EP2929559A1 - Procédé de fabrication d'un module de commutation et d'un module de grille associé ainsi que module de grille associé et composant électronique correspondant - Google Patents

Procédé de fabrication d'un module de commutation et d'un module de grille associé ainsi que module de grille associé et composant électronique correspondant

Info

Publication number
EP2929559A1
EP2929559A1 EP13776805.7A EP13776805A EP2929559A1 EP 2929559 A1 EP2929559 A1 EP 2929559A1 EP 13776805 A EP13776805 A EP 13776805A EP 2929559 A1 EP2929559 A1 EP 2929559A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
electronic component
module
grid module
spring element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13776805.7A
Other languages
German (de)
English (en)
Inventor
Thomas Hessler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2929559A1 publication Critical patent/EP2929559A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/86—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14163—Positioning or centering articles in the mould using springs being part of the positioning means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3443—Switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making

Definitions

  • the invention relates to a method for producing a switching module according to the preamble of independent claim 1 and a method for producing a grating module according to the preamble of independent claim 8 and of a grating module according to the preamble of independent claim 1 1 and an electronic Assembly with such a grating module.
  • At least one electronic component is coupled to at least one heat sink and at least partially surrounded by a plastic.
  • the heat sink cools the electronic component during operation of the manufactured switching module.
  • the published patent application DE 199 12 443 A1 describes a method for mounting and electrically contacting a power semiconductor component, which comprises a metallic heat sink.
  • the heat sink is designed as a carrier for the semiconductor chip and simultaneously dissipates heat.
  • the heat sink provides a connection contact for the semiconductor chip.
  • the heat sink is mechanically and electrically and thermally connected by laser welding to a terminal contact area of a circuit trace.
  • a holding element for fixing at least one electronic power component arranged on a guide plate to a heat sink is described.
  • the retaining element comprises a Spring element, by which the electronic power device is pressed against the heat sink.
  • the inventive method for producing a switching module having the features of independent claim 1 and the inventive method for producing a grating module with the features of independent claim 8 and the grating module according to the invention and the electronic assembly according to the invention have the advantage that both the same and different electronic components can be combined in a module, these components may have different heights and different geometries.
  • Embodiments of the present invention provide a method for producing a switching module, which comprises at least one electronic component and at least one heat sink for cooling the at least one electronic component.
  • the at least one electronic component is coupled to the at least one heat sink and at least partially surrounded by a plastic.
  • the at least one electronic component and the at least one heat sink are inserted into an injection mold, wherein a spring element is arranged between the at least one electronic component and an inner side of the injection mold.
  • the spring element is supported on the inside of the injection molding tool such that the at least one heat sink is pressed against a wall of the injection molding tool.
  • a liquid plastic may be used, which is cured after the wrapping process.
  • the electronic components can be designed as power components that produce large amounts of heat during operation.
  • the at least one heat sink can be designed, for example, as a metallic body with good thermal conductivities.
  • a grating module with at least two electronic components is proposed, which are already packed and / or wrapped and arranged in a composite, each electronic component of the composite assembly is coupled in each case with a heat sink and at least partially covered with plastic.
  • the heat sinks each form part of the outer surface of the grating module and are arranged in a plane for defrosting the electronic components over the outer surface.
  • An electronic assembly according to the invention comprises at least one such grating module with at least two electronic components.
  • the grating module according to the invention can be mounted as a module and not as tolerated individually packaged components.
  • the arrangement of the heat sink in a plane advantageously uniform cooling of the electronic components is possible.
  • the plastic shell advantageously facilitates the positioning of the mesh. termoduls.
  • the composite arrangement allows smaller tolerances, which only result from the injection process.
  • the at least one electronic component can be pressed by the spring element against the at least one heat sink.
  • the at least one electronic component can be reliably coupled positively and / or non-positively by means of the spring force of the spring element with the corresponding heat sink before being enveloped.
  • the at least one electronic component can be aligned with the at least one heat sink of the spring element in a predetermined direction.
  • the heat sink and the corresponding component can be transferred by aligning in a predetermined position within the switching module. Since the electronic components are individually aligned, the electronic components can advantageously have very small tolerances, both in the plane and in terms of the clamping surface in height in the composite of the enveloping material.
  • a bearing surface of the spring element can be recessed at the at least one electronic component during wrapping. This makes it possible for the spring element to be removed from the finished switching module after the wrapping process, when the at least one electronic component is coupled to the heat sink via the surrounding mass.
  • the recess of the support surface can be achieved via the injection mold when the injection molding tool comprises, for example, an inner wall which separates the spring element from the enveloping material.
  • a surface of the at least one heat sink facing away from the at least one electronic component can be recessed during the envelopment and aligned in a planar manner.
  • the finished switching module can be easily arranged by the planar surface on a plane, which is designed for example as part of a printed circuit board and / or a punched grid.
  • the heat transferred from the electronic component to the heat sink can be further dissipated via the recessed area in the enclosure from the heat sink, the heat sink being accessible through the recessed area directly for cooling by further cooling elements. As a result, a uniform cooling of the switching module can be realized in an advantageous manner.
  • the finished switching module can be electrically contacted via the recessed surface of the heat sink when the heat sink is made of electrically conductive material. This allows, for example, a build-up of the switching module by a slug down method and / or a slug up method.
  • electrical connecting elements can be electrically conductively connected to the at least one electronic component and at least partially enveloped.
  • the electrical connection elements can be removed from the wrapping. Lung mass protrude and thus easily contacted in an advantageous manner.
