US3582478A - Method of manufacturing plated metal elements - Google Patents

Method of manufacturing plated metal elements Download PDF

Info

Publication number
US3582478A
US3582478A US775706A US3582478DA US3582478A US 3582478 A US3582478 A US 3582478A US 775706 A US775706 A US 775706A US 3582478D A US3582478D A US 3582478DA US 3582478 A US3582478 A US 3582478A
Authority
US
United States
Prior art keywords
plating
wire
aluminum
plated
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US775706A
Inventor
William D Kelly
William D Kelly Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WILLIAM D KELLY
WILLIAM D KELLY JR
Original Assignee
WILLIAM D KELLY
WILLIAM D KELLY JR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WILLIAM D KELLY, WILLIAM D KELLY JR filed Critical WILLIAM D KELLY
Application granted granted Critical
Publication of US3582478A publication Critical patent/US3582478A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • C25D5/42Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44Aluminium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0607Wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982Coating
    • Y10T29/49986Subsequent to metal working

Definitions

  • This invention relates to metal plating and in particular to manufacturing metal plated elements.
  • the present invention comprehends an improved method of manufacturing plated elements eliminating the disadvantages of the known methods in a novel and simple manner. More specically, the invention comprehends a method of continuously forming plated elongated metal elements wherein the elements are extruded and delivered to the plating means through an inert atmosphere effectively precluding chemical changes in the surface of the metal elements thereby obviating the need for removal of such changed surface portions. Further, the invention comprehends the Working of the extruded elements in the inert atmosphere prior to the plating operation thereby to provide improved strength and other desirable characteristics.
  • the invention comprehends a method of continuously forming a plated elongated metal element comprising the steps of extruding metal into a fluid which is substantially inert relative to the extruded metal, the metal
  • the invention comprehends the provision of such a method wherein the working step com prises a step of drawing the element through a drawing die.
  • the invention comprehends the concurrent extrusion of a plurality of such elements and subsequent concurrent working and plating of the plurality thereby to further reduce the cost.
  • the invention is directed to manufacturing copper plated aluminum elements, such as wires or tubes, by extruding the aluminum elements into an inert atmosphere, drawing the aluminum elements Patented June 1, 1971 ice while maintaining them in an inert atmosphere and directly copper plating the drawn wires by passing lthem directly from the inert atmosphere into an electroplating fluid.
  • a plated elongated metal element generally designated 10 is continuously formed in an apparatus generally designated 11.
  • the plated element may comprise a copper plated aluminum wire, it being understood that other suitable material may be employed and elements formed within the scope of the invention.
  • the apparatus 11 includes an extruder generally designated 12, a drawing portion generally designated 13, and a plating portion 14.
  • the apparatus 11 is shown schematically as specific constructions of the elements thereof are well known to those -skilled in the art and require no further description here.
  • the extruder 12 comprises a conventional extruder having a pressure piston 15 arranged to extrude aluminum 16 through an extruder nozzle 17 in the lform of a wire 18.
  • the aluminum 16 is maintained at a high temperature in the extruder 12 and is permitted to cool as it passes lfrom the extruder nozzle 17 to form the continuous wire 18.
  • a take-up loop 19 is provided in the newly formed wire 18 with the size of the loop being controlled by suitable upper and lower control elements 20 and 21 herein comprising a pair of conventional electric eye sensing devices responsive to a movement of the loop 19 into the sensing area of either of the devices to permit suitable control selectively of the nozzle 17 or of the speed of the wire through the apparatus.
  • suitable upper and lower control elements 20 and 21 comprising a pair of conventional electric eye sensing devices responsive to a movement of the loop 19 into the sensing area of either of the devices to permit suitable control selectively of the nozzle 17 or of the speed of the wire through the apparatus.
  • Such controls are well known and conventional in web fed art and require no further description herein.
  • the loop 19 is provided in a chamber 22 defined by a housing 2 3 including a liquid cooling jacket 24 extending thereabout to provide an initial cooling of the extruded wire 18 in space 22.
  • Suitable means may be provided for circulating a cooling liquid, such as water W, through jacket 24.
  • a cooling liquid such as water W
  • an inlet 25 and an outlet 26 may be provided in the jacket at spaced portions thereof.
