EP2921037A1 - Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure - Google Patents

Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure

Info

Publication number
EP2921037A1
EP2921037A1 EP13794857.6A EP13794857A EP2921037A1 EP 2921037 A1 EP2921037 A1 EP 2921037A1 EP 13794857 A EP13794857 A EP 13794857A EP 2921037 A1 EP2921037 A1 EP 2921037A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
board structure
bending
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13794857.6A
Other languages
German (de)
English (en)
Inventor
Markus WÖLFEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jumatech GmbH
Original Assignee
Jumatech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jumatech GmbH filed Critical Jumatech GmbH
Publication of EP2921037A1 publication Critical patent/EP2921037A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Definitions

  • the invention relates to a bendable and / or angled printed circuit board structure having at least two angularly arranged to each other or arranged printed circuit board sections, the printed circuit board structure includes at least one line element which extends between two connection points and is electrically conductively connected to these connection points, wherein the two connection points are located while maintaining the connections between the connection points and the at least one line element and under bending of the at least one line element via a bending edge between the circuit board sections against each other and angled and / or angled.
  • Such a printed circuit board structure is known from WO 2006/077164 A2.
  • the present invention has for its object to develop a bendable printed circuit board structure of the type mentioned in such a way that a significant improvement in the electrical and mechanical connection between the printed circuit board sections can be achieved.
  • the bendable and / or angled printed circuit board structure comprising at least two printed circuit board sections which can be arranged at an angle to one another, wherein the printed circuit board structure contains at least one line element which extends between two connection points and is electrically conductive with these connection points is connected, wherein the two connection points are located on different circuit board sections, wherein the circuit board sections while retaining the connections between the connection points and the at least one line element and bending of the at least one line element via a bending edge between the circuit board sections are bent and / or angled against each other, wherein the line element seen in cross-section along the bending edge has a greater Leasere- ckung than perpendicular thereto.
  • the cross section along the bending edge is preferably defined by the smallest bending radius, wherein the bending radius in the bending vertex is usually the smallest.
  • the conventional circuit board structure according to the invention extends at least one flat line element on the bending edge, which unlike the conventionally used round wires is better bendable and both in electrical and in mechanical terms, a much better connection between the PCB cut can accomplish.
  • the production costs are considerably reduced because, for example, instead of a large number of round wires, only a single line element with a corresponding line cross section has to be laid in order to transmit comparable amounts of heat and currents between the printed circuit board sections.
  • the number of contacts to be made between the line element and the connection points can also be considerably reduced compared to the conventional solutions with round wires.
  • the mechanical strength of the printed circuit board structure according to the invention is significantly increased by the flat line element in contrast to the plurality of round wires, because the extension of the line member along the bending edge a significantly improved torsional stiffness can be achieved.
  • the mechanical stability of the printed circuit board structure can be improved if the molded part at the edges causes a tear protection.
  • the conduit element is at least predominantly, preferably completely, embedded in the printed circuit board structure.
  • the bending edge extends on or parallel to a surface of the printed circuit board structure.
  • the printed circuit board structure according to the invention is preferably used in the field of power electronics.
  • power electronics generally describes the sub-field of electrical engineering, which has the transformation of electrical energy with electrical or electronic components to the object.
  • circuit or control electronics generally means, in essence, the use of electrical power only for signal and data processing.
  • the lead wire consists of a conductive material, preferably of metal, preferably copper.
  • the conductor wire is manufactured by extrusion.
  • the conductor wire has a polygonal, preferably rectangular or substantially rectangular cross-section, with the side of the cross-section having the greater extent extending along the bending edge or parallel thereto.
  • the lead wire has, preferably in cross section along the bending edge, a thickness in the range of 10 to 500 ⁇ , preferably in the range of 50 to 400 ⁇ , preferably in the range of 100 to 200 ⁇ on.
  • a width of the conductor wire is, preferably in cross section along the bending edge, at least 1, 5 to 100 times, preferably 2 to 10 times as large as the thickness of the conductor wire.
  • the lead wire is at least predominantly embedded in the printed circuit board structure.
  • the conductor wire is roughened.
