EP2625713A1 - Electronic module and method for producing same - Google Patents

Electronic module and method for producing same

Info

Publication number
EP2625713A1
EP2625713A1 EP11761075.8A EP11761075A EP2625713A1 EP 2625713 A1 EP2625713 A1 EP 2625713A1 EP 11761075 A EP11761075 A EP 11761075A EP 2625713 A1 EP2625713 A1 EP 2625713A1
Authority
EP
European Patent Office
Prior art keywords
circuit carrier
spring device
electronic assembly
mold
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11761075.8A
Other languages
German (de)
French (fr)
Other versions
EP2625713B1 (en
Inventor
Matthias Keil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2625713A1 publication Critical patent/EP2625713A1/en
Application granted granted Critical
Publication of EP2625713B1 publication Critical patent/EP2625713B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Definitions

  • the present invention relates to an electronic module, in particular a power electronics, and a method for producing the electronic module.
  • the electronic modules are provided as Mold modules. These mold modules can have a surface which is exposed on one side and not surrounded by the mold mass, so-called exposed pads, via which a dissipation of heat can take place. Usually these are
  • the electronic module according to the invention with the features of claim 1 has the advantage that the electronic module has two mutually parallel outer side surfaces of circuit carriers for heat dissipation.
  • the electronic assembly according to the invention can be provided very simply and inexpensively.
  • the electronic assembly comprises a mold body and a first and second circuit carrier, wherein the circuit carriers each having an inner side surface and an outer side surface.
  • the module can be connected via the
  • Outer exposed outside surfaces release heat directly to the outside.
  • the outer side surfaces of the circuit carrier are arranged on opposite sides of the electronic assembly, so that the heat from the electronic assembly into each other by 180 °
  • the spring device may be directly in contact with the inner side surfaces or is arranged on the inner side surfaces of the electronic components or the like.
  • the spring device has in particular the task, the two circuit carrier during the mold
  • the two circuit carriers and the spring device are provided as an integral component.
  • the two circuit carriers and the spring device are provided as a leadframe, wherein the leadframe is bent over in such a way that the two circuit carriers and the spring device are formed.
  • the spring device for example, by repeatedly bending the
  • Leadframes are obtained, so that a resilient area is obtained.
  • a second, separate spring device is provided.
  • the circuit carrier can be resiliently supported at two different positions, in particular at opposite end regions.
  • the two circuit carriers have a common electrical
  • the electronic module comprises a first and a second circuit carrier and a spring device, which are each provided as separate components.
  • the spring device preferably comprises at least one separate spring element which determines the positions of the two separate circuit carriers during the molding process. More preferably, the two separate
  • Circuit substrate each have separate electrical connection terminals.
  • two or four separate spring elements are provided.
  • the spring device additionally comprises an electrically conductive function.
  • the spring device in addition to the spring property on another property, so that, for example, electrical connections from the first to the second
  • Circuit carrier can be realized via the spring device.
  • the inventive method for producing the electronic assembly with two circuit carriers and a mold body comprises the steps of arranging the two circuit carriers in a Mold tool, wherein a
  • Spring device is arranged between the first and second circuit carrier.
  • the spring device is arranged such that the
  • the spring device may be formed integrally with the two circuit carriers, or the spring device is provided as a separate component. Also, in addition to the integral spring device, a further separate spring device can be provided. The spring force of the spring device is chosen such that the
  • Used spring device of an electrically conductive material which is connected to the circuit carriers in an electrically conductive manner prior to insertion into the mold mold.
  • a connection can be made for example by means of soldering or bonding or welding or the use of conductive adhesive.
  • Figure 1 is a schematic sectional view of an electronic circuit
  • Figure 2 is a schematic sectional view of the electronic
  • Figure 3 is a schematic sectional view of an electronic
  • the electronic module 1 comprises a
  • Mold body 2 a first circuit carrier 3 and a second circuit carrier 3
  • the first circuit carrier 3 has a first electrical connection terminal 8 and the second circuit carrier 4 has a second electrical connection terminal 9. It should be noted that each of the circuit carriers may also have a plurality of electrical connection terminals.
  • the two circuit carriers 3, 4 are provided as separate components. Both circuit carriers 3, 4 are substantially sheet-like components with an inner side surface 3a and an outer side surface 3b or an inner side surface 4a and an outer side surface 4b.
  • Inner side surfaces 3a, 4a, electronic components 5 are arranged in a known manner.
  • a spring device with a first spring element 6 and a second spring element 7 is provided between the first circuit carrier 3 and the second circuit carrier 4.
  • Spring elements 6, 7 are supported directly on the inner side surfaces 3a, 4a of the circuit carrier 3, 4.
  • the two spring elements 6, 7 may be made of an electrically conductive material and also an electrical
  • Circuit carriers 3, 4 may be arranged.
  • FIG. 2 shows a section through a mold tool 20 with a first tool half 21 and a second tool half 22.
  • the first and second spring elements 6, 7 are located between the first and second circuit carriers 3, 4 arranged. hereby an outer side surface 3b of the first circuit substrate is pressed against a first wall surface 21 a of the first mold half.
  • the outer side surface 4b of the second circuit substrate 4 is pressed against a second wall surface 22a of the second tool half 22.
  • Wall surfaces 21 a, 22 a are arranged parallel to each other.
  • the two outer side surfaces 3b, 4b of the circuit carrier 3, 4 are arranged parallel to each other.
  • the circuit carriers 3, 4 are already fully equipped, so that in a next step, a mold mass in an inner cavity 23 in the mold tool 20 can be introduced.
  • the spring elements 6, 7 hold the two circuit carriers 3, 4 against the wall surfaces 21 a, 22 a, so that in the finished component, as shown in Figure 1, the two outer side surfaces 3 b, 4 b are arranged exposed to the outside.
  • the two outer side surfaces 3b, 4b can be used for heat dissipation of the electronic module 1.
  • the heat can thereby be dissipated in directions A (opposite to each other by 180.degree.
  • On the first outer side surface 3b) and B on the second outer side surface 4b).
  • the parallelism of the mold tool 20 is used to produce electronic assemblies with the outside free circuit carrier surfaces. This allows electronic modules 1 with large
  • Cooling surfaces are produced in a very simple and inexpensive way.
  • two spring elements are provided. It should be noted, however, that a single or even a plurality of spring elements, for example four spring elements, which are arranged essentially at corner regions of the circuit carriers 3, 4 can be used. Also can be used instead of the coil springs shown, other spring elements.
  • Circuit carrier used but the circuit carrier are represented by a common component 12, which also integrates the spring device.
  • the common component 12 is a leadframe which, starting from a common electrical
  • Connection terminal 18 or more electrical connection terminals
  • an electronic package 1 is again provided in which the outer side surfaces 13b and 14b of the circuit carriers 13, 14 are exposed to the outside and as heat emitting surfaces, as indicated by the arrows A and B.
  • the inner side surfaces of the first and second circuit carriers 13, 14 are designated by reference numerals 13a and 14a.
  • the common electrical connection terminal 18 is led out of the mold tool 20, so that then in the cavity 23 as in the first embodiment, a mold mass can be introduced to the
  • Mold body 2 to produce.
  • the mold body 2 encloses both the integrated spring device 16 and the separate spring element 6.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Finishing Walls (AREA)