  • housing 23 is further provided with an inlet 27 for introduction of an inert gas, such as nitrogen, helium, or carbon dioxide, etc., or a reducing medium, such as hydrogen gas, preselected to prevent chemical alteration of the surface of the metal wire 18. More specifically, the gas herein prevents oxidationvof the surface of the aluminum wire 18 as it passes through the drawing portion 13 of apparatus 11 to the plating portion 14.
  • an inert gas such as nitrogen, helium, or carbon dioxide, etc.
  • a reducing medium such as hydrogen gas
  • the working of the extruded wire 18 may be eected by any suitable working method.
  • the working of the wire 18 herein is effected by a drawing of the fines, together with a further housing portion 31, a second chamber 32, and together with a third housing portion 33, a third chamber 34.
  • Means are provided for conducting the inert gas sequentially from chamber 22 through chambers 32 and 34.
  • passages 35 may be provided in plate 30 to provide communication between chamber 22 and chamber 32 and passages 36 may be provided in plate 30 to provide communication between chamber 32 and chamber 34.
  • An outlet 37 may be provided in housing 33 for conducting the inert gas therefrom, such as for recirculation through inlet 27 by suitable pump means (not shown).
  • the wire 18 is drawn through die 28 and about a pulley 38 in chamber 32 to the die 29.
  • the further drawn wire leaving die 29 may pass with one or more turns about a second capstan 39 in chamber 34 and through a sealing baille 40 into a plating chamber 41 defined by a closed tank 42 of plating portion 14.
  • the extruded wire 18 is maintained in an inert atmosphere at all times effectively precluding chemical change of its surface so that upon delivery thereof directly into the plating fluid 43 in chamber 41, the surface of the wire is suitable for plating directly thereon without need of chemical or mechanical surface treating steps.
  • the wire is worked to provide improved strength and other desirable metallurgical characteristics obviating the need for such working steps subsequent to the plating operation.
  • the flow of the inert gas through the chambers 22, 32 and 34 may be correlated with the movement of the hot extruded wire 18 therethrough the effect a desirable cooling of the wire prior to the delivery thereof into the plating fluid 43.
  • the flow of the inert gas may be coordinated with the cooling effect of the cooling jacket 24 as desired.
  • the plating apparatus 14 may comprise a conventional electroplating apparatus utilizing a direct current source 44 for suitably charging anode electrodes 45 in contact with the plating fluid, herein comprising a conventional copper plating liquid solution, and a cathode ground connection 46 to the wire.
  • the plated wire 10 may pass from chamber 41 through a sealing bushing 47 mounted on the tank wall defining chamber 41, to pass around a capstan 48 to a spooling device 49 to provide the plated wire in suitable lengths as desired.
  • a vacuum pump 50 may be provided for maintaining the chamber 41 substantially oxygen free by withdrawing such gas from the chamber 41.
  • the invention comprehends the provision of the extruded element directly from the extruder nozzle to the plating bath where working of the element is not required.
  • the extruded element in passing from the nozzle to the bath, the extruded element is maintained in an inert fluid atmosphere to prevent surface changes as discussed above, within the scope of the invention.
  • the invention has been described in connection with an inert gaseous fluid, it will be obvious to those skilled in the art that other suitable insert liquid fluids may be used as desired.
  • the plating operation has been disclosed as an electroplating operation, as will be obvious to those skilled in the art, other plating methods, such as vapor deposition, may be employed within the scope of the invention.
  • the method of continuously forming a plated elongated aluminum element comprising the steps of: extruding aluminum into a fluid which is substantially inert relative to the extruded aluminum, said aluminum being extruded to define an elongated element; working the element while maintaining it in said fluid substantially preventing chemical alteration of the surface of said element; delivering the worked element directly from said fluid into a plating fluid whereby said extruded element is delivered thereto without prior exposure to ambient atmosphere; and causing the plating fluid to plate the element.
  • the method of continuously forming a plated elongated aluminum element comprising the steps of: extruding aluminum into a fluid which is substantially inert relative to the extruded aluminum, said aluminum being extruded to define an elongated element; delivering the said element directly from said fluid into a plating fluid whereby said extruded element is delivered thereto without prior exposure to ambient atmosphere; and electroplating said element with said plating fluid.
  • the method of continuously forming copper plated aluminum wire comprising the steps of:

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Extraction Processes (AREA)

Abstract

A METHOD OF MANUFACTURING PLATED METAL ELEMENTS INCLUDING THE STEPS OF EXTRUDING AN ELEMENT INTO AN INERT ATMOSPHERE, WORKING THE METAL ELEMENT AS BY DRAWING THE SAME WHILE MAINTAINING IT IN AN INERT ATMOSPHERE TO PREVENT CHEMICAL CHANGES OF THE SURFACE MATERIAL THEREOF,

AND PLATING THE ELEMENT DIRECTLY AS IT IS DELIVERED FROM THE INERT ATMOSPHERE.