  • the lead wire is chemically roughened, preferably by chemical etching, wherein the chemical etching preferably occurs by immersing the lead wire in a liquid corroding the material of the lead wire, or by spraying the lead wire with such liquid.
  • the lead wire is mechanically roughened, preferably by mechanical working, preferably by knurling, by sandblasting or by spraying pumice or quartz flour under high pressure.
  • Such a conductor wire can contact the junction over a particularly large area and thus transmit larger amounts of heat and electricity between the printed circuit board sections.
  • conduit element is a plate-shaped molding which meets at least one of the following requirements:
  • the molded part consists of an electrically conductive material, preferably of metal, preferably of copper.
  • the molded part is at least partially, preferably completely, embedded in the printed circuit board structure.
  • the flat sides of the molding are aligned substantially parallel to at least one surface of the printed circuit board structure. At least one flat side of the molding merges flush with an adjacent surface of the printed circuit board structure.
  • the molding is separated out of a plate-shaped workpiece, preferably by water jet cutting, eroding or shaving, preferably by punching.
  • the molding has, preferably in cross section along the bending edge, a thickness in the range of 50 to 500 ⁇ , preferably in the range of 75 to 400 ⁇ , preferably in the range of 100 to 200 ⁇ on.
  • a width of the molding is, preferably in cross-section along the bending edge, at least five times, preferably at least ten times, preferably at least twenty times, preferably at least fifty times or preferably at least one hundred times as large as the thickness of the molding.
  • the molded part comprises, preferably in cross section along the bending edge, a rectangular or substantially rectangular cross section.
  • the thickness of the molded part is constant, preferably in cross section along the bending edge.
  • the molded part protrudes at least in sections from the printed circuit board structure, preferably in the region of at least one printed circuit board section.
  • the molded part comprises at least one recess, which is incorporated starting from an edge side of the molded part in the molded part.
  • the molding comprises at least one aperture which extends transversely, preferably perpendicularly, to a flat side or an edge side of the molding through the molding, wherein the aperture preferably comprises a circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, rectangular or square outline , wherein the aperture is preferably formed substantially slit-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably extends at least partially parallel to an edge side of the molding, the breakthrough particularly preferably at least in sections with insulating and stabilizing agent is filled.
  • the molded part comprises at least one opening which extends from a flat side or an edge side of the molded part in sections into the molded part, the opening preferably at least in the region of its mouth a circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, preferably rectangular or square Outline, wherein the opening is preferably formed substantially groove-shaped and extending continuously or discontinuously along a straight or curved line, this line particularly preferably at least partially parallel to an edge side of the molding extends, the opening particularly preferably at least partially with insulation and stabilizing agent is filled.
  • the molding and / or a portion of the molding is substantially I-shaped, L-shaped, T-shaped, H-shaped, S-shaped, O-shaped, E-shaped, F-shaped in view of a flat side of the molding , X, Y, Z, C, U, or ⁇ .
  • moldings are arranged in the same plane or in different planes, preferably in mutually parallel planes within the circuit board structure.
  • the molding is at least predominantly embedded in the printed circuit board structure.
  • the molded article is chemically roughened, preferably by chemical etching, wherein the chemical etching preferably takes place by immersing the molded article in a liquid which corrodes the material of the molded article or by spraying the molded article with such a liquid.
  • the molding is mechanically roughened, preferably by mechanical working, preferably by knurling, by sandblasting or by spraying pumice or quartz flour under high pressure.
  • Such a molded part can accomplish a further improved electrical and / or mechanical connection between the printed circuit board sections in comparison to a flat wire.
  • connection point is arranged on a surface of the printed circuit board structure.
  • connection point contacts the line element and / or at least one electrical component at in each case at least one contact point, wherein the line element and / or the electrical component are preferably arranged on different flat sides of the connection point, whereby preferably a plurality of contact points are spaced apart at preferably regular intervals.
  • connection point and the line element and / or between the connection point and the at least one electrical component at the at least one contact point is a contacting by welding, bonding, soldering or conductive bonding.
  • the junction is made of metal, preferably copper.
  • the junction is, preferably by etching, from a conductive surface element, in particular from a copper foil, worked out.
