EP3110982A1 - Formulations à base humide pour l'élimination sélective de métaux nobles - Google Patents
Formulations à base humide pour l'élimination sélective de métaux noblesInfo
- Publication number
- EP3110982A1 EP3110982A1 EP15755407.2A EP15755407A EP3110982A1 EP 3110982 A1 EP3110982 A1 EP 3110982A1 EP 15755407 A EP15755407 A EP 15755407A EP 3110982 A1 EP3110982 A1 EP 3110982A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- acid
- leaching composition
- noble metals
- chloride
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 123
- 229910000510 noble metal Inorganic materials 0.000 title claims abstract description 71
- 238000009472 formulation Methods 0.000 title description 5
- 238000002386 leaching Methods 0.000 claims abstract description 99
- 238000000034 method Methods 0.000 claims abstract description 42
- 150000004820 halides Chemical class 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 20
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000007800 oxidant agent Substances 0.000 claims description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- -1 oxone Chemical compound 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 15
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 13
- 239000003638 chemical reducing agent Substances 0.000 claims description 13
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 12
- 229910017604 nitric acid Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000010953 base metal Substances 0.000 claims description 9
- 238000005363 electrowinning Methods 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 8
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 8
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 7
- 239000003112 inhibitor Substances 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052717 sulfur Inorganic materials 0.000 claims description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 239000011780 sodium chloride Substances 0.000 claims description 6
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 claims description 5
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002699 waste material Substances 0.000 claims description 5
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 claims description 4
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- FLJPGEWQYJVDPF-UHFFFAOYSA-L caesium sulfate Chemical compound [Cs+].[Cs+].[O-]S([O-])(=O)=O FLJPGEWQYJVDPF-UHFFFAOYSA-L 0.000 claims description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 4
- 235000010333 potassium nitrate Nutrition 0.000 claims description 4
- 239000004323 potassium nitrate Substances 0.000 claims description 4
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 4
- FGDZQCVHDSGLHJ-UHFFFAOYSA-M rubidium chloride Chemical compound [Cl-].[Rb+] FGDZQCVHDSGLHJ-UHFFFAOYSA-M 0.000 claims description 4
- 235000010344 sodium nitrate Nutrition 0.000 claims description 4
- 239000004317 sodium nitrate Substances 0.000 claims description 4
- UBXAKNTVXQMEAG-UHFFFAOYSA-L strontium sulfate Chemical compound [Sr+2].[O-]S([O-])(=O)=O UBXAKNTVXQMEAG-UHFFFAOYSA-L 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021592 Copper(II) chloride Inorganic materials 0.000 claims description 3
- 229910002651 NO3 Inorganic materials 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000010793 electronic waste Substances 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 150000002823 nitrates Chemical class 0.000 claims description 3
- 229910052762 osmium Inorganic materials 0.000 claims description 3
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 3
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 3
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 3
- 238000006722 reduction reaction Methods 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 150000003458 sulfonic acid derivatives Chemical class 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 2
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 2
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- KHPLPBHMTCTCHA-UHFFFAOYSA-N ammonium chlorate Chemical compound N.OCl(=O)=O KHPLPBHMTCTCHA-UHFFFAOYSA-N 0.000 claims description 2
- 235000019270 ammonium chloride Nutrition 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- KBKZYWOOZPIUJT-UHFFFAOYSA-N azane;hypochlorous acid Chemical compound N.ClO KBKZYWOOZPIUJT-UHFFFAOYSA-N 0.000 claims description 2
- ZRDJERPXCFOFCP-UHFFFAOYSA-N azane;iodic acid Chemical compound [NH4+].[O-]I(=O)=O ZRDJERPXCFOFCP-UHFFFAOYSA-N 0.000 claims description 2
- YUUVAZCKXDQEIS-UHFFFAOYSA-N azanium;chlorite Chemical compound [NH4+].[O-]Cl=O YUUVAZCKXDQEIS-UHFFFAOYSA-N 0.000 claims description 2
- URGYLQKORWLZAQ-UHFFFAOYSA-N azanium;periodate Chemical compound [NH4+].[O-]I(=O)(=O)=O URGYLQKORWLZAQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 claims description 2
- 239000001110 calcium chloride Substances 0.000 claims description 2
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- HCAJEUSONLESMK-UHFFFAOYSA-N cyclohexylsulfamic acid Chemical compound OS(=O)(=O)NC1CCCCC1 HCAJEUSONLESMK-UHFFFAOYSA-N 0.000 claims description 2