Abstract

The invention relates to an electronic module and to a method for producing same, comprising a mould body (2), a first circuit carrier (3; 13) having a first inner face (3a; 13a), on which electronic components (5) are arranged, and a first outer face (3b; 13b), a second circuit carrier (4; 14) having a second inner face (4a; 14a), on which electronic components (5) are arranged, and a second outer face (4b; 14b), and at least one spring device (6, 7; 16) which connects the inner faces (3a, 14a; 13a, 14a), or surfaces of electronic components (5) arranged thereon, of the first and second circuit carriers (3, 4; 13, 14), wherein the first and second outer faces (3a, 4a; 13a, 14a) are exposed towards the outside of the electronic module in order to emit heat directly to the outside, and wherein the first and second outer faces (3a, 4a; 13a, 14a) are parallel to each other.

Description

Beschreibung  description
Titel title
Elektronische Baugruppe sowie Verfahren zu deren Herstellung Stand der Technik  Electronic assembly and method for its production. State of the art
Die vorliegende Erfindung betrifft eine elektronische Baugruppe, insbesondere eine Leistungselektronik, sowie ein Verfahren zur Herstellung der elektronischen Baugruppe. The present invention relates to an electronic module, in particular a power electronics, and a method for producing the electronic module.
Elektronische Baugruppen werden im Stand der Technik vielfältig verwendet. Hierbei werden die elektronischen Baugruppen als Mold-Module vorgesehen. Diese Mold-Module können eine einseitig freiliegende, von der Mold-Masse nicht umschlossene Fläche aufweisen, sogenannte Exposed-Pads, über welche eine Ableitung von Wärme erfolgen kann. Üblicherweise werden diese Electronic assemblies are widely used in the art. Here, the electronic modules are provided as Mold modules. These mold modules can have a surface which is exposed on one side and not surrounded by the mold mass, so-called exposed pads, via which a dissipation of heat can take place. Usually these are
wärmeableitenden, nach außen gerichteten Flächen durch Abfräsen oder Abschleifen der Oberflächen der Mold-Module erzeugt. Dies ist jedoch relativ aufwendig und zeitintensiv. Ferner kann es bei derartigen spanabhebenden Vorgängen zu Beschädigungen der elektronischen Baugruppe kommen. heat dissipating, outwardly facing surfaces produced by milling or grinding the surfaces of the mold modules. However, this is relatively expensive and time-consuming. Furthermore, damage to the electronic assembly may occur in such machining processes.
Offenbarung der Erfindung Disclosure of the invention
Die erfindungsgemäße elektronische Baugruppe mit den Merkmalen des Anspruchs 1 weist demgegenüber den Vorteil auf, dass die elektronische Baugruppe zwei zueinander parallele Außenseitenflächen von Schaltungsträgern zur Wärmeabgabe aufweist. Dabei kann die erfindungsgemäße elektronische Baugruppe sehr einfach und kostengünstig bereitgestellt werden. Insbesondere ist erfindungsgemäß nach einem Mold-Vorgang keine weitere Nachbearbeitung der Baugruppe notwendig, so dass keine Gefahr besteht, dass in einer nachfolgenden Bearbeitung eine unerwünschte Beschädigung der Baugruppe auftritt. Darüber hinaus können erfindungsgemäß definierte, die Wärme sehr gut ableitende, Flächen bereitgestellt werden, welche zur Außenseite der Baugruppe freiliegen. Dies wird erfindungsgemäß dadurch erreicht, dass die elektronische Baugruppe einen Mold-Körper sowie einen ersten und zweiten Schaltungsträger umfasst, wobei die Schaltungsträger jeweils eine Innenseitenfläche und eine Außenseitenfläche aufweisen. Die Baugruppe kann dabei über die zur In contrast, the electronic module according to the invention with the features of claim 1 has the advantage that the electronic module has two mutually parallel outer side surfaces of circuit carriers for heat dissipation. In this case, the electronic assembly according to the invention can be provided very simply and inexpensively. In particular, according to the invention, after a mold process, no further post-processing of the assembly is necessary, so that there is no danger that undesired damage to the assembly will occur in subsequent processing. In addition, according to the invention defined, the heat very well dissipative, surfaces are exposed, which are exposed to the outside of the assembly. This is inventively achieved in that the electronic assembly comprises a mold body and a first and second circuit carrier, wherein the circuit carriers each having an inner side surface and an outer side surface. The module can be connected via the
Außenseite freiliegenden Außenseitenflächen Wärme direkt zur Außenseite abgeben. Die Außenseitenflächen der Schaltungsträger sind dabei an einander gegenüberliegenden Seiten der elektronischen Baugruppe angeordnet, so dass die Wärme von der elektronischen Baugruppe in einander um 180°  Outer exposed outside surfaces release heat directly to the outside. The outer side surfaces of the circuit carrier are arranged on opposite sides of the electronic assembly, so that the heat from the electronic assembly into each other by 180 °
entgegengesetzte Richtungen abgeleitet werden kann. Ferner ist zwischen denopposite directions can be derived. Furthermore, between the
Innenseitenflächen eine die beiden Schaltungsträger verbindende Inner side surfaces connecting one of the two circuit carriers
Federvorrichtung vorgesehen. Die Federvorrichtung kann dabei direkt mit den Innenseitenflächen in Kontakt sein oder ist an den Innenseitenflächen der elektronischen Bauteile oder dgl. angeordnet. Die Federvorrichtung hat dabei insbesondere die Aufgabe, die beiden Schaltungsträger während des Mold-Spring device provided. The spring device may be directly in contact with the inner side surfaces or is arranged on the inner side surfaces of the electronic components or the like. The spring device has in particular the task, the two circuit carrier during the mold