  • the junction comprises a thickness in the range of 1 to 200 ⁇ , preferably in the range of 10 to 100 ⁇ , preferably in the range of 15 to 50 ⁇ .
  • insulation and stabilization means is arranged in at least one region between the connection point and the line element, preferably between two contact points and / or around at least one contact point.
  • connection points and / or a plurality of line elements are connected via at least one interconnect, wherein the interconnect is preferably printed or etched.
  • connection point is designed for electrical connections and / or for electrical components.
  • connection point allows a particularly large-area contact with the line element, so that the transmission capacity with respect to heat and current quantities between the connection point and the line element can be further increased.
  • the bending edge meets at least one of the following requirements:
  • the bending edge is formed substantially linear.
  • the bending edge extends at least in sections along a straight and / or curved line.
  • the bending edge extends from an edge side of the printed circuit board structure to an opposite edge side of the printed circuit board structure.
  • the bending edge runs on the bending inside of the printed circuit board structure through the bending vertex.
  • the bending edge extends at or parallel to a surface of the circuit board structure.
  • the position of the bending edge is preferably uniquely identifiable by the bending vertex on the bending inside of the printed circuit board structure.
  • the printed circuit board structure has a forming section comprising the bending edge between the printed circuit board sections, wherein the forming section fulfills at least one of the following requirements:
  • the rigidity and / or the strength and / or the thickness of the printed circuit board structure preferably along the bending edge, preferably on the inside bending side and / or on the outside Biegeau, compared to the adjacent printed circuit board sections reduced.
  • the printed circuit board material preferably on the bending inside and / or on the bending outside, is at least partially removed, preferably by milling, sawing or laser ablation.
  • the printed circuit board structure has at least one groove which preferably extends at least in sections along the bending edge on the bending inside and / or on the outside of the bend, wherein the groove preferably has a constant width or tapers from the groove opening to the groove bottom, or vice versa. wherein particularly preferably a foreign material is embedded in the groove in order to fix an angled state of the printed circuit board structure.
  • a bending radius of the printed circuit board structure and / or of the line element at the bending inside is in the range of 0.05 to 10 mm, preferably in the range of 1 to 8 mm, preferably in the range of 3 to 7 mm.
  • the thickness of the printed circuit board structure in the range of 100 to 1000 ⁇ , preferably in the range of 150 to 500 ⁇ , preferably in the range of 200 to 300 ⁇ .
  • the forming section forms a solid-state joint in order to be able to move the printed circuit board sections to one another in an articulated manner.
  • the forming section enables a controlled bending and / or shape fixing of the printed circuit board structure by the special shaping according to at least one of the above features, wherein the risk of damage to the line element during the bending of the printed circuit board structure and the bending of the line element is significantly reduced.
  • the printed circuit board structure can form a solid-state joint along the bending edge, which is an easy way to connect the printed circuit board sections of the printed circuit board structure in an articulated manner.
  • the removal of material, in particular in the small and medium series area, is a sensible, cost-effective and production-technically flexible option for making the printed circuit board sections movable relative to one another.
  • the rigidity of the printed circuit board structure along the bending edge is reduced so far and brought the bending edge to the wiring level of the interconnected circuit board sections so far as to preclude mechanical damage of the lead wires in Abwinkelkein at the angle and so a reliable electrical connection of the individual circuit board sections PCB structure can be ensured.
  • the printed circuit board structure has at least one thin, at least partially conductive surface element which fulfills at least one of the following requirements:
  • the surface element is a conductive foil, preferably a copper foil.
  • the surface element is produced by rolling.
  • the surface element has a thickness in the range of 10 to 100 ⁇ , preferably in the range of 20 to 50 ⁇ , preferably in the range of 30 to 40 ⁇ on. At least one surface element is arranged at least in sections on a surface of the printed circuit board structure.
  • At least one surface element is arranged at least partially parallel to a surface of the printed circuit board structure below this surface of the printed circuit board structure.
  • the surface element is partially removed in order to form at least one conductor track and / or at least one connection point.
  • At least one conductor track and / or at least one connection point is worked out of the surface element, preferably by etching.
