EP3652776A1 - Dispositif de séchage et procédés de séchage d'un substrat - Google Patents

Dispositif de séchage et procédés de séchage d'un substrat

Info

Publication number
EP3652776A1
EP3652776A1 EP18793166.2A EP18793166A EP3652776A1 EP 3652776 A1 EP3652776 A1 EP 3652776A1 EP 18793166 A EP18793166 A EP 18793166A EP 3652776 A1 EP3652776 A1 EP 3652776A1
Authority
EP
European Patent Office
Prior art keywords
drying
air
slot
head
drying head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18793166.2A
Other languages
German (de)
English (en)
Inventor
Markus Uihlein
Stefan Hansen
Tobias ROSSHART
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RENA Technologies GmbH
Original Assignee
RENA Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RENA Technologies GmbH filed Critical RENA Technologies GmbH
Publication of EP3652776A1 publication Critical patent/EP3652776A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F26B15/14—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined the objects or batches of materials being carried by trays or racks or receptacles, which may be connected to endless chains or belts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
    • F26B3/04—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over or surrounding the materials or objects to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B2015/003—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form the load carrying elements having provisions for defining drying gas ducts, e.g. panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Definitions

  • the invention relates to a drying device according to the preamble of claim 1 and a method for drying a flat substrate in a continuous flow according to the preamble of the independent method claim.
  • Flat substrates are often treated with liquids, in the course of which it is necessary to subsequently dry the flat substrates.
  • wet-chemically processed in Ferti ⁇ supply of solar cell semiconductor substrates which represent sub-surface ⁇ strate and are often referred to as a wafer.
  • Area substrates are treated on an industrial scale or processed, for example in the industrial Ferti ⁇ supply of solar cells made of semiconductor substrates, this is done regularly with a continuous process and continuous flow systems, through which are transported through the planar substrates. It is known, for the purpose of drying the Halbleitersub ⁇ strate in such continuous flow of air through perforated sheets o- the like on the upper and lower sides of the Halbleitersub- strate to direct and by means of the inflowing air on the
  • the present invention has for its object to provide an apparatus, by means of which sheet-like substrates in continuous operation can be dried reli ⁇ permeable.
  • the invention has for its object to provide a drive Ver ⁇ to provide, by means of which sub-area ⁇ strate in a fürlaufanläge at elevated transport speeds of the planar substrates speeds by the fürlaufan ⁇ location therethrough can be reliably dried.
  • the drying device according to the invention has at least one upper drying head and at least one lower one
  • the at least one upper voltage Trock ⁇ head above a transport plane on which to trock ⁇ designating objects are transported through the drying apparatus ⁇ therethrough in a transport direction is disposed.
  • the at least one lower drying head is arranged below the genann ⁇ th transport plane.
  • Drying head and the at least one lower drying head each have at least one air outlet slot.
  • the mentioned air outlet slots are shaped and attached in such a way orders that longitudinal directions of said air outlet ⁇ slots extend substantially parallel to the transport plane and transversely to the transport direction. Further, they are formed and arranged such that slot planes in WEL chen extend the air exit said slots intersecting Trans ⁇ port plane at angles which are larger than 0 ° and smaller than 90 °.
  • the term of the air outlet slot is present not to be understood so that mandatory air for drying is ⁇ sets must be. Instead, ande also re ⁇ gases or gas mixtures can in principle be used as the drying medium ⁇ to. As far as present air is concerned, this term always includes other gases or gas mixtures, which can be used for drying.
  • the angles mentioned can be different for all slot segments .
  • the angles mentioned are selected uniformly for those slot planes in which the at least one air outlet slot of the at least one upper drying head extends, and they assume a first dimension.
  • the angles mentioned are Trains t for all slot levels equal large, that is, the first measure and the second measure are identical.
  • air discharge slots may be formed in an advantageous manner, continuous air jet fronts ⁇ the.
