EP2929559A1 - Method for producing a switching module and an associated grid module, and an associated grid module and corresponding electronic subassembly - Google Patents

Method for producing a switching module and an associated grid module, and an associated grid module and corresponding electronic subassembly

Info

Publication number
EP2929559A1
EP2929559A1 EP13776805.7A EP13776805A EP2929559A1 EP 2929559 A1 EP2929559 A1 EP 2929559A1 EP 13776805 A EP13776805 A EP 13776805A EP 2929559 A1 EP2929559 A1 EP 2929559A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
electronic component
module
grid module
spring element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13776805.7A
Other languages
German (de)
French (fr)
Inventor
Thomas Hessler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2929559A1 publication Critical patent/EP2929559A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/86—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14163—Positioning or centering articles in the mould using springs being part of the positioning means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3443—Switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making

Definitions

  • the invention relates to a method for producing a switching module according to the preamble of independent claim 1 and a method for producing a grating module according to the preamble of independent claim 8 and of a grating module according to the preamble of independent claim 1 1 and an electronic Assembly with such a grating module.
  • At least one electronic component is coupled to at least one heat sink and at least partially surrounded by a plastic.
  • the heat sink cools the electronic component during operation of the manufactured switching module.
  • the published patent application DE 199 12 443 A1 describes a method for mounting and electrically contacting a power semiconductor component, which comprises a metallic heat sink.
  • the heat sink is designed as a carrier for the semiconductor chip and simultaneously dissipates heat.
  • the heat sink provides a connection contact for the semiconductor chip.
  • the heat sink is mechanically and electrically and thermally connected by laser welding to a terminal contact area of a circuit trace.
  • a holding element for fixing at least one electronic power component arranged on a guide plate to a heat sink is described.
  • the retaining element comprises a Spring element, by which the electronic power device is pressed against the heat sink.
  • the inventive method for producing a switching module having the features of independent claim 1 and the inventive method for producing a grating module with the features of independent claim 8 and the grating module according to the invention and the electronic assembly according to the invention have the advantage that both the same and different electronic components can be combined in a module, these components may have different heights and different geometries.
  • Embodiments of the present invention provide a method for producing a switching module, which comprises at least one electronic component and at least one heat sink for cooling the at least one electronic component.
  • the at least one electronic component is coupled to the at least one heat sink and at least partially surrounded by a plastic.
  • the at least one electronic component and the at least one heat sink are inserted into an injection mold, wherein a spring element is arranged between the at least one electronic component and an inner side of the injection mold.
  • the spring element is supported on the inside of the injection molding tool such that the at least one heat sink is pressed against a wall of the injection molding tool.
  • a liquid plastic may be used, which is cured after the wrapping process.
  • the electronic components can be designed as power components that produce large amounts of heat during operation.
  • the at least one heat sink can be designed, for example, as a metallic body with good thermal conductivities.
  • a grating module with at least two electronic components is proposed, which are already packed and / or wrapped and arranged in a composite, each electronic component of the composite assembly is coupled in each case with a heat sink and at least partially covered with plastic.
  • the heat sinks each form part of the outer surface of the grating module and are arranged in a plane for defrosting the electronic components over the outer surface.
  • An electronic assembly according to the invention comprises at least one such grating module with at least two electronic components.
  • the grating module according to the invention can be mounted as a module and not as tolerated individually packaged components.
  • the arrangement of the heat sink in a plane advantageously uniform cooling of the electronic components is possible.
  • the plastic shell advantageously facilitates the positioning of the mesh. termoduls.
  • the composite arrangement allows smaller tolerances, which only result from the injection process.
  • the at least one electronic component can be pressed by the spring element against the at least one heat sink.
  • the at least one electronic component can be reliably coupled positively and / or non-positively by means of the spring force of the spring element with the corresponding heat sink before being enveloped.
  • the at least one electronic component can be aligned with the at least one heat sink of the spring element in a predetermined direction.
  • the heat sink and the corresponding component can be transferred by aligning in a predetermined position within the switching module. Since the electronic components are individually aligned, the electronic components can advantageously have very small tolerances, both in the plane and in terms of the clamping surface in height in the composite of the enveloping material.
  • a bearing surface of the spring element can be recessed at the at least one electronic component during wrapping. This makes it possible for the spring element to be removed from the finished switching module after the wrapping process, when the at least one electronic component is coupled to the heat sink via the surrounding mass.
  • the recess of the support surface can be achieved via the injection mold when the injection molding tool comprises, for example, an inner wall which separates the spring element from the enveloping material.
  • a surface of the at least one heat sink facing away from the at least one electronic component can be recessed during the envelopment and aligned in a planar manner.
  • the finished switching module can be easily arranged by the planar surface on a plane, which is designed for example as part of a printed circuit board and / or a punched grid.
  • the heat transferred from the electronic component to the heat sink can be further dissipated via the recessed area in the enclosure from the heat sink, the heat sink being accessible through the recessed area directly for cooling by further cooling elements. As a result, a uniform cooling of the switching module can be realized in an advantageous manner.
  • the finished switching module can be electrically contacted via the recessed surface of the heat sink when the heat sink is made of electrically conductive material. This allows, for example, a build-up of the switching module by a slug down method and / or a slug up method.
  • electrical connecting elements can be electrically conductively connected to the at least one electronic component and at least partially enveloped.
  • the electrical connection elements can be removed from the wrapping. Lung mass protrude and thus easily contacted in an advantageous manner.
  • webs can be formed between the switching modules during the wrapping process.
  • Advantageously, can be saved by the formation of webs, material and weight.
  • the individual switching modules could be easily separated, for example, by cutting the webs, so that the manufacture of many switching modules can be facilitated in a wrapping process.
  • At least one centering bolt can be formed during the wrapping process.
  • the trained centering pin can advantageously facilitate alignment of the grid module on a printed circuit board and / or in an assembly.
  • the centering pin can be inserted into a predetermined recess, so that a translational movement of the grid module is prevented and a rotational movement about the centering pin is made possible.
  • the enveloping plastic can form at least one centering pin in order to facilitate the positioning of the grating module during assembly.
  • identically aligned electrical connection elements of the electronic components can be arranged on the side facing away from the heat sinks. This advantageously makes possible a simultaneous electrical contacting, for example via stamped grid.
  • the enveloping plastic may be, for example, a glass fiber reinforced plastic.
  • the heat sink are connected to at least one heat sink to a good To allow heat dissipation.
  • the electronic components are connected to each other via plastic webs.
  • FIG. 1 shows a schematic sectional view of an injection molding tool with a switching module produced by the method according to the invention.
  • Fig. 2 shows a schematic sectional view of a grating module produced by the method according to the invention.
  • FIG. 3 shows a schematic perspective view of the grating module from FIG. 2.
  • Conventional methods for producing a switching module couple in a method step at least one electronic component with at least one heat sink.
  • the coupling can take place, for example, by means of a welding method, wherein the at least one electronic component is firmly welded to the at least one heat sink.
  • the at least one electronic component and the at least one heat sink are at least partially enveloped by a plastic.