  • At least one surface element or at least one conductor track or connection point machined out of the surface element extends from a printed circuit board section over the bending edge into another printed circuit board section.
  • At least one surface element is arranged on the bending outer side or on the bending inner side of the printed circuit board structure.
  • At least one surface element based on the bending radius of the printed circuit board structure, arranged radially outside of the at least one line element.
  • the use of the thin and conductive surface element enables a particularly inexpensive and effective production of the printed circuit board structure according to the invention, since in particular a conductor pattern with conductor tracks and connection points in the etching process can be produced by a single operation.
  • the isolation and stabilization means separates at least two conductive layers, preferably at least two conductive surface elements.
  • the insulating and stabilizing means surrounds the at least one conduit element in cross section over at least a part of its circumference. - The insulating and stabilizing means covers the at least one conduit element in cross-section seen on at least one edge side and / or on at least one flat side, preferably on the bending outside and / or on the inside bending.
  • the isolation and stabilization means surrounds the at least one line element in cross-section over its entire circumference with the exception of one or more contact points to at least one electrically conductive connection point.
  • the insulating and stabilizing agent comprises a reinforcement, preferably a glass fiber reinforcement.
  • the isolation and stabilization means provides the circuit board structure with inherent strength and rigidity, while at the same time electrically isolating the conductor patterns from one another to prevent mating contacts.
  • the printed circuit board structure produced by this method can have all the features of the circuit board structure according to the invention.
  • a first planar printed circuit board for example, according to the method of DE 101 08 168 C1 are produced, laid on the inside of a thin surface element made of electrically conductive material, a line element defined and contacted at the defined contact points of the surface element and fixed.
  • a stabilizing surface element for example in the form of a prepreg or a cast in insulating resin is on the inside of the surface element with the contacted line element Reinforcing layer connected.
  • the thin surface element from its accessible outer side, for example, by mechanical processing, laser evaporation or etching, structured such that the connection points separated from the remaining surface element and thus discretized and electrically isolated from each other.
  • a flat circuit board can then, for example, with at least one predetermined bending edge z. B. be provided by removal of printed circuit board material by laser ablation or mechanical removal by milling.
  • an assembly with electronic or electrical components in the initially flat state of the bendable printed circuit board structure can be made.
  • the electrical or electronic components can be connected to at least some of the connection points even after the deviation of the printed circuit board sections.
  • the electronic circuit and all electrical connections of the spatial printed circuit board structure can be made in a single operation on a single, initially even printed circuit board.
  • further operations such as electronic components placement, balancing, circuit testing, troubleshooting, and any repairs may also be performed in the planar state of the circuit board.
  • a troubleshooting and repair in this flat state is particularly easy because no spatial structure is yet formed, which could hinder the accessibility to individual components of the circuit.
  • the angular arrangement of the individual circuit board sections to each other can be made by simply bending the flexible conduit member which connects the circuit board sections together. Another advantageous aspect of such an angled arrangement is the good thermal, electrical or electromagnetic separation or decoupling of different circuit areas.
  • such an angled region of a printed circuit board structure can advantageously be used for mounting display components and sockets, for example on the front side and possibly in different fastening planes.
  • the pipe element can be welded to the connection points.
  • the one printed circuit board section can be fixed in position relative to another printed circuit board section, whereby a stable and mechanically robust spatial printed circuit board structure can be produced.
  • the line element can be brought into contact with the (not yet worked out) connection points on a flat, thin, at least partially conductive surface element, preferably a conductive film, wherein the surface element then at least partially with an insulating and stabilizing agent on the side of the line element, which preferably contains a reinforcing layer, is cast or pressed to produce a printed circuit board.
  • a flat, thin, at least partially conductive surface element preferably a conductive film
  • an insulating and stabilizing agent on the side of the line element which preferably contains a reinforcing layer
  • the circuit board structure can be angled along the bending edge in a plastic state.
  • this method step it is possible to transform a uniform printed circuit board carrier structure, for example, without material removal in a spatial structure and this without further stabilization measures after the onset of solidification or curing of the printed circuit board material, for. B. by polymerization to obtain a robust and mechanically stable product.