- LFINSDKRYHNMRB-UHFFFAOYSA-N diazanium;oxido sulfate Chemical compound [NH4+].[NH4+].[O-]OS([O-])(=O)=O LFINSDKRYHNMRB-UHFFFAOYSA-N 0.000 claims description 2
- 229910001448 ferrous ion Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 2
- IGMBKNUVZFAHJM-UHFFFAOYSA-I hydrogen sulfate;oxido hydrogen sulfate;tetrabutylazanium;sulfate Chemical compound OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-].CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC IGMBKNUVZFAHJM-UHFFFAOYSA-I 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 2
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 150000002825 nitriles Chemical class 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 239000001103 potassium chloride Substances 0.000 claims description 2
- 235000011164 potassium chloride Nutrition 0.000 claims description 2
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 claims description 2
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 2
- 239000001230 potassium iodate Substances 0.000 claims description 2
- 235000006666 potassium iodate Nutrition 0.000 claims description 2
- 229940093930 potassium iodate Drugs 0.000 claims description 2
- 239000012286 potassium permanganate Substances 0.000 claims description 2
- 235000011151 potassium sulphates Nutrition 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 2
- 229940102127 rubidium chloride Drugs 0.000 claims description 2
- 229910000344 rubidium sulfate Inorganic materials 0.000 claims description 2
- GANPIEKBSASAOC-UHFFFAOYSA-L rubidium(1+);sulfate Chemical compound [Rb+].[Rb+].[O-]S([O-])(=O)=O GANPIEKBSASAOC-UHFFFAOYSA-L 0.000 claims description 2
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 2
- 235000011152 sodium sulphate Nutrition 0.000 claims description 2
- 229910001631 strontium chloride Inorganic materials 0.000 claims description 2
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 claims description 2
- 125000004434 sulfur atom Chemical group 0.000 claims description 2
- 150000003464 sulfur compounds Chemical class 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 125000005207 tetraalkylammonium group Chemical group 0.000 claims description 2
- LUVHDTDFZLTVFM-UHFFFAOYSA-M tetramethylazanium;chlorate Chemical compound [O-]Cl(=O)=O.C[N+](C)(C)C LUVHDTDFZLTVFM-UHFFFAOYSA-M 0.000 claims description 2
- FDXKBUSUNHRUIZ-UHFFFAOYSA-M tetramethylazanium;chlorite Chemical compound [O-]Cl=O.C[N+](C)(C)C FDXKBUSUNHRUIZ-UHFFFAOYSA-M 0.000 claims description 2
- ZRVXFJFFJZFRLQ-UHFFFAOYSA-M tetramethylazanium;iodate Chemical compound [O-]I(=O)=O.C[N+](C)(C)C ZRVXFJFFJZFRLQ-UHFFFAOYSA-M 0.000 claims description 2
- ZCWKIFAQRXNZCH-UHFFFAOYSA-M tetramethylazanium;perchlorate Chemical compound C[N+](C)(C)C.[O-]Cl(=O)(=O)=O ZCWKIFAQRXNZCH-UHFFFAOYSA-M 0.000 claims description 2
- HLQAWDQQEJSALG-UHFFFAOYSA-M tetramethylazanium;periodate Chemical compound C[N+](C)(C)C.[O-]I(=O)(=O)=O HLQAWDQQEJSALG-UHFFFAOYSA-M 0.000 claims description 2
- DAFQZPUISLXFBF-UHFFFAOYSA-N tetraoxathiolane 5,5-dioxide Chemical compound O=S1(=O)OOOO1 DAFQZPUISLXFBF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
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- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical class O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 1
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- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 1
- CWRVKFFCRWGWCS-UHFFFAOYSA-N Pentrazole Chemical compound C1CCCCC2=NN=NN21 CWRVKFFCRWGWCS-UHFFFAOYSA-N 0.000 description 1
- 229930184207 Polyphenon Natural products 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 description 1
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 description 1
- 229960000643 adenine Drugs 0.000 description 1
- 229960005305 adenosine Drugs 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000005910 alkyl carbonate group Chemical group 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 229940107816 ammonium iodide Drugs 0.000 description 1
- 239000002246 antineoplastic agent Substances 0.000 description 1
- 229940041181 antineoplastic drug Drugs 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 150000008107 benzenesulfonic acids Chemical class 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 1
- 229910001622 calcium bromide Inorganic materials 0.000 description 1
- 229940059251 calcium bromide Drugs 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 229910001640 calcium iodide Inorganic materials 0.000 description 1
- 229940046413 calcium iodide Drugs 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 235000010350 erythorbic acid Nutrition 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- LRBQNJMCXXYXIU-QWKBTXIPSA-N gallotannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@H]2[C@@H]([C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-QWKBTXIPSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229940094952 green tea extract Drugs 0.000 description 1