  • the at least one electronic component 22 and the at least one heat sink 24 of a switching module 20 are placed according to the invention in an injection mold 30, wherein a spring element 32 is arranged between the at least one electronic component 22 and an inner side 34 of the injection mold 30 becomes.
  • the spring element 32 is supported on the inner side 34 of the injection molding tool 30 such that the at least one heat sink 24 is pressed against a wall 36 of the injection molding tool 30.
  • the at least one heat sink 24 is fixed by the spring element 32 to the wall 36 of the injection mold 30 so that manufacturing tolerances of the electronic component 22 and the heat sink 24 in a first spatial direction z can be compensated, wherein a change in position of the heat sink 24 during the Enveloping process can be prevented by the force of the spring element 32.
  • the switching module comprises a plurality of electronic components 22 with different overall heights and / or tolerances, these can be compensated by the corresponding spring elements 32.
  • enveloping plastic 26 for example, a glass fiber reinforced plastic can be used.
  • the at least one electronic component 22 may have a recess in which the at least one heat sink 24 is arranged.
  • the switching modules 20 illustrated in the exemplary embodiments each have an already packaged or enclosed electronic component 22 and a heat sink 24.
  • the at least one electronic component 22 is pressed by the spring element 32 against the at least one heat sink 24.
  • a positive and / or a non-positive connection between the at least one electronic component 22 and the at least one heat sink 24 It would also be possible to couple a plurality of electronic components 22 with a heat sink 24, wherein each electronic component 22 of a corresponding Federele - Ment 32 is pressed against the heat sink 24.
  • the at least one electronic component 22 is aligned with the at least one heat sink 24 by the spring element 32 in a predetermined direction z.
  • a support surface 22. 1 of the spring element 32 is cut out on the at least one electronic component 22 during the wrapping.
  • the spring element 32 at the end of the manufacturing process can be easily removed, wherein a recess shown in Fig. 3 26.1 in the region of the support surface 22.1 in the switching module 20 is formed.
  • This recess can then be filled with a suitable filling material be filled.
  • Another possibility is not to remove the spring element 32 and also to wrap.
  • a surface 24 is formed
  • Cooling body 24 recessed during wrapping and aligned planar. In this way, after the wrapping process, a planar surface of the switching module 20 is formed, wherein the at least one heat sink 24 is easily accessible via the recessed surface 24.1 for further cooling.
  • electrical connection elements 28 are electrically conductively connected to at least one electronic component 22 and at least partially enveloped.
  • one end of the connecting elements 28 may protrude out of the switching module after the wrapping process and a simple contacting of the corresponding electronic
  • a plurality of switching modules 10, which comprise at least one electronic component 22 and at least one heat sink 24, can be combined to form a grid module 10, in which the assemblies 22, 24 of the corresponding switching modules 20 are inserted into the same injection molding tool 30 are inserted and wrapped in a common process with plastic 26.
  • the illustrated electronic components 22 have the same shape and height, but it would also be conceivable that the switching modules 10 have different components with different heights, the different heights can be compensated by the corresponding spring elements 32.
  • each of the electronic components 22 of the composite assembly is coupled to a heat sink 24 and at least partially coated with plastic 26.
  • the heat sinks 24 each form part of the outer surface of the grating module 10 and are arranged to defrost the electronic components 22 over the outer surface in a plane.
  • the individual electronic components 22 are connected to each other via plastic webs 12.
  • the enveloping plastic 26 forms two centering bolts 14 in the exemplary embodiment of the grid module 10 according to the invention.
  • the identically aligned electrical connection elements 28 or line connections of the electronic components 22 are arranged on the side facing away from the heat sinks 24 and can, for example, be electrically contacted via a corresponding not shown punched grid.
  • the heat sink 24 can be connected to at least one heat sink, not shown.
  • a grating module 10 which is manufactured by the method according to the invention, comprises at least one switching module 20.
  • the illustrated embodiment comprises nine switching modules 20. These switching modules 20 can be made identical and fulfill similar tasks or different be executed and fulfill different tasks.
  • Such a grating module 10 can be used together with other components, not shown, for example, as a power switching stage in an electronic module.
  • the electronic components 22 can advantageously have very small tolerances in the composite of the enveloping material, both in the plane x-y and in terms of the clamping surface in the height z. This means that through the enveloping material, the circumferential tolerances of the electronic components 22 and the heat sink 24 in the x-direction and y-direction and the tolerance in the height z can be compensated by different material thicknesses of the enclosure.

Abstract

The invention relates to a method for producing a switching module (20), which comprises at least one electronic component (22) and at least one heat sink (24) for cooling the at least one electronic component (22), the at least one electronic component (22) being coupled with the at least one heat sink (24) and being at least partly overmolded with a plastic (26). The invention further relates to a corresponding method for producing a grid module (10) and to a grid module produced by the method of the invention, and to a corresponding electronic subassembly having such a grid module. According to the invention, the at least one electronic component (22) and the at least one heat sink (24) are inserted into an injection mold (30), wherein a spring element (32) is arranged between the at least one electronic component (22) and an inner side (34) of the injection mold (30), wherein the spring element (32) is supported on the inner side (34) of the injection mold (30) such that the at least one heat sink (24) is pressed against a wall (36) of the injection mold (30).

Description

Beschreibung  description
Titel title
Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe  Method for producing a switching module and an associated grid module and an associated grid module and corresponding electronic module
Stand der Technik State of the art
Die Erfindung geht aus von einem Verfahren zur Herstellung eines Schaltmoduls nach der Gattung des unabhängigen Patentanspruchs 1 und von einem Verfah- ren zur Herstellung eines Gittermoduls nach der Gattung des unabhängigen Patentanspruchs 8 sowie von einem Gittermodul nach der Gattung des unabhängigen Patentanspruchs 1 1 und einer elektronischen Baugruppe mit einem solchen Gittermodul. The invention relates to a method for producing a switching module according to the preamble of independent claim 1 and a method for producing a grating module according to the preamble of independent claim 8 and of a grating module according to the preamble of independent claim 1 1 and an electronic Assembly with such a grating module.
Üblicherweise wird bei Verfahren zur Herstellung von Schaltmodulen mindestens ein elektronisches Bauelement mit mindestens einen Kühlkörper gekoppelt und zumindest teilweise von einem Kunststoff umhüllt. Der Kühlkörper kühlt das elektronische Bauelement während des Betriebs des hergestellten Schaltmoduls. Usually, in processes for the production of switching modules, at least one electronic component is coupled to at least one heat sink and at least partially surrounded by a plastic. The heat sink cools the electronic component during operation of the manufactured switching module.
In der Offenlegungsschrift DE 199 12 443 A1 wird ein Verfahren zur Montage und zur elektrischen Kontaktierung eines Leistungshalbleiterbauelements beschrieben, welches einen metallischen Kühlkörper umfasst. Der Kühlkörper ist als Träger für den Halbleiterchip ausgeführt und leitet gleichzeitig Wärme ab. Zudem stellt der Kühlkörper einen Anschlusskontakt für den Halbleiterchip zur Verfügung. Der Kühlkörper wird durch Laserschweißen mit einem Anschlusskontaktbereich eines Leiterzugs mechanisch und elektrisch und thermisch verbunden. The published patent application DE 199 12 443 A1 describes a method for mounting and electrically contacting a power semiconductor component, which comprises a metallic heat sink. The heat sink is designed as a carrier for the semiconductor chip and simultaneously dissipates heat. In addition, the heat sink provides a connection contact for the semiconductor chip. The heat sink is mechanically and electrically and thermally connected by laser welding to a terminal contact area of a circuit trace.