  • a groove can be formed along the bending edge in a plastic state of the printed circuit board structure, whereby a particularly simple and cost-effective method for jointing the printed circuit board structure, which avoids mechanical post-processing, can be achieved in mass production.
  • the groove along the bending edge can be filled by embedding a foreign material before its solidification or hardening, whereby, for example, a desired deformation line or a parting line can be produced and a mechanical processing of the printed circuit board structure can be omitted.
  • the removal of the printed circuit board material along the bending edge can be done by laser ablation, whereby a very high processing speed can be achieved while avoiding depositions of removed material on the remaining printed circuit board structures.
  • the removal of the printed circuit board material along the bending edge by mechanical removal, preferably by means of milling or sawing done. This represents a very efficient and technologically flexible way of producing a bending edge, especially in the small and medium series range.
  • the groove may be spaced from the conduit member along the flexure edge after removal of the circuit board material, and may be maintained above the conduit member, preferably from 5% to 30% of the original circuit board thickness.
  • this embodiment achieves good stabilization of the forming area while avoiding mechanical damage to the line element by distortion, shear or compression during bending and, on the other hand, high security against accidental damage to the line element extending in the bending area during removal of the printed circuit board material along the bending edge ensure easy and cost-effective even with relatively high manufacturing tolerances and without additional measures. But it is the same conceivable to completely remove the printed circuit board material to the level of the line element and leave no printed circuit board support material above the line element.
  • the conductive surface element can be removed before the removal of the printed circuit board material along the bending edge. In this way, the unwanted formation of metallic removal in the mechanical processing of the printed circuit board structure can reliably be avoided and a contacting of the conductive surface regions of the printed circuit board structure according to their angle can be prevented.
  • the bending of the printed circuit board structure can take place from the side of the material removal or towards this side.
  • a joint structure can be created with a relatively narrow groove and at relatively low groove depth and thus at relatively low material removal, which allows a Abwinkein the printed circuit board sections against each other without damaging the line element and after bending well accessible from the outside with an insulation and Stabilizer filled and mechanically stabilized.
  • the removal of the printed circuit board material along the bending edge can preferably take place in the form of a groove and the angling can be made in the direction of the groove.
  • a groove can be milled into the printed circuit board material by means of a milling cutter, thus achieving a gap between the individual printed circuit board sections which is easy to mechanically stabilize.
  • a cutter with a point angle of more than 90 °, in order to maintain a gap between the individual angled printed circuit board sections in the case of a 90 ° bend of the printed circuit board sections of the printed circuit board structure, through which a better electrical and thermal separation of the printed circuit board sections can be achieved can.
  • the insulating and stabilizing means for producing a printed circuit board may comprise a reinforcing layer, which is arranged adjacent to the line element and at least partially retained in the angling of the printed circuit board sections.
  • a reinforcing layer for example made of glass fiber fabric.
  • the harder and a higher tool wear causing glass fiber fabric must not be mechanically removed.
  • a very effective, tensile receiving, and thus effectively preventing a tearing of the joint area stabilizing element in the joint area between the individual printed circuit board sections of the printed circuit board structure is maintained.
  • This stabilizing element protects the one hand, the conduit element Turning the printed circuit board sections against mechanical damage and, on the other hand, makes possible a far better mechanical stabilization of the bending section after filling the angled groove with an insulating and stabilizing means.
  • the laid pipe element For putting in the reinforcing layer holds the laid pipe element reliably down and protects it from unwanted damage during material removal along the Abwinkel edge.
  • For putting in the groove along the bending edge can be subsequently provided with an insulating and stabilizing agent.
  • the printed circuit board sections of the printed circuit board structure can be electrically insulated from one another after their angling and mechanically stabilized to form a functional spatial printed circuit board structure.
  • At least one further printed circuit board section can be produced from at least one printed circuit board section.
  • At least six printed circuit board sections may be angled such that they form the side surfaces of a closed housing.
  • Such a structure is very compact and mechanically robust and offers a number of important advantages.
  • the components of the circuit accommodated in the interior of the printed circuit board housing can be protected from changing environmental influences and, if appropriate, also tempered and shielded from draft, thus preventing impairments in function and accuracy or premature aging.