- 235000020688 green tea extract Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- NPZTUJOABDZTLV-UHFFFAOYSA-N hydroxybenzotriazole Substances O=C1C=CC=C2NNN=C12 NPZTUJOABDZTLV-UHFFFAOYSA-N 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229940026239 isoascorbic acid Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910001641 magnesium iodide Inorganic materials 0.000 description 1
- 229940104873 methyl perfluorobutyl ether Drugs 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- WLGDAKIJYPIYLR-UHFFFAOYSA-N octane-1-sulfonic acid Chemical compound CCCCCCCCS(O)(=O)=O WLGDAKIJYPIYLR-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229960005152 pentetrazol Drugs 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- YJPVTCSBVRMESK-UHFFFAOYSA-L strontium bromide Chemical compound [Br-].[Br-].[Sr+2] YJPVTCSBVRMESK-UHFFFAOYSA-L 0.000 description 1
- 229910001625 strontium bromide Inorganic materials 0.000 description 1
- 229940074155 strontium bromide Drugs 0.000 description 1
- KRIJWFBRWPCESA-UHFFFAOYSA-L strontium iodide Chemical compound [Sr+2].[I-].[I-] KRIJWFBRWPCESA-UHFFFAOYSA-L 0.000 description 1
- 229910001643 strontium iodide Inorganic materials 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- LDGFRUUNCRYSQK-UHFFFAOYSA-N triazin-4-ylmethanediamine Chemical compound NC(N)C1=CC=NN=N1 LDGFRUUNCRYSQK-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- WRTMQOHKMFDUKX-UHFFFAOYSA-N triiodide Chemical compound I[I-]I WRTMQOHKMFDUKX-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- 239000010938 white gold Substances 0.000 description 1
- 229910000832 white gold Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
- C22B3/065—Nitric acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
- C22B3/08—Sulfuric acid, other sulfurated acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/22—Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means, or by thermal decomposition
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/44—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Definitions
- the present invention relates generally to processes for recycling/reclaiming of noble metals, such as ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold from source materials.
- noble metals such as ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold from source materials.
- noble metals such as gold, silver and platinum group metals which offer the opportunity for economical recovery.
- gold is available from ores and numerous scrap sources, including industrial wastes, gold plated electronic circuit boards, and in alloys with copper, zinc, silver or tin in the karat gold used in jewelry.
- Silver is available from photographic and x-ray film emulsions, scrap sterling, and numerous industrial sources.
- Platinum group metals are available from industrial sources, such as catalysts. There are numerous instances in which it is desirable to recover these metals from an aggregate material.
- Platinum is a silvery, white, ductile metal which is insoluble in mineral and organic acids, but soluble in aqua regia. Platinum does not corrode or tarnish, and forms strong complexes with halides (i.e., chloride, bromide, fluoride and iodide). Platinum is used as a catalyst (nitric acid, sulfuric acid, and high-octane gasoline production; automobile exhaust gas converters), in laboratory ware, spinnerets for rayon and glass fiber manufacture, jewelry, dentistry, electrical contacts, thermocouples, surgical wire, bushings, electroplating, electric furnace windings, chemical reaction vessels, anti-cancer drugs and permanent magnets.
- halides i.e., chloride, bromide, fluoride and iodide
- Platinum is used as a catalyst (nitric acid, sulfuric acid, and high-octane gasoline production; automobile exhaust gas converters), in laboratory ware, spinnerets for rayon and glass fiber manufacture, jewelry, dentistry,
- Palladium is similarly a silvery, white, ductile metal which does not tarnish in air. It is the least noble (e.g., most reactive) of the platinum group, is insoluble in organic acids, but soluble in aqua regia and fused alkalies. Palladium is used as a catalyst for chemical processes including reforming cracked petroleum fractions and hydrogenation, for metallizing ceramics, as "white gold” in jewelry, in protective coatings, and in hydrogen valves (in hydrogen separation equipment). . Both platinum and palladium are good electrical conductors and are used in alloys for electrical relays in switching systems and telecommunication equipment, resistance wires and aircraft spark plugs. Further, platinum group metal applications include industrial radiography, catalysts, pen points, electrical contacts, jewelry, coatings and headlight reflectors.
- the present invention relates generally to compositions and processes for leaching noble metals from sources comprising same including, but not limited to, ores, jewelry, scraps comprising said noble metals, waste materials, alloys, catalyst materials, and various industrial sources. More specifically, the compositions for leaching noble metals from sources are acidic, halide-based compositions that efficiently remove noble metals from the source at room temperature.
