ES2043970T3 - Dispositivo de fijacion para un disco, asi como su aplicacion. - Google Patents
Dispositivo de fijacion para un disco, asi como su aplicacion.Info
- Publication number
- ES2043970T3 ES2043970T3 ES89112113T ES89112113T ES2043970T3 ES 2043970 T3 ES2043970 T3 ES 2043970T3 ES 89112113 T ES89112113 T ES 89112113T ES 89112113 T ES89112113 T ES 89112113T ES 2043970 T3 ES2043970 T3 ES 2043970T3
- Authority
- ES
- Spain
- Prior art keywords
- processing
- slice
- secures
- transportation
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Holding Or Fastening Of Disk On Rotational Shaft (AREA)
- Feeding Of Workpieces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
ESTE DISPOSITIVO SUJETADOR PARA DISCOS SEMICONDUCTORES (WAFER) ORIENTA Y ASEGURA EL DISCO DURANTE EL TRANSPORTE A LA POSICION DE MECANIZADO, PERO PUEDE PASAR FACILMENTE A UNA POSICION LIBRE DE LA SUPERFICIE SUPERIOR DE MECANIZADO, O BIEN ASEGURA LA POSICION WAFER CON AYUDA DE UN ANILLO QUE PERMANECE EN LA POSICION DE FUNCIONAMIENTO. DE ESTE MODO LA SUPERFICIE DEL DISCO FUNCIONA POR COMPLETO O CON UNA MINIMA PERDIDA DE RENDIMIENTO, Y AL MISMO TIEMPO LA MECANICA DE TRANSPORTE ESTA PROTEGIDA PARA UN OPTIMO CUMPLIMIENTO DE SUS FUNCIONES, COMO POR EJEMPLO EL RECUBRIMIENTO POR CAPAS O LA CAUTERIZACION. TODAS LAS PARTES QUE FUNCIONAN PERMANENTEMENTE PUEDEN CAMBIARSE CON FACILIDAD. EN CASO DE QUE EL DISCO SE QUEDE CLAVADO EN LA ESTACION DE MECANIZADO, SE ARRANCA MEDIANTE UN MECANISMO DE SEGURIDAD DE TRANSPORTE EN FORMA DE LLAVE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH272288 | 1988-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2043970T3 true ES2043970T3 (es) | 1994-01-01 |
Family
ID=4240139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89112113T Expired - Lifetime ES2043970T3 (es) | 1988-07-15 | 1989-07-03 | Dispositivo de fijacion para un disco, asi como su aplicacion. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5037262A (es) |
EP (1) | EP0350752B1 (es) |
JP (1) | JP2927452B2 (es) |
AT (1) | ATE95949T1 (es) |
DE (1) | DE58905888D1 (es) |
ES (1) | ES2043970T3 (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111318500A (zh) * | 2020-02-03 | 2020-06-23 | 徐州鑫晶半导体科技有限公司 | 切割后硅棒的脱胶装置和方法 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228501A (en) * | 1986-12-19 | 1993-07-20 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism and heater/cooler |
US5484011A (en) * | 1986-12-19 | 1996-01-16 | Applied Materials, Inc. | Method of heating and cooling a wafer during semiconductor processing |
EP0452779B1 (en) * | 1990-04-20 | 1996-03-27 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism |
US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
US5238499A (en) * | 1990-07-16 | 1993-08-24 | Novellus Systems, Inc. | Gas-based substrate protection during processing |
DE69113553T2 (de) * | 1990-07-23 | 1996-06-20 | Dainippon Screen Mfg | Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten. |
DE4116392C2 (de) * | 1991-05-18 | 2001-05-03 | Micronas Gmbh | Halterung zur einseitigen Naßätzung von Halbleiterscheiben |
JPH04358071A (ja) * | 1991-06-05 | 1992-12-11 | Mitsubishi Electric Corp | 真空処理装置 |
US5316278A (en) * | 1992-09-18 | 1994-05-31 | Applied Materials, Inc. | Clamping ring apparatus for processing semiconductor wafers |