  • Another very important aspect is the electrostatic and electromagnetic shielding, in the so-called "ESD protection" of electrostatic sensitive components as well as in the high voltage protection of people and electronic components.
  • an exposed surface of the conduit member may be provided with at least one cover layer of insulating material.
  • an additional useful electrical insulation layer can be applied.
  • the line element exposed by the individual printed circuit board sections in the region of the bending edge can be fixed and protected on the printed circuit board sections in that the line element is provided with at least one cover layer of insulating material in front of the bend.
  • the printed circuit board sections then contact along the bending edge or lie there at least directly opposite, wherein the conduit member extends over the bending edge and is integrally embedded on both sides between the respective circuit board portion and the at least one cover layer of Isolierstoffmasse cohesively.
  • connection points can be connected to at least some of the connection points before or after the angle.
  • z. B. in the flat state assembly operations with mechanical, electrical and electronic components, balancing, circuit testing, troubleshooting and any repairs are usually much easier and without obstruction by spatial structures in the flat state of the circuit board performed.
  • Fig. 1 is a schematic perspective view of a printed circuit board structure according to the invention.
  • Fig. 2 shows a section II-II of Fig. 1 with disproportionately highlighted for illustration purposes thickness of the printed circuit board structure.
  • Fig. 3 is a partial section III-III of Fig. 2 by the bending edge.
  • Fig. 4 is a view of a flat side of a molded part in undeformed and removed state.
  • FIG. 1 shows a schematic perspective view of a bendable and angled printed circuit board structure 1 according to the invention, which has two planar printed circuit board sections 2, 3 arranged at an angle to one another.
  • An embedded in the circuit board structure 1 line element 4 extends between two connection points 5 on different circuit board sections 2, 3 and is electrically connected to these connection points 5.
  • the conduit element 4 has a greater extent along the bending edge 6 than perpendicular to it.
  • the bending edge 6 extends along a straight line from one edge side of the printed circuit board structure 1 to an opposite edge side of the printed circuit board structure 1 on the bending inner side Bl of the printed circuit board structure 1 through the bending vertex.
  • conduit member 4 are preferably a so-called.
  • the flat wire for example, a copper wire and is produced by the extrusion process.
  • the shape and orientation of the lead wire are chosen so that the lead wire seen in cross-section along the bending edge 6 has a greater extent than perpendicular thereto. If the conductor wire has a substantially rectangular cross-section, the side of the cross-section with the greater extent extends along the bending edge 6 or parallel thereto.
  • a plate-shaped molding 40 is used as a conduit element 4, as shown with a view of one of its flat sides 41 in unbent and expanded state, for example in Fig. 4.
  • the molded part 40 consists for example of copper and can be separated out of a plate-shaped workpiece, in particular by punching.
  • the molding 40 may at least partially in the circuit board structure. 1 be embedded, so that at least one flat side 41 of the molding 40 flush merges into an adjacent surface of the printed circuit board structure 1 and the flat sides 41 of the molding 40 are aligned parallel to the flat sides of the printed circuit board structure 1.
  • the molding 40 preferably has a thickness of (more than) 100 ⁇ , wherein the width of the molding 40 is preferably significantly greater than that of a conductor wire.
  • the molded part 40 shown in FIG. 4 comprises a rectangular cross-section, which is preferably constant along the bending edge 6.
  • the molded part 40 is usually installed in the printed circuit board structure 1 in such a way that the bending edge 6 is aligned perpendicular to the long edge sides 42a of the molded part 40 and parallel to the short edge sides 42b of the molded part 40.
  • a recess 43 is incorporated, starting from a long edge side 42a of the molding 40 in the molding 40.
  • the molded part comprises an opening 44, which extends perpendicular to the flat side 41 through the molded part 40, wherein the opening 44 is formed substantially slit-shaped and continuous along a straight line parallel to a long edge side 42a of the molding 40.
  • the opening 44 is preferably filled with insulation and stabilizing agent 9 and penetrated by it.
  • the molding 40 comprises an opening 45 which extends from the flat side 41 in sections into the molding 40 and is substantially groove-shaped, and thereby continuously along a straight line parallel to the long edge side 42a of the molding 40 and parallel to the direction of the opening 44 runs.