  • air outlet slots with a length of 180 mm have proven themselves in connection with silicon semiconductor substrates. It has, in particular in connection with the drying of semiconductor substrates made of silicon, proven to be advantageous for the drying result, when the slot planes run in the wel ⁇ chen the air exit said slots intersecting Trans ⁇ port plane at angles less than greater than 60 ° and than 80 ° are. Preferably, these angles are greater than 65 ° and less than 75 °, and more preferably 70 °.
  • the air outlet slots preferably have a uniform slot depth which is between 1 mm and 5 mm.
  • the slot depth is between 2 mm and 4 mm and more preferably between 2.5 mm and 3.5 mm. These slot depths have proven particularly useful in practice.
  • the air outlet slots preferably have a slot ⁇ width that is greater than or equal to 0.3 mm and less than or equal to 0.7 mm. Particularly preferably, the slit width ⁇ 0.5 mm. In this way, an efficient drying can be effected.
  • Stiffening webs are provided, which are adapted to stabilize the shapes of the air outlet slots over the slot length away. This is particularly advantageous when larger slot lengths are chosen, which extends over an entire width of the material to be dried flat substrate he ⁇ stretch.
  • the drying ⁇ device has at least one drying head, a base plate, into which a bag for air guidance is turned processing ⁇ tet. Further, a connectable to the base plate De ⁇ ckel is provided by means of which the bag is closed to form a cavity. This cavity serves so ⁇ then mentioned air duct in the drying head to the air outlet slots out. This allows a Jerusalemwandsgüns ⁇ term production of the at least one drying head. Preference ⁇ way all drying heads are designed in the manner described. The term of the air duct in this case includes the leadership of another gaseous drying medium.
  • Several lids of different drying heads can be connected to each other via a flow-through pipe. Before ⁇ preferably two lids are connected directly to each other via such pipes. This allows a uniform air distribution.
  • a further development of the drying apparatus provides a ⁇ angle sheet which is capable of at least one voltage Trock ⁇ head for stiffening and contemplated.
  • Such an angle sheet may be inserted into the pocket machined into the base plate or secured externally to the base plate.
  • all drying heads are provided with an angle plate.
  • the longitudinal direction of at least one air outlet slot extends transversely to the transport direction. tion, that said longitudinal direction deviates by an angle of 87 ° or less from the transport direction.
  • an air outlet slot outgoing air jet impinges pa- rallel to a trailing edge of the area to be dried sub ⁇ strats.
  • this parallel impact liquid located at the trailing edge can be pushed by the relative to the trailing edge obliquely extending air ⁇ beam when passing through the drying device from one end of the trailing edge to the opposite end of the rear ⁇ edge. This is particularly advantageous if the liquid tends to adhere to edges.
  • said angle is more than 75 ° and is less than or equal to 87 °.
  • said angle is more than 75 ° and is less than or equal to 87 °.
  • the longitudinal directions of all the air outlet slots in the manner described above extend transversely to the transport direction. This can be the case, for example, if the liquid adheres very strongly to edges. Moreover, stabilization can be effected in this way if the sheet substrates show a tendency to vibrate. Such vibrations may be due to deflecting effects of air jets in the drying apparatus. Especially in the case of thin, flat substrates, such vibrations can lead to the rupture of the planar substrate.
  • a further development of the invention provides that the longitudinal direction ⁇ an air outlet slot extends at least in ⁇ We sentlichen perpendicular to the transport direction.
  • drying heads can then be built very compact.
  • an upper drying head and a lower drying head are a drying head pair arranged to form such überei ⁇ Nander that the slot planes run in which the air outlet slots of the upper drying head of the Trock ⁇ voltage head pair, with the transport plane sectional Gera ⁇ form the, which coincide with intersection lines which DIE donating slot planes in which the air outlet slots of the lower head drying of the drying head pair duri ⁇ fen, make with the plane of transport.
  • the flat substrate can be virtually closed by a closed air jet ring. This allows a particularly efficient drying.