In der Offenlegungsschrift DE 101 54 878 A1 wird ein Halteelement zur Fixierung von mindestens einem an einer Leitplatte angeordneten elektronischen Leistungsbauteil an einem Kühlkörper beschrieben. Das Halteelement umfasst ein Federelement, durch welches das elektronische Leistungsbauteil gegen den Kühlkörper gedrückt wird. In the published patent application DE 101 54 878 A1, a holding element for fixing at least one electronic power component arranged on a guide plate to a heat sink is described. The retaining element comprises a Spring element, by which the electronic power device is pressed against the heat sink.
Offenbarung der Erfindung Disclosure of the invention
Das erfindungsgemäße Verfahren zur Herstellung eines Schaltmoduls mit den Merkmalen des unabhängigen Patentanspruchs 1 und das erfindungsgemäße Verfahren zur Herstellung eines Gittermoduls mit den Merkmalen des unabhängigen Anspruchs 8 sowie das erfindungsgemäße Gittermodul und die erfindungsgemäße elektronische Baugruppe, haben demgegenüber den Vorteil, dass sowohl gleiche als auch verschiedene elektronische Bauelemente in einem Modul zusammengefasst werden können, wobei diese Bauelemente unterschiedliche Bauhöhen und unterschiedliche Geometrien aufweisen können. The inventive method for producing a switching module having the features of independent claim 1 and the inventive method for producing a grating module with the features of independent claim 8 and the grating module according to the invention and the electronic assembly according to the invention, in contrast, have the advantage that both the same and different electronic components can be combined in a module, these components may have different heights and different geometries.
Im Unterschied zu den aus dem Stand der Technik bekannten Verfahren, welche einen mit elektronischen Bauelementen bestückten Substratträger zumindest teilweise mit Kunststoff umhüllen werden bei den erfindungsgemäßen Verfahren vorzugsweise bereits verpackte bzw. umhäuste elektronische Bauelemente zumindest teilweise mit Kunststoff umhüllt um ein Schaltmodul bzw. ein Gittermodul zu fertigen. In contrast to the methods known from the prior art, which at least partially surround a substrate carrier equipped with electronic components with plastic, in the inventive method preferably already packaged or wrapped electronic components are at least partially encased in plastic around a switching module or a grid module finished.
Ausführungsformen der vorliegenden Erfindung stellen ein Verfahren zur Herstellung eines Schaltmoduls zur Verfügung, welches mindestens ein elektronisches Bauelement und mindestens einen Kühlkörper zum Kühlen des mindestens einen elektronischen Bauelements umfasst. Das mindestens eine elektronische Bauelement wird mit dem mindestens einen Kühlkörper gekoppelt und zumindest teilweise von einem Kunststoff umhüllt. Erfindungsgemäß werden das mindestens eine elektronische Bauelement und der mindestens eine Kühlkörper in ein Spritzwerkzeug eingelegt, wobei ein Federelement zwischen dem mindestens einen elektronischen Bauelement und einer Innenseite des Spritzwerkzeugs angeordnet wird. Das Federelement wird so an der Innenseite des Spritzwerkzeugs abgestützt, dass der mindestens eine Kühlkörper an eine Wand des Spritzwerkzeugs gedrückt wird. Bei einem erfindungsgemäßen Verfahren zur Herstellung eines Gittermoduls, welches mehrere Schaltmodule umfasst, werden die Bauteile der korrespondie- renden Schaltmodule in dasselbe Spritzwerkzeug eingelegt und in einem gemeinsamen Prozess umhüllt. Embodiments of the present invention provide a method for producing a switching module, which comprises at least one electronic component and at least one heat sink for cooling the at least one electronic component. The at least one electronic component is coupled to the at least one heat sink and at least partially surrounded by a plastic. According to the invention, the at least one electronic component and the at least one heat sink are inserted into an injection mold, wherein a spring element is arranged between the at least one electronic component and an inner side of the injection mold. The spring element is supported on the inside of the injection molding tool such that the at least one heat sink is pressed against a wall of the injection molding tool. In a method according to the invention for producing a grating module which comprises a plurality of switching modules, the components of the corresponding inserted switching modules in the same injection mold and wrapped in a common process.
Zum teilweisen Umhüllen der elektronischen Bauelemente und der Kühlköper kann vorzugsweise ein flüssiger Kunststoff verwendet werden, welcher nach dem Umhüllungsprozess ausgehärtet wird. For partially enveloping the electronic components and the heat sink, a liquid plastic may be used, which is cured after the wrapping process.
Die elektronischen Bauelemente können als Leistungsbauelemente ausgeführt werden, welche im Betrieb große Mengen an Wärme produzieren. The electronic components can be designed as power components that produce large amounts of heat during operation.
Der mindestens eine Kühlkörper kann beispielsweise als metallischer Körper mit guten Wärmeleitfähigkeiten ausgeführt werden. The at least one heat sink can be designed, for example, as a metallic body with good thermal conductivities.
In vorteilhafter Weise können durch das Federelement unterschiedliche Bauhöhen und unterschiedliche Geometrien der elektronischen Bauelemente während des Herstellungsverfahrens ausgeglichen werden. Somit können trotz ungenauer Mechanik der einzelnen elektronischen Bauteile in vorteilhafter Weise im Verbund hoch genaue Mechaniken geschaffen werden. Advantageously, different heights and different geometries of the electronic components can be compensated during the manufacturing process by the spring element. Thus, in spite of inaccurate mechanics of the individual electronic components, highly accurate mechanisms can advantageously be created in the composite.
Des Weiteren wird ein Gittermodul mit mindestens zwei elektronischen Bauelementen vorgeschlagen, welche bereits verpackt und/oder umhäust und in einem Verbund angeordnet sind, wobei jedes elektronische Bauelement der Verbundanordnung jeweils mit einem Kühlkörper gekoppelt und zumindest teilweise mit Kunststoff umhüllt ist. Erfindungsgemäß bilden die Kühlkörper jeweils einen Teil der äußeren Fläche des Gittermoduls und sind zum Entwärmen der elektronischen Bauelemente über die äußere Fläche in einer Ebene angeordnet. Furthermore, a grating module with at least two electronic components is proposed, which are already packed and / or wrapped and arranged in a composite, each electronic component of the composite assembly is coupled in each case with a heat sink and at least partially covered with plastic. According to the invention, the heat sinks each form part of the outer surface of the grating module and are arranged in a plane for defrosting the electronic components over the outer surface.
Eine erfindungsgemäße elektronische Baugruppe umfasst mindestens ein solches Gittermodul mit mindestens zwei elektronischen Bauelementen. An electronic assembly according to the invention comprises at least one such grating module with at least two electronic components.
