SE0403042D0 - Improved stabilization and performance of autocatalytic electroless process - Google Patents

Improved stabilization and performance of autocatalytic electroless process

Info

Publication number
SE0403042D0
SE0403042D0 SE0403042A SE0403042A SE0403042D0 SE 0403042 D0 SE0403042 D0 SE 0403042D0 SE 0403042 A SE0403042 A SE 0403042A SE 0403042 A SE0403042 A SE 0403042A SE 0403042 D0 SE0403042 D0 SE 0403042D0
Authority
SE
Sweden
Prior art keywords
bath
metal
autocatalytic
autocatalytic electroless
performance
Prior art date
Application number
SE0403042A
Other languages
English (en)
Inventor
Anders Remgaard
Original Assignee
Polymer Kompositer I Goeteborg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymer Kompositer I Goeteborg filed Critical Polymer Kompositer I Goeteborg
Priority to SE0403042A priority Critical patent/SE0403042D0/sv
Publication of SE0403042D0 publication Critical patent/SE0403042D0/sv
Priority to KR1020077016208A priority patent/KR101314035B1/ko
Priority to CN200580042943XA priority patent/CN101080512B/zh
Priority to AU2005317239A priority patent/AU2005317239B2/en
Priority to BRPI0519014-2A priority patent/BRPI0519014A2/pt
Priority to UAA200707939A priority patent/UA91995C2/ru
Priority to PCT/SE2005/001930 priority patent/WO2006065221A1/en
Priority to JP2007546613A priority patent/JP4891919B2/ja
Priority to US11/791,512 priority patent/US20080206474A1/en
Priority to CN200910205698XA priority patent/CN101693992B/zh
Priority to RU2007126815A priority patent/RU2398049C2/ru
Priority to MX2007006537A priority patent/MX2007006537A/es
Priority to EP05819079.4A priority patent/EP1828435A4/en
Priority to CA 2591411 priority patent/CA2591411C/en
Priority to IL183354A priority patent/IL183354A0/en
Priority to NO20072917A priority patent/NO20072917L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
SE0403042A 2004-12-14 2004-12-14 Improved stabilization and performance of autocatalytic electroless process SE0403042D0 (sv)

Priority Applications (16)

Application Number Priority Date Filing Date Title
SE0403042A SE0403042D0 (sv) 2004-12-14 2004-12-14 Improved stabilization and performance of autocatalytic electroless process
CA 2591411 CA2591411C (en) 2004-12-14 2005-12-13 Improved stabilization and performance of autocatalytic electroless processes
PCT/SE2005/001930 WO2006065221A1 (en) 2004-12-14 2005-12-13 Stabilization amd performance of autocatalytic electroless processes.
US11/791,512 US20080206474A1 (en) 2004-12-14 2005-12-13 Stabilization and Performance of Autocatalytic Electroless Processes
AU2005317239A AU2005317239B2 (en) 2004-12-14 2005-12-13 Stabilization amd performance of autocatalytic electroless processes.
BRPI0519014-2A BRPI0519014A2 (pt) 2004-12-14 2005-12-13 mÉtodo para deposiÇço de um substrato com um metal, objeto, banho de deposiÇço de prata sem eletricidade autocatalÍtica, e, mÉtodo para deposiÇço autocatalÍtica de prata metÁlica
UAA200707939A UA91995C2 (ru) 2004-12-14 2005-12-13 Способы нанесения покрытия металла на подкладку автокаталитическим осажденимем, ванна для осуществления способов и изделие с нанесенным покрытием
KR1020077016208A KR101314035B1 (ko) 2004-12-14 2005-12-13 자기 촉매적 무전해 공정들의 안정성 및 수행
JP2007546613A JP4891919B2 (ja) 2004-12-14 2005-12-13 自己触媒無電解法の改善された安定化及び性能
CN200580042943XA CN101080512B (zh) 2004-12-14 2005-12-13 自催化无电工艺的稳定和性能
CN200910205698XA CN101693992B (zh) 2004-12-14 2005-12-13 自催化无电工艺的稳定和性能
RU2007126815A RU2398049C2 (ru) 2004-12-14 2005-12-13 Усовершенствованные стабилизация и рабочие характеристики автокаталитических способов нанесения покрытия методом химического восстановления
MX2007006537A MX2007006537A (es) 2004-12-14 2005-12-13 Estabilizacion y desempeno de procesos autocataliticos no electroliticos.
EP05819079.4A EP1828435A4 (en) 2004-12-14 2005-12-13 STABILIZATION AND EFFICIENCY OF AUTO CATALYTIC ELECTRICITY PROCESSES
IL183354A IL183354A0 (en) 2004-12-14 2007-05-21 Stabilization and performance of autocatalytic electroless processes
NO20072917A NO20072917L (no) 2004-12-14 2007-06-07 Autokatalytisk fremgangsmate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0403042A SE0403042D0 (sv) 2004-12-14 2004-12-14 Improved stabilization and performance of autocatalytic electroless process

