JPS57116774A - Etching method - Google Patents

Etching method

Info

Publication number
JPS57116774A
JPS57116774A JP320781A JP320781A JPS57116774A JP S57116774 A JPS57116774 A JP S57116774A JP 320781 A JP320781 A JP 320781A JP 320781 A JP320781 A JP 320781A JP S57116774 A JPS57116774 A JP S57116774A
Authority
JP
Japan
Prior art keywords
temp
sample
type gas
chlorine type
thermometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP320781A
Other languages
Japanese (ja)
Other versions
JPS6358913B2 (en
Inventor
Shunei Ogata
Tatsumi Mizutani
Hideo Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP320781A priority Critical patent/JPS57116774A/en
Publication of JPS57116774A publication Critical patent/JPS57116774A/en
Publication of JPS6358913B2 publication Critical patent/JPS6358913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To form fine wiring patterns of high density integrated circuits accurately with good reproducibility by etching a sample by means of a chlorine type gas while maintaining the temp. of Al (alloy) which is the sample at a specific temp. range. CONSTITUTION:A chlorine type gas of low pressure is flowed in a vacuum etching chamber 1, and a high frequency electric field is applied by a high frequency electric power source to cause glow discharge and turn the chlorine type gas to plasma. The surface of an Al or Al alloy sample 4 masked with a resist film is etche by the ions and radicals in this plasma. At this time, the temp. of the sample 4 is detected by measuring the intensity of the IR rays generated from the sample 4 with an IR thermometer 8. Cooling water or a heater 6 is automatically controlled with the thermometer 8 so as to maintain the temp. thereof in a 50-130 deg.C, more preferably, 50-80 deg.C temp. range.
JP320781A 1981-01-14 1981-01-14 Etching method Granted JPS57116774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP320781A JPS57116774A (en) 1981-01-14 1981-01-14 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP320781A JPS57116774A (en) 1981-01-14 1981-01-14 Etching method

Publications (2)

Publication Number Publication Date
JPS57116774A true JPS57116774A (en) 1982-07-20
JPS6358913B2 JPS6358913B2 (en) 1988-11-17

Family

ID=11550988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP320781A Granted JPS57116774A (en) 1981-01-14 1981-01-14 Etching method

Country Status (1)

Country Link
JP (1) JPS57116774A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543166A1 (en) * 1983-03-25 1984-09-28 Lfe Corp COMPOSITION AND PROCESS FOR THE SELECTIVE ATTACK, USING PLASMA REACTIVE IONS, ALUMINUM AND ALUMINUM ALLOYS
JPS62281423A (en) * 1986-05-30 1987-12-07 Hitachi Ltd Method and device for dry etching
JPS63238288A (en) * 1987-03-27 1988-10-04 Fujitsu Ltd Dry etching method
JPH0192384A (en) * 1987-10-02 1989-04-11 Hitachi Ltd Plasma treating device
US9618033B2 (en) 2006-05-29 2017-04-11 Hi-Lex Corporation Control cable and remote control device using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552718A (en) * 1978-06-20 1980-01-10 Nakagawa Boshoku Kogyo Kk Corrosion-preventing method for metal submerged in water
JPS55154583A (en) * 1979-05-21 1980-12-02 Nippon Telegr & Teleph Corp <Ntt> Etching processing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552718A (en) * 1978-06-20 1980-01-10 Nakagawa Boshoku Kogyo Kk Corrosion-preventing method for metal submerged in water
JPS55154583A (en) * 1979-05-21 1980-12-02 Nippon Telegr & Teleph Corp <Ntt> Etching processing apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2543166A1 (en) * 1983-03-25 1984-09-28 Lfe Corp COMPOSITION AND PROCESS FOR THE SELECTIVE ATTACK, USING PLASMA REACTIVE IONS, ALUMINUM AND ALUMINUM ALLOYS
JPS62281423A (en) * 1986-05-30 1987-12-07 Hitachi Ltd Method and device for dry etching
JPS63238288A (en) * 1987-03-27 1988-10-04 Fujitsu Ltd Dry etching method
JPH0428791B2 (en) * 1987-03-27 1992-05-15 Fujitsu Ltd
JPH0192384A (en) * 1987-10-02 1989-04-11 Hitachi Ltd Plasma treating device
US9618033B2 (en) 2006-05-29 2017-04-11 Hi-Lex Corporation Control cable and remote control device using the same

Also Published As

Publication number Publication date
JPS6358913B2 (en) 1988-11-17

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