WO2018050382A1 - Ensemble électronique, en particulier pour un module de commande de boîte de vitesses, et procédé de fabrication d'un ensemble électronique - Google Patents

Ensemble électronique, en particulier pour un module de commande de boîte de vitesses, et procédé de fabrication d'un ensemble électronique Download PDF

Info

Publication number
WO2018050382A1
WO2018050382A1 PCT/EP2017/070614 EP2017070614W WO2018050382A1 WO 2018050382 A1 WO2018050382 A1 WO 2018050382A1 EP 2017070614 W EP2017070614 W EP 2017070614W WO 2018050382 A1 WO2018050382 A1 WO 2018050382A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cover material
electrically insulating
printed circuit
electronic assembly
Prior art date
Application number
PCT/EP2017/070614
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2018050382A1 publication Critical patent/WO2018050382A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • Electronic assembly in particular for a transmission control module, and method for producing an electronic assembly
  • the invention relates to an electronic assembly, in particular for a transmission control module, and method for producing an electronic assembly
  • DE 10 2013 215 367 AI describes an electronic circuit module with a housing, in particular a control device for a motor vehicle.
  • the soldered to the circuit board or printed circuit board (PCB) bottom of the device is made of metal (so-called ePad) or is metallized. This ensures intimate thermal contact from the ePad to the copper pad on the PCB.
  • this metal bottom of the component is always at the same time also at the same electrical potential as at least one of
  • connection pins i.us R. drain.
  • the component is then glued with the plastic "back" on the PCB or PCB and the pins or legs are now bent the other way around, so that they reach back onto the PCB ePad now points away from the printed circuit board or PCB in the direction of a heat sink, but can not be directly connected to this heat sink (corresponding to the Cu surface on the PCB or PCB), because the electrical component otherwise electrically connected to the
  • Heat sink would be connected.
  • FETs Field Effect Transistors
  • the ePad is usually connected to the drain pin of the FET.
  • one of the FETs has a drain at the power supply and the other one
  • Embodiments of the present invention can advantageously make it possible to have as thin a layer as possible for electrical insulation, while at the same time ensuring that the heat of the electrical
  • an electronic assembly in particular for a transmission control module, comprising a printed circuit board having a first side and a second side facing away from the first side and at least one arranged on the first side of the printed circuit board heat generating component, wherein the Component is covered with an electrically insulating potting material, characterized by a flowable before curing a cover material for dissipating the heat of the device from the electronic assembly, wherein the cover material, the electrically insulating potting material at least partially, in particular substantially completely covered.
  • a method for producing an electronic assembly comprising the steps:
  • the electrically insulating potting material has a
  • An advantage of this is that the heat can be dissipated usually better.
  • a base plate for dissipating the heat is arranged such that the base plate covers the cover material and is at least partially directly connected to the first side of the printed circuit board.
  • the electrical assembly can generally be made particularly technically simple. This usually reduces manufacturing costs.
  • the cover material has a substantially planar surface on a side remote from the first side of the printed circuit board.
  • the printed circuit board has a thermal conduction layer inside the printed circuit board.
  • the printed circuit board can have thermal vias in order to dissipate the heat in the direction of the cover material.
  • the method further comprises the following step:
  • cover material is applied to the electrically insulating potting material by, prior to curing of the cover material
  • the cover material can generally be applied in a particularly simple and cost-effective manner.
  • the method further comprises the step of: placing a casting frame on the first side of the circuit board to form a deckle of a receiving volume for receiving the board
  • Potting material is applied by a prior to curing of the cover material, in particular, before the curing flowable, cover material in the
  • the cover material can usually be applied in a particularly simple and cost-effective manner.
  • the method further comprises the following step:
  • Base plate is placed in the cavity. This can do that Cover material usually be applied particularly easily and inexpensively.
