JPS55154583A - Etching processing apparatus - Google Patents

Etching processing apparatus

Info

Publication number
JPS55154583A
JPS55154583A JP6151179A JP6151179A JPS55154583A JP S55154583 A JPS55154583 A JP S55154583A JP 6151179 A JP6151179 A JP 6151179A JP 6151179 A JP6151179 A JP 6151179A JP S55154583 A JPS55154583 A JP S55154583A
Authority
JP
Japan
Prior art keywords
gas
vessel
processing apparatus
processed
etching processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6151179A
Other languages
Japanese (ja)
Inventor
Katsuyuki Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP6151179A priority Critical patent/JPS55154583A/en
Publication of JPS55154583A publication Critical patent/JPS55154583A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: Plasma etching processing apparatus, made possible to use resist material having not high durability, by providing a means to maintain the body to be processed at a fixed temperature.
CONSTITUTION: Back side of the body to be processed is closely stuck on the support tool 2 having such construction as, for example, to circulate cooling medium like water through the inner part and the body 1 is placed in the vacuum vessel 4. Air in the vessel 4 is evacuated from the discharge opening 5 after the cover 3 is closed and a high frequency voltage is applied between the electrodes 7 and 8 while introducing a fixed flowing amount of gas from the gas introducing opening 6. Hereby, gas plasma is generated in the vessel 4 and the surface of the body 1 is etched. Further, means of cooling the gas in the etching vacuum vessel can be used as the means of maintaining the body 1 at a fixed temperature.
COPYRIGHT: (C)1980,JPO&Japio
JP6151179A 1979-05-21 1979-05-21 Etching processing apparatus Pending JPS55154583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6151179A JPS55154583A (en) 1979-05-21 1979-05-21 Etching processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6151179A JPS55154583A (en) 1979-05-21 1979-05-21 Etching processing apparatus

Publications (1)

Publication Number Publication Date
JPS55154583A true JPS55154583A (en) 1980-12-02

Family

ID=13173176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6151179A Pending JPS55154583A (en) 1979-05-21 1979-05-21 Etching processing apparatus

Country Status (1)

Country Link
JP (1) JPS55154583A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57116774A (en) * 1981-01-14 1982-07-20 Hitachi Ltd Etching method
JPS5954227A (en) * 1982-09-21 1984-03-29 Tokyo Denshi Kagaku Kabushiki Dry type pattern forming method
JPS61119342U (en) * 1985-01-10 1986-07-28

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112445A (en) * 1975-03-28 1976-10-04 Tokyo Shibaura Electric Co Gas etching means
JPS52122236A (en) * 1976-04-07 1977-10-14 Tokyo Shibaura Electric Co Etching device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51112445A (en) * 1975-03-28 1976-10-04 Tokyo Shibaura Electric Co Gas etching means
JPS52122236A (en) * 1976-04-07 1977-10-14 Tokyo Shibaura Electric Co Etching device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57116774A (en) * 1981-01-14 1982-07-20 Hitachi Ltd Etching method
JPS6358913B2 (en) * 1981-01-14 1988-11-17
JPS5954227A (en) * 1982-09-21 1984-03-29 Tokyo Denshi Kagaku Kabushiki Dry type pattern forming method
JPS61119342U (en) * 1985-01-10 1986-07-28

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