JP2705361B2 - Mold for manufacturing hollow type resin-sealed semiconductor pressure sensor - Google Patents
Mold for manufacturing hollow type resin-sealed semiconductor pressure sensorInfo
- Publication number
- JP2705361B2 JP2705361B2 JP3127379A JP12737991A JP2705361B2 JP 2705361 B2 JP2705361 B2 JP 2705361B2 JP 3127379 A JP3127379 A JP 3127379A JP 12737991 A JP12737991 A JP 12737991A JP 2705361 B2 JP2705361 B2 JP 2705361B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- insert
- pressure sensor
- sealed semiconductor
- semiconductor pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、中空型樹脂封止半導体
圧力センサ製造用金型の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a mold for manufacturing a hollow resin-sealed semiconductor pressure sensor.
【０００２】[0002]
【従来の技術】図３は従来の中空型樹脂封止半導体圧力
センサ（以下、圧力センサと称する）の製造用金型の構
造を示す断面図である。同図において、１は圧力を感知
する半導体素子を含むインサート、２は半導体素子１の
上面に形成され大気に直接接触する圧力感知部、３はイ
ンサート１と外部回路とのコンタクトを取るリード、４
はインサート１とリード３とを結線するワイヤ、５はイ
ンサート全体を封止する樹脂である。樹脂５は成形用の
上金型６と下金型７とで形成された空間に充填される。
８は圧力感知部２を大気と直接接触させるための中空部
を形成する上ピン、９はインサート１の下方への変位を
規制する下ピン、これら両ピン８、９はそれぞれ上下金
型６、７に固定されている。2. Description of the Related Art FIG. 3 is a sectional view showing the structure of a mold for manufacturing a conventional hollow resin-sealed semiconductor pressure sensor (hereinafter referred to as a pressure sensor). In the figure, 1 is an insert including a semiconductor element for sensing pressure, 2 is a pressure sensing section formed on the upper surface of the semiconductor element 1 and directly in contact with the atmosphere, 3 is a lead for making contact between the insert 1 and an external circuit, 4
Is a wire connecting the insert 1 and the lead 3, and 5 is a resin for sealing the entire insert. The resin 5 is filled in a space formed by the upper mold 6 and the lower mold 7 for molding.
Reference numeral 8 denotes an upper pin that forms a hollow portion for bringing the pressure sensing unit 2 into direct contact with the atmosphere, 9 denotes a lower pin that regulates downward displacement of the insert 1, and these pins 8 and 9 are upper and lower molds 6, respectively. 7 is fixed.
【０００３】つぎに動作について説明する。インサート
１およびリード３を下金型７にセットし、上金型６で型
締めし、樹脂５を注入してトランスファ成形する。その
際、インサート１は上ピン８と下ピン９とによってクラ
ンプされる。成形後、圧力感知部２の上面は上ピン８に
よって樹脂の注入が妨げられるため中空となる。また下
ピン９によってインサート１の下方向への移動が規制さ
れるため、注入時の樹脂５の圧力によって、インサート
１が下方向に移動することによって生じる中空部の成形
不良を防ぐことができる。Next, the operation will be described. The insert 1 and the lead 3 are set in a lower mold 7, clamped by an upper mold 6, and injected with a resin 5 to perform transfer molding. At that time, the insert 1 is clamped by the upper pin 8 and the lower pin 9. After the molding, the upper surface of the pressure sensing portion 2 becomes hollow because injection of the resin is prevented by the upper pin 8. In addition, since the downward movement of the insert 1 is regulated by the lower pin 9, it is possible to prevent the molding failure of the hollow portion caused by the downward movement of the insert 1 due to the pressure of the resin 5 at the time of injection.
【０００４】[0004]
【発明が解決しようとする課題】しかるに、上記した従
来の圧力センサ製造用金型においては、型締めの際、イ
ンサートの高さ、方向の寸法がばらつくと上ピンと下ピ
ンとのクリアランスが一定のため、インサートを破壊し
たり、樹脂のもれによって成形不良を生じる等の問題が
発生する。本発明は上記した従来の問題点に鑑みてなさ
れたものであり、その目的とするところは、成形時に不
良が生じない高歩留の圧力センサを得ることにある。However, in the above-described conventional mold for manufacturing a pressure sensor, when the height and the direction of the insert vary during mold clamping, the clearance between the upper pin and the lower pin is constant. In addition, problems such as breakage of the insert and molding failure due to leakage of the resin occur. The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a high-yield pressure sensor that does not cause a defect during molding.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る圧力センサ製造用金型は、全体を樹脂
で封止しパッケージ上面に半導体素子と大気を直接接触
する貫通穴を設けた圧力センサを製造する金型であっ
て、インサートの上下クランプ部にブロックを配設し、
このブロックの弾性力によってインサートをクランプし
たものである。In order to achieve this object, a mold for manufacturing a pressure sensor according to the present invention is provided. A mold for manufacturing the provided pressure sensor, wherein a block is disposed in the upper and lower clamp portions of the insert,
The insert is clamped by the elastic force of the block.
