Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
  • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
  • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
  • C23C16/303—Nitrides
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
  • C23C16/45563—Gas nozzles
  • C23C16/45572—Cooled nozzles
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
  • C30B25/02—Epitaxial-layer growth
  • C30B25/16—Controlling or regulating
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
  • C30B29/10—Inorganic compounds or compositions
  • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
  • C30B29/403—AIII-nitrides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02365—Forming inorganic semiconducting materials on a substrate
  • H01L21/02436—Intermediate layers between substrates and deposited layers
  • H01L21/02439—Materials
  • H01L21/02455—Group 13/15 materials
  • H01L21/02458—Nitrides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02365—Forming inorganic semiconducting materials on a substrate
  • H01L21/02518—Deposited layers
  • H01L21/02521—Materials
  • H01L21/02538—Group 13/15 materials
  • H01L21/0254—Nitrides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02365—Forming inorganic semiconducting materials on a substrate
  • H01L21/02612—Formation types
  • H01L21/02617—Deposition types
  • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
  • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
  • H01L29/66007—Multistep manufacturing processes
  • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
  • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
  • H01L29/66409—Unipolar field-effect transistors
  • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
  • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT

Definitions

• the invention relates to a method for depositing a semiconductor layer system on a substrate by feeding reactive gases together with a carrier gas into a process chamber of a CVD reactor, with a first, gallium-containing layer or in a first process step at first process parameters
• Layer sequence can be deposited by feeding in at least one first reactive gas containing gallium and subsequently in a second process step with second process parameters a second indium-containing layer or layer sequence by feeding in at least one indium-containing second reactive gas.
• a silicon-doped A1N layer is first deposited on a substrate, in particular a silicon substrate.
• An AlGaN layer is deposited on the latter. This in turn has an AIN layer.
• the layer sequence contains further Al-GaN layers and a GaN layer forming a u-GaN channel.
• An indium-containing layer or layer sequence is then deposited onto this gallium-containing layer or layer sequence, optionally with an intermediate layer of A1N being deposited, it being possible for this layer to have AlInN.
• parasitic deposits that contain gallium are formed on the walls of the process chamber and in particular on the process chamber ceiling which is opposite a process chamber floor that carries the substrates.
• this gallium can have a disruptive effect on the layer quality of the indium-containing second layer or layer sequence in that gallium is incorporated into the indium-containing layer.
• the invention is based on the object of proposing measures with which the undesired incorporation of gallium atoms into the second layer or layer sequence is suppressed.
• a reactive gas containing indium atoms is fed into the process chamber. Simultaneously with, for example, trimethylgallium, for example, trimethylindium or also triethylindium can be fed into the process chamber.
• the first process parameters are set in such a way that no indium is incorporated into the gallium-containing layer in the first process step.
• the surface temperature of the substrates be greater than 1000 ° C. during the first process step.
• hydrogen as the carrier gas, the use of which does not involve the deposition of indium in the layer to be deposited favored or even suppressed.
• an intermediate step can be carried out in which an indium-containing reactive gas, for example TMI or TEI, is fed into the process chamber.
• an indium-containing reactive gas for example TMI or TEI
• Th is preferably used as the carrier gas.
• the temperature is preferably above 1000 ° C.
• the process parameters are chosen so that no indium is deposited on the substrate.
• an exchange reaction takes place on the process chamber ceiling, which is cooled in particular to temperatures around 100 ° C.
• the reactive gas containing indium, in particular the organometallic indium compound reacts with gallium which adheres to the process chamber ceiling or another wall of the process chamber. It can be elemental gallium or a gallium compound that has condensed on the process chamber ceiling.
• the indium compound reacts with the gallium, the organometallic indium compound in particular being able to react with the elemental gallium to form elemental indium and a volatile organometallic gallium compound.
• Elemental indium can remain on the process chamber ceiling.
• the exchange reaction can also lead to an indium compound that adheres at least temporarily to the process chamber wall.
• the process chamber ceiling can also be brought to a temperature above 100 ° C, for example by lowering the gas inlet element or lowering a protective plate made of quartz or graphite arranged under the gas inlet element, so that its surface temperature due to the the greater proximity to the heated susceptor and the greater distance to the cooled gas inlet organ increases.
• an intermediate step is then carried out in which the gas outlet surface of the gas inlet element or a protective plate has a smaller distance from the heated susceptor than in the first process step.
• the reactive gas containing indium is in particular used together with a carrier gas, for example hydrogen, fed into the process chamber.
• a carrier gas for example hydrogen
• an indium-containing layer or layer sequence is deposited on the first gallium-containing layer or layer sequence. This is preferably done at temperatures below 1000 ° C and preferably with nitrogen as the carrier gas.
• as many indium atoms are preferably fed into the process chamber as there are gallium atoms on the process chamber ceiling.
