EP2130419A1 - Procédé d'équipement d'un élément de mise en contact avec un composant électrique et élément de mise en contact comportant un composant électrique - Google Patents

Procédé d'équipement d'un élément de mise en contact avec un composant électrique et élément de mise en contact comportant un composant électrique

Info

Publication number
EP2130419A1
EP2130419A1 EP08708260A EP08708260A EP2130419A1 EP 2130419 A1 EP2130419 A1 EP 2130419A1 EP 08708260 A EP08708260 A EP 08708260A EP 08708260 A EP08708260 A EP 08708260A EP 2130419 A1 EP2130419 A1 EP 2130419A1
Authority
EP
European Patent Office
Prior art keywords
heat
contacting element
connection point
conductor region
smd component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08708260A
Other languages
German (de)
English (en)
Inventor
Norbert Knab
Georg Schulze-Icking-Konert
Thomas Mohr
Stefan Kotthaus
Nikolas Haberl
Stefan Stampfer
Michael Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2130419A1 publication Critical patent/EP2130419A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • the invention relates to a method for equipping contacting elements with electrical components as well as contacting elements with applied electrical components.
  • stamped grids comprise conductor structures with conductor tracks, which are encapsulated with a plastic material in order to ensure dimensional stability.
  • electrical components which must be connected thereto, for example, by soldering to the conductor tracks.
  • SMD Surface Mounted Device
  • the temperature resistance of the plastic used for the encapsulation of the stamped grid is not sufficient to carry out the usually by planar heating (eg in a reflow oven) held soldering of the SMD components on the stamped grid.
  • Soldering of the SMD components before encapsulation of the stamped grid with the plastic is also a possible alternative because the temperature of the plastic sprayed around the leadframe is usually greater than the melting temperature of the solder used to solder SMD devices to the leadframe.
  • a method for equipping a contacting element, in particular a stamped grid, with an SMD component comprises the Steps of providing the KunststofftechniksIESs with a sheath, in which a connection point is provided in a recess of the sheath; the placement of the SMD component on the connection point; and locally heating a heat conduction member to heat the pad so that the SMD component is connected to the pad.
  • the method has the advantage that electrical components can be applied to a stamped grid, although this is already provided with a non-heat-resistant sheath.
  • a stamped grid By locally heating a heat conducting element of the stamped grid, the heat can be brought directly to the connection point, so that the sheath is not affected directly by the heating.
  • solder material is provided before heating between the connection point and the SMD component.
  • the local heating may be performed by immersing the heat conduction member in a solder bath, by induction, by resistance heating, by applying hot air, by heat conduction with the aid of an applied punch or by applying a laser.
  • a protective plate may be placed on the contacting element before heating so that the heat-conducting element extends through an opening in the protective plate, and the contacting element provided with the protective plate is introduced into a reflow oven.
  • connection point can be provided on a contact web in the recess of the casing, wherein the Er- is carried out the heating of the heat conducting only a maximum of a period of time until the contact bar has reached a limit temperature of the material of the casing at the edge of the recess.
  • a contacting element in particular a stamped grid, is provided for applying an SMD component.
  • the contacting element comprises a line structure; a casing which at least partially surrounds the pipe structure; a recess in the shroud to provide an unclad conductor area of the line structure with a connection point; and a heat conduction member formed on the conductor portion to supply heat to the terminal.
  • the heat-conducting element can be formed projecting from the conductor region and be provided as an integral part of the conductor region.
  • the heat-conducting element is arranged on the conductor region such that there is better heat conduction to the connection point than to the position of the conductor region at the edge of the recess.
  • a heat dissipation device may be provided on the conductor region and / or a heat dissipating structuring of the conductor region between the point of the conductor region at the edge of the recess and the point at which the heat conduction element and the conductor region are in contact with one another.
  • Fig. 1 is a plan view of a stamped grid, which is equipped with an SMD component
  • 2 shows a process status during the application of the SMD component to the stamped grid according to a first embodiment
  • 3 shows a process state of the application of the SMD component according to a further embodiment of the invention
  • FIG. 4 is a plan view of a stamped grid, which is equipped with an SMD component, according to another embodiment of the invention.
  • FIG. 5 shows a stamped grid, which is equipped with an SMD component and which is provided with a protective plate, according to a further embodiment of the invention.
  • FIG. 1 shows a section of a stamped grid 1, which has two contact webs 2, which have a connection point 3 at their respective ends.
  • the connection points 3 are used to apply an SMD component 4 and to contact there, so that it is electrically connected via the contact webs 2.
  • the stamped grid 1 is provided with a sheath 5 made of a plastic material, which is recessed in the region of the contact bridges and the SMD component 4 in order to enable the application of the SMD component 4.
  • the plastic material serves to protect printed conductors of the stamped grid 1 against unintentional contact and also provides corrosion protection for the printed conductors.
  • another for the Verkap- Be the conductor tracks of the lead frame 1 suitable non-conductive material used.
  • the plastic material is applied to the stamped grid 1 by means of an injection molding process, in which the plastic material is liquefied by supplying heat and is sprayed around the stamped grid with the aid of a suitable casting mold.
  • the recesses in the stamped grid for the soldering of the SMD component 4 on the contact webs 2 are introduced either after the injection process in the lead frame 1 or the injection process is carried out so that the contact webs 2 are not covered by the plastic material.
  • the SMD components 4 are usually in a reflow process on printed circuit boards and the like. soldered to contact them.
  • a reflow process means a large-area heating of the printed circuit board in order to melt a solder paste, which is arranged between the connection points 3 and the contacts of the SMD component 4.