Description

June 1,1971 w. D. KELLY EIAL 3,582,478
' METMon oF MANUFACTURING PLATED META1J ELEMENTS Filed Nov. 14, 1968 Nwm INVENTORS WILLIAM I D. KELLY WILLIAM o. KELLY JR,
- W BY /jk 77 ATTORNEYS.
United States lPatent O METHOD OF MANUFACTURING PLATED lMETAL ELEMENTS William D. Kelly, 12 Blodgett St., Clarendon Hills, Ill. 60514, and William D. Kelly, Jr., 1000 Waola, La Grange, Ill. 60525 Filed Nov. 14, 1968, Ser. No. 775,706 Int. Cl. B21c 23/22; B231) 17/00; C23b 5 /58 U.S. Cl, 204--28 14 Claims ABSTRACT OF THE DISCLOSURE A method of manufacturing plated metal elements including the steps of extruding an element into an inert atmosphere, working the rnetal element as .by drawing the same while maintaining it in an inert atmosphere to prevent chemical changes of the surface material thereof, and plating the element directly as it is delivered from the inert atmosphere.
BACKGROUND OF THE INVENTION Field of the invention This invention relates to metal plating and in particular to manufacturing metal plated elements. t
Description of the prior art In ,one known method of manufacturing copper plated aluminum elements, the aluminum is lirstly chemically treated to remove the oxide coating normally formed thereon, immediately prior to the plating operation. The aluminum is then rstly plated with zinc or the like and then copper plated by substituting copper for the original plating metal. Such preparation operations are relatively expensive.
SUMMARY OF THE INVENTION The present invention comprehends an improved method of manufacturing plated elements eliminating the disadvantages of the known methods in a novel and simple manner. More specically, the invention comprehends a method of continuously forming plated elongated metal elements wherein the elements are extruded and delivered to the plating means through an inert atmosphere effectively precluding chemical changes in the surface of the metal elements thereby obviating the need for removal of such changed surface portions. Further, the invention comprehends the Working of the extruded elements in the inert atmosphere prior to the plating operation thereby to provide improved strength and other desirable characteristics.
More specilically, the invention comprehends a method of continuously forming a plated elongated metal element comprising the steps of extruding metal into a fluid which is substantially inert relative to the extruded metal, the metal |being extruded to define an elongated element, working the element While maintaining it in substantially inert fluid, delivering the worked element directly -from the inert fluid'into a plating uid, and causing the plating fluid to plate the element.
Still more specilically, the invention comprehends the provision of such a method wherein the working step com prises a step of drawing the element through a drawing die. The invention comprehends the concurrent extrusion of a plurality of such elements and subsequent concurrent working and plating of the plurality thereby to further reduce the cost.
Still more specifically, the invention is directed to manufacturing copper plated aluminum elements, such as wires or tubes, by extruding the aluminum elements into an inert atmosphere, drawing the aluminum elements Patented June 1, 1971 ice while maintaining them in an inert atmosphere and directly copper plating the drawn wires by passing lthem directly from the inert atmosphere into an electroplating fluid.
BRIEF DESCRIPTION OF THE DRAWING DESCRIPTION OF THE PREFERRED EMBODIMENT In the exemplary embodiment of the invention as disclosed in the drawing, a plated elongated metal element generally designated 10 is continuously formed in an apparatus generally designated 11. In illustrating the invention, the plated element may comprise a copper plated aluminum wire, it being understood that other suitable material may be employed and elements formed within the scope of the invention.
As shown in the drawing, the apparatus 11 includes an extruder generally designated 12, a drawing portion generally designated 13, and a plating portion 14. The apparatus 11 is shown schematically as specific constructions of the elements thereof are well known to those -skilled in the art and require no further description here. Thus, the extruder 12 comprises a conventional extruder having a pressure piston 15 arranged to extrude aluminum 16 through an extruder nozzle 17 in the lform of a wire 18. The aluminum 16 is maintained at a high temperature in the extruder 12 and is permitted to cool as it passes lfrom the extruder nozzle 17 to form the continuous wire 18. A take-up loop 19 is provided in the newly formed wire 18 with the size of the loop being controlled by suitable upper and lower control elements 20 and 21 herein comprising a pair of conventional electric eye sensing devices responsive to a movement of the loop 19 into the sensing area of either of the devices to permit suitable control selectively of the nozzle 17 or of the speed of the wire through the apparatus. Such controls are well known and conventional in web fed art and require no further description herein.