  • drying head pair may be provided in an advantageous manner that an upper voltage Trock ⁇ head and a lower head drying a drying head pair are arranged one above the other making that the
  • Slit planes in which the air outlet slots of the upper drying head of the drying head pair extend, form with the transport plane first line of intersection, which run parallel to the second line of intersection, which those slots levels, in which the air outlet slots of the lower drying ⁇ tion head of the drying head pair run, form with the Trans ⁇ portebene.
  • the arrangement is made such that the first line of intersection with respect to the second line of intersection in the transport direction by a value between 1 mm and 5 mm are offset from each other.
  • these Ver ⁇ set between 1 mm and 3 mm and preferably 2 mm.
  • the air jets from the upper Trock ⁇ head voltage and the lower drying head does not impinge on opposite points of the upper or Untersei ⁇ te of the planar substrate to but against each other ver ⁇ sets.
  • This may have a less efficient drying result, but on the other hand, the above ⁇ be signed and occurring in some applications inclination in this way be reduced to vibration and the associated risk of breakage or avoided.
  • an arrangement has such a way that are offset downstream the first cutting ⁇ straight opposite the second cut line in the transport direction ⁇ .
  • At least two Trock ⁇ voltage pairs of heads are provided, which are arranged in the transport direction nacheinan ⁇ .
  • These two drying head pairs can be configured identically. Basically, however, the two pairs of heads drying may also be different to the requirements of each application to meet the ⁇ .
  • ⁇ couple the drying heads may be arranged in a second drying mind that the ers ⁇ th and second cut lines are displaced in the manner described above against each other while being arranged in the first drying ⁇ head couple the drying heads such that the line of intersection as above coincide.
  • an upper and a lower drying head a drying head pair are forming above the other ranked at ⁇ .
  • the upper and lower drying heads of the drying head pair each have at least one flow-through stabilizing slot.
  • Said Stabili ⁇ s istsschlitze are arranged in each case in the transport direction ver ⁇ sets next to an air outlet slot. Furthermore, the said stabilizing slots are formed and arranged such that their longitudinal directions extend substantially parallel to the transport plane and in an angle deviating from 90 ° ⁇ the angle transverse to the transport direction. Further, the at least one stabilizing slot of the upper drying head and the at least one stabilizing ⁇ slot of the lower drying head pairs net angeord- such that arranged in the drying in the upper head
  • the stabilizing slots of the stabilizing slot pair are oriented in opposite directions relative to the transport direction, so that the outflowing air fronts of the stabilizing slots of this pair of stabilizing slots intersect in the transport plane.
  • stabilizing ⁇ slots instead of other measures to avoid vibration.
  • the drying device can thus optimally to the particular application and its compassionbe ⁇ conditions, such as limited space, be matched.
  • a combination of stabilizing slots and air outlets extending substantially perpendicularly to the transport direction may prove to be very advantageous in the case of limited space and vibration tendency.
  • the inventive method for drying a flat substrate in a fürlaufanläge envisages itself to flow through a top surface of the planar substrate from a slurry over an entire ⁇ te of the planar substrate extending across the upper air jet. Simultaneously, a bottom of the sur fa ⁇ speaking substrate is flown from a over an entire width of the planar substrate extending across the bottom air jet.
  • the top and bottom of the sheet substrate are of the upper and lower air jet loading subjected to a transport plane in which the sheet-like sub ⁇ strat is transported flows against at angles which are larger than 0 ° and smaller than 90 °.
  • the term the upper side of the flat substrate is a first large-area side of the flat substrate, Be ⁇ reached the bottom of a second large-area side of the sur fa ⁇ speaking substrate.
  • the top and bottom of the flat sub ⁇ strats are not necessarily flowing at equal angles, they can in principle surfaces from each other differ, especially if it is necessary in the particular application to be advantageous. Usually, however, they are flowed at equal angles.
  • the inventive method makes it possible to dry-area sub strate ⁇ in continuous flow systems, even at elevated speeds Transportge ⁇ by the fürönanläge therethrough insbeson ⁇ particular at transport speeds greater than 2.6 meters per te for minutes, reliable. By Flow over across the entire width of the flat substrate away occidentalre ⁇ ADORABLE air jets barely liquid, the air jets go to ⁇ .
