JPS5426664A - Tool for heat treatment of semiconductor wafer - Google Patents

Tool for heat treatment of semiconductor wafer

Info

Publication number
JPS5426664A
JPS5426664A JP9174477A JP9174477A JPS5426664A JP S5426664 A JPS5426664 A JP S5426664A JP 9174477 A JP9174477 A JP 9174477A JP 9174477 A JP9174477 A JP 9174477A JP S5426664 A JPS5426664 A JP S5426664A
Authority
JP
Japan
Prior art keywords
tool
heat treatment
semiconductor wafer
core tube
air shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9174477A
Other languages
Japanese (ja)
Other versions
JPS618569B2 (en
Inventor
Sokichi Yamagishi
Kazuhide Kunitoku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
NEC Kyushu Ltd
Original Assignee
NEC Corp
Nippon Electric Co Ltd
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd, NEC Kyushu Ltd filed Critical NEC Corp
Priority to JP9174477A priority Critical patent/JPS5426664A/en
Publication of JPS5426664A publication Critical patent/JPS5426664A/en
Publication of JPS618569B2 publication Critical patent/JPS618569B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To increase the shield effect, by making approximately equal the diameter of one shield body among a plurality of external air shielding bodies to the inner diameter of the core tube, in providing a plural number of exteranl air shielding bodies with the rod used for the boat mounting semiconductor wafers to put it in or out of the core tube.
COPYRIGHT: (C)1979,JPO&Japio
JP9174477A 1977-07-29 1977-07-29 Tool for heat treatment of semiconductor wafer Granted JPS5426664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9174477A JPS5426664A (en) 1977-07-29 1977-07-29 Tool for heat treatment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9174477A JPS5426664A (en) 1977-07-29 1977-07-29 Tool for heat treatment of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5426664A true JPS5426664A (en) 1979-02-28
JPS618569B2 JPS618569B2 (en) 1986-03-15

Family

ID=14035030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9174477A Granted JPS5426664A (en) 1977-07-29 1977-07-29 Tool for heat treatment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5426664A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140236A (en) * 1979-04-18 1980-11-01 Teru Saamuko Kk Device for heat treating semiconductor
FR2583779A1 (en) * 1985-06-25 1986-12-26 Montaudon Patrick Device for reducing the oxidation of objects placed in a gas treatment enclosure when they are extracted therefrom
JPS63140620U (en) * 1987-03-05 1988-09-16
JP2001185600A (en) * 1999-12-27 2001-07-06 Japan Steel Works Ltd:The Transfer mechanism of heated board and transfer method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140236A (en) * 1979-04-18 1980-11-01 Teru Saamuko Kk Device for heat treating semiconductor
JPS5923464B2 (en) * 1979-04-18 1984-06-02 テルサ−ムコ株式会社 Semiconductor heat treatment equipment
FR2583779A1 (en) * 1985-06-25 1986-12-26 Montaudon Patrick Device for reducing the oxidation of objects placed in a gas treatment enclosure when they are extracted therefrom
JPS63140620U (en) * 1987-03-05 1988-09-16
JP2001185600A (en) * 1999-12-27 2001-07-06 Japan Steel Works Ltd:The Transfer mechanism of heated board and transfer method

Also Published As

Publication number Publication date
JPS618569B2 (en) 1986-03-15

Similar Documents

Publication Publication Date Title
JPS5224478A (en) Semiconductor device manufacturing process
JPS5212576A (en) Wafer washing drying device
JPS5395571A (en) Semiconductor device
JPS5426664A (en) Tool for heat treatment of semiconductor wafer
JPS51111020A (en) Semiconductor fixing memory equipment
JPS5211525A (en) Method of manufacturing headrests
JPS53142185A (en) Manufacture of walled emitter type semiconductor device
JPS5210032A (en) Construction method of semiconductor memory unit
JPS5389675A (en) Jig pair for wafer transfer
JPS51148369A (en) Manufacturing method of semiconductor
JPS52143760A (en) Quartz tube in heat treatment furnace
JPS52143515A (en) Tube dividing device
JPS52156552A (en) Wafer inspection apparatus
JPS51112279A (en) Semiconductor device
JPS5230150A (en) Manufacturing system of electron radiation cathode rod
JPS51112292A (en) Semiconductor device
JPS51113580A (en) Memory unit of large-scale semi- conductor integrated circuit
JPS5234688A (en) Manufacturing process of x-ray tube
JPS53144672A (en) Semiconductor device
JPS5243373A (en) Jigs for apparatus of producing a semiconductor
JPS542670A (en) Plasma etching method
JPS5275873A (en) Method of protective treatment on fluorescent substance
JPS51148389A (en) Manufacturing method of semiconductor device
JPS5230171A (en) Method for fabrication of semiconductor device
JPS5227358A (en) Semiconductor unit