JPS5691418A - Heat treatment device - Google Patents

Heat treatment device

Info

Publication number
JPS5691418A
JPS5691418A JP16866879A JP16866879A JPS5691418A JP S5691418 A JPS5691418 A JP S5691418A JP 16866879 A JP16866879 A JP 16866879A JP 16866879 A JP16866879 A JP 16866879A JP S5691418 A JPS5691418 A JP S5691418A
Authority
JP
Japan
Prior art keywords
heat treatment
port
wafers
section
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16866879A
Other languages
Japanese (ja)
Inventor
Yoshiki Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP16866879A priority Critical patent/JPS5691418A/en
Publication of JPS5691418A publication Critical patent/JPS5691418A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To prevent oxidation or the like at the time of cooling after heat treatment by forming an extension section providing an inactive gas lead-in port at the opened end section opposing to the gas lead-in port at one end of a tubular reactor core tube. CONSTITUTION:An extension section 9 is formed at the opened end section opposing to a gas lead-in port 3 locating at one end of a tubular reactor core tube 2 and an inactive gas lead-in port 6 is provided at the extension section 9. Wafers 5 placed on a boat 4 are led out as far as the extension section 9 after applying heat treatment to the wafers 5 and the wafers 5 are cooled while feeding the inactive gas from the section 6 to prevent the flow of air. In this way, when applying heat treatment to the semiconductor wafers having Mo films on the surfaces, the oxidation of the Mo films and a change in the quality of the films by reacting to external air at the time of cooling will be prevented.
JP16866879A 1979-12-25 1979-12-25 Heat treatment device Pending JPS5691418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16866879A JPS5691418A (en) 1979-12-25 1979-12-25 Heat treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16866879A JPS5691418A (en) 1979-12-25 1979-12-25 Heat treatment device

Publications (1)

Publication Number Publication Date
JPS5691418A true JPS5691418A (en) 1981-07-24

Family

ID=15872277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16866879A Pending JPS5691418A (en) 1979-12-25 1979-12-25 Heat treatment device

Country Status (1)

Country Link
JP (1) JPS5691418A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893230A (en) * 1981-11-30 1983-06-02 Toshiba Corp Ultra high vacuum processing apparatus
JPS64328U (en) * 1987-06-22 1989-01-05
JPS6421917A (en) * 1987-07-16 1989-01-25 Fujitsu Ltd Heating furnace processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893230A (en) * 1981-11-30 1983-06-02 Toshiba Corp Ultra high vacuum processing apparatus
JPS64328U (en) * 1987-06-22 1989-01-05
JPS6421917A (en) * 1987-07-16 1989-01-25 Fujitsu Ltd Heating furnace processing method

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