WO2009124180A3 - In situ plating and soldering of materials covered with a surface film - Google Patents

In situ plating and soldering of materials covered with a surface film Download PDF

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Publication number
WO2009124180A3
WO2009124180A3 PCT/US2009/039282 US2009039282W WO2009124180A3 WO 2009124180 A3 WO2009124180 A3 WO 2009124180A3 US 2009039282 W US2009039282 W US 2009039282W WO 2009124180 A3 WO2009124180 A3 WO 2009124180A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating
pattern
immersion
bath
substrate
Prior art date
Application number
PCT/US2009/039282
Other languages
French (fr)
Other versions
WO2009124180A2 (en
Inventor
Robert J. Von Gutfeld
Alan C. West
Original Assignee
The Trustees Of Columbia University In The City Of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Trustees Of Columbia University In The City Of New York filed Critical The Trustees Of Columbia University In The City Of New York
Publication of WO2009124180A2 publication Critical patent/WO2009124180A2/en
Publication of WO2009124180A3 publication Critical patent/WO2009124180A3/en
Priority to US12/897,379 priority Critical patent/US20110042201A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Abstract

The disclosed subject matter provides systems and methods for etching and/or metal plating of substrate materials. An exemplary method in accordance with the disclosed subject matter for metal-plating or etching a substrate includes submerging portions of the substrate in a first bath of chemical solution, performing in-situ laser ablation of the substrate to achieve an immersion plated pattern with a first cation, plating-up the immersion plated pattern with the first cation in the first bath, and plating-up the immersion plated pattern with a second cation in a second bath. The same or another exemplary method can utilize a reel-to-reel system. The plating-up can begin after patterning by immersion plating is complete. Further, a single plating pattern can be used to define a pattern and the same bath can be used to plate the immersion pattern, thereby achieving a uniform thickness of the pattern.
PCT/US2009/039282 2008-04-02 2009-04-02 In situ plating and soldering of materials covered with a surface film WO2009124180A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/897,379 US20110042201A1 (en) 2008-04-02 2010-10-04 In situ Plating And Soldering Of Materials Covered With A Surface Film

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US4163008P 2008-04-02 2008-04-02
US61/041,630 2008-04-02
US7859608P 2008-07-07 2008-07-07
US61/078,596 2008-07-07
US11749908P 2008-11-24 2008-11-24
US61/117,499 2008-11-24
US11953508P 2008-12-03 2008-12-03
US61/119,535 2008-12-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/897,379 Continuation US20110042201A1 (en) 2008-04-02 2010-10-04 In situ Plating And Soldering Of Materials Covered With A Surface Film

Publications (2)

Publication Number Publication Date
WO2009124180A2 WO2009124180A2 (en) 2009-10-08
WO2009124180A3 true WO2009124180A3 (en) 2010-04-29

Family

ID=41136110

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/039282 WO2009124180A2 (en) 2008-04-02 2009-04-02 In situ plating and soldering of materials covered with a surface film

Country Status (2)

Country Link
US (1) US20110042201A1 (en)
WO (1) WO2009124180A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8496799B2 (en) 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
US8057587B2 (en) * 2008-05-12 2011-11-15 Michael Beeck Composition for coloring solder
FR2940155B1 (en) * 2008-12-19 2011-03-04 Commissariat Energie Atomique METHOD FOR ABLUSING A SURFACE LAYER OF A WALL, AND ASSOCIATED DEVICE
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
JP5712872B2 (en) * 2011-08-31 2015-05-07 株式会社オートネットワーク技術研究所 Aluminum base terminal bracket
US9039887B2 (en) * 2012-05-14 2015-05-26 United Technologies Corporation Component finishing method and assembly
US9786634B2 (en) * 2015-07-17 2017-10-10 National Taiwan University Interconnection structures and methods for making the same
JP7034645B2 (en) * 2017-09-22 2022-03-14 株式会社Ｓｃｒｅｅｎホールディングス Board processing method and board processing equipment
US11638331B2 (en) 2018-05-29 2023-04-25 Kontak LLC Multi-frequency controllers for inductive heating and associated systems and methods
US11555473B2 (en) 2018-05-29 2023-01-17 Kontak LLC Dual bladder fuel tank
CN110587143B (en) * 2019-08-28 2020-10-13 中国科学院长春光学精密机械与物理研究所 Curved surface FSS laser etching equipment and method
CN115595566A (en) * 2022-11-17 2023-01-13 西华大学（Cn） Environment-friendly, energy-saving, efficient and flexible chemical plating device and method

Citations (3)

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Publication number Priority date Publication date Assignee Title
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
WO2006086407A2 (en) * 2005-02-08 2006-08-17 The University Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US20080029152A1 (en) * 2006-08-04 2008-02-07 Erel Milshtein Laser scribing apparatus, systems, and methods

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3957452A (en) * 1974-12-12 1976-05-18 General Cable Corporation Procedure for copper plating aluminium wire and product thereof
US4283259A (en) * 1979-05-08 1981-08-11 International Business Machines Corporation Method for maskless chemical and electrochemical machining
DE2943107C2 (en) * 1979-10-25 1984-07-26 Robert 6600 Saarbrücken Langen Procedure for derusting
JPH0621420B2 (en) * 1985-08-20 1994-03-23 東燃株式会社 Carbon fiber surface treatment method
US4877644A (en) * 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
FR2641718B1 (en) * 1989-01-17 1992-03-20 Ardt METHOD FOR CLEANING THE SURFACE OF SOLID MATERIALS AND DEVICE FOR CARRYING OUT THIS METHOD, USING A PULSE PULSE LASER, SHORT PULSES, OF WHICH THE BEAM FOCUSES ON THE SURFACE TO BE CLEANED
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
JP2001140100A (en) * 1999-11-12 2001-05-22 Fuji Photo Film Co Ltd Device for electrolyzing metallic sheet and electrode for electrolyzing metallic sheet
DE202006010188U1 (en) * 2005-12-28 2007-05-10 Marantec Antriebs- Und Steuerungstechnik Gmbh & Co. Kg door drive
US7879685B2 (en) * 2006-08-04 2011-02-01 Solyndra, Inc. System and method for creating electric isolation between layers comprising solar cells

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
WO2006086407A2 (en) * 2005-02-08 2006-08-17 The University Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US20080029152A1 (en) * 2006-08-04 2008-02-07 Erel Milshtein Laser scribing apparatus, systems, and methods

Also Published As

Publication number Publication date
US20110042201A1 (en) 2011-02-24
WO2009124180A2 (en) 2009-10-08

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