WO2016146613A1 - Dispositif de commande électronique - Google Patents

Dispositif de commande électronique Download PDF

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Publication number
WO2016146613A1
WO2016146613A1 PCT/EP2016/055511 EP2016055511W WO2016146613A1 WO 2016146613 A1 WO2016146613 A1 WO 2016146613A1 EP 2016055511 W EP2016055511 W EP 2016055511W WO 2016146613 A1 WO2016146613 A1 WO 2016146613A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
circuit carrier
control device
electronic control
power component
Prior art date
Application number
PCT/EP2016/055511
Other languages
German (de)
English (en)
Inventor
Ilya Kuperberg
Heiko Buss
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2016146613A1 publication Critical patent/WO2016146613A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the invention relates to an electronic control device.
  • the invention further relates to a method for producing an electronic control device.
  • DE 10 2010 001 958 A1 discloses an electronic control unit with power components, wherein the power components each have a heat-slug element which is provided to receive heat of the respective power device.
  • the heat-slug elements are in thermal contact with a foil-formed heat-conducting element, thereby forming a larger area with a correspondingly larger heat capacity. Disclosure of the invention
  • An object of the invention is to provide an improved electronic control device with an electronic power device.
  • an electronic control device comprising:
  • circuit carrier having an electronic power device disposed thereon
  • circuit carrier and the electronic power device are contacted by means of a plantetorial representation of the circuit carrier and the electronic power device; wherein heat of the power device is away from the circuit carrier weg21bar;
  • circuit carrier is fixed in the housing by means of the heat transfer medium.
  • the object is achieved with a method for producing an electronic control device, comprising the steps:
  • the circuit substrate can be fixed force-free in the housing, wherein the heat-conducting medium can take over a mechanical fixation of the circuit substrate relative to the housing in the cured state. Due to the fact that the heat-conducting medium can be introduced very thinly, an optimized heat dissipation from the electronic power component to the housing is also supported.
  • the Power component is connected in this way with only one measure of a tolerance chain to the functioning as a heat sink housing.
  • the heat conduction Medium can take over the thermal advantageous also the mechanical fixation of the circuit substrate within the housing.
  • control device is characterized in that the circuit carrier is positioned with the electronic power component relative to the housing by means of at least three support areas, wherein at least one support area between the housing and the electronic
  • Power component is formed. In this way, a three-point support is realized between the housing and the circuit carrier, whereby a stable fixation of the circuit carrier supported in the housing and a mobility of the fixed circuit substrate is advantageously reduced.
  • Housing rib of the housing is formed. As a result, an already existing structure of the housing can be used for the stable positioning of the circuit carrier within the housing.
  • Power component is positioned relative to the housing by means of three support areas, wherein a support area between the housing and the electronic power device is formed, and wherein two bearing areas are formed as housing ribs of the housing. This provides a stable fixation of the circuit carrier to the power device within the housing.
  • Circuit carrier in the housing with a good grip of the circuit carrier within the housing is supported in this way.
  • control device is characterized in that by means of at least one spacer a defined distance between a surface of the electronic power device and the housing is made. Thereby, a defined distance can be created, which is provided as a later contact area between the power device and the housing, wherein in this contact region, the thermally bonding heat transfer medium is inserted.
  • control device is characterized in that the at least one spacer is formed on the power component or designed as a housing rib of the housing.
  • a pasty heat transfer medium can be inserted between the power component and the housing, resulting in a fixation of the power component to the housing and a heat transfer from
  • a further advantageous development of the control device is characterized in that by means of fixing elements the circuit carrier is fixed in a force-free manner to the housing during hardening of the originally pasty heat-conducting medium. In this way, an unintentional shifting of the circuit carrier relative to the housing can be avoided in a production phase in which the paste-like heat-conducting medium is already inserted.