  • the sheet substrate can be dried reliably over its entire width.
  • the upper surface of the planar substrate from the top air jet and the bottom of the flat sub ⁇ strats receive flow from the lower air jet counter to a transport ⁇ direction in which the sheet-like substrate is transported in the transport plane.
  • a flow direction of the air jet has a whilskomponen ⁇ te, which is directed opposite the transport direction.
  • the upper surface of the flat sub ⁇ strats of the top air jet and the bottom of the sur fa ⁇ speaking substrate are blown onto the transport plane at angles obtained from the lower air jet, which are larger than 60 ° and smaller than 80 °.
  • these angles are RESIZE ⁇ SSER than 65 ° and smaller than 75 °.
  • the upper and lower air jet are preferably aligned such that they impinge in opposite preparation ⁇ surfaces of the flat substrate, on the one hand lie on the upper side of the flat substrate, on the other hand on the underside of the planar substrate.
  • an air jet composite can be formed, which is the planar Surrounds the substrate circumferentially. Liquid can at such ei ⁇ nem circulating air jet structure is very difficult past ge ⁇ long, so efficient drying can be effected.
  • top air jet and the bottom air jet to be aligned such that it in the transport direction by a value between 1 mm and 5 mm against ⁇ staggered impinge on the planar substrate.
  • this value is between 1 mm and 3 mm and more preferably 2 mm.
  • a trailing edge of the flat sub ⁇ strats of the upper and lower air jet in Anströmrich ⁇ lines flowed so obliquely that the trailing edge with the direction of flow of the upper air jet and also with the on ⁇ strömraum the lower air jet angle of 3 ° or more.
  • the angles are less than 15 ° and are greater than or equal to 3 °.
  • the angles are 3 °.
  • the sur fa ⁇ CHIGE substrate by a plurality of upper and a plurality of lower air ⁇ radiation is flown, in each case an upper and a lower air jet forming an air jet couple and impinge the air jets of the various air jet pairs in the transport direction gegeneinan ⁇ of offset to the planar substrate.
  • an upper and a lower air jet forming an air jet couple and impinge the air jets of the various air jet pairs in the transport direction gegeneinan ⁇ of offset to the planar substrate.
  • the upper surface of an upper stabilization air jet and the bottom are preferably flows against a lower stabilization air jet for the stabilization of the sheet substrate.
  • the lower stabilization air jet preferably has a a flow direction of the upper stabilization air jet entge ⁇ gennch directed flow direction. This measure can be performed alternatively or in addition to the other to avoid vibration of the planar substrate serving steps by ⁇ .
  • the flow directions of the stabilization ⁇ air jets are particularly preferably selected parallel to a WING ⁇ chennormalen the transport plane.
  • the beam profiles of the upper and lower stabilization air jet are so designed from ⁇ that in the case of Zuströmens the upper stabilizer ⁇ l Deutschens KunststoffStrahls with opposite flow direction on the lower stabilization air jet at a Pro ⁇ jection of the beam profiles in the flow direction in a Pro ⁇ projection image of the two beam profiles results in an intersection.
  • this point of intersection lies approximately in the middle of the projection image.
  • the beam profiles are formed axially symmetrical to an axis passing through the point of intersection.
  • the sheet-like substrates at a rate RESIZE ⁇ SSER than 2.6 m per minute through the fürlaufanläge be transported ⁇ advantage during the drying of the flat sub ⁇ strate. In this way, good and reliable trock ⁇ planning results can be realized at a comparatively high speed fürsatzge-.
  • FIG. 2 partial representation of the drying apparatus from FIG. 1
  • FIG. 3 partial representation of a drying head from FIG. 2
  • FIG. 4 partial representation of the drying device from FIG. 1 during the passage through a semiconductor substrate
  • FIG. 5 (a) partial sectional view, (b) sectional view and (c) detail of a drying head from FIG.
