JPS53106573A - Gas treatment method of semiconductor wafers - Google Patents

Gas treatment method of semiconductor wafers

Info

Publication number
JPS53106573A
JPS53106573A JP2125277A JP2125277A JPS53106573A JP S53106573 A JPS53106573 A JP S53106573A JP 2125277 A JP2125277 A JP 2125277A JP 2125277 A JP2125277 A JP 2125277A JP S53106573 A JPS53106573 A JP S53106573A
Authority
JP
Japan
Prior art keywords
treatment method
gas treatment
semiconductor wafers
boat
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2125277A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Yoshiaki Yadoiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2125277A priority Critical patent/JPS53106573A/en
Publication of JPS53106573A publication Critical patent/JPS53106573A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To pervent influent air from reaching substrates, make possible slow cooling, prevent warpage of the substrates and make possible the automation of putting in and out of boat by placing a shield object slightly smaller in diameter than the inside diameter of a furnace core tube to the end on the downstream side of the boat.
COPYRIGHT: (C)1978,JPO&Japio
JP2125277A 1977-02-28 1977-02-28 Gas treatment method of semiconductor wafers Pending JPS53106573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2125277A JPS53106573A (en) 1977-02-28 1977-02-28 Gas treatment method of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2125277A JPS53106573A (en) 1977-02-28 1977-02-28 Gas treatment method of semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS53106573A true JPS53106573A (en) 1978-09-16

Family

ID=12049875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2125277A Pending JPS53106573A (en) 1977-02-28 1977-02-28 Gas treatment method of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS53106573A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870832A (en) * 1981-10-23 1983-04-27 Nec Kyushu Ltd Heat treatment system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5870832A (en) * 1981-10-23 1983-04-27 Nec Kyushu Ltd Heat treatment system
JPS6259626B2 (en) * 1981-10-23 1987-12-11 Kyushu Nippon Electric

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