Vorgangs in einer definierten, zueinander parallelen Position zu halten. Alternativ kann die Federvorrichtung auch an Oberflächen von Bauteilen, welche an den Innenseitenflächen angeordnet sind, angreifen. Die Unteransprüche zeigen bevorzugte Weiterbildungen der Erfindung. To keep operation in a defined, mutually parallel position. Alternatively, the spring device also on surfaces of components which are arranged on the inner side surfaces, attack. The dependent claims show preferred developments of the invention.
Vorzugsweise sind die beiden Schaltungsträger und die Federvorrichtung als ein integrales Bauteil vorgesehen. Hierdurch kann die Anzahl der Einzelteile reduziert werden und eine Herstellung ist besonders kostengünstig möglich. Besonders bevorzugt sind die beiden Schaltungsträger und die Federvorrichtung als Leadframe vorgesehen, wobei das Leadframe derart umgebogen ist, dass die beiden Schaltungsträger sowie die Federvorrichtung gebildet werden. Die Federvorrichtung kann beispielsweise durch mehrfaches Umbiegen des Preferably, the two circuit carriers and the spring device are provided as an integral component. As a result, the number of items can be reduced and a production is particularly cost possible. Particularly preferably, the two circuit carriers and the spring device are provided as a leadframe, wherein the leadframe is bent over in such a way that the two circuit carriers and the spring device are formed. The spring device, for example, by repeatedly bending the
Leadframes erhalten werden, so dass ein federnder Bereich erhalten wird. Leadframes are obtained, so that a resilient area is obtained.
Weiter bevorzugt ist zusätzlich zu der integrierten Federvorrichtung noch eine zweite, separate Federvorrichtung vorgesehen. Hierdurch ist es möglich, dass die Schaltungsträger an zwei verschiedenen Positionen, insbesondere an einander gegenüberliegenden Endbereichen, federnd abgestützt werden können. Gemäß einer weiteren bevorzugten Ausgestaltung der Erfindung haben die beiden Schaltungsträger einen gemeinsamen elektrischen Further preferably, in addition to the integrated spring device, a second, separate spring device is provided. This makes it possible that the circuit carrier can be resiliently supported at two different positions, in particular at opposite end regions. According to a further preferred embodiment of the invention, the two circuit carriers have a common electrical
Verbindungsanschluss. Gemäß einer alternativen Ausgestaltung der vorliegenden Erfindung umfasst die elektronische Baugruppe einen ersten und einen zweiten Schaltungsträger sowie eine Federvorrichtung, welche jeweils als separate Bauteile vorgesehen sind. Hierdurch ist zwar eine erhöhte Bauteilezahl notwendig, allerdings kann die Herstellung der Bauteile vereinfacht werden, da die Federvorrichtung nicht als integraler Bestandteil der Schaltungsträger hergestellt werden muss. Bevorzugt umfasst die Federvorrichtung hierbei wenigstens ein separates Federelement, welches die Positionen der beiden separaten Schaltungsträger beim Mold- Vorgang bestimmt. Weiter bevorzugt weisen die beiden separaten Connection port. According to an alternative embodiment of the present invention, the electronic module comprises a first and a second circuit carrier and a spring device, which are each provided as separate components. Although this requires an increased number of components, the manufacture of the components can be simplified since the spring device does not have to be manufactured as an integral part of the circuit carrier. In this case, the spring device preferably comprises at least one separate spring element which determines the positions of the two separate circuit carriers during the molding process. More preferably, the two separate
Schaltungsträger jeweils separate elektrische Verbindungsanschlüsse auf. Circuit substrate each have separate electrical connection terminals.
Vorzugsweise sind zwei oder vier separate Federelemente vorgesehen. Preferably, two or four separate spring elements are provided.
Gemäß einer bevorzugten Ausgestaltung der vorliegenden Erfindung umfasst die Federvorrichtung zusätzlich eine elektrisch leitende Funktion. Somit weist die Federvorrichtung neben der Federeigenschaft noch eine weitere Eigenschaft auf, so dass beispielsweise elektrische Verbindungen vom ersten zum zweitenAccording to a preferred embodiment of the present invention, the spring device additionally comprises an electrically conductive function. Thus, the spring device in addition to the spring property on another property, so that, for example, electrical connections from the first to the second
Schaltungsträger über die Federvorrichtung realisiert werden können. Circuit carrier can be realized via the spring device.
Das erfindungsgemäße Verfahren zur Herstellung der elektronischen Baugruppe mit zwei Schaltungsträgern und einem Mold-Körper umfasst die Schritte des Anordnens der beiden Schaltungsträger in einem Mold-Werkzeug, wobei eineThe inventive method for producing the electronic assembly with two circuit carriers and a mold body comprises the steps of arranging the two circuit carriers in a Mold tool, wherein a
Federvorrichtung zwischen dem ersten und zweiten Schaltungsträger angeordnet ist. Hierbei ist die Federvorrichtung derart angeordnet, dass die Spring device is arranged between the first and second circuit carrier. Here, the spring device is arranged such that the