The loop 19 is provided in a chamber 22 defined by a housing 2 3 including a liquid cooling jacket 24 extending thereabout to provide an initial cooling of the extruded wire 18 in space 22. Suitable means (not shown) may be provided for circulating a cooling liquid, such as water W, through jacket 24. For this purpose, an inlet 25 and an outlet 26 may be provided in the jacket at spaced portions thereof.
As discussed above, the invention comprehends the forming of the plated wire10 without the need for removing chemically altered surface portions of the wire as conventionally form on metal, such as aluminum, by their exposure to ambient air. Thus, housing 23 is further provided with an inlet 27 for introduction of an inert gas, such as nitrogen, helium, or carbon dioxide, etc., or a reducing medium, such as hydrogen gas, preselected to prevent chemical alteration of the surface of the metal wire 18. More specifically, the gas herein prevents oxidationvof the surface of the aluminum wire 18 as it passes through the drawing portion 13 of apparatus 11 to the plating portion 14.
The working of the extruded wire 18 may be eected by any suitable working method. Illustratively, the working of the wire 18 herein is effected by a drawing of the fines, together with a further housing portion 31, a second chamber 32, and together with a third housing portion 33, a third chamber 34. Means are provided for conducting the inert gas sequentially from chamber 22 through chambers 32 and 34. Thus, passages 35 may be provided in plate 30 to provide communication between chamber 22 and chamber 32 and passages 36 may be provided in plate 30 to provide communication between chamber 32 and chamber 34. An outlet 37 may be provided in housing 33 for conducting the inert gas therefrom, such as for recirculation through inlet 27 by suitable pump means (not shown).
The wire 18 is drawn through die 28 and about a pulley 38 in chamber 32 to the die 29. The further drawn wire leaving die 29 may pass with one or more turns about a second capstan 39 in chamber 34 and through a sealing baille 40 into a plating chamber 41 defined by a closed tank 42 of plating portion 14. Thus, during the working operations, the extruded wire 18 is maintained in an inert atmosphere at all times effectively precluding chemical change of its surface so that upon delivery thereof directly into the plating fluid 43 in chamber 41, the surface of the wire is suitable for plating directly thereon without need of chemical or mechanical surface treating steps. At the same time, the wire is worked to provide improved strength and other desirable metallurgical characteristics obviating the need for such working steps subsequent to the plating operation. Still further, the flow of the inert gas through the chambers 22, 32 and 34 may be correlated with the movement of the hot extruded wire 18 therethrough the effect a desirable cooling of the wire prior to the delivery thereof into the plating fluid 43. The flow of the inert gas may be coordinated with the cooling effect of the cooling jacket 24 as desired.
The plating apparatus 14 may comprise a conventional electroplating apparatus utilizing a direct current source 44 for suitably charging anode electrodes 45 in contact with the plating fluid, herein comprising a conventional copper plating liquid solution, and a cathode ground connection 46 to the wire. The plated wire 10 may pass from chamber 41 through a sealing bushing 47 mounted on the tank wall defining chamber 41, to pass around a capstan 48 to a spooling device 49 to provide the plated wire in suitable lengths as desired. To further minimize possible attack of the wire surface prior to the effective plating thereof, a vacuum pump 50 may be provided for maintaining the chamber 41 substantially oxygen free by withdrawing such gas from the chamber 41.