- a leaching composition comprising at least one oxidizing agent, at least one halide, at least one acid, and at least one solvent.
- a method of removing noble metals from a source comprising contacting said source under conditions with the leaching composition, wherein said noble metals are dissolved or otherwise solubilized in the leaching composition, and wherein the leaching composition comprises at least one oxidizing agent, at least one halide, at least one acid, and at least one solvent.
- the present invention relates generally to compositions and processes for leaching noble metals from sources comprising same including, but not limited to, ores, jewelry, scraps comprising said noble metals, waste materials, alloys, catalyst materials, and various industrial sources. More specifically, the compositions for leaching noble metals from sources are acidic, halide-based compositions that efficiently remove noble metals from the source at low temperatures.
- “noble metals” refers to the group of metals including gold, silver, the platinum group metals, alloys comprising same, and combinations thereof.
- the "platinum group metals” include ruthenium, osmium, rhodium, iridium, palladium and platinum.
- base metals corresponds to iron, nickel, zinc, copper, aluminum, tungsten, molybdenum, tantalum, magnesium, cobalt, bismuth, cadmium, titanium, zirconium, antimony, manganese, beryllium, chromium, germanium, vanadium, gallium, hafnium, indium, niobium, rhenium, thallium, alloys comprising same, and combinations thereof.
- substantially devoid is defined herein as less than 2 wt. %, preferably less than 1 wt. %, more preferably less than 0.5 wt. %, and most preferably less than 0.1 wt. %. "Devoid” corresponds to 0 wt. %.
- halide corresponds to fluoride, chloride, bromide or iodide -containing species such as salts or acids.
- the "source” is a noble metal-containing material including, but not limited to, ores, jewelry, scraps comprising said noble metals, waste materials comprising said noble metals including electronic waste, alloys, catalyst materials, various industrial sources, and combinations thereof.
- to remove noble metals from a source means that the noble metal is substantially dissolved or solubilized or the like in the leaching composition, while base metals are not substantially dissolved or solubilized or the like.
- substantially dissolved is defined herein more than 95 wt. % of the material originally present is dissolved or solubilized or the like, preferably more than 98 wt. %, more preferably more than 99 wt. %, and most preferably more than 99.9 wt. %.
- “Not substantially dissolved” is defined herein less than 5 wt. % of the material originally present is dissolved or solubilized or the like, preferably less than 2 wt. %, more preferably less than 1 wt. %, and most preferably less than 0.1 wt. %.
- the term “leaches” or “leaching” corresponds to the complete or partial removal or extraction of the gold and/or other noble metals from the source into the leaching composition.
- the gold or other noble metal is dissolved or otherwise solubilized in the leaching composition, preferably dissolved.
- crushing corresponds to any method that substantially exposes the gold and other noble metals of the source material to the leaching composition, e.g., crushing, cracking, pulverizing, shredding, or grinding.
- agitation means include, but are not limited to, physical agitation such as mixing, recirculation, turbulence, and combinations thereof.
- compositions may be embodied in a wide variety of specific formulations, as hereinafter more fully described.
- specific constituents of the composition are discussed in reference to weight percentage ranges including a zero lower limit, it will be understood that such constituents may be present or absent in various specific embodiments of the composition, and that in instances where such constituents are present, they may be present at concentrations as low as 0.001 weight percent, based on the total weight of the composition in which such constituents are employed.
- a method of removing noble metals from a source wherein said noble metals are dissolved or otherwise solubilized in a leaching composition. More specifically, the method of removing noble metals from a source comprises contacting said source with a leaching composition, wherein said noble metals are dissolved or otherwise solubilized in the leaching composition. Preferably, noble metals are selectively removed relative to base metals also present in the source.
- new volumes of the source can be added to the leaching composition and the process of removing the noble metals can be repeated again and again until the leaching composition is saturated with noble metals.
- a "feed and bleed" process may be used wherein clean leaching composition is periodically introduced to the working leaching composition with simultaneous withdrawal of some of the working leaching composition.
- the leaching composition comprising the noble metals can be processed to obtain useful forms of said noble metals (e.g., electrochemically, by electrowinning, or using reducing agents).
- the leaching composition is contacted in any suitable manner to the source, e.g., by spraying the leaching composition on the source, by dipping the source in a volume of the leaching composition, by contacting the source with another material, e.g., a pad, or fibrous sorbent applicator element, that has the leaching composition absorbed thereon, by contacting the source with a recirculating composition, or by any other suitable means, manner or technique, by which the leaching composition is brought into contact with the source.
- a suitable manner or technique by which the leaching composition is brought into contact with the source.