【０００６】[0006]
【作用】本発明においては、インサートブロック形状を
有する上、下ピンはインサートを上下の金型にて型締め
する際、インサートの高さ方向のばらつきを上、下ピン
の弾性ひずみによって吸収する。In the present invention, the upper and lower pins having an insert block shape absorb variations in the height direction of the insert by elastic strain of the upper and lower pins when the insert is clamped by the upper and lower molds.
【０００７】[0007]
【実施例】以下、本発明の一実施例を図面にもとづいて
説明する。図１において、従来技術と同一の符号を付し
たものは同一の構成を示すものであり、詳細な説明は省
略する。本発明の特徴とするところは、インサート１を
クランプする上、下ピン１０、１１をインサートブロッ
ク形状とした点にある。このような構成とすることによ
り、インサート１およびリード３を上金型６、下金型７
によって型締めする際、インサート１は上、下ピン１
０、１１によって挟み込まれ、このとき上、下ピン１
０、１１は弾性ひずみを生じ、その弾性力によってイン
サート１をクランプする。したがって、あらかじめ上下
ピン１０、１１との間隔をインサート１の高さ方向のば
らつきを吸収可能な寸法に設定することにより、インサ
ート１の破壊あるいはクランプ不良による成形不良を防
止できることとなる。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, components denoted by the same reference numerals as those in the related art indicate the same configuration, and a detailed description thereof will be omitted. The feature of the present invention resides in that the insert 1 is clamped and the lower pins 10 and 11 are formed in an insert block shape. With such a configuration, the insert 1 and the lead 3 are connected to the upper mold 6 and the lower mold 7.
When the mold is clamped by the insert 1, the upper and lower pins 1
0, 11 and the upper and lower pins 1
Elastic strains 0 and 11 cause the insert 1 to be clamped by the elastic force. Therefore, by setting the distance between the upper and lower pins 10 and 11 to a dimension capable of absorbing variations in the height direction of the insert 1, it is possible to prevent molding failure due to breakage of the insert 1 or defective clamping.
【０００８】上記した第１の実施例では上下ピンとして
一体ピンを用いたが、これに限定されることなく図２に
示すようにピン１２とスプリング１３とを組み合わせた
ものでもよいことは勿論であり、要はインサート１をク
ランプする際にインサート１の高さ方向のばらつきを吸
収できる構造であればよい。In the first embodiment described above, the integral pins are used as the upper and lower pins. However, the present invention is not limited to this, and it is a matter of course that the pins 12 and the springs 13 may be combined as shown in FIG. In short, any structure that can absorb variations in the height direction of the insert 1 when clamping the insert 1 may be used.
【０００９】[0009]
【発明の効果】以上説明したように、本発明によれば、
圧力センサ製造用金型の上、下ピンをインサートブロッ
ク形状とし、ブロックの弾性力によりインサートをクラ
ンプする構造としたので、上下金型による型締め時にお
けるインサートの高さ方向のばらつきに起因したインサ
ート破壊あるいは中空部成形不良を防止でき、この結果
高品質ならびに高歩留の圧力センサを得ることができる
効果がある。As described above, according to the present invention,
The upper and lower pins of the pressure sensor manufacturing mold are in the form of an insert block, and the insert is clamped by the elasticity of the block. Destruction or defective molding of the hollow portion can be prevented, and as a result, a pressure sensor having high quality and high yield can be obtained.
【図１】本発明の第１の実施例を示す中空型樹脂封止半
導体圧力センサ製造用金型の断面図である。FIG. 1 is a sectional view of a mold for manufacturing a hollow resin-sealed semiconductor pressure sensor according to a first embodiment of the present invention.
【図２】本発明の第２の実施例を示す中空型樹脂封止半
導体圧力センサ製造用金型の断面図である。FIG. 2 is a sectional view of a mold for manufacturing a hollow-type resin-sealed semiconductor pressure sensor according to a second embodiment of the present invention.
【図３】従来の中空型樹脂封止半導体圧力センサ製造用
金型の断面図である。FIG. 3 is a sectional view of a conventional mold for manufacturing a hollow resin-sealed semiconductor pressure sensor.