  • the smallest possible closing size between the circuit carrier and the housing is advantageously supported in this way.
  • the fixing elements comprise at least one of the following group: plastic sleeve, dowel, contact spring, snap element.
  • Fig. 1 a is a cross-sectional view through a conventional electronic
  • Fig. 1 b is a cross-sectional view through a conventional electronic
  • Fig. 2 is a cross-sectional view through an embodiment of
  • FIG. 3 is a perspective view of an electronic power device
  • Fig. 1 1 is a perspective view of an electronic control device
  • an electronic power component is understood to mean a "slug-up component" which generates heat generated during operation of the power component by means of a heat sink from a printed circuit board on which the Slug-up component is mounted, directed away.
  • the heat sink may be formed as a tinned metal plate (eg made of copper), which is encapsulated in the production of the power device with molding compound.
  • the heat sink is thermally contacted directly with a heat sink without penetrating the circuit board. This is achieved by connecting the slug-up component and the heat sink to opposite sides
  • Fig. 1a shows a cross-sectional view through a conventional electronic control device 100 prior to assembly.
  • a circuit carrier 20, preferably a printed circuit board, on which an electronic power component 30 in SMD design is arranged can be seen.
  • thermal energy of the power component 30 can be delivered to the housing 10 during operation.
  • the housing 10 thus also functions as a heat sink.
  • FIG. 1 b shows a cross-sectional view through the assembled electronic control device 100 of FIG. 1 a. It is indicated that by a
  • the closing dimension X must be dimensioned disadvantageously relatively large, for example, about 0.4 mm to about 0.6 mm high.
  • thermal energy of the power device is to realize the thermal connection of the power device to the housing via insulated films. In this way, an improvement of the thermal
  • Resistance can be achieved, but with additional spring elements are required to produce a required contact force of the film to the power device.
  • the high forces caused thereby can adversely effect that solder joint reliability may be compromised.
  • the additional mechanical forces on solder pins of the device can shorten an operation time of the device on the substrate from a viewpoint of thermal cycling processes.
  • Fig. 2 shows a cross section through an embodiment of the electronic control device 100 according to the invention. It can be seen that a
  • Circuit carrier 20 at an upper side and at a lower side with a
  • the power component 30 is connected.
  • the power component 30 is also mechanically and thermally connected to the housing 10 by means of the thermal interface medium 40 (TIM).
  • TIM thermal interface medium 40
  • spacers 31 or spacing knobs which define a defined distance of a surface of the power component 30 from the surface, can be seen
  • Power device 30 may be provided to allow immobile contacting of the power device 30 to the housing 10 and an electrical short circuit between the power device 30 and the
  • a defined, minimal thermal gap is provided between a surface of the power component 30 and the housing 10, for example with a height of approximately 0.1 mm to approximately 0.3 mm, as a result of which a defined
  • Cavity is formed, in which the pasty heat transfer medium 40 can be inserted.
  • the heat-conducting medium 40 after curing takes on the function of a mechanical and effective thermal connection of the circuit substrate 20 with the power component 30 to the housing 10th
  • a three-point support is thereby realized between the housing 10 and the circuit carrier 20, wherein housing fins 11 are provided on the housing 10 by means of which the circuit carrier 20 can be arranged in a defined position in the housing 10.
  • a third point of the Three-point support is formed by the power device 30 itself, which has at least one, preferably three or more spacers 31, which contact with the spacers 31 to the housing 10.
  • the housing rib 1 1 acts as a spacer for setting a defined distance between the power device 30 and the housing
  • Variants of the control device 100 that are not illustrated in FIGS.
  • the three-point support between the housing 10 and the circuit carrier 20 can be realized by three power components 30 or by a power component 30 and two housing ribs 11 or by two power components 30 and a housing rib 11.
  • FIG 3 shows a perspective view of the power device 30 in the form of an electronic MCPP B6 bridge circuit (Multi Chip Power