- the source i.e., noble metal containing material
- the leaching composition can be added to the leaching composition as is, pulverized into a powder, shredded into pieces, crushed, or in any other form so long as the metals contained in the source are readily exposed for removal from the source.
- the leaching composition and the source can be agitated such that the source is substantially exposed to the leaching composition.
- the leaching composition typically is contacted with the source for a time of from about 1 min to about 120 minutes, preferably about 3 min to 60 at temperature in a range of from about 20°C to about 100°C, preferably in a range from about 20°C to about 60°C, more preferably about 20°C to about 40°C, and most preferably about room temperature.
- Such contacting times and temperatures are illustrative, and any other suitable time and temperature conditions may be employed that are efficacious to remove the noble metals from the source comprising same.
- a leaching composition comprising, consisting of, or consisting essentially of at least one oxidizing agent, at least one halide, at least one acid, and at least one solvent.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one chloride salt, at least one acid, and at least one solvent.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one chloride salt, at least one sulfur- containing acid, and at least one solvent.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one alkaline chloride salt, at least one sulfur-containing acid, and at least one solvent.
- the leaching composition comprises, consists of, or consists essentially of at least one nitrate salt oxidizing agent, at least one alkaline chloride salt, at least one sulfur-containing acid, and at least one solvent.
- the leaching composition is aqueous in nature and has a pH less than about 2, more preferably less than about 1.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one halide salt, at least one acid, and at least one solvent, present in the following weight percentages, based on the total weight of the composition:
- the leaching composition comprises, consists of, or consists essentially of at least one nitrate salt oxidizing agent, at least one alkaline chloride salt, at least one sulfur-containing acid, and at least one solvent, present in the following weight percentages, based on the total weight of the composition:
- Oxidizing agents are included in the composition to oxidize the metals to be removed into an ionic form and accumulate highly soluble salts of dissolved metals.
- Oxidizing agents contemplated herein include, but are not limited to, ozone, nitric acid (HN0 3 ), bubbled air, cyclohexylaminosulfonic acid, , hydrogen peroxide (H 2 0 2 ), oxone (potassium peroxymonosulfate, 2KHSO 5 KHSO 4 K 2 SO 4 ), ammonium polyatomic salts (e.g., ammonium peroxomonosulfate, ammonium chlorite (NH 4 C10 2 ), ammonium chlorate (NH 4 CIO 3 ), ammonium iodate (NH 4 IO 3 ), ammonium perborate (NH 4 BO 3 ), ammonium perchlorate (NH 4 CIO 4 ), ammonium periodate (NH 4 IO 3 ), ammonium pers
- the oxidizing agent comprises a nitrate ion including, but not limited to, nitric acid, sodium nitrate, potassium nitrate, ammonium nitrate, tetraalkylammonium nitrate, and combinations thereof.
- the at least one halide is preferably a chloride-containing compound including, but not limited to, hydrochloric acid, and alkaline chlorides (e.g., sodium chloride, potassium chloride, rubidium chloride, cesium chloride, magnesium chloride, calcium chloride, strontium chloride, ammonium chloride, quaternary ammonium chloride salts), and combinations thereof, with the proviso that the chloride-containing compound cannot include copper chloride, chlorine gas, or a second, different halide.
- the at least one halide is devoid of compounds such as CuCl 2 , Cl 2 , and BrCl 2 " .
- the at least one halide comprises an alkaline chloride, even more preferably an alkali metal chloride such as sodium chloride.
- the at least one halide can also include salts and/or acids comprising bromide and iodide including, but not limited to, sodium bromide, sodium iodide, potassium bromide, potassium iodide, rubidium bromide, rubidium iodide, cesium bromide, cesium iodide, magnesium bromide, magnesium iodide, calcium bromide, calcium iodide, strontium bromide, strontium iodide, ammonium bromide, ammonium iodide, quaternary ammonium bromide salts, and quaternary ammonium bromide salts.
- the at least one halide is preferably substantially devoid of fluoride ions.
- the at least one acid is preferably a sulfur-containing species such as sulfuric acid, sulfate salts (e.g., sodium sulfate, potassium sulfate, rubidium sulfate, cesium sulfate, magnesium sulfate, calcium sulfate, strontium sulfate, barium sulfate), sulfonic acid, sulfonic acid derivatives, and combinations thereof.
- sulfuric acid e.g., sodium sulfate, potassium sulfate, rubidium sulfate, cesium sulfate, magnesium sulfate, calcium sulfate, strontium sulfate, barium sulfate
- sulfate salts e.g., sodium sulfate, potassium sulfate, rubidium sulfate, cesium sulfate, magnesium sulfate, calcium sulfate, strontium sulf
- Sulfonic acid derivatives contemplated include methanesulfonic acid (MSA), ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid), benzenesulfonic acid, benzenesulfonic acid derivatives, and combinations thereof.
