WO2003075626A1 - Dissipateur thermique destine a dissiper la chaleur produite par un composant electrique - Google Patents

Dissipateur thermique destine a dissiper la chaleur produite par un composant electrique Download PDF

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Publication number
WO2003075626A1
WO2003075626A1 PCT/DE2003/000581 DE0300581W WO03075626A1 WO 2003075626 A1 WO2003075626 A1 WO 2003075626A1 DE 0300581 W DE0300581 W DE 0300581W WO 03075626 A1 WO03075626 A1 WO 03075626A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
filler
circuit board
component
heat dissipation
Prior art date
Application number
PCT/DE2003/000581
Other languages
German (de)
English (en)
Inventor
Günter LUGERT
Thomas Riepl
Daniela Wolf
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003075626A1 publication Critical patent/WO2003075626A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • Heat dissipation device for dissipating heat, which is generated by an electrical "component
  • the invention relates to a heat dissipation device for dissipating heat that is generated by an electrical component due to its loss conduction.
  • a known device (US 4,979,074) has electrical
  • a printed circuit board PCB
  • a thermally highly conductive elastomer Components, a printed circuit board (PCB), a thermally highly conductive elastomer and a heat sink.
  • the circuit board is equipped with usually wired components.
  • the connecting wires of the components which protrude through the printed circuit board are pressed into the elastomer until the underside of the printed circuit board lies flat against the side of the elastomer facing it and the other side of the elastomer lies flat against a heat sink.
  • the circuit board, the elastomer and the heat sink are mechanically connected using a screw. In this way, a thermally conductive path is created, via which the power loss of the electrical component is transferred to the heat sink.
  • the elastomer represents the element with the lowest thermal conductivity in the path. If the elastomer is still provided with an adhesive film on both sides for the mechanical connection of the printed circuit board, elastomer and heat sink, the heat conduction is further deteriorated by this adhesive film. This limits the permissible working range of the electrical component. If the permissible temperature of the component is exceeded, there can be a total failure of the component or partial damage, which sooner or later can also lead to a total failure of the component.
  • the use of adhesive films with increased thermal conductivity reduces the mechanical adhesion of the materials currently available.
  • a printed circuit board is known from patent specification EP 0 489 958 B1, which has a recess into which a metal plate with good thermal conductivity is inserted. This plate is from below, i.e. inserted into the circuit board from the solder side and connected to the component with a rivet. The circuit board is then mechanically connected to a housing.
  • the object of the invention is to provide a heat dissipation device for dissipating heat, which is generated by an electrical component, which enables an improvement in the thermal conductivity between the component and the cooling element and ensures good and easy-to-manufacture heat dissipation to a cooling element. Furthermore, it is an object of the invention to enable a test of a circuit arrangement and possibly an exchange of the component.
  • a cavity is arranged in the heat dissipation device below an electrical component that has a high power loss. This cavity is subsequently filled with a thermally highly conductive filler. In the area of the printed circuit board where waste heat is generated due to the loss of conduction of the component, a thermally highly conductive connection between the component and the cooling element is ensured in this way.
  • the invention is particularly suitable for extending the service life and increasing the reliability of electronic components in areas of elevated ambient temperature, such as those found in control electronics in the field of automotive technology.
  • the control electronics are increasingly arranged in the area of vehicle components, such as the engine, transmission or brakes.
  • the invention further enables a targeted and therefore also inexpensive thermal connection of thermally critical components to a cooling element.
  • thermally conductive filler ie the filler can be installed on the circuit board and / or after the circuit board has been mechanically fixed on the Cooling element are introduced.
  • the filler is introduced into the cavity from the outside through an opening.
  • the air displaced by the filler from the cavity escapes through the same or a further opening.
  • the filler is introduced by pressing the filler into the cavity.
  • the filler can also be sucked into the cavity by means of negative pressure or be sucked into the cavity due to the capillary force which arises from the surface tension of the filler which is liquid in this case.
  • a solid filler can also be introduced into the cavity, which is in granular form or as a powder.
  • a liquid filler can also be used, which hardens after being introduced. This prevents the filler from escaping from the cavity during later operation.
  • the opening can be closed after insertion.