  • FIG. 7 shows perspective views of a second execution ⁇ example of the drying device 8 is partial view of the drying apparatus of Figure 7
  • FIG. 10 partial representation of a drying head from FIG. 9
  • Figure 11 first perspective view of a drying ⁇ head pair of Figure 9
  • Figure 12 is perspective view of the second head pair ⁇ drying of Figure 11,
  • FIG. 13 shows a schematic diagram of a first exemplary embodiment of the method
  • FIG 14 Schematic representation of a second embodiment of the method Figure 15
  • Third embodiment of the method Figure 16 Opposing beam profiles
  • FIG. 1 shows a first embodiment of the drying device.
  • the drying device 1 shown therein has two upper drying heads 2a, 2b and two lower drying heads 3a, 3b.
  • the upper drying head 2a and the lower drying head 3a on the one hand and the upper voltage Trock ⁇ head 2b and the lower drying head 3b are respectively connected to the drying head pairs.
  • the drying device 1 will be explained in more detail below with reference to the figures 1 to 6.
  • Figure 2 shows the two lower drying heads 3a, 3b in a perspective view.
  • air outlet slots 5a, 5b can be seen, which are arranged in the lower drying heads 3a, 3b.
  • the air outlet ⁇ slot 5a is also visible in the enlarged partial view of the lower drying head 3a in Figure 3 and in Figure 4.
  • Figure 4 also shows a semiconductor substrate, which is transported straight through in a transport direction 9 through the drying device 1.
  • An underside of the Halbleitersub ⁇ strats extends in a transport plane 8.
  • the upper drying head 2a is in the representation of Figure 4, the BES seren clarity is ⁇ provided only to a small extent. However, this shows an upper air outlet ⁇ slot 4a. From FIGS. 1 and 4, it can thus be seen that the upper drying heads 2a, 2b are arranged above the transport plane 8, whereas the lower drying heads 3a, 3b are arranged below the transport plane 8. As can be seen from FIG. 2, the lower drying heads 3a, 3b have a plurality of air outlet slots 5a, 5b. The upper drying heads also have several air outlet slots.
  • Air outlet slot 4a of the upper drying head 2a gehö ⁇ ing slot plane 11 is indicated schematically in Figure 4.
  • This slot plane 11 intersects the transport plane 8 at ei ⁇ nem angle a.
  • This angle a is greater than 0 ° and at the same time less than 90 °. Preferably, it is 70 °.
  • FIG. 5a) shows a partial view of a bottom view of the upper drying head 2b.
  • a Thomasdar ⁇ position through this upper drying head 2b along the Li ⁇ is never reproduced CC of Figure 5a).
  • FIG. 5 shows the upper drying head 2b with the cover 20 removed.
  • the air outlet slits 4a, 4b, 5a, 5b have, at the Trock ⁇ drying apparatus 1 all have a uniform slot depth 13 (see FIG. 4), which is 3 mm.
  • a ge in Figure 5c) ⁇ shows detailed view of a portion Z of Figure 5b) il- lustriert a slot width 14. This is a uniform
  • stiffening webs 16 are provided in the drying device 1. These are arranged at a distance of about 5 cm from each other. In this way, the dimensional stability of the air outlet slots 4a, 4b, 5a, 5b can be increased.
  • the longitudinal directions of the air exit slits extend 4a, 4b, 5a, 5b of the ⁇ art transversely to the transport direction 9, that said longitudinal ⁇ directions by an angle b deviate ⁇ surfaces of the transport direction, the 87 ° or less.
  • the angle shown in Fi gur ⁇ 5a) is (90 ° -b) thus 3 °.
  • the drying apparatus 1 is a trock ⁇ voltage device for a multi-track system, more specifically for a five-track system.
  • the semiconductor substrates 7 can run side by side through the drying device in five Spu ⁇ ren.
  • the air outlet slots 4a, 4b, 5a, 5b see pre ⁇ are for each track.
