JP5699006B2 - 変速機制御装置及び電子回路装置 - Google Patents
変速機制御装置及び電子回路装置 Download PDFInfo
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- JP5699006B2 JP5699006B2 JP2011043464A JP2011043464A JP5699006B2 JP 5699006 B2 JP5699006 B2 JP 5699006B2 JP 2011043464 A JP2011043464 A JP 2011043464A JP 2011043464 A JP2011043464 A JP 2011043464A JP 5699006 B2 JP5699006 B2 JP 5699006B2
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- 230000005540 biological transmission Effects 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims description 66
- 239000011347 resin Substances 0.000 claims description 66
- 238000007789 sealing Methods 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims 5
- 238000000465 moulding Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 13
- 239000000758 substrate Substances 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 238000001721 transfer moulding Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- General Engineering & Computer Science (AREA)
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Description
2 ベース
2a フランジ部
2b 基板接着部
2c 貫通した開口部
3 リード端子
3a,12 ボンディングパット部
4 封止樹脂
5 電子回路組立体
6 回路素子
7 ベアチップ
8 回路基板
8a 貫通した通路用の開口部(直行方向)
8b 貫通した通路用の開口部(斜方向)
8c 溝形の通路用の開口部
9 Au細線
10 接着剤
11 アルミ細線
13 チップ下部の開口部
14 封止樹脂の流動方向
Claims (6)
- 発熱素子が回路基板上に設けられ、自動車の変速機への制御信号を出力する制御回路と、
前記回路基板を支持するベース部材とを備え、
前記回路基板とベース部材とを樹脂でモールドした変速制御装置において、
前記樹脂は前記回路基板よりも熱伝導性が高く、
前記発熱素子直下の前記ベース部材と前記回路基板とに、それぞれの穴が重なるように貫通する開口部を設け、
前記樹脂が前記開口部に充填されることにより前記発熱素子の上面及び下面に直接接触することを特徴とする変速制御装置。 - 請求項1において、
前記回路基板には、前記開口部へ通じる通路が形成され、
前記開口部と前記通路とが前記樹脂によって連続して充填されたことを特徴とする変速制御装置。 - 請求項1において、
前記ベース部材の一部には、前記変速機への取り付けのためのフランジ部が形成され、
前記フランジ部は前記樹脂によってモールドされていないことを特徴とする変速制御装置。 - 自動車の変速機及び駆動機を制御するための電子回路組立体と、前記電子回路組立体を固定するベースと、前記電子回路組立体を電気的に接続したリード端子とを、モールド樹脂で封止した電子回路装置において、
発熱素子であるベアチップの下部に回路基板及びベースのそれぞれの穴が重なるように貫通する開口部を有し、前記モールド樹脂は前記回路基板よりも熱伝導性が高く、前記発熱素子の両面が前記開口部に充填された前記モールド樹脂と熱的に連結したことを特徴とする電子回路装置。 - 請求項4において、
前記回路基板に封止樹脂が充填できる通路用の開口部を有し、発熱素子の両面が封止樹脂と熱的に連結し、前記封止樹脂とベースが熱的に連結したことを特徴とする電子回路装置。 - 請求項4において、
前記回路基板及びベースに封止樹脂が充填できる通路用の開口部を有し、発熱素子の両面が封止樹脂と熱的に連結したことを特徴とする電子回路装置。
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JP2011043464A JP5699006B2 (ja) | 2011-03-01 | 2011-03-01 | 変速機制御装置及び電子回路装置 |
PCT/JP2012/054162 WO2012117899A1 (ja) | 2011-03-01 | 2012-02-21 | 変速機制御装置及び電子回路装置 |
US13/985,235 US20130329384A1 (en) | 2011-03-01 | 2012-02-21 | Transmission Control Device and Electronic Circuit Device |
DE112012001049.3T DE112012001049B4 (de) | 2011-03-01 | 2012-02-21 | Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung |
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US8207607B2 (en) * | 2007-12-14 | 2012-06-26 | Denso Corporation | Semiconductor device with resin mold |
KR20230023834A (ko) * | 2020-12-09 | 2023-02-20 | 주식회사 솔루엠 | 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법 |
USD984397S1 (en) * | 2021-03-16 | 2023-04-25 | Yidong Cai | Circuit board |
DE102022210525A1 (de) | 2022-10-05 | 2024-04-11 | Vitesco Technologies Germany Gmbh | Elektronische Baugruppe, sowie Verfahren zu deren Herstellung |
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JP2749153B2 (ja) * | 1989-10-25 | 1998-05-13 | 株式会社日立製作所 | 半導体デバイス |
JP2000286379A (ja) * | 1999-01-28 | 2000-10-13 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US6188579B1 (en) * | 1999-07-12 | 2001-02-13 | Lucent Technologies Inc. | Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage |
US6400574B1 (en) * | 2000-05-11 | 2002-06-04 | Micron Technology, Inc. | Molded ball grid array |
JP3553513B2 (ja) | 2001-03-06 | 2004-08-11 | 株式会社日立製作所 | 自動車用電子回路装置 |
DE10210041B4 (de) * | 2002-03-07 | 2009-04-16 | Continental Automotive Gmbh | Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung |
JP4283514B2 (ja) * | 2002-09-24 | 2009-06-24 | 株式会社日立製作所 | 電子回路装置 |
JP4821537B2 (ja) * | 2006-09-26 | 2011-11-24 | 株式会社デンソー | 電子制御装置 |
JP4244235B2 (ja) * | 2006-10-10 | 2009-03-25 | 株式会社日立製作所 | 電子回路装置 |
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