In vorteilhafter Weise kann das erfindungsgemäße Gittermodul als Modul und nicht als toleranzbehaftete einzeln verpackte Bauelemente montiert werden. Durch die Anordnung der Kühlkörper in einer Ebene ist in vorteilhafter Weise eine gleichmäßige Entwärmung der elektronischen Bauelemente möglich. Zudem erleichtert die Kunststoffhülle in vorteilhafter Weise die Positionierung des Git- termoduls. Des Weiteren können durch die Verbundanordnung geringere Toleranzen ermöglicht werden, die lediglich durch den Spritzprozess ergeben. Advantageously, the grating module according to the invention can be mounted as a module and not as tolerated individually packaged components. The arrangement of the heat sink in a plane advantageously uniform cooling of the electronic components is possible. In addition, the plastic shell advantageously facilitates the positioning of the mesh. termoduls. Furthermore, the composite arrangement allows smaller tolerances, which only result from the injection process.
Durch die in den abhängigen Ansprüchen aufgeführten Maßnahmen und Weiter- bildungen sind vorteilhafte Verbesserungen des im unabhängigen Patentanspruch 1 angegebenen Verfahrens zur Herstellung eines Schaltmoduls und des im unabhängigen Anspruch 8 angegebenen Verfahrens zur Herstellung eines Gittermoduls sowie eines im unabhängigen Anspruch 1 1 angegebenen Gittermoduls möglich. By means of the measures and developments listed in the dependent claims, advantageous improvements of the method specified in independent claim 1 for the production of a switching module and the method specified in independent claim 8 for the production of a grid module and a grid module specified in the independent claim 11 are possible.
In vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Schaltmoduls kann das mindestens eine elektronische Bauelement von dem Federelement gegen den mindestens einen Kühlkörper gedrückt werden. In vorteilhafter Weise kann das mindestens eine elektronische Bauelement vor dem Umhüllen zuverlässig über die Federkraft des Federelements mit dem korrespondierenden Kühlkörper formschlüssig und/oder kraftschlüssig gekoppelt werden. In an advantageous embodiment of the method according to the invention for producing a switching module, the at least one electronic component can be pressed by the spring element against the at least one heat sink. In an advantageous manner, the at least one electronic component can be reliably coupled positively and / or non-positively by means of the spring force of the spring element with the corresponding heat sink before being enveloped.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Schaltmoduls kann das mindestens eine elektronische Bauelement mit dem mindestens einen Kühlkörper von dem Federelement in eine vorgegebene Richtung ausgerichtet werden. In vorteilhafter Weise können der Kühlkörper und das korrespondierenden Bauelement durch das Ausrichten in eine vorgegebene Position innerhalb des Schaltmoduls überführt werden. Da die elektronischen Bauelemente einzeln ausgerichtet werden, können die elektronischen Bauelemente in vorteilhafter Weise im Verbund des umhüllenden Materials sehr kleine Toleranzen, sowohl in der Ebene als auch hinsichtlich der Aufspannfläche in der Höhe aufweisen. In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zurIn a further advantageous embodiment of the method according to the invention for producing a switching module, the at least one electronic component can be aligned with the at least one heat sink of the spring element in a predetermined direction. Advantageously, the heat sink and the corresponding component can be transferred by aligning in a predetermined position within the switching module. Since the electronic components are individually aligned, the electronic components can advantageously have very small tolerances, both in the plane and in terms of the clamping surface in height in the composite of the enveloping material. In a further advantageous embodiment of the method according to the invention for
Herstellung eines Schaltmoduls können unterschiedliche Bauhöhen und/oder Toleranzen der elektronischen Bauelemente durch die korrespondierenden Federelemente ausgeglichen werden. In vorteilhafter Weise können elektronische Bauelemente mit unterschiedlichen Bauhöhen und Toleranzen im selben Spritz- Werkzeug angeordnet und in einem gemeinsamen Prozess umhüllt werden. In vorteilhafter Weise kann durch den gemeinsamen Umhüllungsprozess Zeit eingespart werden. Production of a switching module, different heights and / or tolerances of the electronic components can be compensated by the corresponding spring elements. Advantageously, electronic components with different heights and tolerances in the same spray tool can be arranged and wrapped in a common process. In Advantageously, time can be saved by the common wrapping process.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Schaltmoduls kann eine Auflagefläche des Federelements an dem mindestens einen elektronischen Bauelement beim Umhüllen ausgespart werden. Dies ermöglicht, dass das Federelement nach dem Umhüllungsprozess von dem fertigen Schaltmodul entfernt werden kann, wenn das mindestens eine elektronische Bauelement über die umhüllende Masse mit dem Kühlkörper ge- koppelt ist. In vorteilhafter Weise kann die Aussparung der Auflagefläche über das Spritzwerkzeug erzielt werden, wenn das Spritzwerkzeug beispielsweise eine Innenwandung umfasst, welche das Federelement von dem umhüllenden Material abtrennt. In a further advantageous embodiment of the method according to the invention for the production of a switching module, a bearing surface of the spring element can be recessed at the at least one electronic component during wrapping. This makes it possible for the spring element to be removed from the finished switching module after the wrapping process, when the at least one electronic component is coupled to the heat sink via the surrounding mass. Advantageously, the recess of the support surface can be achieved via the injection mold when the injection molding tool comprises, for example, an inner wall which separates the spring element from the enveloping material.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Schaltmoduls kann eine von dem mindestens einen elektronischen Bauelement abgewandte Fläche des mindestens einen Kühlkörpers beim Umhüllen ausgespart und planar ausgerichtet werden. In vorteilhafter Weise kann das fertiggestellte Schaltmodul durch die planare Fläche einfach auf einer Ebene, welche beispielsweise als Teil einer Leiterplatte und/oder eines Stanzgitters ausgeführt ist, angeordnet werden. Des Weiteren kann die Wärme, welche von dem elektronischen Bauelement auf den Kühlköper übertragen wird, über die ausgesparte Fläche in der Umhüllung vom Kühlkörper weiter abgeleitet werden, wobei der Kühlkörper durch die ausgesparte Fläche direkt für eine Kühlung durch weitere Kühlelemente zugänglich ist. Dadurch kann in vorteilhafter Weise eine gleichmäßige Entwärmung des Schaltmoduls realisiert werden. Des Weiteren kann das fertiggestellte Schaltmodul über die ausgesparte Fläche des Kühlkörpers elektrisch kontaktiert werden, wenn der Kühlköper aus elektrisch leitfähigem Material gefertigt ist. Dies ermöglicht beispielsweise eine Verbauung des Schaltmoduls durch eine Slug Down Methode und/oder eine Slug Up Methode. In a further advantageous embodiment of the method according to the invention for the production of a switching module, a surface of the at least one heat sink facing away from the at least one electronic component can be recessed during the envelopment and aligned in a planar manner. Advantageously, the finished switching module can be easily arranged by the planar surface on a plane, which is designed for example as part of a printed circuit board and / or a punched grid. Furthermore, the heat transferred from the electronic component to the heat sink can be further dissipated via the recessed area in the enclosure from the heat sink, the heat sink being accessible through the recessed area directly for cooling by further cooling elements. As a result, a uniform cooling of the switching module can be realized in an advantageous manner. Furthermore, the finished switching module can be electrically contacted via the recessed surface of the heat sink when the heat sink is made of electrically conductive material. This allows, for example, a build-up of the switching module by a slug down method and / or a slug up method.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Schaltmoduls können elektrische Verbindungselemente mit dem mindestens einem elektronischen Bauelement elektrisch leitend verbunden und zumindest teilweise umhüllt werden. In vorteilhafter Weise können die elektrischen Verbindungselemente nach dem Umhüllungsprozess aus der Umhül- lungsmasse herausragen und somit in vorteilhafter Weise einfach kontaktiert werden. In a further advantageous embodiment of the method according to the invention for producing a switching module, electrical connecting elements can be electrically conductively connected to the at least one electronic component and at least partially enveloped. Advantageously, after the wrapping process, the electrical connection elements can be removed from the wrapping. Lung mass protrude and thus easily contacted in an advantageous manner.
In vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Gittermoduls können während des Umhüllungsprozesses zwischen den Schaltmodulen Stege ausgebildet werden. In vorteilhafter Weise kann durch die Ausbildung von Stegen, Material und Gewicht eingespart werden. Des Weiteren könnten die einzelnen Schaltmodule beispielsweise durch Zerschneiden der Stege einfach voneinander getrennt werden, so dass die Anfertigung von vielen Schaltmodulen in einem Umhüllungsprozess erleichtert werden kann. In an advantageous embodiment of the method according to the invention for producing a grid module, webs can be formed between the switching modules during the wrapping process. Advantageously, can be saved by the formation of webs, material and weight. Furthermore, the individual switching modules could be easily separated, for example, by cutting the webs, so that the manufacture of many switching modules can be facilitated in a wrapping process.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Verfahrens zur Herstellung eines Gittermoduls kann beim Umhüllungsprozess mindestens ein Zentrierbolzen ausgebildet werden. Der ausgebildete Zentrierbolzen kann in vorteilhafter Weise ein Ausrichten des Gittermoduls auf einer Leiterplatte und/oder in einer Baugruppe erleichtern. Hierfür kann der Zentrierbolzen in eine vorgegebene Aussparung eingeführt werden, so dass eine Translationsbewegung des Gittermoduls unterbunden und eine Rotationsbewegung um den Zentrierbolzen ermöglicht wird. In a further advantageous embodiment of the method according to the invention for producing a grid module, at least one centering bolt can be formed during the wrapping process. The trained centering pin can advantageously facilitate alignment of the grid module on a printed circuit board and / or in an assembly. For this purpose, the centering pin can be inserted into a predetermined recess, so that a translational movement of the grid module is prevented and a rotational movement about the centering pin is made possible.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Gittermoduls kann der umhüllende Kunststoff mindestens einen Zentrierbolzen ausbilden, um die Positionierung des Gittermoduls bei der Montage zu erleichtern. In a further advantageous embodiment of the grating module according to the invention, the enveloping plastic can form at least one centering pin in order to facilitate the positioning of the grating module during assembly.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Gittermoduls können gleich ausgerichtete elektrische Verbindungselemente der elektronischen Bauelemente auf der den Kühlkörpern abgewandten Seite angeordnet werden. Dies ermöglicht in vorteilhafter Weise eine gleichzeitige elektrische Kontaktie- rung, beispielsweise über Stanzgitter. In a further advantageous embodiment of the grating module according to the invention identically aligned electrical connection elements of the electronic components can be arranged on the side facing away from the heat sinks. This advantageously makes possible a simultaneous electrical contacting, for example via stamped grid.
In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Gittermoduls kann der umhüllende Kunststoff beispielsweise ein glasfaserverstärkter Kunststoff sein. In weiterer vorteilhafter Ausgestaltung des erfindungsgemäßen Gittermoduls sind die Kühlkörper an mindestens eine Wärmesenke angebunden, um eine gute Wärmeableitung zu ermöglichen. Vorzugsweise sind die elektronischen Bauelemente über Kunststoffstege miteinander verbunden. Dadurch kann in vorteilhafter Weise Material für die Kunststoffhülle des Bauteilverbunds eingespart werden. In a further advantageous embodiment of the grating module according to the invention, the enveloping plastic may be, for example, a glass fiber reinforced plastic. In a further advantageous embodiment of the grating module according to the invention, the heat sink are connected to at least one heat sink to a good To allow heat dissipation. Preferably, the electronic components are connected to each other via plastic webs. As a result, material for the plastic shell of the composite component can be saved in an advantageous manner.
Ausführungsbeispiele der Erfindung sind in den Zeichnungen dargestellt und werden in der nachfolgenden Beschreibung näher erläutert. In den Zeichnungen bezeichnen gleiche Bezugszeichen Komponenten bzw. Elemente, die gleiche bzw. analoge Funktionen ausführen. Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description. In the drawings, like reference numerals designate components that perform the same or analog functions.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Fig. 1 zeigt eine schematische Schnittdarstellung eines Spritzwerkzeugs mit einem nach dem erfindungsgemäßen Verfahren hergestellten Schaltmodul. 1 shows a schematic sectional view of an injection molding tool with a switching module produced by the method according to the invention.
Fig. 2 zeigt eine schematische Schnittdarstellung eines nach dem erfindungsgemäßen Verfahren hergestellten Gittermoduls. Fig. 2 shows a schematic sectional view of a grating module produced by the method according to the invention.
Fig. 3 zeigt eine schematische Perspektive Darstellung des Gittermoduls aus Fig. 2. 3 shows a schematic perspective view of the grating module from FIG. 2.