  • a slot length 15 of the air outlet slots 4a, 4b, 5a, 5b each extend over the entire width of the semiconductor substrate (see FIG. In the case of Silizi ⁇ to semiconductor substrates, a slot length has proven 15 of 180 mm.
  • the upper drying head 2a and the lower drying head 3a are arranged one above the other so that the slot plane 11 forms a cutting line with the transport plane 8, which coincides with a cutting line, which forms the slot plane associated with the lower air outlet slot 5a with the Trans ⁇ Portebene 8.
  • This has the consequence that a is true from the obe ⁇ ren air outlet slit 4a air exiting beam over its entire length with an emerging from the lower air outlet ⁇ slot 5a air jet in the transport plane. 8
  • All drying heads 2a, 2b, 3a, 3b have base plates 18a, 18b, 19a, 19b, in each of which a pocket 22 for air guide ⁇ incorporated.
  • This is shown in FIG. 6 by way of example for the lower drying head 3a, which is shown there for this purpose with the cover 20 removed.
  • the bag 22 forms when the lid 20 is a cavity 23, which serves to guide the air.
  • an angle plate 24 is inserted into the drying heads 2a, 2b, 3a, 3b, which has the gleichze ⁇ lar air distribution serving holes 25.
  • Drying head 3a In the case of the drying apparatus 1, the upper Trock ⁇ voltage heads 2a, 2b connected together by a common upper Rohrzulei ⁇ tung 26th Accordingly, the lower drying heads 3a, 3b connected by a common lower tube ⁇ supply 27th About these pipe feeders 26, 27 is an air used for drying, or another ⁇ res used gas mixture, the drying device 1 is supplied ⁇ .
  • Figures 7 and 8 illustrate a furtherconstrusbei ⁇ play of the drying apparatus. So figure shows two 7-perspective by ⁇ representations of a drying device 40 from different angles.
  • the drying device 40 has two upper drying heads 42a, 42b and two lower drying heads 43a, 43b, which form two drying head pairs 42a, 43a and 42b, 43b.
  • the upper and lower pipe feed line 26, 27 in the drying device 1 40 separate hose feed 51a, 51b, 51c, 51d are provided for each drying head 42a, 42b, 43a, 43b in the Trocknungsvor ⁇ direction. These serve in a similar manner to the supply of air or other drying medium.
  • Each of the drying heads 42a, 42b, 43a, 43b similarly as in the case of the drying apparatus 1 comprises a base plate 48a, 48b, 49a, 49b, in which a bag is incorporated, which is closable with ⁇ means of the lid 20th
  • an angle plate 54 serving for stiffening is not arranged in the pockets in the case of the drying device 40, but is fastened on the outside to the drying heads 42a, 42b, 43a, 43b.
  • Manner can be prevented from flowing move from the angle plates being ⁇ rising metallic impurities by means of through pockets air on the semiconductor substrates and contaminate.
  • continuous air outlet slots 45a, 45b are provided in the drying ⁇ device. As can be seen in FIG. 8, these extend substantially perpendicular to the transport direction 9.
  • the drying device 40 can still be used in multi-lane systems.
  • appropriately designed air outlet slots are provided in the upper drying heads 42a, 42b. However, they are offset relative to the air outlet slots 45a, 45b of the lower drying heads 43a, 43b.
  • this first cut line no longer coincide with the second line of intersection forming those Schlitzebe ⁇ NEN with the transport plane 8, in which the air from ⁇ passage slots 45a, 45b of the lower drying heads 43a, 43b extend. Rather, in each drying head pair 42a, 43a and 42b, 43b, the first cut line relative to the second
  • FIGS 9 to 12 illustrate a furtherconstrusbei ⁇ play of the drying apparatus.
  • the illustrated drying ⁇ device 70 has two upper drying heads 72a, 72b and two lower drying heads 73a, 73b.