  • a reflow process has the disadvantage that thereby also the plastic material of the sheath 5 melts or degrades, and is thereby destroyed or deformed.
  • a reflow process for applying SMD components to a stamped grid with a plastic coating is therefore not suitable.
  • the possibility is excluded of applying the sheath 5 after the application of the SMD component 4 to the connection points 3 of the contact webs 2, ie before the plastic material is injected around the conductor track of the stamped grid.
  • This has the consequence that due to the high temperature which is required for liquefying the plastic material, the solder between the contacts of the SMD component 4 and the connection points 3 also on melts and it may come during the injection process to a detachment of the SMD component from the connection points, to the disruption of the solder joints between the connection points 3 and the contacts of the SMD component 4 and the like.
  • each part of the contact web 2 is bent away from a plane of the contact web 2. This is used as a heat supply element 10 and brought into contact with a heat source in order to conduct heat via the heat supply element 10 via the contact web 2 to the connection point 3.
  • a solder paste 11 is applied, on which the SMD component 4 is placed.
  • the heat-conducting element 10 as shown in FIG. 1, preferably punched out as a web from the interior of the contact web 2 and bent transversely, preferably perpendicular, to the plane of the contact webs 2, so that the heat-conducting element 10 projects perpendicularly from the contact web 2.
  • the heat-conducting element 10 is bent at a position of the contact web 2, which is closer to the connection region 3 than to the edge of the recess 7, in which no plastic material is located on the lead frame 1, and thus the contact webs 2 are exposed.
  • the web of the heat-conducting element 10 is punched into the contact web 2 such that the heat-conducting element 10 is bent in the immediate vicinity, in particular adjacent to the connection point 3, of the contact web 2.
  • the heat-conducting element 10 serves to heat energy via the heat-conducting element 10 on the contact web 2 and to the connection point. 3 supply, so that there the solder paste 11 is melted to connect the SMD component 4 with the contact webs 2.
  • the heat is conducted via the contact web 2 also in the direction of the edge of the recess 7, ie to the plastic material of the casing 5 at the edge of the recess 7.
  • the heat supply must therefore be such that, although the solder paste 11 is melted, the heat supply, however, as soon as the soldering of the soldering of the SMD component 4 is completed on the contact webs 2, the heat supply is removed or switched off to avoid that the temperature of the
  • the heat input can be made by immersing the heat conducting elements 10 in a Lotbad 15 in which molten solder is at a temperature which is above the melting point of the solder.
  • the temperature is conducted after a short time to the connection points 3, so that there rises the temperature above the melting point of the solder solder paste 11, this liquefied and thus the SMD component at the connection points 3.
  • the temperature of the contact webs begins to rise at the edge of the recess, where the sheath of the plastic material begins to rise.
  • the temperature of the solder material in the solder bath 15 is selected such that the temperature at the connection point 3 exceeds the melting temperature of the solder paste as quickly as possible in order to complete the soldering process, but the temperature at the edge of the recess does not reach the melting temperature of the plastic material until the soldering operation is completed ,
  • a process state is shown, in which the heat is supplied by introducing the heat into the heat-conducting elements 10 by means of induction coils 16.
  • FIGS. 4 and 5 show a stamped grid with an applied SMD component, in which the stamped grid is provided with a protective plate 20 which has openings 21 through which the heat-conducting elements 10 extend.
  • the stamped grid can also be introduced into a reflow oven, in which the heat of the heated air is supplied from the oven via the heat-conducting elements 10, which conduct the heat to the connection points 3.
  • the heat-conducting elements 10 are not bent as in the embodiments of Figures 1 to 3 in the direction of a side of the contact webs 2, which is opposite to the side on which the SMD component 4 is applied, but in the direction the same side as the SMD component 4.
  • the invention can also be realized with a printed circuit board or other contacting element.
  • 2 heat sinks can be provided along one or more contact webs, which dissipate heat from the corresponding contact land 2 in the environment.
  • the contact web 2 can be widened in the region between the edge of the recess 7 and the connection between the heat-conducting element 10 and the connection point 3, so as to achieve a larger area for dissipating the heat.
  • Such measures extend the period of time during which a heat supply may be applied via the heat-conducting element 10 in order to solder the SMD component 4 without the temperature at the edge of the recess 7 reaching or reaching a melting temperature of the plastic material of the jacket 5 which a permanent deformation of the plastic material can be obtained.
  • the heat-conducting elements 10 can also be heated with a laser or by deliberately applying hot air in order to achieve the soldering of the SMD component at the connection point 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un procédé d'équipement d'un élément de mise en contact (1), notamment d'un grillage estampé, avec un composant monté en surface (4), comportant les étapes suivantes: mise en oeuvre d'un élément de mise en contact (1) comportant une enveloppe, une zone de connexion (3) étant prévue dans un évidement (7) de l'enveloppe (5); application du composant monté en surface (4) sur la zone de connexion (3); et chauffage d'un élément thermoconducteur visant à chauffer la zone de connexion (3) de telle manière que le composant monté en surface (4) est connecté à la zone de connexion (3).
EP08708260A 2007-03-26 2008-01-28 Procédé d'équipement d'un élément de mise en contact avec un composant électrique et élément de mise en contact comportant un composant électrique Withdrawn EP2130419A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007014337.2A DE102007014337B4 (de) 2007-03-26 2007-03-26 Verfahren zum Bestücken eines Kontaktierungselementes mit einem elektrischen Bauelement sowie ein Kontaktierungselement mit einem elektrischen Bauelement
PCT/EP2008/050937 WO2008116677A1 (fr) 2007-03-26 2008-01-28 Procédé d'équipement d'un élément de mise en contact avec un composant électrique et élément de mise en contact comportant un composant électrique