Übliche Verfahren zum Herstellen eines Schaltmoduls koppeln in einem Verfahrensschritt mindestens ein elektronisches Bauelement mit mindestens einem Kühlkörper. Die Kopplung kann beispielsweise über ein Schweißverfahren erfol- gen, wobei das mindestens eine elektronische Bauelement fest mit dem mindestens einen Kühlkörper verschweißt wird. In einem weiteren Verfahrensschritt werden das mindestens eine elektronische Bauelement und der mindestens eine Kühlkörper zumindest teilweise von einem Kunststoff umhüllt. Wie aus Fig. 1 ersichtlich ist, werden das mindestens eine elektronische Bauelement 22 und der mindestens eine Kühlkörper 24 eines Schaltmoduls 20 erfindungsgemäß in ein Spritzwerkzeug 30 eingelegt, wobei ein Federelement 32 zwischen dem mindestens einen elektronischen Bauelement 22 und einer Innenseite 34 des Spritzwerkzeugs 30 angeordnet wird. Hierbei wird das Federelement 32 so an der Innenseite 34 des Spritzwerkzeugs 30 abgestützt, dass der mindestens eine Kühlkörper 24 an eine Wand 36 des Spritzwerkzeugs 30 gedrückt wird. Auf diese Weise wird der mindestens eine Kühlkörper 24 durch das Federelement 32 an der Wand 36 des Spritzwerkzeugs 30 fixiert, so dass Fertigungstoleranzen des elektronischen Bauelements 22 und dem Kühlkörper 24 in einer ersten Raumrichtung z ausgeglichen werden können, wobei eine Positionsänderung des Kühlkörpers 24 während des Umhüllungsvorgangs durch die Kraft des Federelements 32 unterbunden werden kann. Umfasst das Schaltmodul mehrere elektronische Bauelemente 22 mit unterschiedlichen Bauhöhen und/oder Toleranzen können diese durch die korrespondierenden Federelemente 32 ausgeglichen werden. Als umhüllender Kunststoff 26 kann beispielsweise ein glasfaser- verstärkter Kunststoff verwendet werden. Conventional methods for producing a switching module couple in a method step at least one electronic component with at least one heat sink. The coupling can take place, for example, by means of a welding method, wherein the at least one electronic component is firmly welded to the at least one heat sink. In a further method step, the at least one electronic component and the at least one heat sink are at least partially enveloped by a plastic. As can be seen from FIG. 1, the at least one electronic component 22 and the at least one heat sink 24 of a switching module 20 are placed according to the invention in an injection mold 30, wherein a spring element 32 is arranged between the at least one electronic component 22 and an inner side 34 of the injection mold 30 becomes. In this case, the spring element 32 is supported on the inner side 34 of the injection molding tool 30 such that the at least one heat sink 24 is pressed against a wall 36 of the injection molding tool 30. In this way, the at least one heat sink 24 is fixed by the spring element 32 to the wall 36 of the injection mold 30 so that manufacturing tolerances of the electronic component 22 and the heat sink 24 in a first spatial direction z can be compensated, wherein a change in position of the heat sink 24 during the Enveloping process can be prevented by the force of the spring element 32. If the switching module comprises a plurality of electronic components 22 with different overall heights and / or tolerances, these can be compensated by the corresponding spring elements 32. As enveloping plastic 26, for example, a glass fiber reinforced plastic can be used.
Wie aus Fig. 1 und 2 weiter ersichtlich ist, kann das mindestens eine elektronische Bauelement 22 eine Aussparung aufweisen, in welcher der mindestens ein Kühlkörper 24 angeordnet wird. Die in den Ausführungsbeispielen dargestellten Schaltmodule 20 weisen jeweils ein bereits verpacktes bzw. eingehäustes elektronisches Bauelement 22 und einen Kühlkörper 24 auf. As is further apparent from FIGS. 1 and 2, the at least one electronic component 22 may have a recess in which the at least one heat sink 24 is arranged. The switching modules 20 illustrated in the exemplary embodiments each have an already packaged or enclosed electronic component 22 and a heat sink 24.
Wie aus Fig. 1 weiter ersichtlich ist, wird das mindestens eine elektronische Bauelement 22 von dem Federelement 32 gegen den mindestens einen Kühlkörper 24 gedrückt. Auf diese Weise entstehen eine formschlüssige und/oder eine kraftschlüssige Verbindung zwischen dem mindestens einen elektronischen Bauelement 22 und dem mindestens einen Kühlkörper 24. Es wäre auch möglich mehrere elektronische Bauelemente 22 mit einem Kühlkörper 24 zu koppeln, wobei jedes elektronische Bauelement 22 von einem korrespondierenden Federele- ment 32 gegen den Kühlkörper 24 gedrückt wird. As is further apparent from FIG. 1, the at least one electronic component 22 is pressed by the spring element 32 against the at least one heat sink 24. In this way, a positive and / or a non-positive connection between the at least one electronic component 22 and the at least one heat sink 24. It would also be possible to couple a plurality of electronic components 22 with a heat sink 24, wherein each electronic component 22 of a corresponding Federele - Ment 32 is pressed against the heat sink 24.
Wie aus Fig. 1 weiter ersichtlich ist, wird das mindestens eine elektronische Bauelement 22 mit dem mindestens einen Kühlkörper 24 von dem Federelement 32 in eine vorgegebene Richtung z ausgerichtet. As is further apparent from FIG. 1, the at least one electronic component 22 is aligned with the at least one heat sink 24 by the spring element 32 in a predetermined direction z.
Wie aus Fig. 1 bis 3 weiter ersichtlich ist, wird eine Auflagefläche 22.1 des Federelements 32 an dem mindestens einen elektronischen Bauelement 22 beim Umhüllen ausgespart. Auf diese Weise kann das Federelement 32 am Ende des Herstellungsprozesses einfach entfernt werden, wobei eine in Fig. 3 dargestellte Aussparung 26.1 in dem Bereich der Auflagefläche 22.1 im Schaltmodul 20 entsteht. Diese Aussparung kann anschließend mit einem geeigneten Füllmaterial gefüllt werden. Eine weitere Möglichkeit besteht darin das Federelement 32 nicht zu entfernen und ebenfalls zu umhüllen. As is further apparent from FIGS. 1 to 3, a support surface 22. 1 of the spring element 32 is cut out on the at least one electronic component 22 during the wrapping. In this way, the spring element 32 at the end of the manufacturing process can be easily removed, wherein a recess shown in Fig. 3 26.1 in the region of the support surface 22.1 in the switching module 20 is formed. This recess can then be filled with a suitable filling material be filled. Another possibility is not to remove the spring element 32 and also to wrap.
Wie aus Fig. 1 und 2 weiter ersichtlich ist, wird eine von dem mindestens einem elektronischen Bauelement 22 abgewandte Fläche 24.1 des mindestens einenAs is further apparent from FIGS. 1 and 2, a surface 24. 1. Of the at least one surface facing away from the at least one electronic component 22 is formed
Kühlkörpers 24 beim Umhüllen ausgespart und planar ausgerichtet. Auf diese Weise entsteht nach dem Umhüllungsvorgang eine planare Fläche des Schaltmoduls 20, wobei der mindestens eine Kühlkörper 24 über die ausgesparte Fläche 24.1 leicht zu weiteren Kühlung zugänglich ist. Cooling body 24 recessed during wrapping and aligned planar. In this way, after the wrapping process, a planar surface of the switching module 20 is formed, wherein the at least one heat sink 24 is easily accessible via the recessed surface 24.1 for further cooling.
Wie Aus Fig. 1 bis 3 weiter ersichtlich ist, werden elektrische Verbindungselemente 28, mit mindestens einem elektronischen Bauelement 22 elektrisch leitend verbunden und zumindest teilweise umhüllt. Hierbei kann ein Ende der Verbindungselemente 28 nach dem Umhüllungsprozess aus dem Schaltmodul heraus- ragen und ein einfaches Kontaktieren des korrespondierenden elektronischenAs is further apparent from FIGS. 1 to 3, electrical connection elements 28 are electrically conductively connected to at least one electronic component 22 and at least partially enveloped. In this case, one end of the connecting elements 28 may protrude out of the switching module after the wrapping process and a simple contacting of the corresponding electronic
Bauelements 22 ermöglichen. Allow device 22.