  • a usable cavity between the power component 30 and the housing 10 can be provided.
  • the distance between the power device 30 and the housing 10 may also be achieved via other elements not shown in figures, such as printed on the circuit carrier 20
  • the thermal connection of the power component 30 and the heat sink is preferably carried out by means of a heat transfer medium 40 in the form of a
  • Thermal paste (e.g., in the form of a 2K paste), which also at other locations of the circuit substrate 20 further components, such. Capacitors, coils, shunts, tracks (not shown) thermally connected to the heat sink or the housing 10. This thermal connection takes over in the cured state, the mechanical attachment of the assembled circuit substrate
  • a temporary, force-free fixing of the circuit carrier 20 with the housing 10 in the z-direction until the pasty heat-conducting medium 42 has hardened is preferably effected by simple clamping or fixing elements 50 which do not apply any additional mechanical forces or deformations to the circuit carrier 20.
  • a dowel ( Figure 4) may be provided with projecting tracks arranged on a circumference of the dowel acting as a kind of barb, a plastic sleeve ( Figure 6) or a metallic contact spring ( Figure 8).
  • a contact spring By means of the contact spring, an electrical contacting of the power component 30 with the circuit carrier 20 can advantageously also be realized.
  • FIGS. 5, 7 and 9 show the aforementioned fixing elements 50 in the circuit carrier 20.
  • Manufacturing process of the electronic control device 100 are met. After the force-free positioning of the circuit carrier 20 with the housing 10, the paste-like heat transfer medium 40 can be inserted.
  • FIG. 10 shows a further embodiment of the fixing element 50 in the form of a snap element or hook. It can be seen that different heights of the circuit carrier 20 can be realized within the housing 10, whereby depending on the altitude of the circuit carrier 20, the snap hooks more or less unfolds. Dashed lines indicate two potential altitudes of the circuit carrier 20 in the z direction and two potential skew positions of the snap hook. This is made possible by a slope of the snap-action hook, which contacts the circuit carrier 20 and holds it in a play-free position by means of a spring action. A required for the snap hook holding force by means of the
  • Circuit carrier 20 is held in position, via a suitable
  • FIG. 1 1 shows a perspective view of a complete circuit group with circuit carrier 20, fixing elements 50 and housing 10.
  • the electronic power component 30 arranged on the underside of the circuit carrier 20 and fixed by means of the fixing elements 50 is not discernible.
  • FIG. 12 shows a basic sequence of an embodiment of the method according to the invention.
  • a step 200 force-free fixing of a circuit carrier 20 with an electronic power component 30 relative to a housing 10 is performed.
  • a pasty heat-conducting medium 40 is arranged on one side of the circuit carrier 20, on which the electronic power component is arranged.
  • a step 220 the housing 10 is closed with a housing cover.
  • a step 230 the heat-conducting medium 40 is cured.
  • the present invention proposes an electronic control device and a method for producing an electronic control device, which enable improved heat dissipation and improved fixation of an electronic slug-up component arranged on a printed circuit board of the control device.
  • the support of the circuit carrier 20 relative to the housing 10 is not limited to the three-point support.
  • the support of the circuit carrier 20 relative to the housing 10 can be effected by means of a plurality of contact areas.
  • the bearing areas are formed by housing ribs 1 1 and at least one power component 30.
  • the bearing areas can also by several power devices 30 or
  • Housing ribs 1 1 are formed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dispositif de commande électronique (100) présentant : un boîtier (10) ; un support de circuit (20) sur lequel est agencé un composant de puissance électronique (30) ; le support de circuit (20) et le composant de puissance électronique (30) étant mis en contact électrique avec le boîtier (10) au moyen d'un milieu conducteur de chaleur (40) ; la chaleur du composant de puissance électronique (30) pouvant être dissipée dans une direction opposée au support de circuit (20) ; et le support de circuit (20) étant fixé dans le boîtier (10) au moyen du milieu conducteur de chaleur (40).
PCT/EP2016/055511 2015-03-18 2016-03-15 Dispositif de commande électronique WO2016146613A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015204905.1A DE102015204905A1 (de) 2015-03-18 2015-03-18 Elektronische Steuervorrichtung
DE102015204905.1 2015-03-18