Außenseitenflächen der beiden Schaltungsträger gegen zwei zueinander parallele Wandbereiche des Mold-Werkzeugs gedrückt werden. Mit anderen Worten werden die beiden Schaltungsträger durch die Federvorrichtung derart imOuter side surfaces of the two circuit carrier are pressed against two mutually parallel wall portions of the mold tool. In other words, the two circuit carrier by the spring device in such
Mold-Werkzeug in Position gebracht, dass die Außenseitenflächen gegen die einander gegenüberliegenden, parallelen Wandflächen des Mold-Werkzeugs gedrückt werden. Hierdurch kann sichergestellt werden, dass im anschließenden Mold-Vorgang, bei dem eine Mold-Masse in das Mold-Werkzeug zugeführt wird, die beiden Außenseiten, die an den Randbereichen des Mold-Werkzeugs anliegen, in der hergestellten elektronischen Baugruppe frei zur Außenseite liegen. Dadurch sind sie als Wärmeabgabenflächen ausgebildet, ohne dass eine zusätzliche nachfolgende Bearbeitung der elektronischen Baugruppe notwendig ist. Hierdurch kann die erfindungsgemäße elektronische Baugruppe sehr einfach und kostengünstig hergestellt werden. Die Federvorrichtung kann dabei integral mit den beiden Schaltungsträgern gebildet sein, oder die Federvorrichtung ist als separates Bauteil vorgesehen. Auch kann zusätzlich neben der integralen Federvorrichtung eine weitere separate Federvorrichtung vorgesehen werden. Die Federkraft der Federvorrichtung wird dabei derart gewählt, dass die Mold tool positioned so that the outer side surfaces are pressed against the opposite, parallel wall surfaces of the Mold tool. In this way, it can be ensured that in the subsequent mold process, in which a mold mass is fed into the mold tool, the two outer sides which bear against the edge regions of the mold tool in the produced electronic assembly are exposed to the outside lie. As a result, they are designed as heat-emitting surfaces, without any additional subsequent processing of the electronic assembly is necessary. As a result, the electronic assembly according to the invention can be produced very simply and inexpensively. The spring device may be formed integrally with the two circuit carriers, or the spring device is provided as a separate component. Also, in addition to the integral spring device, a further separate spring device can be provided. The spring force of the spring device is chosen such that the
Außenseitenflächen der Schaltungsträger während des Mold-Vorgangs sicher gegen die Wandbereiche des Mold-Werkzeugs gedrückt werden. Outer side surfaces of the circuit board during the molding process are pressed securely against the wall portions of the Mold tool.
Besonders bevorzugt wird beim erfindungsgemäßen Verfahren eine Particularly preferred in the method according to the invention is a
Federvorrichtung aus einem elektrisch leitenden Material verwendet, welche vor dem Einlegen in das Mold-Werkzeug in elektrisch leitender Weise mit den Schaltungsträgern verbunden wird. Ein Verbinden kann beispielsweise mittels Löten oder Bonden oder Schweißen oder einer Verwendung von Leitkleber erfolgen. Used spring device of an electrically conductive material, which is connected to the circuit carriers in an electrically conductive manner prior to insertion into the mold mold. A connection can be made for example by means of soldering or bonding or welding or the use of conductive adhesive.
Zeichnung drawing
Nachfolgend werden bevorzugte Ausführungsbeispiele der Erfindung unter Bezugnahme auf die begleitende Zeichnung im Detail beschrieben. In der Zeichnung ist: Figur 1 eine schematische Schnittansicht einer elektronischen Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings. In the drawing: Figure 1 is a schematic sectional view of an electronic
Baugruppe gemäß einem ersten Ausführungsbeispiel der Erfindung,  Assembly according to a first embodiment of the invention,
Figur 2 eine schematische Schnittansicht der elektronischen Figure 2 is a schematic sectional view of the electronic
Baugruppe von Figur 1 während des Herstellungsprozesses,  Assembly of Figure 1 during the manufacturing process,
Figur 3 eine schematische Schnittansicht einer elektronischen Figure 3 is a schematic sectional view of an electronic
Baugruppe gemäß einem zweiten Ausführungsbeispiel der Erfindung, und Figur 4 eine schematische Schnittansicht der elektronischen Assembly according to a second embodiment of the invention, and Figure 4 is a schematic sectional view of the electronic
Baugruppe von Figur 3 während des Herstellungsprozesses,  Assembly of Figure 3 during the manufacturing process,
Bevorzugte Ausführungsformen der Erfindung Preferred embodiments of the invention
Nachfolgend wird unter Bezugnahme auf die Figuren 1 und 2 eine elektronische Baugruppe 1 gemäß einem ersten bevorzugten Ausführungsbeispiel der Erfindung im Detail beschrieben. Wie aus Figur 1 ersichtlich ist, umfasst die elektronische Baugruppe 1 einenHereinafter, an electronic assembly 1 according to a first preferred embodiment of the invention will be described in detail with reference to Figures 1 and 2. As can be seen from FIG. 1, the electronic module 1 comprises a
Mold-Körper 2, einen ersten Schaltungsträger 3 und einen zweiten Mold body 2, a first circuit carrier 3 and a second