Wie aus Fig. 2 und 3 weiter ersichtlich ist, können auch mehrere Schaltmodule 10, welche mindestens ein elektronisches Bauelement 22 und mindestens einen Kühlkörper 24 umfassen zu einem Gittermodul 10 zusammengefasst werden, in dem die Baugruppen 22, 24 der korrespondierenden Schaltmodule 20 in dasselbe Spritzwerkzeug 30 eingelegt und in einem gemeinsamen Prozess mit Kunststoff 26 umhüllt werden. Die dargestellten elektronischen Bauelemente 22 weisen die gleiche Form und Bauhöhe auf, es wäre aber auch denkbar, dass die Schaltmodule 10 unterschiedliche Bauelemente mit verschiedenen Bauhöhen aufweisen, wobei die unterschiedlichen Bauhöhen über die korrespondierenden Federelemente 32 ausgeglichen werden können. As can also be seen from FIGS. 2 and 3, a plurality of switching modules 10, which comprise at least one electronic component 22 and at least one heat sink 24, can be combined to form a grid module 10, in which the assemblies 22, 24 of the corresponding switching modules 20 are inserted into the same injection molding tool 30 are inserted and wrapped in a common process with plastic 26. The illustrated electronic components 22 have the same shape and height, but it would also be conceivable that the switching modules 10 have different components with different heights, the different heights can be compensated by the corresponding spring elements 32.
Wie aus Fig. 2 und 3 weiter ersichtlich ist, sind im dargestellten Ausführungsbei- spiel des erfindungsgemäßen Gittermoduls 10 neun elektronische BauelementeAs is further apparent from FIGS. 2 and 3, in the illustrated exemplary embodiment of the grating module 10 according to the invention, there are nine electronic components
22, welche bereits verpackt und/oder umhäust sind, in einem Verbund angeordnet. Jedes der elektronischen Bauelemente 22 der Verbundanordnung ist jeweils mit einem Kühlkörper 24 gekoppelt und zumindest teilweise mit Kunststoff 26 umhüllt. Erfindungsgemäß bilden die Kühlkörper 24 jeweils einen Teil der äuße- ren Fläche des Gittermoduls 10 bilden und sind zum Entwärmen der elektronischen Bauelemente 22 über die äußere Fläche in einer Ebene angeordnet. Die einzelnen elektronischen Bauelemente 22 sind über Kunststoffstege 12 miteinander verbunden. 22, which are already packed and / or jacketed, arranged in a composite. Each of the electronic components 22 of the composite assembly is coupled to a heat sink 24 and at least partially coated with plastic 26. According to the invention, the heat sinks 24 each form part of the outer surface of the grating module 10 and are arranged to defrost the electronic components 22 over the outer surface in a plane. The individual electronic components 22 are connected to each other via plastic webs 12.
Wie aus Fig. 3 weiter ersichtlich ist, bildet der umhüllende Kunststoff 26 im dargestellten Ausführungsbeispiel des erfindungsgemäßen Gittermoduls 10 zwei Zentrierbolzen 14 aus. Die gleich ausgerichteten elektrischen Verbindungselemente 28 bzw. Leitungsanschlüsse der elektronischen Bauelemente 22 sind auf der den Kühlkörpern 24 abgewandten Seite angeordnet und können beispielsweise einfach über ein entsprechendes nicht dargestelltes Stanzgitter elektrisch kontaktiert werden. Zur gleichmäßigen Wärmeabfuhr können die Kühlkörper 24 an mindestens eine nicht dargestellte Wärmesenke angebunden werden. As can also be seen from FIG. 3, the enveloping plastic 26 forms two centering bolts 14 in the exemplary embodiment of the grid module 10 according to the invention. The identically aligned electrical connection elements 28 or line connections of the electronic components 22 are arranged on the side facing away from the heat sinks 24 and can, for example, be electrically contacted via a corresponding not shown punched grid. For uniform heat dissipation, the heat sink 24 can be connected to at least one heat sink, not shown.
Wie aus Fig. 2 und 3 weiter ersichtlich ist, umfasst ein Gittermodul 10, welches mit dem erfindungsgemäßen Verfahren hergestellt wird, mindestens ein Schaltmodul 20. Das dargestellte Ausführungsbeispiel umfasst neun Schaltmodule 20. Diese Schaltmodule 20 können identisch ausgeführt werden und ähnliche Aufgaben erfüllen oder unterschiedlich ausgeführt werden und unterschiedliche Aufgaben erfüllen. Ein solches Gittermodul 10 kann zusammen mit anderen nicht dargestellten Bauteilen beispielsweise als Leistungsschaltstufe in einer elektronischen Baugruppe eingesetzt werden. As is further apparent from FIGS. 2 and 3, a grating module 10, which is manufactured by the method according to the invention, comprises at least one switching module 20. The illustrated embodiment comprises nine switching modules 20. These switching modules 20 can be made identical and fulfill similar tasks or different be executed and fulfill different tasks. Such a grating module 10 can be used together with other components, not shown, for example, as a power switching stage in an electronic module.
Da die elektronischen Bauelemente 22 und Kühlkörper 24 der Schaltmodule einzeln ausgerichtet werden, können die elektronischen Bauelemente 22 in vorteilhafter Weise im Verbund des umhüllenden Materials sehr kleine Toleranzen, sowohl in der Ebene x-y als auch hinsichtlich der Aufspannfläche in der Höhe z aufweisen. Das bedeutet, dass durch das umhüllende Material die umlaufenden Toleranzen der elektronischen Bauteile 22 und der Kühlkörper 24 in x-Richtung und y-Richtung und die Toleranz in der Höhe z durch unterschiedliche Materialdicken der Umhüllung ausgeglichen werden können. Since the electronic components 22 and heat sink 24 of the switching modules are individually aligned, the electronic components 22 can advantageously have very small tolerances in the composite of the enveloping material, both in the plane x-y and in terms of the clamping surface in the height z. This means that through the enveloping material, the circumferential tolerances of the electronic components 22 and the heat sink 24 in the x-direction and y-direction and the tolerance in the height z can be compensated by different material thicknesses of the enclosure.

Claims

Ansprüche  claims
Verfahren zur Herstellung eines Schaltmoduls, welches mindestens ein elektronisches Bauelement (22) und mindestens einen Kühlkörper (24) zum Kühlen des mindestens einen elektronischen Bauelements (22) umfasst, wobei das mindestens eine elektronische Bauelement (22) mit dem mindestens einen Kühlkörper (24) gekoppelt und zumindest teilweise von einem Kunststoff (26) umhüllt wird, dadurch gekennzeichnet, dass das mindestens eine elektronische Bauelement (22) und der mindestens eine Kühlkörper (24) in ein Spritzwerkzeug (30) eingelegt werden, wobei ein Federelement (32) zwischen dem mindestens einen elektronischen Bauelement (22) und einer Innenseite (34) des Spritzwerkzeugs (30) angeordnet wird, wobei das Federelement (32) so an der Innenseite (34) des Spritzwerkzeugs (30) abgestützt wird, dass der mindestens eine Kühlkörper (24) an eine Wand (36) des Spritzwerkzeugs (30) gedrückt wird. Method for producing a switching module, which comprises at least one electronic component (22) and at least one heat sink (24) for cooling the at least one electronic component (22), wherein the at least one electronic component (22) is connected to the at least one heat sink (24) coupled and at least partially by a plastic (26) is wrapped, characterized in that the at least one electronic component (22) and the at least one heat sink (24) are inserted into an injection mold (30), wherein a spring element (32) between the at least one electronic component (22) and an inner side (34) of the injection molding tool (30) are arranged, wherein the spring element (32) is supported on the inside (34) of the injection molding tool (30) such that the at least one heat sink (24) is pressed against a wall (36) of the injection tool (30).
Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass das mindestens eine elektronische Bauelement (22) von dem Federelement (32) gegen den mindestens einen Kühlkörper (24) gedrückt wird. A method according to claim 1, characterized in that the at least one electronic component (22) is pressed by the spring element (32) against the at least one heat sink (24).
Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das mindestens eine elektronische Bauelement (22) mit dem mindestens einen Kühlkörper (24) von dem Federelement (32) in eine vorgegebene Richtung ausgerichtet wird. A method according to claim 1 or 2, characterized in that the at least one electronic component (22) is aligned with the at least one heat sink (24) of the spring element (32) in a predetermined direction.
Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass unterschiedliche Bauhöhen und/oder Toleranzen der elektronischen Bauelemente (22) durch die korrespondierenden Federelemente (32) ausgeglichen werden. Method according to one of claims 1 to 3, characterized in that different heights and / or tolerances of the electronic components (22) are compensated by the corresponding spring elements (32).
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass eine Auflagefläche (22.1 ) des Federelements (32) an dem mindestens einen elektronischen Bauelement (22) beim Umhüllen ausgespart wird. 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass eine von dem mindestens einen elektronischen Bauelement (22) abgewandte Fläche (24.1 ) des mindestens einen Kühlkörpers (24) beim Umhüllen ausgespart und planar ausgerichtet wird. 7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass elektrische Verbindungselemente (28) mit dem mindestens einem elektronischen Bauelement (22) elektrisch leitend verbunden und zumindest teilweise umhüllt werden. 8. Verfahren zur Herstellung eines Gittermoduls, welches mehrere Schaltmodule (20) umfasst, dadurch gekennzeichnet, dass das Gittermodul (10) nach einem der Ansprüche 1 bis 7 hergestellt wird, wobei die Bauteile (22, 24) der korrespondierenden Schaltmodule (20) in dasselbe Spritzwerkzeug (30) eingelegt und in einem gemeinsamen Prozess umhüllt werden. 5. The method according to any one of claims 1 to 4, characterized in that a bearing surface (22.1) of the spring element (32) on the at least one electronic component (22) is recessed during wrapping. 6. The method according to any one of claims 1 to 5, characterized in that one of the at least one electronic component (22) facing away from surface (24.1) of the at least one heat sink (24) recessed during wrapping and aligned planar. 7. The method according to any one of claims 1 to 6, characterized in that electrical connection elements (28) are electrically conductively connected to the at least one electronic component (22) and at least partially enveloped. 8. A method for producing a grid module, which comprises a plurality of switching modules (20), characterized in that the grid module (10) is produced according to one of claims 1 to 7, wherein the components (22, 24) of the corresponding switching modules (20) in the same injection mold (30) are inserted and wrapped in a common process.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass während des Umhüllungsprozesses zwischen den Schaltmodulen (20) Stege (12) ausgebildet werden. 10. Verfahren nach Anspruch 9 oder 10, dadurch gekennzeichnet, dass beim9. The method according to claim 8, characterized in that during the wrapping process between the switching modules (20) webs (12) are formed. 10. The method according to claim 9 or 10, characterized in that at
Umhüllungsprozess mindestens ein Zentrierbolzen (14) ausgebildet wird. Enveloping process at least one centering pin (14) is formed.
1 1 . Gittermodul mit mindestens zwei elektronischen Bauelementen (22), welche bereits verpackt und/oder umhäust und in einem Verbund angeordnet sind, wobei jedes elektronische Bauelement (22) der Verbundanordnung jeweils mit einem Kühlkörper (24) gekoppelt und zumindest teilweise mit Kunststoff umhüllt ist, dadurch gekennzeichnet, dass die Kühlkörper (24) jeweils einen Teil der äußeren Fläche des Gittermoduls bilden und zum Entwärmen der elektronischen Bauelemente (22) über die äußere Fläche in einer Ebene an- geordnet sind. 1 1. Grid module with at least two electronic components (22), which are already packed and / or wrapped and arranged in a composite, each electronic component (22) of the composite assembly each having a heat sink (24) is coupled and at least partially coated with plastic, characterized in that the heat sinks (24) each form part of the outer surface of the grating module and are arranged in a plane over the outer surface for the purpose of warming the electronic components (22).
12. Gittermodul nach Anspruch 1 1 , dadurch gekennzeichnet, dass der umhüllende Kunststoff (26) mindestens einen Zentrierbolzen (14) ausbildet. 12. grid module according to claim 1 1, characterized in that the enveloping plastic (26) at least one centering bolt (14) is formed.
13. Gittermodul nach Anspruch 1 1 oder 12, dadurch gekennzeichnet, dass 13. grid module according to claim 1 1 or 12, characterized in that
gleich ausgerichtete elektrische Verbindungselemente (28) der elektronischen Bauelemente (22) auf der den Kühlkörpern (24) abgewandten Seite angeordnet sind.  identically aligned electrical connection elements (28) of the electronic components (22) are arranged on the side facing away from the heat sinks (24).
14. Gittermodul nach einem der Ansprüche 1 1 bis 13, dadurch gekennzeichnet, dass der umhüllende Kunststoff (26) ein glasfaserverstärkter Kunststoff ist. 14 grid module according to one of claims 1 1 to 13, characterized in that the enveloping plastic (26) is a glass fiber reinforced plastic.
15. Gittermodul nach einem der Ansprüche 1 1 bis 14, dadurch gekennzeichnet, dass die Kühlkörper (24) an mindestens eine Wärmesenke angebunden sind. 15. Grid module according to one of claims 1 1 to 14, characterized in that the heat sink (24) are connected to at least one heat sink.
16. Gittermodul nach einem der Ansprüche 1 1 bis 15, dadurch gekennzeichnet, dass die elektronischen Bauelemente (22) über Kunststoffstege (12) miteinander verbunden sind. 16. grid module according to one of claims 1 1 to 15, characterized in that the electronic components (22) via plastic webs (12) are interconnected.
17. Elektronische Baugruppe, gekennzeichnet durch mindestens ein Gittermodul mit mindestens zwei elektronischen Bauelementen (22) nach einem der Ansprüche 1 1 bis 16. 17. Electronic assembly, characterized by at least one grating module with at least two electronic components (22) according to any one of claims 1 1 to 16.
EP13776805.7A 2012-12-10 2013-10-15 Method for producing a switching module and an associated grid module, and an associated grid module and corresponding electronic subassembly Withdrawn EP2929559A1 (en)

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DE102012222679.6A DE102012222679A1 (en) 2012-12-10 2012-12-10 Method for producing a switching module and an associated grid module and an associated grid module and corresponding electronic module
PCT/EP2013/071475 WO2014090442A1 (en) 2012-12-10 2013-10-15 Method for producing a switching module and an associated grid module, and an associated grid module and corresponding electronic subassembly

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