  • the electrically insulating potting material is applied such that the electrically insulating potting material has a thickness of less than about 1000 ⁇ , in particular less than about 500 ⁇ , preferably less than about 50 ⁇ having.
  • the heat can usually be dissipated particularly well or removed from the electronic module.
  • Fig. 1 shows a schematic cross-sectional view of a first
  • Fig. 2 shows a schematic cross-sectional view of the electronic
  • Gear housing is arranged
  • Fig. 3 shows a schematic cross-sectional view of a second
  • FIG. 4 shows a schematic cross-sectional view of a third
  • FIG. 5 shows a schematic cross-sectional view of the assembly from FIG.
  • Fig. 1 shows a schematic cross-sectional view of a first embodiment of the electronic assembly according to the invention 5.
  • Assembly 5 has a printed circuit board 10 or a printed circuit board (PCB).
  • the printed circuit board 10 has a first side 12 and a second side 14, wherein the second side 14 of the first side 12 opposite.
  • the first side 12 is on the upper side of the circuit board 10 and the second side 14 on the lower side of the circuit board 10.
  • electrical components 20-26 are arranged on the two sides 12, 14 of the circuit board 10 .
  • the electrical components 20-26 are both passive electrical components 25, 26, which in the
  • the electrical assembly 5 also includes a sensor 28 and two
  • Printed circuit board 10 and the printed circuit board 10 itself can be connected to other devices.
  • the leads 35, 36 may be e.g.
  • the printed circuit board 10 with at least one electrical component 20-26 on the first side 12 of the printed circuit board 10 is provided.
  • Component 20-26 is electrically connected via conductor tracks of the printed circuit board 10 with further electrical components 20-26 and with the connecting lines 35, 36. Subsequently, the electrical component 20-26 and parts or areas of the first side 12 of the circuit board 10 with a
  • Potting material 50 covered which is electrically insulating.
  • the material may be, for example, an epoxy resin.
  • Thermal expansion coefficient e.g. be in the range of about 18 ppm / K.
  • Epoxy resins are particularly resistant to aggressive media we hydraulic or gear oil.
  • the electrically insulating potting material 50 can be applied to the first side 12 and to the second side 14 of the printed circuit board 10 and the respective electrical components 20-26 present there.
  • the electrically insulating potting material 50 is applied as a thin layer. That the layer has e.g. a thickness of about 50 ⁇ to about 1 mm, in particular between about 50 ⁇ and about 100 ⁇ , preferably about 50 ⁇ or about 100 ⁇ . The range of about 50 ⁇ to about 300 ⁇ is possible.
  • the thermal conductivity of the electrical insulating layer has z. B. between about 0.5 W / m K and about 1 W / m K on. The thermal conductivity can also be greater than about 1 W / mK.
  • a deckle 55 is applied to the first side 12.
  • the deckle 55 is closed and forms an edge of a
  • the deckle 55 may be a so-called dam material (low viscosity dispensing material that remains dimensionally stable, i.e., does not shred) before curing, or a casting frame that is removed after the coverstock 60 is inserted and the coverstock 60 is cured.
  • dam material can be made of the same material as the
  • a cover material 60 in particular material that can flow before curing (so-called fill material), is then introduced into the receiving volume.
  • the cover material 60 is introduced into the receiving volume in such a way that the surface is flush with the edge boundary 55 (upward in FIG. 1). Now that will be
  • Cover material 60 cured, eg by heat. It is also conceivable that the cover material 60 is applied in layers and cured after each applied layer, for example by UV light.
  • the cover material 60 covers the electrically insulating layer or the electrically insulating potting material 50, which is located on the first electrical component 20-26. In addition, usually the cover material 60 directly contacts the printed circuit board 10 in some areas. Penetration of oil or the like into the area between cover material 60 and
  • the cover material 60 may be electrically conductive or electrically non-conductive / electrically insulating, since the components 20-26 and the
  • the cover material 60 has a good or particularly good thermal conductivity.
  • the thermal conductivity of the cover material 60 may be at least about 0.5 W / mK, in particular in the range between about 1 W / mK to about 5 W / mK.
  • the cover material 60 may include epoxy resins, acrylates and / or bulk mold
  • BMC unsaturated polyester thermosets
  • CTE thermal expansion coefficient