Schaltungsträger 4. Der erste Schaltungsträger 3 weist einen ersten elektrischen Verbindungsanschluss 8 auf und der zweite Schaltungsträger 4 weist einen zweiten elektrischen Verbindungsanschluss 9 auf. Es sei angemerkt, dass jeder der Schaltungsträger auch mehrere elektrische Verbindungsanschlüsse aufweisen kann. Die beiden Schaltungsträger 3, 4 sind als separate Bauteile vorgesehen. Beide Schaltungsträger 3, 4 sind im Wesentlichen flächenartige Bauteile mit einer Innenseitenfläche 3a und einer Außenseitenfläche 3b bzw. einer Innenseitenfläche 4a und einer Außenseitenfläche 4b. An den Circuit carrier 4. The first circuit carrier 3 has a first electrical connection terminal 8 and the second circuit carrier 4 has a second electrical connection terminal 9. It should be noted that each of the circuit carriers may also have a plurality of electrical connection terminals. The two circuit carriers 3, 4 are provided as separate components. Both circuit carriers 3, 4 are substantially sheet-like components with an inner side surface 3a and an outer side surface 3b or an inner side surface 4a and an outer side surface 4b. To the
Innenseitenflächen 3a, 4a sind in bekannter Weise elektronische Bauteile 5 angeordnet. Inner side surfaces 3a, 4a, electronic components 5 are arranged in a known manner.
Wie weiter aus Figur 1 ersichtlich ist, ist zwischen dem ersten Schaltungsträger 3 und dem zweiten Schaltungsträger 4 eine Federvorrichtung mit einem ersten Federelement 6 und einem zweiten Federelement 7 vorgesehen. Die beidenAs further apparent from FIG. 1, a spring device with a first spring element 6 and a second spring element 7 is provided between the first circuit carrier 3 and the second circuit carrier 4. The two
Federelemente 6, 7 stützen sich direkt an den Innenseitenflächen 3a, 4a der Schaltungsträger 3, 4 ab. Die beiden Federelemente 6, 7 können aus einem elektrisch leitenden Material hergestellt sein und auch eine elektrische Spring elements 6, 7 are supported directly on the inner side surfaces 3a, 4a of the circuit carrier 3, 4. The two spring elements 6, 7 may be made of an electrically conductive material and also an electrical
Verbindungsfunktion übernehmen. Alternativ oder zusätzlich könnte ein Take over connection function. Alternatively or additionally, could
Federelement zwischen den elektrischen Bauteilen 5 an den beiden Spring element between the electrical components 5 at the two
Schaltungsträgern 3, 4 angeordnet sein.  Circuit carriers 3, 4 may be arranged.
Figur 2 zeigt dabei einen Schnitt durch ein Mold-Werkzeug 20 mit einer ersten Werkzeugshälfte 21 und einer zweiten Werkzeughälfte 22. Wie aus Figur 2 ersichtlich ist, sind im Mold-Werkzeug 20 das erste und zweite Federelement 6, 7 zwischen dem ersten und zweiten Schaltungsträger 3, 4 angeordnet. Hierdurch wird eine Außenseitenfläche 3b des ersten Schaltungsträgers gegen eine erste Wandfläche 21 a der ersten Werkzeughälfte gedrückt. Gleichzeitig wird die Außenseitenfläche 4b des zweiten Schaltungsträgers 4 gegen eine zweite Wandfläche 22a der zweiten Werkzeughälfte 22 gedrückt. Die beiden FIG. 2 shows a section through a mold tool 20 with a first tool half 21 and a second tool half 22. As can be seen from FIG. 2, in the mold tool 20 the first and second spring elements 6, 7 are located between the first and second circuit carriers 3, 4 arranged. hereby an outer side surface 3b of the first circuit substrate is pressed against a first wall surface 21 a of the first mold half. At the same time, the outer side surface 4b of the second circuit substrate 4 is pressed against a second wall surface 22a of the second tool half 22. The two
Wandflächen 21 a, 22a sind dabei parallel zueinander angeordnet. Hierdurch werden auch die beiden Außenseitenflächen 3b, 4b der Schaltungsträger 3, 4 parallel zueinander angeordnet. Die Schaltungsträger 3, 4 sind dabei schon vollständig bestückt, so dass in einem nächsten Schritt eine Mold-Masse in einem inneren Hohlraum 23 im Mold-Werkzeug 20 eingeführt werden kann. Hierbei halten die Federelemente 6, 7 die beiden Schaltungsträger 3, 4 gegen die Wandflächen 21 a, 22a gedrückt, so dass im fertigen Bauteil, wie in Figur 1 gezeigt, die beiden Außenseitenflächen 3b, 4b freiliegend zur Außenseite angeordnet sind. Hierdurch können die beiden Außenseitenflächen 3b, 4b zur Wärmeabgabe der elektronischen Baugruppe 1 verwendet werden. Wie aus Figur 1 ersichtlich ist, kann dadurch die Wärme in zueinander um 180° entgegengesetzte Richtungen A (an der ersten Außenseitenfläche 3b) und B (an der zweiten Außenseitenfläche 4b) abgegeben werden. Wall surfaces 21 a, 22 a are arranged parallel to each other. As a result, the two outer side surfaces 3b, 4b of the circuit carrier 3, 4 are arranged parallel to each other. The circuit carriers 3, 4 are already fully equipped, so that in a next step, a mold mass in an inner cavity 23 in the mold tool 20 can be introduced. Here, the spring elements 6, 7 hold the two circuit carriers 3, 4 against the wall surfaces 21 a, 22 a, so that in the finished component, as shown in Figure 1, the two outer side surfaces 3 b, 4 b are arranged exposed to the outside. As a result, the two outer side surfaces 3b, 4b can be used for heat dissipation of the electronic module 1. As can be seen from FIG. 1, the heat can thereby be dissipated in directions A (opposite to each other by 180.degree. On the first outer side surface 3b) and B (on the second outer side surface 4b).
Hierdurch kann erfindungsgemäß ein sehr einfaches und kostengünstiges Verfahren zur Herstellung der elektronischen Baugruppe 1 mit zwei zueinander parallelen, außen freiliegenden Wärmeabgabeflächen erhalten werden. Die Federelemente 6, 7 werden dabei vollständig von der Mold-Masse umschlossen. Hierdurch weisen die Federelemente 6, 7 in der fertigen elektronischen In this way, according to the invention, a very simple and cost-effective method for producing the electronic assembly 1 with two mutually parallel, externally exposed heat release surfaces can be obtained. The spring elements 6, 7 are completely enclosed by the mold mass. As a result, the spring elements 6, 7 in the finished electronic