  • webs can be formed between the switching modules during the wrapping process.
  • Advantageously, can be saved by the formation of webs, material and weight.
  • the individual switching modules could be easily separated, for example, by cutting the webs, so that the manufacture of many switching modules can be facilitated in a wrapping process.
  • At least one centering bolt can be formed during the wrapping process.
  • the trained centering pin can advantageously facilitate alignment of the grid module on a printed circuit board and / or in an assembly.
  • the centering pin can be inserted into a predetermined recess, so that a translational movement of the grid module is prevented and a rotational movement about the centering pin is made possible.
  • the enveloping plastic can form at least one centering pin in order to facilitate the positioning of the grating module during assembly.
  • identically aligned electrical connection elements of the electronic components can be arranged on the side facing away from the heat sinks. This advantageously makes possible a simultaneous electrical contacting, for example via stamped grid.
  • the enveloping plastic may be, for example, a glass fiber reinforced plastic.
  • the heat sink are connected to at least one heat sink to a good To allow heat dissipation.
  • the electronic components are connected to each other via plastic webs.
  • FIG. 1 shows a schematic sectional view of an injection molding tool with a switching module produced by the method according to the invention.
  • Fig. 2 shows a schematic sectional view of a grating module produced by the method according to the invention.
  • FIG. 3 shows a schematic perspective view of the grating module from FIG. 2.
  • Conventional methods for producing a switching module couple in a method step at least one electronic component with at least one heat sink.
  • the coupling can take place, for example, by means of a welding method, wherein the at least one electronic component is firmly welded to the at least one heat sink.
  • the at least one electronic component and the at least one heat sink are at least partially enveloped by a plastic.
  • the at least one electronic component 22 and the at least one heat sink 24 of a switching module 20 are placed according to the invention in an injection mold 30, wherein a spring element 32 is arranged between the at least one electronic component 22 and an inner side 34 of the injection mold 30 becomes.
  • the spring element 32 is supported on the inner side 34 of the injection molding tool 30 such that the at least one heat sink 24 is pressed against a wall 36 of the injection molding tool 30.
  • the at least one heat sink 24 is fixed by the spring element 32 to the wall 36 of the injection mold 30 so that manufacturing tolerances of the electronic component 22 and the heat sink 24 in a first spatial direction z can be compensated, wherein a change in position of the heat sink 24 during the Enveloping process can be prevented by the force of the spring element 32.
  • the switching module comprises a plurality of electronic components 22 with different overall heights and / or tolerances, these can be compensated by the corresponding spring elements 32.
  • enveloping plastic 26 for example, a glass fiber reinforced plastic can be used.
  • the at least one electronic component 22 may have a recess in which the at least one heat sink 24 is arranged.
  • the switching modules 20 illustrated in the exemplary embodiments each have an already packaged or enclosed electronic component 22 and a heat sink 24.
  • the at least one electronic component 22 is pressed by the spring element 32 against the at least one heat sink 24.
  • a positive and / or a non-positive connection between the at least one electronic component 22 and the at least one heat sink 24 It would also be possible to couple a plurality of electronic components 22 with a heat sink 24, wherein each electronic component 22 of a corresponding Federele - Ment 32 is pressed against the heat sink 24.
  • the at least one electronic component 22 is aligned with the at least one heat sink 24 by the spring element 32 in a predetermined direction z.
  • a support surface 22. 1 of the spring element 32 is cut out on the at least one electronic component 22 during the wrapping.
  • the spring element 32 at the end of the manufacturing process can be easily removed, wherein a recess shown in Fig. 3 26.1 in the region of the support surface 22.1 in the switching module 20 is formed.
  • This recess can then be filled with a suitable filling material be filled.
  • Another possibility is not to remove the spring element 32 and also to wrap.
  • a surface 24 is formed
  • Cooling body 24 recessed during wrapping and aligned planar. In this way, after the wrapping process, a planar surface of the switching module 20 is formed, wherein the at least one heat sink 24 is easily accessible via the recessed surface 24.1 for further cooling.
  • electrical connection elements 28 are electrically conductively connected to at least one electronic component 22 and at least partially enveloped.
  • one end of the connecting elements 28 may protrude out of the switching module after the wrapping process and a simple contacting of the corresponding electronic
  • a plurality of switching modules 10, which comprise at least one electronic component 22 and at least one heat sink 24, can be combined to form a grid module 10, in which the assemblies 22, 24 of the corresponding switching modules 20 are inserted into the same injection molding tool 30 are inserted and wrapped in a common process with plastic 26.
  • the illustrated electronic components 22 have the same shape and height, but it would also be conceivable that the switching modules 10 have different components with different heights, the different heights can be compensated by the corresponding spring elements 32.
  • each of the electronic components 22 of the composite assembly is coupled to a heat sink 24 and at least partially coated with plastic 26.
  • the heat sinks 24 each form part of the outer surface of the grating module 10 and are arranged to defrost the electronic components 22 over the outer surface in a plane.
  • the individual electronic components 22 are connected to each other via plastic webs 12.
  • the enveloping plastic 26 forms two centering bolts 14 in the exemplary embodiment of the grid module 10 according to the invention.
  • the identically aligned electrical connection elements 28 or line connections of the electronic components 22 are arranged on the side facing away from the heat sinks 24 and can, for example, be electrically contacted via a corresponding not shown punched grid.
  • the heat sink 24 can be connected to at least one heat sink, not shown.
  • a grating module 10 which is manufactured by the method according to the invention, comprises at least one switching module 20.
  • the illustrated embodiment comprises nine switching modules 20. These switching modules 20 can be made identical and fulfill similar tasks or different be executed and fulfill different tasks.
  • Such a grating module 10 can be used together with other components, not shown, for example, as a power switching stage in an electronic module.
  • the electronic components 22 can advantageously have very small tolerances in the composite of the enveloping material, both in the plane x-y and in terms of the clamping surface in the height z. This means that through the enveloping material, the circumferential tolerances of the electronic components 22 and the heat sink 24 in the x-direction and y-direction and the tolerance in the height z can be compensated by different material thicknesses of the enclosure.