- the at least one acid comprises sulfuric acid, preferably concentrated sulfuric acid.
- the at least one solvent includes, but is not limited to, water, methanol, ethanol, isopropanol, butanol, pentanol, hexanol, 2-ethyl-l-hexanol, heptanol, octanol, ethylene glycol, propylene glycol, butylene glycol, tetrahydrofurfuryl alcohol (THFA), butylene carbonate, ethylene carbonate, propylene carbonate, dipropylene glycol, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol phenyl
- the leaching composition further comprises a corrosion inhibitor, specifically a base metal corrosion inhibitor, so as to ensure that the leaching composition selectively removes noble metals from the source relative to base metals.
- the leaching composition can comprise, consist of, or consist essentially of at least one oxidizing agent, at least one halide, at least one acid, at least one solvent, and at least one corrosion inhibitor.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one chloride salt, at least one acid, at least one solvent, and at least one corrosion inhibitor.
- the leaching composition comprises, consists of, or consists essentially of at least one oxidizing agent, at least one chloride salt, at least one sulfur-containing acid, at least one solvent, and at least one corrosion inhibitor.
- Corrosion inhibitors for passivating the base metals include, but are not limited to, ascorbic acid, adenosine, adenine, L(+)-ascorbic acid, isoascorbic acid, ascorbic acid derivatives, citric acid, ethylenediamine, gallic acid, oxalic acid, tannic acid, ethylenediaminetetraacetic acid (EDTA), uric acid, 1,2,4-triazole (TAZ), triazole derivatives (e.g., benzotriazole (BTA), tolyltriazole, 5-phenyl-benzotriazole, 5-nitro-benzotriazole, 3-amino-5- mercapto- 1,2,4-triazole, 1 -amino- 1,2,4-
- the leaching composition of the second aspect can further comprise noble metal chelators, surfactants, defoamers, and combinations thereof, as readily determined by the person skilled in the art.
- the leaching composition comprises, consists of, or consists essentially of sodium chloride, sulfuric acid, nitric acid, and water, with the proviso that the leaching composition is substantially devoid of hydrogen peroxide, copper (II) chloride, chlorine gas, BrCl 2 ⁇ , fluoride-containing compounds, hydroxide -containing compounds, ferrous ions, a sulfur compound comprising a sulfur atom with an oxidation state in the range of -2 to +5, and cyanides.
- the leaching composition comprises a nitrate such as nitric acid
- NO x gases can be emitted.
- the leaching process is carried out in a system comprising a condenser, wherein the NO x gases can be collected and converted back into nitric acid, as readily known to the person skilled in the art.
- NO x corresponds to mononitrogen oxides such as NO and N0 2 .
- the leaching composition is easily recyclable and can be employed in a closed-loop process generating minimal waste.
- the resulting leaching composition including the noble metals can be recycled by reclaiming the noble metals.
- the recycled leaching solution can be reused, with or without the addition of fresh leaching composition chemistry.
- the leaching composition is essentially non-toxic once the noble metals are reclaimed and the excess acidity neutralized.
- the leaching compositions described herein are easily formulated by simple addition of the respective ingredients and mixing to homogeneous condition. Furthermore, the leaching composition may be readily formulated as single-package formulations or multi-part formulations that are mixed at or before the point of use, e.g., the individual parts of the multi-part formulation may be mixed at the tool or in a storage tank upstream of the tool.
- the concentrations of the respective ingredients may be widely varied in specific multiples of the composition, i.e., more dilute or more concentrated, and it will be appreciated that the compositions described herein can variously and alternatively comprise, consist or consist essentially of any combination of ingredients consistent with the disclosure herein.
- the leaching composition described herein is capable of substantially removing noble metals from a source at room temperature without the use of high temperatures (e.g., temperatures greater than about 100°C), high pressures (e.g., pressures greater than atmospheric pressure) or electrodes to maintain the voltage of the composition in a specific range.
- the leaching composition is more environmentally friendly than the prior art cyanide compositions and more inexpensive than tri-iodide compositions.
- the vessel that is used to process the source to remove the noble metals can comprise any material without any concern of corrosion or degradation.
- the noble metals can be reclaimed from the leaching composition using a number of methods including, but not limited to, electrochemical techniques such as electrowinning, and chemical reduction processes.
- a reducing agent can be added to the leaching composition containing noble metals to cause their precipitation.