  • the drying apparatus 40 72b, 73a, 73b continuous or at least na ⁇ hezu continuous air exit slots 74a, 75a are in the Trock ⁇ voltage heads 72a, arranged whose longitudinal directions are substantially perpendicular to the
  • Transport direction 9 extend. Unlike drying Device 40 come in the drying device 70, the air outlet slots 74a, 75a upper 72a, 72b and lower drying heads 73a, 73b again superposed. Infol ⁇ gepository arrives arranged from that in the upper drying head 72a air exit slot 74a outgoing air jet analogously as in the case of the drying apparatus 1 in the Trans ⁇ port plane 8 with an outgoing from the air exit slot 75a of the un ⁇ direct drying head 73a air jet together. However, the upper 72a and the lower drying head 73a of the drying head pair shown in Figs. 11 and 12 of air, or more specifically the drying medium, have flow through stabilizing slots 80a, 81a. These are arranged offset in transport ⁇ direction 9 adjacent to the air outlet slots 74a or 75a. Longitudinal directions of the stabilizing slots
  • the stabilizing slots 80a in the upper drying head 72a are opposite to the Stabilizing ⁇ slots 81 a arranged in the lower drying head 73 a.
  • the stabilizing ⁇ slots 80a, 81a are formed such that strikes them from ausströ ⁇ air flowing in a direction parallel to a surface normal of the transport plane 8 to the semiconductor substrate.
  • Stabilizing slots 80a, 81a are also provided in the drying heads 72b, 73b in a corresponding manner. You can, as explained above, be additionally or alternatively used as co ⁇ tel to reduce or avoid vibration to be dried semiconductor substrates.
  • 72a have the drying ⁇ heads, 72b, 73a, 73b in a similar manner as in the overall therein Trock ⁇ drying devices 1 and 40 base plates 78a, 79a, formed pockets 82 and the lid 20.
  • the Ausstei ⁇ tion serving angle plate 54 is mounted as in the case of drying ⁇ device 40 outside the pockets 82. Consequently, in the angle plate 54 no holes for distributing the air in the pockets 82 on the various tracks and associated air outlet slots 74 a, 75 a arranged ⁇ who.
  • the uniform distribution of the air flow within the pockets 82a which is significant for a uniform drying result on all tracks, must therefore take place in a different manner.
  • FIG. 13 illustrates a schematic representation of a first exemplary embodiment of the method.
  • an upper side 28 of the semiconductor substrate 7 is flown over the entire width of the semiconductor substrate 7 away from an upper air jet 92.
  • a bottom side 29 of the semiconductor substrate 7 will be flowed through by a over the entire width of the semiconductor substrate 7 of time extending lower air jet ⁇ 93rd
  • the top 28 as well as the bottom 29 are thereby against the transport direction 9 flows against said air jets 92, 93.
  • the flow occurs at each ⁇ at the angle a, which preferably carries 70 ° ⁇ .
  • the upper 92 and the lower air jet 93 are aligned such that they impinge in opposite Berei ⁇ chen the top 28 on the one hand and the bottom 29 on the other hand.
  • the first embodiment of the method can be performed in advantageous manner ⁇ with the drying apparatus 1 or the drying device 70th
  • ⁇ tert hereinafter referring back to FIG. 4
  • a trailing edge 6 of the semiconductor substrate of the upper 92 and the lower air ⁇ jet 93 is flowed obliquely in flow directions that the trailing edge 6 with the direction of flow of the upper air jet ⁇ 92 and also with the direction of flow of the lower air ⁇ jet 93rd an angle c of 3 °.
  • Figure 14 illustrates a second embodiment of the Ver ⁇ driving.
  • the upper air jet 92 and the un- tere air jet 93 are aligned such that they are added in the transport direction by an offset ⁇ 94 impinge on the Halbleitersub ⁇ strat. 7
  • the offset 94 is preferably 2 mm.
  • the upper air jet 92 impinges against the lower air ⁇ jet 93 downstream in the transport direction 9 on the semiconductor substrate 7. This has proven itself in practice.