• the molar ratio of indium to gallium is at least one third.
• the molar ratio can be lower, for example at least one tenth.
• the parasitic deposition of gallium on the walls of the process chamber is reduced during the deposition of a layer containing gallium, for example a gallium nitride layer or an aluminum-gallium nitride layer.
• the total pressures can be below 100 mbar or below 200 mbar.
• an indium-containing layer is then deposited, but which does not contain any gallium.
• Fig. 1 schematically shows a layer system select separated with the method according to the invention
• 2 shows a device for performing the method in a first operating position
• FIG. 3 shows the device according to FIG. 2 in a second operating position.
• the device shown in FIGS. 2 and 3 is a MOCVD
• Reactor with a reactor housing 1 which can be evacuated. Inside the housing 1 there is a gas inlet element 5 in the form of a showerhead with a cooled gas outlet plate 6. For this purpose, there are cooling channels in the gas outlet plate through which a coolant can flow. A plurality of gas outlet openings evenly distributed over the gas outlet plate 6 run through the gas outlet plate 6, from which a process gas, which is fed into the gas inlet element 5 from the outside, can flow into a process chamber 2.
• the exemplary embodiment there is a protective plate 10 with passage openings 9 below the gas outlet plate 6, which is aligned with the gas outlet openings 7 in an operating position according to FIG. 2 in which the protective plate 10 is arranged directly below the gas outlet plate 6.
• the gas outlet plate 6 can consist of quartz or graphite.
• the gas inlet element 5 and the gas outlet plate 6 can be made of metal, in particular stainless steel.
• the bottom of the process chamber 2 forms a susceptor 3, which can consist of a coated graphite body.
• the susceptor 3 carries one or more substrates 4 which are coated in the process chamber 2 with a semiconductor layer or a semiconductor layer sequence.
• the susceptor 3 can be driven to rotate about an axis of rotation.
• the susceptor 3 is brought from below with a heating device 8 to a process temperature which can be measured with temperature measuring devices (not shown) on the substrates 4 or on the broad side of the susceptor 3 facing the process chamber 2.
• FIG. 1 shows a sequence of layers which can be deposited in the device shown in FIGS. 2 and 3 using the method according to the invention.
• a layer sequence is deposited in a first process step sequence 11, which may contain gallium, aluminum and nitrogen.
• This sequence of layers does not contain any indium.
• process gases in the form of ammonia and organometallic compounds of aluminum and gallium are introduced into the process chamber 2 through the gas inlet element 5.
• the process chamber 2 is heated to a temperature that is above 1000 ° C. The temperature is measured on the substrate 4 or on the top of the susceptor 3 facing the process chamber 2.
• deposits containing gallium can occur on the surfaces that adjoin the process chamber 2, that is to say in particular on the underside of the protective plate 10.
• a reactive gas containing an indium is added to the Process chamber 2 initiated. It can be TMI or TEI or another organometallic indium compound.
• the Process parameters are selected here so that no indium is built into the layer deposited during these process steps. For this purpose, the temperatures of the susceptor surface are kept at over 1000 ° C.
• inorganic metal compounds such as chlorides
• an indium-containing layer 12, 13 is deposited on the layer system. This is done by feeding a reactive gas containing indium into the process chamber 2.
• the first layer sequence 11 is deposited without an indium-containing reactive gas.
• a reactive gas containing indium can then be fed into the process chamber at an elevated temperature.
• the temperature is selected so high that no indium is deposited on the substrates 4.
• it can - as FIG. 3 shows - be lowered in the direction of the heated susceptor 3.
• hydrogen is used as the carrier gas.
• nitrogen can be used as the carrier gas.
• the second layer sequence which has layers which contain at least indium, also contain aluminum and nitrogen.
• a reactive gas containing aluminum in particular an organometallic aluminum compound
• a carrier gas which can be nitrogen
• ammonia is fed into the process chamber, which supplies the nitrogen component of the layer.
• a method which is characterized in that during the intermediate step the surface temperature of the process chamber ceiling is different and in particular a higher temperature than during the first and / or second process step and / or that during the intermediate step the process chamber height is decreased.
• a method which is characterized in that, in the first process step or in the intermediate step, the process chamber height is reduced by lowering a gas inlet element 5 forming the process chamber ceiling or a protective plate 10 arranged below the gas inlet element 5.
• a method which is characterized in that during the first and the second process step on the same substrate 4, which has a diameter of at least 300 mm, layers for manufacturing a HEMT are deposited, the process chamber height being 9 to 25 mm - wearing.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Mechanical Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Inorganic Chemistry (AREA)
• Computer Hardware Design (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Crystallography & Structural Chemistry (AREA)
• Ceramic Engineering (AREA)
• Chemical Vapour Deposition (AREA)
• Recrystallisation Techniques (AREA)

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• 2019
  • 2019-05-06 DE DE102019111598.1A patent/DE102019111598A1/de active Pending
• 2020
  • 2020-04-30 TW TW109114429A patent/TW202106911A/zh unknown
  • 2020-05-05 CN CN202080044304.1A patent/CN114008239B/zh active Active
  • 2020-05-05 JP JP2021564981A patent/JP7547376B2/ja active Active
  • 2020-05-05 KR KR1020217037090A patent/KR20220003542A/ko unknown
  • 2020-05-05 EP EP20725451.7A patent/EP3966361A1/de active Pending
  • 2020-05-05 US US17/594,996 patent/US20220205086A1/en active Pending
  • 2020-05-05 WO PCT/EP2020/062356 patent/WO2020225228A1/de unknown

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