- various reducing agents can be applied to cause selective or non-selective precipitation of noble metals. Precipitation can be done in a manner to avoid the contamination of the leaching composition, so that the leaching composition can be regenerated and reused in the next leaching cycle after the noble metals have been removed.
- the reducing agent is a so-called environmentally friendly chemical.
- the reduction occurs rapidly with minimal heating requirements.
- precipitation with S0 2 is known to be selective for gold, non-contaminating to the leaching composition and inexpensive.
- Gold is precipitated as a fine powder that is separated from the leaching solution by filtration.
- a flocculating agent can be added to the solution at the same time as the reducing agent, if the reducing agent is in liquid or gaseous form. If the reducing agent is in the form of powder, a flocculating agent can be added after complete dissolution of the reducing agent to prevent collection of particles of the reducing agent.
- commercially available MAGNAFLOK-351 that is typically used for concentrating finely ground gold ores, can be used. The use of a non-ionic flocculating agent is preferred to avoid the possible undesirable recovery of iodine from the composition.
- the reducing agents can include, but are not limited to, sodium borohydride, ascorbic acid, diethyl malonate, sodium metabisulfite, polyphenon 60 (P60, green tea extract), glucose, and sodium citrate.
- ascorbic acid introduced to a composition comprising Au 3+ ions at pH 1 produces highly pure gold metal.
- Sodium metabisulfite (SMB) can be added to a composition comprising Au 3+ ions at pH 1 or H 7 and produce highly pure gold metal.
- the noble metal ions can be converted to noble metals via electrowinning or electrochemical techniques. Any suitable means can be used to remove the precipitated noble metals. Settling and decanting, filtering the solution through a filter press or centrifuging are convenient procedures for such removal.
- the leaching composition may still include leached silver and palladium ions.
- a selective reducing agent may be added for precipitation of silver, such as hydroxylamine.
- the use of a flocculating agent is suggested to facilitate filtration.
- palladium can be precipitated, for example, with the use of a stabilized alkali metal borohydride and a flocculating agent.
- the source material subsequent to leaching can be rinsed (e.g., with water) to further recover the residual leaching composition on the surface of the source material, which can contain very significant amounts of dissolved noble metals.
- Electrowinning is a common way of gold recovery from solutions, but if the rinse water comprising dissolved gold is recovered, conventional electrowinning becomes ineffective as gold is present in rinse water in small concentrations.
- the removal of gold from rinse water solutions can become effective if high surface area (HSA) electrodes are used for electrowinning.
- HSA electrowinning may economically remove gold having a concentration greater than 10 ppm down to ppb level.
- Iodide can also be oxidized and recovered using the same process if an undivided electrowinning cell is used.
- a leaching composition comprising 30 wt% water, 29 wt% sulfuric acid (96%), 18 wt% nitric acid (70%) and 23 wt%> saturated sodium chloride was prepared.
- the leaching composition was divided into four test tubes containing 1 Og each of the leaching composition. Gold fingers, pure Pd, pure Pt and pure Ag were added to each of the test tubes and processed as indicated and the pre- and post-weight of the noble metals determined, as summarized in Table 1.
- the leaching composition effectively and efficiently dissolved gold and palladium and could be loaded with additional metal as more source is added to said composition.