US5352294A (en) * | 1993-01-28 | 1994-10-04 | White John M | Alignment of a shadow frame and large flat substrates on a support |
KR960006956B1 (ko) * | 1993-02-06 | 1996-05-25 | 현대전자산업주식회사 | 이시알(ecr) 장비 |
US5346601A (en) * | 1993-05-11 | 1994-09-13 | Andrew Barada | Sputter coating collimator with integral reactive gas distribution |
US6258219B1 (en) * | 1993-09-09 | 2001-07-10 | Applied Materials, Inc. | Two-step deposition process for preventing arcs |
JP2534196B2 (ja) * | 1993-12-21 | 1996-09-11 | 株式会社エンヤシステム | ウエ−ハ貼付方法 |
KR950025850A (ko) * | 1994-02-17 | 1995-09-18 | 서성기 | 박막의 열처리 장치 |
US5791895A (en) * | 1994-02-17 | 1998-08-11 | Novellus Systems, Inc. | Apparatus for thermal treatment of thin film wafer |
US5804042A (en) * | 1995-06-07 | 1998-09-08 | Tokyo Electron Limited | Wafer support structure for a wafer backplane with a curved surface |
US5653565A (en) * | 1995-07-05 | 1997-08-05 | Asyst Technologies, Inc. | SMIF port interface adaptor |
US5860640A (en) * | 1995-11-29 | 1999-01-19 | Applied Materials, Inc. | Semiconductor wafer alignment member and clamp ring |
US6035522A (en) * | 1996-03-13 | 2000-03-14 | Motorola, Inc. | Circuit board leveling apparatus |
DE19615674A1 (de) * | 1996-04-19 | 1997-10-23 | Mci Computer Gmbh | Meßvorrichtung für integrierte Schaltkreise |
US6176667B1 (en) | 1996-04-30 | 2001-01-23 | Applied Materials, Inc. | Multideck wafer processing system |
US5748434A (en) * | 1996-06-14 | 1998-05-05 | Applied Materials, Inc. | Shield for an electrostatic chuck |
US6132517A (en) * | 1997-02-21 | 2000-10-17 | Applied Materials, Inc. | Multiple substrate processing apparatus for enhanced throughput |
JP3245833B2 (ja) * | 1999-07-08 | 2002-01-15 | 日本エー・エス・エム株式会社 | 半導体基板アライナー装置および方法 |
US6394440B1 (en) * | 2000-07-24 | 2002-05-28 | Asm America, Inc. | Dual orientation leveling platform for semiconductor apparatus |
US6600556B2 (en) * | 2001-01-10 | 2003-07-29 | Hitachi Global Storage Technologies Netherlands, B.V. | System and method for detecting manufacturing marks on sputtered disks |
JP4173309B2 (ja) * | 2002-01-28 | 2008-10-29 | 東京エレクトロン株式会社 | センタリング装置及び枚葉式検査装置 |
US6899765B2 (en) * | 2002-03-29 | 2005-05-31 | Applied Materials Israel, Ltd. | Chamber elements defining a movable internal chamber |
JP4121413B2 (ja) * | 2003-03-31 | 2008-07-23 | 株式会社神戸製鋼所 | 板状被処理品の高圧処理装置 |
US7703823B2 (en) * | 2004-07-12 | 2010-04-27 | Rudolph Technologies, Inc. | Wafer holding mechanism |
JP4648028B2 (ja) * | 2005-02-10 | 2011-03-09 | 三菱電機株式会社 | マスク位置合わせ装置 |
EP2267179B1 (en) * | 2009-06-25 | 2012-12-26 | Solmates B.V. | Target cooling device |
DE102010017896A1 (de) * | 2010-04-21 | 2011-10-27 | Ald Vacuum Technologies Gmbh | Vorrichtung und Verfahren zum Beschichten von Substraten nach dem EB/PVD-Verfahren |
DE102010017895A1 (de) * | 2010-04-21 | 2011-10-27 | Ald Vacuum Technologies Gmbh | Vorrichtung zum Beschichten von Substraten nach dem EB/PVD-Verfahren |
DE102013214019B3 (de) * | 2013-07-17 | 2014-09-11 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Spannvorrichtung zum Positionieren von Werkstücken, Werkzeugmaschine mit einer derartigen Spannvorrichtung, Verfahren zum Positionieren von Werkstücken mittels einer derartigen Spannvorrichtung |