  • insulating potting material 50 are protected and a possible gap between the cover material 60 and potting material 50 (eg less than 100 ⁇ ) is not a relevant thermal resistance.
  • the components 20-26 on the second side 14 may also be protected by the cover material 60.
  • the electronic subassembly 5 has a high degree of stability due to the double-sided encapsulation / casting, whereby no "Bi- metal I effect" occurs
  • Cover material 60 is flowable before curing. That the flat surface of the cover material 60 contacts the transmission housing 70 or the heat sink directly or directly.
  • the heat sink also has a plane
  • heat of the components 20-26 on the first side 12 and the second side 14 can be dissipated well from the electrical assembly 5 in the heat sink or the transmission housing 70.
  • the devices 20-26 may have slug-down heating. Slug-down components release their heat to the printed circuit board 10. Slug-up components release their heat in a direction away from the printed circuit board 10.
  • the (main) heat path is shown by arrows in the drawings. Dashed lines show the secondary heat path.
  • the printed circuit board 10 may have an approximately 70 ⁇ thick (or even thicker) copper inner layer. As a result, the heat is transversely (in Fig. 2 from left to right), i. in the circuit board 10, passed. Thermal vias may conduct the heat to the first side 12 of the circuit board 10.
  • the printed circuit board 10 can in particular no through opening for
  • FIG. 3 shows a schematic cross-sectional view of a second
  • Embodiment of the electronic assembly 5 according to the invention.
  • a base plate 80 having a cavity is arranged on the first side 12 of the printed circuit board 10.
  • Cavity is formed between the base plate 80 and the circuit board 10.
  • the electrical components 20-26 on the first side 12 are in the
  • the base plate 80 touches the circuit board 10 directly or directly in some areas.
  • the circuit board 10 has a
  • Cover material 60 introduced through the filling opening 85 until the cavity is filled with the cover material 60.
  • the cover material 60 also provides for a connection between the base plate 80 and the printed circuit board 10 and the electrical components 20-26.
  • the filling opening 85 can also be filled with cover material 60.
  • the cover material 60 may be the same material described in connection with FIGS. 1 and 2.
  • 4 shows a schematic cross-sectional view of a third embodiment of the electronic assembly 5 according to the invention.
  • the third embodiment shown in FIG. 4 differs from the second embodiment shown in FIG.
  • the base plate 80 may be a metal base plate, e.g. an aluminum die-cast
  • the base plate 80 is made of a thermally conductive plastic (i.e., a plastic having a high thermal conductivity coefficient).
  • FIG. 5 shows a schematic cross-sectional view of the assembly 5 from FIG. 4, wherein the assembly 5 is arranged on a transmission housing 70.
  • the electrical assembly 5 is provided with a heat sink, in particular the Gear housing 70, connected.
  • the side facing away from the printed circuit board 10 (and the cavity) side of the base plate 80 contacts the heat sink, in particular the gear housing 70.
  • the of the circuit board 10 (and the cavity) facing away from the base plate 80 has a flat or planar surface.
  • the heat sink also has a plane
  • the cover material 60 of the third embodiment may be the same material described in connection with FIG. 1 and FIG. 2 or FIG.
  • the cover material 60 can have a high heat capacity, so that heat can be temporarily stored.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble électronique (5), en particulier pour un module de commande de boîte de vitesses, comprenant une carte de circuits imprimés (10) qui présente un premier côté (12) et un second côté (12) opposé au premier et au moins un composant (20-26) générateur de chaleur disposé sur le premier côté (12) de la carte de circuits imprimés (10), ce composant (20-26) étant recouvert d'un matériau de scellement électriquement isolant (50). L'invention est caractérisée par un matériau de recouvrement (60), fluide avant durcissement, permettant de dissiper la chaleur du composant (20-26) hors de l'ensemble électronique (5), ce matériau de recouvrement (60) recouvrant au moins partiellement, en particulier sensiblement complètement le matériau de scellement électriquement isolant (50).
PCT/EP2017/070614 2016-09-14 2017-08-14 Ensemble électronique, en particulier pour un module de commande de boîte de vitesses, et procédé de fabrication d'un ensemble électronique WO2018050382A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016217554.8 2016-09-14
DE102016217554.8A DE102016217554A1 (de) 2016-09-14 2016-09-14 Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul, und Verfahren zum Herstellen einer elektronischen Baugruppe