Abstract

L'invention concerne un procédé permettant la fabrication d'un module de commutation (20), qui comprend au moins un composant électronique (22) et au moins un dissipateur de chaleur (24) servant à refroidir le ou les composants électroniques (22), lequel/lesquels sont couplés au/aux dissipateurs de chaleur (24) et sont enveloppés au moins en partie par une matière synthétique (26). La présente invention concerne en outre un procédé correspondant servant à la fabrication d'un module de grille (10) ainsi qu'un module de grille fabriqué par le procédé selon la présente invention et un composant électronique correspondant pourvu d'un tel module de grille. Selon la présente invention, le ou les composants électroniques (22) et le ou les dissipateurs de chaleur (24) sont déposés dans un moule à injection (30), un élément élastique (32) étant disposé entre le ou les composants électroniques (22) et une paroi interne (34) du moule à injection (30) et l'élément élastique (32) s'appuyant sur la paroi interne (34) du moule à injection (30) de sorte que le ou les dissipateurs de chaleur (24) soient pressés contre une paroi (36) du moule à injection (30).
EP13776805.7A 2012-12-10 2013-10-15 Procédé de fabrication d'un module de commutation et d'un module de grille associé ainsi que module de grille associé et composant électronique correspondant Withdrawn EP2929559A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012222679.6A DE102012222679A1 (de) 2012-12-10 2012-12-10 Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe
PCT/EP2013/071475 WO2014090442A1 (fr) 2012-12-10 2013-10-15 Procédé de fabrication d'un module de commutation et d'un module de grille associé ainsi que module de grille associé et composant électronique correspondant

Publications (1)

Publication Number Publication Date
EP2929559A1 true EP2929559A1 (fr) 2015-10-14

Family

ID=49356437

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13776805.7A Withdrawn EP2929559A1 (fr) 2012-12-10 2013-10-15 Procédé de fabrication d'un module de commutation et d'un module de grille associé ainsi que module de grille associé et composant électronique correspondant

Country Status (6)

Country Link
US (1) US20150318126A1 (fr)
EP (1) EP2929559A1 (fr)
JP (1) JP2015536579A (fr)
CN (1) CN104823277A (fr)
DE (1) DE102012222679A1 (fr)
WO (1) WO2014090442A1 (fr)

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US10403601B2 (en) 2016-06-17 2019-09-03 Fairchild Semiconductor Corporation Semiconductor package and related methods
US10034410B1 (en) * 2017-04-26 2018-07-24 Chroma Ate Inc. Support apparatus
DE102017126716B4 (de) * 2017-11-14 2021-07-22 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul mit einer Schalteinrichtung
DE102017131110A1 (de) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh Verfahren zum einbetten von optoelektronischen bauelementen in eine schicht
FR3092031B1 (fr) * 2019-01-24 2021-05-07 Safran Electrical & Power procede de fabrication d’un meuble electrique et MEuble electrique correspondant
CN115179497A (zh) * 2022-06-15 2022-10-14 常州市瑞泰光电有限公司 注塑模具

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US20150318126A1 (en) 2015-11-05
JP2015536579A (ja) 2015-12-21
CN104823277A (zh) 2015-08-05
DE102012222679A1 (de) 2014-06-12

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