WO2006086407A3 - In situ plating and etching of materials covered with a surface film - Google Patents

In situ plating and etching of materials covered with a surface film Download PDF

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Publication number
WO2006086407A3
WO2006086407A3 PCT/US2006/004329 US2006004329W WO2006086407A3 WO 2006086407 A3 WO2006086407 A3 WO 2006086407A3 US 2006004329 W US2006004329 W US 2006004329W WO 2006086407 A3 WO2006086407 A3 WO 2006086407A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching
plating
systems
coating materials
methods
Prior art date
Application number
PCT/US2006/004329
Other languages
French (fr)
Other versions
WO2006086407A2 (en
Inventor
Gutfeld Robert J Von
Alan West
Original Assignee
Univ Columbia University In Th
Gutfeld Robert J Von
Alan West
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Columbia University In Th, Gutfeld Robert J Von, Alan West filed Critical Univ Columbia University In Th
Publication of WO2006086407A2 publication Critical patent/WO2006086407A2/en
Publication of WO2006086407A3 publication Critical patent/WO2006086407A3/en
Priority to US11/767,461 priority Critical patent/US8529738B2/en
Priority to US12/208,287 priority patent/US8496799B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. This in situ removal of coating materials may be achieved by pulse heating of the substrate. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.
PCT/US2006/004329 2005-02-08 2006-02-08 In situ plating and etching of materials covered with a surface film WO2006086407A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/767,461 US8529738B2 (en) 2005-02-08 2007-06-22 In situ plating and etching of materials covered with a surface film
US12/208,287 US8496799B2 (en) 2005-02-08 2008-09-10 Systems and methods for in situ annealing of electro- and electroless platings during deposition

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US65087005P 2005-02-08 2005-02-08
US60/650,870 2005-02-08
US67511405P 2005-04-25 2005-04-25
US60/675,114 2005-04-25
US70087705P 2005-07-20 2005-07-20
US60/700,877 2005-07-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/767,461 Continuation-In-Part US8529738B2 (en) 2005-02-08 2007-06-22 In situ plating and etching of materials covered with a surface film

Publications (2)

Publication Number Publication Date
WO2006086407A2 WO2006086407A2 (en) 2006-08-17
WO2006086407A3 true WO2006086407A3 (en) 2006-11-23

Family

ID=36793650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/004329 WO2006086407A2 (en) 2005-02-08 2006-02-08 In situ plating and etching of materials covered with a surface film

Country Status (1)

Country Link
WO (1) WO2006086407A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8496799B2 (en) 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
US8529738B2 (en) 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
WO2008070786A1 (en) 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
WO2009124180A2 (en) * 2008-04-02 2009-10-08 The Trustees Of Columbia University In The City Of New York In situ plating and soldering of materials covered with a surface film
US8985050B2 (en) 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582478A (en) * 1968-11-14 1971-06-01 William D Kelly Method of manufacturing plated metal elements
US4348263A (en) * 1980-09-12 1982-09-07 Western Electric Company, Inc. Surface melting of a substrate prior to plating
US4395320A (en) * 1980-02-12 1983-07-26 Dainichi-Nippon Cables, Ltd. Apparatus for producing electrodeposited wires
US4895633A (en) * 1986-10-06 1990-01-23 Sumitomo Metal Industries, Ltd. Method and apparatus for molten salt electroplating of steel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582478A (en) * 1968-11-14 1971-06-01 William D Kelly Method of manufacturing plated metal elements
US4395320A (en) * 1980-02-12 1983-07-26 Dainichi-Nippon Cables, Ltd. Apparatus for producing electrodeposited wires
US4348263A (en) * 1980-09-12 1982-09-07 Western Electric Company, Inc. Surface melting of a substrate prior to plating
US4895633A (en) * 1986-10-06 1990-01-23 Sumitomo Metal Industries, Ltd. Method and apparatus for molten salt electroplating of steel

Also Published As

Publication number Publication date
WO2006086407A2 (en) 2006-08-17

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