Publications (1)

Publication Number Publication Date
WO2018050382A1 true WO2018050382A1 (fr) 2018-03-22

Family

ID=59626619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/070614 WO2018050382A1 (fr) 2016-09-14 2017-08-14 Ensemble électronique, en particulier pour un module de commande de boîte de vitesses, et procédé de fabrication d'un ensemble électronique

Country Status (2)

Country Link
DE (1) DE102016217554A1 (fr)
WO (1) WO2018050382A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019216723A1 (de) * 2019-10-30 2021-05-06 Robert Bosch Gmbh Mold-Modul

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
FR2680441A1 (fr) * 1991-08-14 1993-02-19 Dassault Electronique Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.
DE102007029913A1 (de) * 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
DE102010062653A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Steuermodul und Verfahren zu seiner Herstellung
DE102012204630A1 (de) * 2012-03-22 2013-09-26 Robert Bosch Gmbh Verfahren zur thermoplastischen Umspritzung und thermoplastische Umspritzung
DE102013215367A1 (de) 2013-08-05 2015-02-05 Zf Friedrichshafen Ag Elektronisches Schaltungsmodul

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
FR2680441A1 (fr) * 1991-08-14 1993-02-19 Dassault Electronique Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.
DE102007029913A1 (de) * 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
DE102010062653A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Steuermodul und Verfahren zu seiner Herstellung
DE102012204630A1 (de) * 2012-03-22 2013-09-26 Robert Bosch Gmbh Verfahren zur thermoplastischen Umspritzung und thermoplastische Umspritzung
DE102013215367A1 (de) 2013-08-05 2015-02-05 Zf Friedrichshafen Ag Elektronisches Schaltungsmodul

Also Published As

Publication number Publication date
DE102016217554A1 (de) 2018-03-15

Similar Documents

Publication Publication Date Title
DE102009042600B4 (de) Herstellungsverfahren für ein Leistungshalbleitermodul
DE102015111204B4 (de) Leistungselektronisches Modul mit Lastanschlusselementen
DE102010047646B4 (de) Harz-versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben
DE102015113208A1 (de) Modul mit integriertem Leistungselektronikschaltkreis und Logikschaltkreis
DE102005023455B4 (de) Box für elektrische Verbindungen und Verfahren zur Herstellung derselben
DE4422216A1 (de) Mehrlagige metallische Leiterplatte und gegossener Baustein
EP2936556A1 (fr) Module électronique contenant un circuit électronique enrobé de matière plastique et procédé pour le fabriquer
WO1999011107A1 (fr) Ensemble comprenant un substrat pour des composants de puissance et un element de refroidissement, et procede pour produire ledit ensemble
DE102010030170A1 (de) Steuergerät
DE102015208348B3 (de) Leistungsmodul sowie Verfahren zum Herstellen eines Leistungsmoduls
WO2008009524A1 (fr) Dispositif électronique
DE102015226712A1 (de) Leiterplatte
DE4416403C2 (de) Kühlvorrichtung für eine Leiterplatte und Verfahren zum Herstellen einer solchen Kühlvorrichtung
EP3289839A1 (fr) Module électronique, en particulier pour un module de commande de transmission
DE102008039921B4 (de) Verfahren zur Herstellung eines elektronischen Geräts mit diskretem Bauelement
DE102016104284B4 (de) Gekapselte Leistungshalbleitereinrichtung mit einem Metallformkörper als erstem Anschlussleiter
EP1592288A1 (fr) Panneau à circuit imprimé
WO2018050382A1 (fr) Ensemble électronique, en particulier pour un module de commande de boîte de vitesses, et procédé de fabrication d'un ensemble électronique
DE102016211967B3 (de) Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
WO2003075626A1 (fr) Dissipateur thermique destine a dissiper la chaleur produite par un composant electrique
DE102015112451B4 (de) Leistungshalbleitermodul
EP3479664A1 (fr) Procédé de fabrication d'une unité appareil de commande, en particulier pour un véhicule, et unité appareil de commande, en particulier pour un véhicule
WO2016146613A1 (fr) Dispositif de commande électronique
EP3574723B1 (fr) Procédé de raccordement mécanique de composants électroniques et arrangement correspondant desdits composants électroniques
EP3520585B1 (fr) Procédé de fabrication d'un composant électronique et composant électronique, en particulier pour un module de commande de boîte de vitesses

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17752122

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17752122

Country of ref document: EP

Kind code of ref document: A1