JPS5732378A - Plasma etching apparatus - Google Patents

Plasma etching apparatus

Info

Publication number
JPS5732378A
JPS5732378A JP10752580A JP10752580A JPS5732378A JP S5732378 A JPS5732378 A JP S5732378A JP 10752580 A JP10752580 A JP 10752580A JP 10752580 A JP10752580 A JP 10752580A JP S5732378 A JPS5732378 A JP S5732378A
Authority
JP
Japan
Prior art keywords
electrode
products
opposite
region
rise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10752580A
Other languages
Japanese (ja)
Inventor
Hideaki Itakura
Haruhiko Abe
Kanji Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10752580A priority Critical patent/JPS5732378A/en
Publication of JPS5732378A publication Critical patent/JPS5732378A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To inhibit a surface temp. rise of products to be worked due to heat of reaction and to prevent the deformation and deterioration of a resist by cooling the products when they are present in the open region of a sample electrode set opposite to a high frequency electrode.
CONSTITUTION: To restrict the generation region of gas plasma 7 a high frequency electrode 24 in a reactor 1 is regulated in size so that it is opposite to about half of a sample electrode 25. Accordingly, products 8 to be worked present in the region of the electrode 25 opposite to the electrode 24 are etched, and products 8 to be worked present in the other region not opposite to the electrode 24 are not exposed to gas plasma 7. Since the electrode 25 is rotated with a rotating mechanism 9, the products 8 are alternately subjected to the progress and stop of etching. As a result, a surface temp. rise of the products 8 during etching and the thermal deformation and deterioration of a resist due to the temp. rise can be inhibited, so micropattern can be formed without causing deformation.
COPYRIGHT: (C)1982,JPO&Japio
JP10752580A 1980-08-05 1980-08-05 Plasma etching apparatus Pending JPS5732378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10752580A JPS5732378A (en) 1980-08-05 1980-08-05 Plasma etching apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10752580A JPS5732378A (en) 1980-08-05 1980-08-05 Plasma etching apparatus

Publications (1)

Publication Number Publication Date
JPS5732378A true JPS5732378A (en) 1982-02-22

Family

ID=14461395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10752580A Pending JPS5732378A (en) 1980-08-05 1980-08-05 Plasma etching apparatus

Country Status (1)

Country Link
JP (1) JPS5732378A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110561U (en) * 1988-01-19 1989-07-26
US5347370A (en) * 1992-12-28 1994-09-13 Nisca Corporation Shading correction method and apparatus
JP2005533391A (en) * 2002-07-18 2005-11-04 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド Plasma injection system and method with target movement
JP2011099650A (en) * 2009-11-09 2011-05-19 Mitsubishi Electric Corp Refrigerator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110561U (en) * 1988-01-19 1989-07-26
US5347370A (en) * 1992-12-28 1994-09-13 Nisca Corporation Shading correction method and apparatus
JP2005533391A (en) * 2002-07-18 2005-11-04 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド Plasma injection system and method with target movement
JP2011099650A (en) * 2009-11-09 2011-05-19 Mitsubishi Electric Corp Refrigerator

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