Publications (1)

Publication Number Publication Date
SE0403042D0 true SE0403042D0 (sv) 2004-12-14

Family

ID=33550639

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0403042A SE0403042D0 (sv) 2004-12-14 2004-12-14 Improved stabilization and performance of autocatalytic electroless process

Country Status (15)

Country Link
US (1) US20080206474A1 (sv)
EP (1) EP1828435A4 (sv)
JP (1) JP4891919B2 (sv)
KR (1) KR101314035B1 (sv)
CN (2) CN101080512B (sv)
AU (1) AU2005317239B2 (sv)
BR (1) BRPI0519014A2 (sv)
CA (1) CA2591411C (sv)
IL (1) IL183354A0 (sv)
MX (1) MX2007006537A (sv)
NO (1) NO20072917L (sv)
RU (1) RU2398049C2 (sv)
SE (1) SE0403042D0 (sv)
UA (1) UA91995C2 (sv)
WO (1) WO2006065221A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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WO2009139366A1 (ja) * 2008-05-15 2009-11-19 日鉱金属株式会社 基板
DE102008063030A1 (de) 2008-12-23 2010-06-24 Bundesdruckerei Gmbh Sicherheits- und/oder Wertdokument mit einer leitfähigen Struktur und Verfahren zu dessen Herstellung
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
CN107002242B (zh) 2014-12-17 2020-02-11 埃托特克德国有限公司 用于化学镀钯的镀浴组合物和方法
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same
JP7080781B2 (ja) * 2018-09-26 2022-06-06 株式会社東芝 多孔質層の形成方法、エッチング方法、物品の製造方法、半導体装置の製造方法、及びめっき液

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Also Published As

Publication number Publication date
JP2008523253A (ja) 2008-07-03
CN101080512A (zh) 2007-11-28
RU2398049C2 (ru) 2010-08-27
UA91995C2 (ru) 2010-09-27
AU2005317239A1 (en) 2006-06-22
MX2007006537A (es) 2007-08-20
WO2006065221A1 (en) 2006-06-22
BRPI0519014A2 (pt) 2008-12-23
NO20072917L (no) 2007-09-14
RU2007126815A (ru) 2009-01-27
CN101693992A (zh) 2010-04-14
CN101080512B (zh) 2011-08-17
JP4891919B2 (ja) 2012-03-07
CN101693992B (zh) 2012-12-26
KR20070092988A (ko) 2007-09-14
IL183354A0 (en) 2007-09-20
US20080206474A1 (en) 2008-08-28
KR101314035B1 (ko) 2013-10-02
CA2591411A1 (en) 2006-06-22
EP1828435A4 (en) 2014-10-29
AU2005317239B2 (en) 2010-03-04
CA2591411C (en) 2014-01-28
EP1828435A1 (en) 2007-09-05

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