Baugruppe keine Federeigenschaft mehr auf, da der erstarrte Mold-Körper 2 die Expansion der Federelemente 6, 7 unterbindet. Gegebenenfalls können dieAssembly no spring property more, since the solidified mold body 2, the expansion of the spring elements 6, 7 prevents. If necessary, the
Federelemente 6, 7 noch elektrisch leitende Funktionen übernehmen. Spring elements 6, 7 still take over electrically conductive functions.
Erfindungsgemäß wird somit die Parallelität des Mold-Werkzeugs 20 verwendet, um elektronische Baugruppen mit zur Außenseite freien Schaltungsträgerflächen zu erzeugen. Hierdurch können elektronische Baugruppen 1 mit großen According to the invention, therefore, the parallelism of the mold tool 20 is used to produce electronic assemblies with the outside free circuit carrier surfaces. This allows electronic modules 1 with large
Kühlflächen auf sehr einfache und kostengünstige Art hergestellt werden.  Cooling surfaces are produced in a very simple and inexpensive way.
In diesem Ausführungsbeispiel sind zwei Federelemente vorgesehen. Es sei jedoch angemerkt, dass auch ein einzelner oder auch mehrere Federelemente, beispielsweise vier Federelemente, welche im Wesentlichen an Eckbereichen der Schaltungsträger 3, 4 angeordnet sind, verwendet werden können. Auch können anstatt der dargestellten Spiralfedern auch andere Federelemente verwendet werden. In this embodiment, two spring elements are provided. It should be noted, however, that a single or even a plurality of spring elements, for example four spring elements, which are arranged essentially at corner regions of the circuit carriers 3, 4 can be used. Also can be used instead of the coil springs shown, other spring elements.
Nachfolgend wird unter Bezugnahme auf die Figuren 3 und 4 eine elektronische Baugruppe 1 gemäß einem zweiten Ausführungsbeispiel der Erfindung im Detail beschrieben, wobei gleiche bzw. funktional gleiche Teile mit den gleichen Bezugszeichen wie im ersten Ausführungsbeispiel bezeichnet sind. An electronic module 1 according to a second embodiment of the invention will be described in detail below with reference to Figures 3 and 4, wherein the same or functionally identical parts are denoted by the same reference numerals as in the first embodiment.
Wie aus Figur 3 ersichtlich ist, werden im Unterschied zum ersten As can be seen from FIG. 3, in contrast to the first one
Ausführungsbeispiel beim zweiten Ausführungsbeispiel nicht zwei separateEmbodiment in the second embodiment is not two separate
Schaltungsträger verwendet, sondern die Schaltungsträger werden durch ein gemeinsames Bauteil 12, welches auch die Federvorrichtung integriert, dargestellt. Wie aus Figur 3 ersichtlich, ist das gemeinsame Bauteil 12 ein Leadframe, welches ausgehend von einem gemeinsamen elektrischen Circuit carrier used, but the circuit carrier are represented by a common component 12, which also integrates the spring device. As can be seen from FIG. 3, the common component 12 is a leadframe which, starting from a common electrical
Verbindungsanschluss 18 oder mehreren elektrischen VerbindungsanschlüssenConnection terminal 18 or more electrical connection terminals
18 einen ersten Schaltungsträger 13, einen zweiten Schaltungsträger 14 und eine integrierte Federvorrichtung 16 aufweist. Die integrierte Federvorrichtung 16 wird dabei durch mehrmaliges Umbiegen des Leadframes erhalten und verbindet den ersten Schaltungsträger 13 mit dem zweiten Schaltungsträger 14. Weiter ist zusätzlich noch ein separates Federelement 6 vorgesehen. Es sei angemerkt, dass eine Ausführung auch ohne das separate Federelement 6 möglich ist, wobei die Federwirkung dann ausschließlich aus der Federvorrichtung 16 kommt. Insgesamt wird wieder eine elektronische Baugruppe 1 bereitgestellt, bei der die Außenseitenflächen 13b und 14b der Schaltungsträger 13, 14 zur Außenseite freiliegen und als Wärmeabgabeflächen, wie durch die Pfeile A und B 18 has a first circuit carrier 13, a second circuit carrier 14 and an integrated spring device 16. The integrated spring device 16 is obtained by repeatedly bending the leadframe and connects the first circuit carrier 13 to the second circuit carrier 14. Further, a separate spring element 6 is additionally provided. It should be noted that a design is possible without the separate spring element 6, wherein the spring action then comes exclusively from the spring device 16. Overall, an electronic package 1 is again provided in which the outer side surfaces 13b and 14b of the circuit carriers 13, 14 are exposed to the outside and as heat emitting surfaces, as indicated by the arrows A and B.
angedeutet, verwendet werden können. Die Innenseitenflächen des ersten und zweiten Schaltungsträgers 13, 14 sind mit dem Bezugszeichen 13a und 14a bezeichnet. Der gemeinsame elektrische Verbindungsanschluss 18 ist aus dem Mold-Werkzeug 20 herausgeführt, so dass dann in den Hohlraum 23 wie im ersten Ausführungsbeispiel eine Mold-Masse eingeführt werden kann, um denindicated, can be used. The inner side surfaces of the first and second circuit carriers 13, 14 are designated by reference numerals 13a and 14a. The common electrical connection terminal 18 is led out of the mold tool 20, so that then in the cavity 23 as in the first embodiment, a mold mass can be introduced to the
Mold-Körper 2 zu erzeugen. Hierbei umschließt der Mold-Körper 2 sowohl die integrierte Federvorrichtung 16 als auch das separate Federelement 6. Mold body 2 to produce. In this case, the mold body 2 encloses both the integrated spring device 16 and the separate spring element 6.
Ansonsten entspricht dieses Ausführungsbeispiel dem vorhergehenden Otherwise, this embodiment corresponds to the previous one
Ausführungsbeispiel, so dass auf die dort gegebene Beschreibung verwiesen werden kann. Embodiment, so that reference may be made to the description given there.