Publications (1)

Publication Number Publication Date
EP2130419A1 true EP2130419A1 (fr) 2009-12-09

Family

ID=39563448

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08708260A Withdrawn EP2130419A1 (fr) 2007-03-26 2008-01-28 Procédé d'équipement d'un élément de mise en contact avec un composant électrique et élément de mise en contact comportant un composant électrique

Country Status (6)

Country Link
US (1) US20100084166A1 (fr)
EP (1) EP2130419A1 (fr)
JP (1) JP4848045B2 (fr)
CN (1) CN101642004B (fr)
DE (1) DE102007014337B4 (fr)
WO (1) WO2008116677A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102049580B (zh) * 2010-09-26 2013-04-24 广州金升阳科技有限公司 一种引线框架的焊接方法
DE102020102938A1 (de) 2020-02-05 2021-08-05 Marelli Automotive Lighting Reutlingen (Germany) GmbH Schaltungsträgerplatte und Verfahren zum Herstellen einer Schaltungsträgerplatte

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JPS60163495A (ja) * 1984-02-06 1985-08-26 キヤノン株式会社 はんだ付けパタ−ン
BE904407A (fr) * 1985-03-13 1986-06-30 Rogers Corp Condensateur de decouplage et methode de fabrication de celui-ci.
DE3616897C1 (en) * 1986-05-20 1987-09-17 Fritz Raible Soldered connection maker for electrical and/or electronic components
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
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US5875546A (en) * 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
JP3906510B2 (ja) * 1997-03-19 2007-04-18 松下電器産業株式会社 電子部品搭載用放熱基板
JP3951400B2 (ja) * 1998-01-05 2007-08-01 松下電器産業株式会社 電子回路モジュール
US6292374B1 (en) * 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
KR100411254B1 (ko) * 2001-06-04 2003-12-18 삼성전기주식회사 Ｓｍｄ 패키지의 리드융착방법
DE102005013599B4 (de) * 2005-03-24 2009-06-10 Erni Electronics Gmbh Verfahren zum Reparaturlöten vielpoliger Miniatur-Steckverbinder

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Also Published As

Publication number Publication date
US20100084166A1 (en) 2010-04-08
DE102007014337B4 (de) 2017-07-06
WO2008116677A1 (fr) 2008-10-02
CN101642004B (zh) 2011-08-24
CN101642004A (zh) 2010-02-03
JP2010522439A (ja) 2010-07-01
JP4848045B2 (ja) 2011-12-28
DE102007014337A1 (de) 2008-10-02

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