In illustrating the invention, a single wire 18 has been described as being carried through the respective forming steps. The invention further comprehends the concurrent forming of a plurality of such wire as by providing a plurality of extrusion nozzles 17 and drawing dies 28, 29 with concurrent plating of the resultant drawn wires in the plating apparatus 14. Further, while the invention has been described in connection with the forming of wire or tube elements, as will be obvious to those skilled in the art, it is adaptable for plating of any extruded element. Where the element is relatively rigid, the path of the extruded element may be rectilinear.
Further, the invention comprehends the provision of the extruded element directly from the extruder nozzle to the plating bath where working of the element is not required. However, in passing from the nozzle to the bath, the extruded element is maintained in an inert fluid atmosphere to prevent surface changes as discussed above, within the scope of the invention. While the invention has been described in connection with an inert gaseous fluid, it will be obvious to those skilled in the art that other suitable insert liquid fluids may be used as desired. Further, while the plating operation has been disclosed as an electroplating operation, as will be obvious to those skilled in the art, other plating methods, such as vapor deposition, may be employed within the scope of the invention.
While we have shown and described one embodiment of our invention, it is capable of many modifications. Changes, therefore, in the construction and arrangement may be made within the spirit and scope of the invention as defined in the appended claims.
We claim:
1. The method of continuously forming a plated elongated aluminum element comprising the steps of: extruding aluminum into a fluid which is substantially inert relative to the extruded aluminum, said aluminum being extruded to define an elongated element; working the element while maintaining it in said fluid substantially preventing chemical alteration of the surface of said element; delivering the worked element directly from said fluid into a plating fluid whereby said extruded element is delivered thereto without prior exposure to ambient atmosphere; and causing the plating fluid to plate the element.
2. The method of claim 1 wherein said working step comprises a drawing step.
3. The method of claim 1 wherein said plating step comprises an electroplating step.
4. The method of claim 1 wherein said elongated element comprises a wire.
5. The method of claim 1 wherein a plurality of plated elongated elements a're concurrently similarly formed.
6. The method of claim 1 wherein said plating fluid plates the element with a metal.
7. The method of claim 1 further including removing free oxygen from the plating fluid during the last named step.
8. The method of continuously forming a plated elongated aluminum element comprising the steps of: extruding aluminum into a fluid which is substantially inert relative to the extruded aluminum, said aluminum being extruded to define an elongated element; delivering the said element directly from said fluid into a plating fluid whereby said extruded element is delivered thereto without prior exposure to ambient atmosphere; and electroplating said element with said plating fluid.
9. The method of claim 8 wherein said elongated element comprises a wire.
10. The method of claim 8 wherein a plurality of plated elongated elements are concurrently similarly formed.
11. The method of claim 8 wherein said plating fluid plates the element with a metal.
12. The method of claim 8 further including removing free oxygen from the plating fluid during the last named step.
13. The method of continuously forming copper plated aluminum wire comprising the steps of:
extruding wires of aluminum into an inert atmosphere;
drawing the extruded wires while in said inert atmosphere; and
directly copper plating the drawn wires.
14. The method of continuously forming copper plated aluminum wire of claim 13 wherein said wires are drawn while at high temperature.
References Cited UNITED STATES PATENTS 2,061,554 11/1936 Billiter 204-209 2,370,973 3/ 1945 Lang 204-28X 2,657,457 11/ 1953 Toulmin 117-107.2X 2,680,710 6/ 1954 Kenmore etal 204-28 2,762,115 9/ 1956 Gates 29-527.4X 2,871,171 1/1959 Atkinson 204-28X V3,060,053 10/ 1962 Carreker et al. 164-86X 3,481,390 12/ 1969 Veltvi et al 164--81X FREDERICK C. EDMUNDSON, Primary Examiner U.S. C1. X.R.
US775706A 1968-11-14 1968-11-14 Method of manufacturing plated metal elements Expired - Lifetime US3582478A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77570668A 1968-11-14 1968-11-14