Claims

Ansprüche claims
1 . Elektronische Baugruppe, umfassend: 1 . Electronic assembly comprising:
- einen Mold-Körper (2),  a mold body (2),
einen ersten Schaltungsträger (3; 13) mit einer ersten  a first circuit carrier (3; 13) with a first
Innenseitenfläche (3a; 13a), an welcher elektronische Bauteile (5) angeordnet sind, und einer ersten Außenseitenfläche (3b; 13b), einen zweiten Schaltungsträger (4; 14) mit einer zweiten Innenseitenfläche (4a; 14a), an welcher elektronische Bauteile (5) angeordnet sind, und einer zweiten Außenseitenfläche (4b; 14b), und wenigstens eine die Innenseitenflächen (3a, 14a; 13a, 14a), oder Oberflächen daran angeordneter elektronischer Bauteile (5), des ersten und zweiten Schaltungsträgers (3, 4; 13, 14) verbindende Federvorrichtung (6, 7; 16),  Inner side surface (3a, 13a), on which electronic components (5) are arranged, and a first outer side surface (3b, 13b), a second circuit carrier (4, 14) with a second inner side surface (4a, 14a), on which electronic components ( 5), and a second outer side surface (4b; 14b), and at least one of the inner side surfaces (3a, 14a; 13a, 14a), or surfaces thereof disposed electronic components (5), the first and second circuit carriers (3, 4; 13, 14) connecting spring device (6, 7, 16),
wobei die erste und zweite Außenseitenfläche (3a, 4a; 13a, 14a) zur Außenseite der elektronischen Baugruppe freiliegen, um Wärme direkt zur Außenseite abzugeben, und  wherein the first and second outer side surfaces (3a, 4a, 13a, 14a) are exposed to the outside of the electronic package to release heat directly to the outside, and
wobei die erste und zweite Außenseitenfläche (3a, 4a; 13a, 14a) parallel zueinander sind.  wherein the first and second outer side surfaces (3a, 4a; 13a, 14a) are parallel to each other.
2. Elektronische Baugruppe nach Anspruch 1 , dadurch gekennzeichnet, dass der erste und zweite Schaltungsträger (13, 14) und die Federvorrichtung (16) ein integrales Bauteil (12) sind. 2. Electronic assembly according to claim 1, characterized in that the first and second circuit carrier (13, 14) and the spring device (16) are an integral component (12).
3. Elektronische Baugruppe nach Anspruch 2, dadurch gekennzeichnet, dass das integrale Bauteil (12) ein Leadframe ist. 3. Electronic assembly according to claim 2, characterized in that the integral component (12) is a leadframe.
4. Elektronische Baugruppe nach Anspruch 2 oder 3, ferner umfassend eine zusätzliche, separate Federvorrichtung. Elektronische Baugruppe nach einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, dass der erste und zweite Schaltungsträger (13, 14) einen gemeinsamen elektrischen Verbindungsanschluss (18) aufweisen. 4. Electronic assembly according to claim 2 or 3, further comprising an additional, separate spring device. Electronic assembly according to one of claims 2 to 4, characterized in that the first and second circuit carrier (13, 14) have a common electrical connection terminal (18).
Elektronische Baugruppe nach Anspruch 1 , dadurch gekennzeichnet, dass der erste Schaltungsträger (3), der zweite Schaltungsträger (4) und die Federvorrichtung (6, 7) separate Bauteile sind. Electronic assembly according to claim 1, characterized in that the first circuit carrier (3), the second circuit carrier (4) and the spring device (6, 7) are separate components.
Elektronische Baugruppe nach Anspruch 6, dadurch gekennzeichnet, dass die Federvorrichtung (6, 7) ein oder mehrere separate Federelemente, vorzugsweise zwei, besonders bevorzugt vier Federelemente, umfasst. Electronic assembly according to claim 6, characterized in that the spring device (6, 7) comprises one or more separate spring elements, preferably two, more preferably four spring elements.
Elektronische Baugruppe nach Anspruch 6 oder 7, dadurch Electronic assembly according to claim 6 or 7, characterized
gekennzeichnet, dass der erste Schaltungsträger (3) und der zweite Schaltungsträger (4) jeweils separate elektrische Verbindungsanschlüsse (8, 9) aufweisen. in that the first circuit carrier (3) and the second circuit carrier (4) each have separate electrical connection terminals (8, 9).
Elektronische Baugruppe nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Federvorrichtung aus einem elektrisch leitenden Material hergestellt ist und eine elektrisch leitende Funktion aufweist. Electronic assembly according to one of the preceding claims, characterized in that the spring device is made of an electrically conductive material and has an electrically conductive function.
Verfahren zur Herstellung einer elektronischen Baugruppe (1 ) mit einem ersten Schaltungsträger (3; 13), einem zweiten Schaltungsträger (4; 14) und einem Mold-Körper (2), umfassend die Schritte: Method for producing an electronic assembly (1) having a first circuit carrier (3; 13), a second circuit carrier (4; 14) and a mold body (2), comprising the steps:
Anordnen des ersten und zweiten Schaltungsträgers (3, 4; 13, 14) in einem Mold-Werkzeug (20), wobei eine Federvorrichtung (6, 7; 16) zwischen dem ersten und zweiten Schaltungsträger angeordnet ist, derart, dass eine Außenseitenfläche (3a; 13a) des ersten  Arranging the first and second circuit carriers (3, 4, 13, 14) in a mold tool (20), wherein a spring device (6, 7, 16) is arranged between the first and second circuit carriers such that an outer side surface (3a ; 13a) of the first
Schaltungsträgers gegen einen ersten Wandbereich (21 a) des Mold- Werkzeugs (20) gedrückt wird und an dem ersten Wandbereich (21 a) anliegt, und derart, dass eine zweite Außenseitenfläche (4b; 14b) des zweiten Schaltungsträgers (4; 14) gegen einen zweiten Wandbereich (22) des Mold-Werkzeugs (20) gedrückt wird und an dem zweiten Wandbereich (22) anliegt, wobei der erste und zweite Wandbereich (21 , 22) zueinander parallel ausgerichtet sind, und Zuführen einer Mold-Masse in das Mold-Werkzeug (20), um den Mold-Körper (2) zu bilden, wobei die Federvorrichtung (6, 7; 16) von der Mold-Masse umschlossen wird und die Außenseitenflächen (3b, 4b; 13b, 14b) der ersten und zweiten Schaltungsträger frei von Mold- Masse bleiben, um als parallele Wärmeabgabeflächen der elektronischen Baugruppe (1 ) zu fungieren. Verfahren nach Anspruch 10, dadurch gekennzeichnet, dass die Circuit carrier against a first wall portion (21 a) of the mold tool (20) is pressed and against the first wall portion (21 a), and such that a second outer side surface (4b, 14b) of the second circuit carrier (4; a second wall portion (22) of the mold tool (20) is pressed and abuts the second wall portion (22), wherein the first and second wall portions (21, 22) are aligned parallel to each other, and Feeding a mold mass into the mold tool (20) to form the mold body (2), wherein the spring device (6, 7; 16) is enclosed by the mold mass and the outer side surfaces (3b, 4b; 13b, 14b) of the first and second circuit carriers remain free of mold material to function as parallel heat-emitting surfaces of the electronic assembly (1). A method according to claim 10, characterized in that the
Federvorrichtung (6, 7; 16) aus leitendem Material hergestellt ist und vor dem Einlegen in das Mold-Werkzeug (20) mit dem ersten und zweiten Schaltungsträger (3, 4; 13, 14) in elektrisch leitender Weise verbunden wird.  Spring device (6, 7; 16) is made of conductive material and before insertion into the Mold tool (20) with the first and second circuit carrier (3, 4; 13, 14) is connected in an electrically conductive manner.
EP11761075.8A 2010-10-07 2011-09-23 Electronic module Not-in-force EP2625713B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010042168A DE102010042168A1 (en) 2010-10-07 2010-10-07 Electronic assembly and method for its production
PCT/EP2011/066608 WO2012045600A1 (en) 2010-10-07 2011-09-23 Electronic module and method for producing same