１ インサート ２ 圧力感知部 ５ 樹脂 ６ 上金型 ７ 下金型 １０ 上ピン １１ 下ピン DESCRIPTION OF SYMBOLS 1 Insert 2 Pressure sensing part 5 Resin 6 Upper mold 7 Lower mold 10 Upper pin 11 Lower pin
Claims (1)
導体素子と大気を直接接触する貫通穴を設けた中空型樹
脂封止半導体圧力センサを製造する金型において、イン
サートの上下クランプ部にブロックを配設し、このブロ
ックの弾性力によってインサートをクランプしたことを
特徴とする中空型樹脂封止半導体圧力センサ製造用金型1. A mold for manufacturing a hollow-type resin-sealed semiconductor pressure sensor having a through hole for directly sealing a semiconductor element and the atmosphere on the upper surface of a package and blocking the insert with upper and lower clamp portions. And a mold for manufacturing a hollow resin-sealed semiconductor pressure sensor, wherein the insert is clamped by the elastic force of the block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3127379A JP2705361B2 (en) | 1991-05-30 | 1991-05-30 | Mold for manufacturing hollow type resin-sealed semiconductor pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3127379A JP2705361B2 (en) | 1991-05-30 | 1991-05-30 | Mold for manufacturing hollow type resin-sealed semiconductor pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04352435A JPH04352435A (en) | 1992-12-07 |
| JP2705361B2 true JP2705361B2 (en) | 1998-01-28 |
Family
ID=14958534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3127379A Expired - Lifetime JP2705361B2 (en) | 1991-05-30 | 1991-05-30 | Mold for manufacturing hollow type resin-sealed semiconductor pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2705361B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2716834B1 (en) * | 1994-03-02 | 1996-04-26 | Sagep | Device for coating a sensor. |
| JP3005461B2 (en) * | 1995-11-24 | 2000-01-31 | 日本電気株式会社 | Electrostatic chuck |
| DE19724025A1 (en) * | 1997-06-06 | 1998-12-10 | Siemens Ag | Pressure sensor component and manufacturing method |
| US7060216B2 (en) * | 2001-05-11 | 2006-06-13 | Melexis, Nv | Tire pressure sensors and methods of making the same |
| US6762077B2 (en) | 2001-05-11 | 2004-07-13 | Melexis Nv | Integrated sensor packages and methods of making the same |
| US6860731B2 (en) * | 2001-07-09 | 2005-03-01 | Asm Technology Singapore Pte Ltd. | Mold for encapsulating a semiconductor chip |
| NL1019042C2 (en) | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Method for encapsulating a chip and / or other object. |
| DE102012222679A1 (en) * | 2012-12-10 | 2014-06-12 | Robert Bosch Gmbh | Method for producing a switching module and an associated grid module and an associated grid module and corresponding electronic module |
| US9269597B2 (en) * | 2013-01-23 | 2016-02-23 | Microchip Technology Incorporated | Open cavity plastic package |
| NL2013191B1 (en) * | 2014-07-15 | 2016-07-14 | Sencio B V | Integrated circuit package moulding method and mould. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138845A (en) * | 1979-04-17 | 1980-10-30 | Citizen Watch Co Ltd | Method of fabricating semiconductor device |
| JPH01241831A (en) * | 1988-03-23 | 1989-09-26 | Nec Corp | Resin-sealing method for semiconductor integrated circuit device |
-
1991
- 1991-05-30 JP JP3127379A patent/JP2705361B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04352435A (en) | 1992-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100196601B1 (en) | Method of encapsulating a semiconductor element in resin and mold used for resin sealing | |
| JP2705361B2 (en) | Mold for manufacturing hollow type resin-sealed semiconductor pressure sensor | |
| KR100222349B1 (en) | Semiconductor chip packaging | |
| US4791472A (en) | Lead frame and semiconductor device using the same | |
| JPH04249348A (en) | Resin sealed semiconductor device and manufacture thereof | |
| JPH11111746A (en) | Method and device for manufacturing semiconductor device | |
| JP2555497B2 (en) | Hollow resin-sealed semiconductor pressure sensor | |
| JPS62115834A (en) | Semiconductor sealing device | |
| JPH04313036A (en) | Hollow-type resin sealed semiconductor pressure sensor | |
| JPH04317363A (en) | Resin sealed semiconductor device without die pad and its manufacturing method | |
| JP2973506B2 (en) | Method of manufacturing resin-encapsulated semiconductor device | |
| JPH0821667B2 (en) | Lead frame | |
| JPH06196609A (en) | Lead frame and semiconductor device using same | |
| JPH0653266A (en) | Semiconductor device | |
| JPH0653264A (en) | Manufacture of semiconductor device | |
| KR0163872B1 (en) | Packing structure having bond wire error prevention blocking lead | |
| KR200245728Y1 (en) | Lead Frames for Semiconductor Packages | |
| KR0156335B1 (en) | A semiconductor chip package using a tie bar | |
| JP2936679B2 (en) | Manufacturing method of resin-sealed semiconductor device and sealing mold | |
| JPH05326587A (en) | Method and device for sealing resin-sealed-type semiconductor device | |
| KR0182505B1 (en) | High heat release package having heat sink for protecting bonding wire | |
| JPH0590315A (en) | Resin molding die | |
| KR20010053792A (en) | lead-frame in manucture for semiconductor package | |
| JPH0653362A (en) | Semiconductor device and manufacture thereof | |
| JPH039538A (en) | Resin seal metal mold for semiconductor device |