구리도금 용액 - Google Patents

무전해 구리도금 용액 Download PDF

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Publication number
KR850001933A
KR850001933A KR1019840004619A KR840004619A KR850001933A KR 850001933 A KR850001933 A KR 850001933A KR 1019840004619 A KR1019840004619 A KR 1019840004619A KR 840004619 A KR840004619 A KR 840004619A KR 850001933 A KR850001933 A KR 850001933A
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KR
South Korea
Prior art keywords
plating solution
copper plating
electroless copper
fluoropolyether
positive integer
Prior art date
Application number
KR1019840004619A
Other languages
English (en)
Other versions
KR890004582B1 (ko
Inventor
아끼시 나까소 (외 3)
Original Assignee
요꼬야마 료오지
히다찌 가세이 고오교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 요꼬야마 료오지, 히다찌 가세이 고오교 가부시끼 가이샤 filed Critical 요꼬야마 료오지
Publication of KR850001933A publication Critical patent/KR850001933A/ko
Application granted granted Critical
Publication of KR890004582B1 publication Critical patent/KR890004582B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

무전해 구리도금 용액
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. (a) 제2구리이온, 제2구리이온을 위한 착염제, 환원제 및 pH 조절제; (b) 다음식의 플루오로폴리에테르;또는
    상기식에서 각각 R은 불소이고, 부분적으로 수소 및/또는 염소로 치환될수 있고; k 및 m은 각각 0 이거나 또는 양의 정수이고(k 및 m은 동시에 0일수 없다); n,p 및 q는 각각 양의 정수이고; 및, (c)시아나이드, α,α′－디피리딜, 1,10－페난트롤린 및 그의 유도체를 구성하는 기로부터 선택된 적어도 한기로 구성됨을 특징으로 하는 무전해구리도금 용액.
  2. 제1항에 있어서, 플루오로폴리에테르가 다음 식의 플루오로폴리에테르 중의 어느 하나임을 특징으로 하는 무전해구리 도금용액;또는
    상기 식에서 r,s,t 및 u는 각각 양의 정수이다.
  3. 제1항에 있어서, 플루오로폴리에테르가50㎎/ℓ또는 그 이상의 양으로 사용됨을 특징으로 하는 무전해구리도금 용액.
  4. 제2항에 있어서, 플루오로폴리에테르가 1,000 내지 20,000의 수평균 분자량을 갖음을 특징으로 하는 무전해구리도금 용액.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840004619A 1983-08-04 1984-08-02 무전해 구리도금 용액 KR890004582B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP142686/83 1983-08-04
JP142,686 1983-08-04
JP58142686A JPS6033358A (ja) 1983-08-04 1983-08-04 無電解銅めっき液

Publications (2)

Publication Number Publication Date
KR850001933A true KR850001933A (ko) 1985-04-10
KR890004582B1 KR890004582B1 (ko) 1989-11-16

Family

ID=15321163

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840004619A KR890004582B1 (ko) 1983-08-04 1984-08-02 무전해 구리도금 용액

Country Status (6)

Country Link
US (1) US4557762A (ko)
EP (1) EP0133800B1 (ko)
JP (1) JPS6033358A (ko)
KR (1) KR890004582B1 (ko)
DE (1) DE3467187D1 (ko)
SG (1) SG20788G (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
JPS60215005A (ja) * 1984-04-10 1985-10-28 Nippon Sanmou Senshoku Kk 導電性材料
JPS6237152A (ja) * 1985-08-12 1987-02-18 松下電工株式会社 金属箔張積層板
US4695505A (en) * 1985-10-25 1987-09-22 Shipley Company Inc. Ductile electroless copper
JPH0639714B2 (ja) * 1985-12-23 1994-05-25 太陽誘電株式会社 化学銅メツキ液
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2794741B2 (ja) * 1989-01-13 1998-09-10 日立化成工業株式会社 無電解銅めっき液
JP2775997B2 (ja) * 1990-06-05 1998-07-16 松下電器産業株式会社 映像信号の階調補正装置およびテレビジョン受像機
CN1679154A (zh) * 2002-05-16 2005-10-05 新加坡国立大学 晶片级无电镀铜法和凸块制备方法,以及用于半导体晶片和微芯片的渡液
SE0403042D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
TWI347373B (en) * 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
EP1876260B1 (en) * 2006-07-07 2018-11-28 Rohm and Haas Electronic Materials LLC Improved electroless copper compositions
EP1876262A1 (en) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
CN104914103A (zh) * 2015-06-19 2015-09-16 金川集团股份有限公司 一种脱硫离子液中硫酸根含量的测定方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
JPS5178744A (ja) * 1974-12-30 1976-07-08 Hitachi Ltd Mudenkaidometsukieki
JPS5627594B2 (ko) * 1975-03-14 1981-06-25
US4059451A (en) * 1976-07-12 1977-11-22 Matsushita Electric Industrial Co., Ltd. Electroless copper plating solution
DE2632920C3 (de) * 1976-07-19 1979-04-19 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Stromlose Verkupferungslösung
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution

Also Published As

Publication number Publication date
KR890004582B1 (ko) 1989-11-16
EP0133800A1 (en) 1985-03-06
JPS6033358A (ja) 1985-02-20
SG20788G (en) 1988-07-08
EP0133800B1 (en) 1987-11-04
JPH0429740B2 (ko) 1992-05-19
DE3467187D1 (en) 1987-12-10
US4557762A (en) 1985-12-10

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