Publications (2)

Publication Number Publication Date
EP2625713A1 true EP2625713A1 (en) 2013-08-14
EP2625713B1 EP2625713B1 (en) 2019-04-17

Family

ID=44677893

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11761075.8A Not-in-force EP2625713B1 (en) 2010-10-07 2011-09-23 Electronic module

Country Status (7)

Country Link
US (1) US8970030B2 (en)
EP (1) EP2625713B1 (en)
JP (1) JP5693736B2 (en)
CN (1) CN103155144B (en)
DE (1) DE102010042168A1 (en)
ES (1) ES2736249T3 (en)
WO (1) WO2012045600A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016084180A1 (en) * 2014-11-27 2016-06-02 三菱電機株式会社 Semiconductor module and semiconductor driving device
US10403601B2 (en) * 2016-06-17 2019-09-03 Fairchild Semiconductor Corporation Semiconductor package and related methods
US10373895B2 (en) 2016-12-12 2019-08-06 Infineon Technologies Austria Ag Semiconductor device having die pads with exposed surfaces
DE102017208772A1 (en) * 2017-05-23 2018-11-29 Robert Bosch Gmbh Method and apparatus for making a printed circuit board sandwich and printed circuit board sandwich

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153309B2 (en) * 1992-01-30 2001-04-09 タカタ株式会社 Seat belt retractor
JP2829188B2 (en) * 1992-04-27 1998-11-25 株式会社東芝 Resin-sealed semiconductor device
JPH06151703A (en) 1992-11-05 1994-05-31 Sony Corp Semiconductor device and formation thereof
EP1148547B8 (en) * 2000-04-19 2016-01-06 Denso Corporation Coolant cooled type semiconductor device
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
KR100701380B1 (en) * 2002-12-30 2007-03-28 동부일렉트로닉스 주식회사 Heat spreading type package structure
US7880282B2 (en) * 2003-12-18 2011-02-01 Rf Module & Optical Design Ltd. Semiconductor package with integrated heatsink and electromagnetic shield
WO2006068643A1 (en) * 2004-12-20 2006-06-29 Semiconductor Components Industries, L.L.C. Semiconductor package structure having enhanced thermal dissipation characteristics
US20070029648A1 (en) * 2005-08-02 2007-02-08 Texas Instruments Incorporated Enhanced multi-die package
DE102007032142A1 (en) 2007-06-30 2009-01-02 Robert Bosch Gmbh Electronic module and method for producing an electronic module
DE102008040488A1 (en) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Electronic assembly and method of making the same

Also Published As

Publication number Publication date
CN103155144A (en) 2013-06-12
JP2013539237A (en) 2013-10-17
US20130201614A1 (en) 2013-08-08
JP5693736B2 (en) 2015-04-01
WO2012045600A1 (en) 2012-04-12
CN103155144B (en) 2016-05-04
DE102010042168A1 (en) 2012-04-12
US8970030B2 (en) 2015-03-03
EP2625713B1 (en) 2019-04-17
ES2736249T3 (en) 2019-12-27

Similar Documents

Publication Publication Date Title
DE102009055882B4 (en) Power semiconductor device
DE102009032973B4 (en) Power semiconductor device
DE112008000229B4 (en) Power semiconductor device
DE102009055648A1 (en) The power semiconductor module
DE10129388A1 (en) Electronic component and method for its production
WO2004109812A2 (en) Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
EP2429273A2 (en) Cooling device for an electric device and method for producing same
EP2313788B1 (en) Electronic sensor or sensor device, in particular acceleration sensor, comprising a chip module mounted in a sensor housing
WO2012045600A1 (en) Electronic module and method for producing same
EP2595249A1 (en) Connection terminal
DE102012222679A1 (en) Method for producing a switching module and an associated grid module and an associated grid module and corresponding electronic module
DE102017213210A1 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE
DE102013202904A1 (en) Optoelectronic semiconductor component and method for its production
DE102016207947A1 (en) Optoelectronic assembly, electronic assembly, method of forming an optoelectronic assembly, and method of forming an electronic assembly
EP3479664B1 (en) Method for producing a control unit, in particular for a vehicle, and control unit, in particular for a vehicle
DE102005001151B4 (en) Component arrangement for series connection in high-voltage applications
WO2018224376A1 (en) Electronic component and method for the production thereof
DE102017203253A1 (en) Semiconductor device
DE102009002376A1 (en) Multichip sensor module and method of making same
WO2009056414A2 (en) Module housing and method for producing a module housing
DE102012219145A1 (en) Electronics assembly has spacer structure that is projected in direction of circuit board when electrical contact is arranged on bottom side of electronic component, and that includes contact portion which is contacted to circuit board
DE102021211643A1 (en) electronics device
DE19506958A1 (en) Semiconductor device with good thermal behavior
DE102016209840A1 (en) Sensor, method and sensor arrangement
EP3411903B1 (en) Molded module, method for producing a molded module and mold for injection molding a molded module

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130507

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20150717

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20181217

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502011015610

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1122498

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190515

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20190417

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190717

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190817

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190718

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190717

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2736249

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20191227

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190817

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502011015610

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

26N No opposition filed

Effective date: 20200120

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190930

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190923

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190923

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190930

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20190930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190930

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1122498

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190923

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190923

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20110923

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20210927

Year of fee payment: 11

Ref country code: IT

Payment date: 20210930

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20210923

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20211123

Year of fee payment: 11

Ref country code: ES

Payment date: 20211019

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502011015610

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20220923

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220930

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220923

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220923

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20231031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220924

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220924