US20180323096A1 (en) * | 2015-11-03 | 2018-11-08 | Board Of Regents, The University Of Texas System | Systems and methods for passive alignment of semiconductor wafers |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4189230A (en) * | 1977-10-26 | 1980-02-19 | Fujitsu Limited | Wafer holder with spring-loaded wafer-holding means |
JPS564244A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Continuous vacuum treatment device for wafer |
JPS5666036A (en) * | 1979-11-05 | 1981-06-04 | Canon Inc | Wafer positioner |
JPS5680135A (en) * | 1979-12-04 | 1981-07-01 | Nec Corp | Substrate holder for ion etching device |
US4344383A (en) * | 1980-12-10 | 1982-08-17 | Rca Corporation | Retainer ring for securing substrates in a vacuum deposition system |
US4473455A (en) * | 1981-12-21 | 1984-09-25 | At&T Bell Laboratories | Wafer holding apparatus and method |
US4422897A (en) * | 1982-05-25 | 1983-12-27 | Massachusetts Institute Of Technology | Process for selectively etching silicon |
JPS5946031A (ja) * | 1982-09-09 | 1984-03-15 | Fujitsu Ltd | プラズマ処理装置 |
US4544311A (en) * | 1983-03-15 | 1985-10-01 | Micronix Partners | Mask alignment apparatus |
US4542298A (en) * | 1983-06-09 | 1985-09-17 | Varian Associates, Inc. | Methods and apparatus for gas-assisted thermal transfer with a semiconductor wafer |
JPH0614520B2 (ja) * | 1983-12-26 | 1994-02-23 | 株式会社日立製作所 | 低圧雰囲気内の処理装置 |
JPS60189927A (ja) * | 1984-03-12 | 1985-09-27 | Matsushita Electric Ind Co Ltd | 気相反応容器 |
US4655584A (en) * | 1984-05-11 | 1987-04-07 | Nippon Kogaku K. K. | Substrate positioning apparatus |
JPS61106768A (ja) * | 1984-10-31 | 1986-05-24 | Anelva Corp | 基体処理装置 |
JPS61140432A (ja) * | 1984-12-11 | 1986-06-27 | Shinko Denki Kk | ウエハ−等の保持装置 |
US4764076A (en) * | 1986-04-17 | 1988-08-16 | Varian Associates, Inc. | Valve incorporating wafer handling arm |
JPH0834205B2 (ja) * | 1986-11-21 | 1996-03-29 | 株式会社東芝 | ドライエツチング装置 |
JPS63219137A (ja) * | 1987-03-09 | 1988-09-12 | Mitsubishi Electric Corp | プラズマ処理装置 |
JP2719332B2 (ja) * | 1987-05-25 | 1998-02-25 | 株式会社日立製作所 | プラズマ処理方法 |
DE58909880D1 (de) * | 1988-05-24 | 2001-12-20 | Unaxis Balzers Ag | Vakuumanlage |
-
1989
- 1989-07-03 ES ES89112113T patent/ES2043970T3/es not_active Expired - Lifetime
- 1989-07-03 DE DE89112113T patent/DE58905888D1/de not_active Expired - Lifetime
- 1989-07-03 AT AT89112113T patent/ATE95949T1/de not_active IP Right Cessation
- 1989-07-03 EP EP89112113A patent/EP0350752B1/de not_active Expired - Lifetime
- 1989-07-12 US US07/378,641 patent/US5037262A/en not_active Expired - Lifetime
- 1989-07-14 JP JP1180625A patent/JP2927452B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111318500A (zh) * | 2020-02-03 | 2020-06-23 | 徐州鑫晶半导体科技有限公司 | 切割后硅棒的脱胶装置和方法 |
CN111318500B (zh) * | 2020-02-03 | 2021-10-26 | 徐州鑫晶半导体科技有限公司 | 切割后硅棒的脱胶装置和方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE95949T1 (de) | 1993-10-15 |
US5037262A (en) | 1991-08-06 |
EP0350752B1 (de) | 1993-10-13 |
DE58905888D1 (de) | 1993-11-18 |
EP0350752A2 (de) | 1990-01-17 |
JP2927452B2 (ja) | 1999-07-28 |
JPH02186658A (ja) | 1990-07-20 |
EP0350752A3 (en) | 1990-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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