  • FIG. 1 shows a top view of a heat dissipation device according to the invention
  • FIG. 2 shows a section through the heat dissipation device, along the line II-II in FIG. 1,
  • Figure 3 shows a section through the heat dissipation device, along the line III-III in Figure 1, and
  • An inventive heat dissipation device shown in plan view in FIG. 1 has a printed circuit board 4 with at least one electrical component 1, a film 5 (cf. FIG. 2) and a cooling element 6.
  • the component 1 generates heat during operation due to its loss conduction.
  • a cavity 9 is arranged below the component 1 between the component 1 and the cooling element 6.
  • the film 5 provided on both sides with an adhesive film has a recess at the point which is below the electrical component 1 in the assembled state.
  • This recess can be produced, for example, by punching the adhesive film 5.
  • the cavity 9 is formed between the component 1 and the cooling element 6 in the assembled state.
  • the circuit board 4 has a first side opening adjacent to the component 1 and 8 on the opposite side adjacent to the component 1, a further east fnung 8 to ⁇ in the circuit board. 4
  • the two openings 8 and 8 provide access to the cavity below the component 1 from the outside.
  • the openings 8 and 8 ⁇ can, for example, be realized as bores in the printed circuit board 4.
  • a filler 7 is introduced into the cavity through the first opening 8.
  • a silicone-based thermal paste such as “Arctic Silver 2”, which contains approximately 80% encapsulated silver, can be used as filler 7.
  • the air displaced by the filler 7 can escape from the cavity via the second opening 8 ', so that the
  • Cavity can largely be filled with the filler 7 without air bubbles.
  • the section shown in FIG. 2 through the heat dissipation device along the line II-II of FIG. 1 shows the device in the assembled state.
  • the cavity is also already filled with the filler 7.
  • the circuit board 4 is glued to the cooling element 6 with the adhesive film 5 during assembly.
  • the cavity below the component 1 is then filled with the highly thermally conductive filler 7.
  • the filler 7 is introduced into the first opening 8 under pressure.
  • the filler 7 fills the cavity and displaces the air therein, which escapes through the second opening 8 ′.
  • the degree of filling of the cavity can be assessed, for example, on the basis of the emergence of filler 7 from the second opening 8 'or on the basis of the amount of filler introduced.
  • the cavity can also be filled, for example, by negative pressure or the capillary force of the filler 7.
  • the cavity and filler opening only one opening 8 or 8 ⁇ may be necessary for this.
  • the filler 7 When filling by negative pressure, the filler 7 is applied over the first or second opening 8 and drawn into the cavity by negative pressure which is generated at the first opening 8.
  • the openings 8 and / or 8 can be closed off from the cavity after filling.
  • a shape of the cavity 9 can be chosen, for example as shown in dashed lines in FIG. 1.
  • the shape of the cavity 9 shown here is oval in shape and has no corners into which the filler 7 could be introduced only with difficulty. Other shapes that are functionally equivalent can also be used.
  • a thermally highly conductive element 10 for example a thermally highly conductive film or paste, was additionally introduced between the component 1 and the printed circuit board 4.
  • the heat goes better from component 1 via the printed circuit board 4 and the filler 7 to the cooling element 6.
  • cooling element 6 can also be provided with openings for filling and / or venting.
  • vias can be provided in the area below the component 1.
  • the printed circuit board 4 - as at least shown in the second exemplary embodiment in FIG. 4 - can have a recess 11 in the region of the component 1 and can be replaced by the filler 7 or by another thermally highly conductive material.
  • the filling of the recess 11 in the circuit board 4 e- may b boss as described above take place after the mounting through the opening 8 or 8 ⁇ or with by introducing a thermally highly conductive material into the recess 11 before placement and filling of the cavity the filler 7 after loading. In this way, tests can be carried out after assembly and any defective components can be replaced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dissipateur thermique et un procédé de fabrication de celui-ci. Ledit dissipateur thermique présente au moins un composant électrique, une plaquette de circuits imprimés (4) et un élément de refroidissement (6). Un espace creux (9) est disposé en dessous d'un composant électrique (1) présentant de fortes pertes thermiques. Cet espace creux (9) est rempli d'un matériau (7) présentant une bonne conductivité thermique. Ainsi, les zones de la plaquette de circuits imprimés dans lesquelles de la chaleur est produite en raison des pertes thermiques des composants (1), sont reliées à l'élément de refroidissement (6) au moyen d'une liaison présentant une bonne conductivité thermique.
PCT/DE2003/000581 2002-03-07 2003-02-24 Dissipateur thermique destine a dissiper la chaleur produite par un composant electrique WO2003075626A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002110041 DE10210041B4 (de) 2002-03-07 2002-03-07 Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung
DE10210041.1 2002-03-07

