JPS5290562A - Metal mold for molding lead frame - Google Patents
Metal mold for molding lead frameInfo
- Publication number
- JPS5290562A JPS5290562A JP690576A JP690576A JPS5290562A JP S5290562 A JPS5290562 A JP S5290562A JP 690576 A JP690576 A JP 690576A JP 690576 A JP690576 A JP 690576A JP S5290562 A JPS5290562 A JP S5290562A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- metal mold
- molding lead
- molding
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP690576A JPS5290562A (en) | 1976-01-24 | 1976-01-24 | Metal mold for molding lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP690576A JPS5290562A (en) | 1976-01-24 | 1976-01-24 | Metal mold for molding lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5290562A true JPS5290562A (en) | 1977-07-29 |
Family
ID=11651239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP690576A Pending JPS5290562A (en) | 1976-01-24 | 1976-01-24 | Metal mold for molding lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5290562A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133317U (en) * | 1985-02-06 | 1986-08-20 | ||
JPS6226827A (en) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | Resin sealing device for semiconductor element |
JP2015536579A (en) * | 2012-12-10 | 2015-12-21 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツングRobert Bosch Gmbh | Method of making switching module and attached grid module, and attached grid module and corresponding electronic unit |
JP2016046818A (en) * | 2014-08-19 | 2016-04-04 | 株式会社三井ハイテック | Resin sealing method for motor core, and device used therefor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4527100Y1 (en) * | 1965-09-02 | 1970-10-20 |
-
1976
- 1976-01-24 JP JP690576A patent/JPS5290562A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4527100Y1 (en) * | 1965-09-02 | 1970-10-20 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133317U (en) * | 1985-02-06 | 1986-08-20 | ||
JPH0139541Y2 (en) * | 1985-02-06 | 1989-11-28 | ||
JPS6226827A (en) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | Resin sealing device for semiconductor element |
JPH0535570B2 (en) * | 1985-07-27 | 1993-05-26 | Mitsubishi Electric Corp | |
JP2015536579A (en) * | 2012-12-10 | 2015-12-21 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツングRobert Bosch Gmbh | Method of making switching module and attached grid module, and attached grid module and corresponding electronic unit |
JP2016046818A (en) * | 2014-08-19 | 2016-04-04 | 株式会社三井ハイテック | Resin sealing method for motor core, and device used therefor |
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