Publications (1)

Publication Number Publication Date
WO2016146613A1 true WO2016146613A1 (fr) 2016-09-22

Family

ID=55538216

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/055511 WO2016146613A1 (fr) 2015-03-18 2016-03-15 Dispositif de commande électronique

Country Status (2)

Country Link
DE (1) DE102015204905A1 (fr)
WO (1) WO2016146613A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023147815A1 (fr) * 2022-02-02 2023-08-10 Schaeffler Technologies AG & Co. KG Système électrique et unité d'entraînement électrique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019200096A1 (de) 2019-01-07 2020-07-09 Zf Friedrichshafen Ag Elektronisches Gerät und Verfahren zum Zusammenbau eines elektronischen Geräts

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0727931A2 (fr) * 1995-02-16 1996-08-21 TEMIC TELEFUNKEN microelectronic GmbH Module de commande électronique
DE19722357C1 (de) * 1997-05-28 1998-11-19 Bosch Gmbh Robert Steuergerät
EP1289011A2 (fr) * 2001-08-25 2003-03-05 Robert Bosch Gmbh Appareil de commutation ou de contrôle
EP1508915A2 (fr) * 2003-08-18 2005-02-23 Delphi Technologies, Inc. Procédé et assemblage électronique pour la dissipation de la chaleur d'un dispositif à circuit
US20050201069A1 (en) * 2004-03-15 2005-09-15 Denso Corporation Electronic device
DE102010001958A1 (de) 2010-02-16 2011-08-18 Robert Bosch GmbH, 70469 Elektronisches Steuergerät
DE102012218932A1 (de) 2012-10-17 2014-04-17 Robert Bosch Gmbh Elektronisches Bauteil zur Entwärmung von Slug-up-Komponenten
DE102013206999A1 (de) * 2013-04-18 2014-10-23 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug mit wärmeleitender Gehäusewand

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
DE19533298A1 (de) * 1995-09-08 1997-03-13 Siemens Ag Elektronisches Modul mit Leistungsbauelementen
US20080128895A1 (en) * 2006-12-05 2008-06-05 Oman Todd P Wafer applied thermal-mechanical interface
DE102008033193A1 (de) * 2008-07-15 2010-02-04 Continental Automotive Gmbh Motorsteuerungsvorrichtung eines Fahrzeugs
DE102009054585A1 (de) * 2009-12-14 2011-06-16 Robert Bosch Gmbh Steuergerät
JP2011249520A (ja) * 2010-05-26 2011-12-08 Mitsubishi Electric Corp 電子制御装置
DE102013016464A1 (de) * 2013-10-04 2015-04-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Verfahren zur Montage einer elektrischen Baugruppe und elektrische Baugruppe
DE202014002060U1 (de) * 2014-03-06 2015-04-08 HKR Seuffer Automotive GmbH & Co. KG Kühleinrichtung und Kühlanordnung mit der Kühleinrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0727931A2 (fr) * 1995-02-16 1996-08-21 TEMIC TELEFUNKEN microelectronic GmbH Module de commande électronique
DE19722357C1 (de) * 1997-05-28 1998-11-19 Bosch Gmbh Robert Steuergerät
EP1289011A2 (fr) * 2001-08-25 2003-03-05 Robert Bosch Gmbh Appareil de commutation ou de contrôle
EP1508915A2 (fr) * 2003-08-18 2005-02-23 Delphi Technologies, Inc. Procédé et assemblage électronique pour la dissipation de la chaleur d'un dispositif à circuit
US20050201069A1 (en) * 2004-03-15 2005-09-15 Denso Corporation Electronic device
DE102010001958A1 (de) 2010-02-16 2011-08-18 Robert Bosch GmbH, 70469 Elektronisches Steuergerät
DE102012218932A1 (de) 2012-10-17 2014-04-17 Robert Bosch Gmbh Elektronisches Bauteil zur Entwärmung von Slug-up-Komponenten
DE102013206999A1 (de) * 2013-04-18 2014-10-23 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug mit wärmeleitender Gehäusewand

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023147815A1 (fr) * 2022-02-02 2023-08-10 Schaeffler Technologies AG & Co. KG Système électrique et unité d'entraînement électrique

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