JPS57180116A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57180116A JPS57180116A JP6554281A JP6554281A JPS57180116A JP S57180116 A JPS57180116 A JP S57180116A JP 6554281 A JP6554281 A JP 6554281A JP 6554281 A JP6554281 A JP 6554281A JP S57180116 A JPS57180116 A JP S57180116A
- Authority
- JP
- Japan
- Prior art keywords
- soi
- annealed
- transformed
- single crystal
- nonsingle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Abstract
PURPOSE:To avoid foams, surface roughness and peeling off by a method wherein when a nonsingle crystal line film is transformed into a single crystal film by energy beam irradiation, the nonsingle crystal film is treated by heat under low pressure beforehand. CONSTITUTION:A heater 6 is provided around a vacuum vessel 5. Wafers 8 to be annealed are set up in the vessel. Exhaust is made through an exhaust hole 10 provided to a cover 9 coupled by rubbing. In such an equipment, Si-on-insulator (SOI) on the wafer 8 is degassed and annealed. Then the SOI is irradiated by energy beam and a nonsingle crystal line Si is transformed into single crystal Si. The SOI which are degassed and annealed by this method shows no foam, surface roughness or peeling off when it is transformed into single crystal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554281A JPS57180116A (en) | 1981-04-30 | 1981-04-30 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6554281A JPS57180116A (en) | 1981-04-30 | 1981-04-30 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57180116A true JPS57180116A (en) | 1982-11-06 |
JPH0337728B2 JPH0337728B2 (en) | 1991-06-06 |
Family
ID=13290003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6554281A Granted JPS57180116A (en) | 1981-04-30 | 1981-04-30 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57180116A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05182923A (en) * | 1991-05-28 | 1993-07-23 | Semiconductor Energy Lab Co Ltd | Laser annealing method |
JPH05235038A (en) * | 1992-02-19 | 1993-09-10 | Casio Comput Co Ltd | Method of manufacturing thin film transistor |
JPH05235039A (en) * | 1992-02-19 | 1993-09-10 | Casio Comput Co Ltd | Method of manufacturing thin film transistor |
JPH06342757A (en) * | 1994-04-15 | 1994-12-13 | Semiconductor Energy Lab Co Ltd | Laser processing device |
US5861337A (en) * | 1991-05-28 | 1999-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US6576534B1 (en) | 1991-09-21 | 2003-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
-
1981
- 1981-04-30 JP JP6554281A patent/JPS57180116A/en active Granted
Non-Patent Citations (1)
Title |
---|
APPL.PHYS.LETT=1978 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05182923A (en) * | 1991-05-28 | 1993-07-23 | Semiconductor Energy Lab Co Ltd | Laser annealing method |
US5861337A (en) * | 1991-05-28 | 1999-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US6174374B1 (en) | 1991-05-28 | 2001-01-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US6494162B1 (en) | 1991-05-28 | 2002-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US6770143B2 (en) | 1991-05-28 | 2004-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
US6576534B1 (en) | 1991-09-21 | 2003-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
US6924212B2 (en) | 1991-09-21 | 2005-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
US7368367B2 (en) | 1991-09-21 | 2008-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a semiconductor |
JPH05235038A (en) * | 1992-02-19 | 1993-09-10 | Casio Comput Co Ltd | Method of manufacturing thin film transistor |
JPH05235039A (en) * | 1992-02-19 | 1993-09-10 | Casio Comput Co Ltd | Method of manufacturing thin film transistor |
JPH06342757A (en) * | 1994-04-15 | 1994-12-13 | Semiconductor Energy Lab Co Ltd | Laser processing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0337728B2 (en) | 1991-06-06 |
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