Abstract
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US201461944366P | 2014-02-25 | 2014-02-25 | |
PCT/US2015/017088 WO2015130607A1 (fr) | 2014-02-25 | 2015-02-23 | Formulations à base humide pour l'élimination sélective de métaux nobles |
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EP3110982A1 true EP3110982A1 (fr) | 2017-01-04 |
EP3110982A4 EP3110982A4 (fr) | 2017-11-22 |
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US (1) | US20160362804A1 (fr) |
EP (1) | EP3110982A4 (fr) |
KR (1) | KR20160127088A (fr) |
CN (1) | CN106661663A (fr) |
CA (1) | CA2943992A1 (fr) |
TW (1) | TW201602357A (fr) |
WO (1) | WO2015130607A1 (fr) |
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EP3083016B1 (fr) * | 2013-12-20 | 2020-07-29 | Greene Lyon Group Inc. | Procédé et appareil de récupération de métaux nobles, y compris de récupération de métaux nobles provenant de déchets plaqués et/ou de déchets remplis |
TWI662379B (zh) | 2013-12-20 | 2019-06-11 | 美商恩特葛瑞斯股份有限公司 | 移除離子植入抗蝕劑之非氧化強酸類之用途 |
US10475658B2 (en) | 2013-12-31 | 2019-11-12 | Entegris, Inc. | Formulations to selectively etch silicon and germanium |
WO2015116818A1 (fr) | 2014-01-29 | 2015-08-06 | Advanced Technology Materials, Inc. | Formulations de post-polissage chimico-mécanique et méthode d'utilisation associée |
PL2985354T3 (pl) * | 2014-11-10 | 2017-04-28 | Heraeus Deutschland Gmbh & Co Kg | Sposób usuwania metalu szlachetnego z kształtek katalizatora zawierających metal szlachetny |
EP3064602A1 (fr) * | 2015-03-05 | 2016-09-07 | Heraeus Deutschland GmbH & Co. KG | Procédé destiné à la fabrication de rhodium élémentaire |
CA2983353A1 (fr) | 2015-04-21 | 2016-10-27 | University Of Saskatchewan | Procedes de lixiviation et d'extraction selectives de metaux precieux dans des solvants organiques |
JP2018524480A (ja) | 2015-06-24 | 2018-08-30 | グリーン リヨン グループ, インコーポレーテッドGreene Lyon Group, Inc. | 硝酸イオン含有流体を包含する酸性流体を用いる貴金属の選択的取り出し関連出願 |
US10920143B2 (en) | 2015-08-26 | 2021-02-16 | Adeka Corporation | Etching liquid composition and etching method |
WO2017033915A1 (fr) * | 2015-08-26 | 2017-03-02 | 株式会社Adeka | Composition de liquide de gravure et procédé de gravure |
CN106498159B (zh) * | 2016-10-24 | 2018-07-03 | 黄奇向 | 一种金银铜选矿添加剂及其生产方法和使用方法 |
WO2019178051A1 (fr) * | 2018-03-12 | 2019-09-19 | Jabil Inc. | Procédés de récupération de métaux précieux |
IT201800005160A1 (it) * | 2018-05-08 | 2019-11-08 | Metodo per il recupero di oro metallico | |
US11441229B2 (en) | 2018-07-06 | 2022-09-13 | Entegris, Inc. | Method for selectively removing nickel platinum material |
CN109811138B (zh) * | 2018-11-05 | 2021-04-09 | 贵研铂业股份有限公司 | 一种从含铱有机废液中回收铱的方法 |
KR102648664B1 (ko) * | 2018-12-04 | 2024-03-19 | 삼성디스플레이 주식회사 | 식각액 조성물 및 이를 이용한 금속 패턴과 어레이 기판의 제조 방법 |
CN109609783B (zh) * | 2018-12-22 | 2020-11-10 | 励福(江门)环保科技股份有限公司 | 一种从含钯、铑合金的合金片中高效分离提纯钯和铑的方法 |
CN109943718A (zh) * | 2019-04-11 | 2019-06-28 | 昆明理工大学 | 一种采用过硫酸盐作为氧化剂的卤化物提金方法 |
CN110006987B (zh) * | 2019-05-06 | 2021-09-21 | 甘肃有色冶金职业技术学院 | 一种合金中金、钯、铂、铑、铱、钌的连续检测方法 |
FR3096833B1 (fr) | 2019-05-29 | 2022-03-04 | Rosi | procédé de recyclage de l’argent présent sur une cellule photovoltaïque |
US11666955B2 (en) | 2019-09-04 | 2023-06-06 | Jabil Inc. | System and method for obtaining mineral rich powder from electronic waste |
CN110669939A (zh) * | 2019-11-12 | 2020-01-10 | 长春黄金研究院有限公司 | 一种晶圆废料回收金的方法 |
CN110964925B (zh) * | 2019-12-23 | 2021-05-07 | 昆明理工大学 | 一种回收镍基高温合金的方法 |
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-
2015
- 2015-02-23 KR KR1020167026584A patent/KR20160127088A/ko unknown
- 2015-02-23 US US15/121,622 patent/US20160362804A1/en not_active Abandoned
- 2015-02-23 EP EP15755407.2A patent/EP3110982A4/fr not_active Withdrawn
- 2015-02-23 CN CN201580020472.6A patent/CN106661663A/zh active Pending
- 2015-02-23 CA CA2943992A patent/CA2943992A1/fr not_active Abandoned
- 2015-02-23 WO PCT/US2015/017088 patent/WO2015130607A1/fr active Application Filing
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CA2943992A1 (fr) | 2015-09-03 |
WO2015130607A1 (fr) | 2015-09-03 |
TW201602357A (zh) | 2016-01-16 |
KR20160127088A (ko) | 2016-11-02 |
EP3110982A4 (fr) | 2017-11-22 |
US20160362804A1 (en) | 2016-12-15 |
CN106661663A (zh) | 2017-05-10 |
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