Publications (1)

Publication Number Publication Date
US3582478A true US3582478A (en) 1971-06-01

Family

ID=25105234

Family Applications (1)

Application Number Title Priority Date Filing Date
US775706A Expired - Lifetime US3582478A (en) 1968-11-14 1968-11-14 Method of manufacturing plated metal elements

Country Status (1)

Country Link
US (1) US3582478A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650017A (en) * 1969-10-02 1972-03-21 Licencia Method and apparatus for coating a workpiece with solder
US4615952A (en) * 1982-10-29 1986-10-07 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
AT388123B (en) * 1986-05-23 1989-05-10 Evg Entwicklung Verwert Ges Installation for drawing, annealing and zinc-plating iron or steel wire at high working speed
US4891275A (en) * 1982-10-29 1990-01-02 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
WO2006086407A2 (en) * 2005-02-08 2006-08-17 The University Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US20080142367A1 (en) * 2005-02-08 2008-06-19 Von Gutfeld Robert J In situ plating and etching of materials covered with a surface film
US20080245674A1 (en) * 2005-09-02 2008-10-09 Von Gutfeld Robert J System and method for obtaining anisotropic etching of patterned substrates
US20080264801A1 (en) * 2005-04-08 2008-10-30 West Alan C Systems And Methods For Monitoring Plating And Etching Baths
US20090081386A1 (en) * 2005-02-08 2009-03-26 Von Gutfeld Robert J Systems and methods for in situ annealing of electro- and electroless platings during deposition
US20100084286A1 (en) * 2006-12-06 2010-04-08 West Alan C Microfluidic systems and methods for screening plating and etching bath compositions
US20110104396A1 (en) * 2009-11-05 2011-05-05 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650017A (en) * 1969-10-02 1972-03-21 Licencia Method and apparatus for coating a workpiece with solder
US4615952A (en) * 1982-10-29 1986-10-07 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
US4891275A (en) * 1982-10-29 1990-01-02 Norsk Hydro A.S. Aluminum shapes coated with brazing material and process of coating
AT388123B (en) * 1986-05-23 1989-05-10 Evg Entwicklung Verwert Ges Installation for drawing, annealing and zinc-plating iron or steel wire at high working speed
US8496799B2 (en) 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
WO2006086407A2 (en) * 2005-02-08 2006-08-17 The University Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
WO2006086407A3 (en) * 2005-02-08 2006-11-23 Univ Columbia University In Th In situ plating and etching of materials covered with a surface film
US20080142367A1 (en) * 2005-02-08 2008-06-19 Von Gutfeld Robert J In situ plating and etching of materials covered with a surface film
US8529738B2 (en) 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US20090081386A1 (en) * 2005-02-08 2009-03-26 Von Gutfeld Robert J Systems and methods for in situ annealing of electro- and electroless platings during deposition
US20080264801A1 (en) * 2005-04-08 2008-10-30 West Alan C Systems And Methods For Monitoring Plating And Etching Baths
US8475642B2 (en) 2005-04-08 2013-07-02 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
US20080245674A1 (en) * 2005-09-02 2008-10-09 Von Gutfeld Robert J System and method for obtaining anisotropic etching of patterned substrates
US8308929B2 (en) 2006-12-06 2012-11-13 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
US20100084286A1 (en) * 2006-12-06 2010-04-08 West Alan C Microfluidic systems and methods for screening plating and etching bath compositions
US20110104396A1 (en) * 2009-11-05 2011-05-05 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating

Similar Documents

Publication Publication Date Title
US3582478A (en) Method of manufacturing plated metal elements
US2370973A (en) Method and apparatus for producing coated wire
US2656283A (en) Method of plating wire
US2445675A (en) Apparatus for producing coated wire by continuous process
US5866195A (en) Methods for forming diamond-coated superconductor wire
DE10241964B4 (en) Coating gas generators and processes
US2371604A (en) Method of and apparatus for making metal wire, rod, strip, and the like
KR100791702B1 (en) Manufacturing methods of copper cladded aluminum wire
GB1147481A (en) Improvements in method and apparatus for producing copper foil by electrodeposition
US6951985B1 (en) Superconducting electrical cable
EP0528036B1 (en) METHOD AND APPARATUS FOR PRODUCING SUPERCONDUCTING Nb3-Al WIRE
JPH06337202A (en) Method and apparatus for adjusting cross-sectional area ratio of metal coated electric wire
DE68917588T2 (en) Method and device for the continuous etching and coating of stainless steel strips with aluminum.
US5318600A (en) Method for making a lithium anode for an electrochemical cell
KR890002742B1 (en) A combined continuous plating apparatus for hot-dip plating and vacuum deposition plating
US3692640A (en) Continuous anodic oxidation method for aluminum and alloys thereof
CN206392600U (en) Double right angle channel continuous extrusion devices
US3365330A (en) Continuous vapor deposition
CN110038918B (en) Processing technology of high-strength high-conductivity pure copper wire
US3073441A (en) Apparatus for hot-sheathing electric cables with tubular metal sheaths
US3038850A (en) Aluminum anodizing apparatus
US3874438A (en) Apparatus for the continuous casting or drawing of an extrusion body through a coolant body
FI85290B (en) ANORDNING OCH FOERFARANDE FOER FRAMSTAELLNING AV EN MYCKET TUNN METALLHINNA.
US3352350A (en) Horizontal continuous casting venting method
US4444636A (en) System for the galvanic deposition of metals such as aluminum