Publications (1)

Publication Number Publication Date
WO2003075626A1 true WO2003075626A1 (fr) 2003-09-12

Family

ID=27771088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000581 WO2003075626A1 (fr) 2002-03-07 2003-02-24 Dissipateur thermique destine a dissiper la chaleur produite par un composant electrique

Country Status (2)

Country Link
DE (1) DE10210041B4 (fr)
WO (1) WO2003075626A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2037498A1 (fr) * 2007-09-11 2009-03-18 Siemens Aktiengesellschaft Module semi-conducteur de puissance résistant à une chaleur importante
CN105009692A (zh) * 2013-10-24 2015-10-28 住友电气工业株式会社 散热电路板及其制造方法
JP2018050011A (ja) * 2016-09-14 2018-03-29 株式会社ジェイテクト 電子制御装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053643A1 (de) * 2005-11-10 2007-05-16 Conti Temic Microelectronic Kühlvorrichtung für elektronische Bauteile mit einer Heatsink in SMD-Technik
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
DE102008039921B4 (de) 2008-08-27 2021-06-10 Vitesco Technologies GmbH Verfahren zur Herstellung eines elektronischen Geräts mit diskretem Bauelement
TWI401017B (zh) * 2010-05-25 2013-07-01 Sunonwealth Electr Mach Ind Co 散熱模組之結合方法
JP5699006B2 (ja) * 2011-03-01 2015-04-08 日立オートモティブシステムズ株式会社 変速機制御装置及び電子回路装置
TW201320848A (zh) 2011-11-11 2013-05-16 Schoeller Electronics Gmbh 用於製造印刷電路板之方法與系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226168A1 (de) * 1992-08-07 1994-02-10 Sel Alcatel Ag Verfahren zur Herstellung einer elektronischen Baugruppe
WO1996023397A1 (fr) * 1995-01-25 1996-08-01 Northern Telecom Limited Dispositif de plaquette a circuits imprimes avec un puits thermique
US5796582A (en) * 1996-11-21 1998-08-18 Northern Telecom Limited Printed circuit board and heat sink arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19532992A1 (de) * 1995-09-07 1997-03-13 Telefunken Microelectron Leiterplatte
DE19806801C2 (de) * 1998-02-18 2001-06-21 Siemens Ag Elektrische Schaltunganordnung
DE10033352B4 (de) * 2000-07-08 2010-08-19 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
DE20100984U1 (de) * 2001-01-19 2001-05-03 Siemens Ag Anordnung zur Entwärmung eines Bauelements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226168A1 (de) * 1992-08-07 1994-02-10 Sel Alcatel Ag Verfahren zur Herstellung einer elektronischen Baugruppe
WO1996023397A1 (fr) * 1995-01-25 1996-08-01 Northern Telecom Limited Dispositif de plaquette a circuits imprimes avec un puits thermique
US5796582A (en) * 1996-11-21 1998-08-18 Northern Telecom Limited Printed circuit board and heat sink arrangement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2037498A1 (fr) * 2007-09-11 2009-03-18 Siemens Aktiengesellschaft Module semi-conducteur de puissance résistant à une chaleur importante
CN105009692A (zh) * 2013-10-24 2015-10-28 住友电气工业株式会社 散热电路板及其制造方法
JPWO2015059967A1 (ja) * 2013-10-24 2017-03-09 住友電気工業株式会社 放熱性回路基板及びその製造方法
JP2018050011A (ja) * 2016-09-14 2018-03-29 株式会社ジェイテクト 電子制御装置

Also Published As

Publication number Publication date
DE10210041A1 (de) 2003-10-02
DE10210041B4 (de) 2009-04-16

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