  • FIG. 15 A further embodiment of the process illustrated Figure 15.
  • the upper surface 28 of the Halbleitersub ⁇ strats be ⁇ flows from an upper stabilization air jet 96, the underside 29 is flown from a bottom stabilization air jet 97th
  • the flow directions of the upper stabilizing air jet 96 and of the lower stabilizing air jet 97 are aligned in opposite directions.
  • the flow directions of both stabilizing air jets 96, 97 are parallel to one another Surface normals of the transport plane 8.
  • the stabilizing air ⁇ rays 96, 97 can in turn be used in addition or alternatively to reduce or avoid vibration of the semiconductor ⁇ semiconductor substrate.
  • Figure 16 shows a schematic representation of a beam ⁇ profile 98 of the upper stabilization air jet 96 of Figure 15 and a beam profile 99 of the lower stabilization air ⁇ beam 97 of Figure 15. As shown in Figure 16 can be seen, these beam profiles 98, 99 are in opposite directions.
  • Figures 15 and 16 can be realized by means of the drying apparatus 70. While the invention in detail illustrated by preferred execution ⁇ examples and described in detail, the He ⁇ invention not a ⁇ set and other variants of the invention may be prepared by the disclosed embodiments be derived by the expert ⁇ man, without departing from the basic idea of the invention.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

L'invention concerne un dispositif de séchage (1) comportant au moins une tête supérieure (2a) de séchage et au moins une tête inférieure (3a) de séchage, dans lequel la ou les têtes supérieures (2a) de séchage étant agencées au-dessus d'un plan de transport (8) dans lequel des objets à sécher peuvent être transportés à travers le dispositif de séchage (1) dans une direction de transport (9), et la ou les têtes inférieures (3a) de séchage étant agencées sous ledit plan de transport (8), la ou les têtes supérieures (2a) de séchage et la ou les têtes inférieures (3a) de séchage comportent au moins une fente de sortie d'air (4a, 5a), des directions longitudinales desdites fentes de sortie d'air (4a, 5a) s'étendent sensiblement parallèlement au plan de transport (8) et obliquement par rapport à la direction de transport (9), et dans lequel des plans de fentes (11) dans lesquels passent lesdites fentes de sortie d'air coupent le plan de transport (8) à des angles (a) qui sont supérieurs à 0° et inférieurs à 90° ; ainsi que des procédés de séchage d'un substrat (7) plat dans une installation de passage.
EP18793166.2A 2017-07-14 2018-07-12 Dispositif de séchage et procédés de séchage d'un substrat Pending EP3652776A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017115875 2017-07-14
PCT/DE2018/100641 WO2019011382A1 (fr) 2017-07-14 2018-07-12 Dispositif de séchage et procédés de séchage d'un substrat

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EP3652776A1 true EP3652776A1 (fr) 2020-05-20

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EP (1) EP3652776A1 (fr)
JP (1) JP7273788B2 (fr)
KR (1) KR20200022501A (fr)
CN (1) CN110892518B (fr)
TW (1) TWI788382B (fr)
WO (1) WO2019011382A1 (fr)

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WO2021180906A1 (fr) 2020-03-13 2021-09-16 Fundació Institut De Bioenginyeria De Catalunya Aptamères pour la détection de globules rouges infectés par plasmodium
CN114967293A (zh) * 2021-02-18 2022-08-30 许苍宏 镜头吸湿套结构

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JP2017154111A (ja) 2016-03-04 2017-09-07 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

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US20230304735A1 (en) 2023-09-28
WO2019011382A1 (fr) 2019-01-17
TW201908680A (zh) 2019-03-01
US20200208913A1 (en) 2020-07-02
US20230314072A1 (en) 2023-10-05
JP7273788B2 (ja) 2023-05-15
KR20200022501A (ko) 2020-03-03
JP2020527689A (ja) 2020-09-10
TWI788382B (zh) 2023-01-01
CN110892518A (zh) 2020-03-17
CN110892518B (zh) 2023-12-05

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