  • the opening 45 is preferably filled with insulating and stabilizing agent 9 in the installed state.
  • connection points 5 are each arranged on a surface of the printed circuit board sections 2, 3 and contact the line member 4 from above and intended each an electrical component from below, so that the line member 4 and the electronic component on different flat sides of the connection point 5 are arranged.
  • the contacting between the connection point 5 and the line element 4 and / or between the connection point 5 and the electrical component takes place at least one contact point by welding, bonding, soldering or Leitkleben.
  • Each connection point 5 is preferably machined out of a thin and conductive surface element 8 arranged on the surface of the printed circuit board structure 1, such as a copper foil with a thickness of, for example, 35 ⁇ m, by etching.
  • an entire circuit pattern with a plurality of interconnects 80 and connection points 5 is generated.
  • a plurality of connection points 5 and / or a plurality of line elements 4 may be connected via at least one etched conductor track 80.
  • an etched line extends terbahn 80 of an etched connection point 5 in a first circuit board portion 2 on the bending edge 6 to another etched connection point 5 in another, second circuit board section 3, and extends at the Biegeau chseite BA, so that the conductor 80 relative to the bending radius BR the printed circuit board structure 1 is arranged radially outside of the line element 4.
  • At least one conductor track 80 can run on the bending inner side Bl. Since the bending radius at the Biegeau tseite BA is greater than at the Biegeinnenseite Bl, the bending or the mechanical stress of the conductor 80 at the Biegeau tseite BA, however, less than at the Biegeinnenseite Bl.
  • a forming section 7 which is designed to promote bending of the printed circuit board structure 1 by bending the conductor element 4 over the bending edge 6.
  • the rigidity and strength of the printed circuit board structure 1 in the forming section along the bending edge 6 by material removal at the bending inside Bl compared to the adjacent printed circuit board sections 2, 3 is reduced, so that along the bending edge 6 at the bending inside Bl a groove 1 1 with a constant width forms, which tapers at an angling of the printed circuit board structure 1 under bending of the conductor element 4 via the bending edge 6 from the groove bottom to the groove opening.
  • a foreign material may be incorporated in the groove 11.
  • a Groove 1 1 forms with a constant width, which widens at a bend of the printed circuit board structure 1 under bending of the conductor element 4 via the bending edge 6 corresponding to the groove bottom to the groove opening.
  • a foreign material can be stored to fix an angled state of the printed circuit board structure 1.
  • a bending radius BR of the printed circuit board structure 1 at the bending inner side Bl is approximately 6 mm, the thickness D1 of the printed circuit board structure 1 being in the radial direction in the range of approximately 200 to 300 ⁇ m.
  • An isolation and stabilization means 9 separates a plurality of conductive layers of conductive surface elements 8 and surrounds the one line element 4 in cross-section over a large part of its circumference, wherein the insulation and stabilization means 9 is also arranged between a connection point 5 and the line element 4 with the exception of the contact points can be.
  • the insulating and stabilizing means 9 may further comprise a reinforcement and the conduit member 4 seen in cross section at the edge sides and / or both flat sides Cover, preferably in the forming section 7 on the bending outside BA and on the inside bending Bl.
  • an electrical or electronic circuit is realized which, in addition to at least one electrical conductor track 80 running on the printed circuit board surface, also comprises at least one electrically conductive line element 4 which is arranged in the interior of the printed circuit board structure 1.
  • circuit board structure 1 The production of the circuit board structure 1 according to the invention is described below:
  • the line element 4 is brought into contact with predetermined areas, at later connection points 5 with a copper foil 8, wherein the contacting takes place for example by welding, bonding, soldering, soldering or the like.
  • the line element 4 is provided, for example, with an insulation in order to be able to arrange line elements 4 in several levels one above the other.
  • the copper foil 8 for example, form a flat circuit board by pressing with a stabilizing surface element.
  • the construction and manufacture of such a wire-printed circuit board 1 is known for example from DE 101 08 168 C1.
  • a multiwire printed circuit board may optionally be produced by analogous application of a wire-writing method, wherein a corresponding line element 4 is laid on the inside of the thin and conductive surface element 8 such as the copper foil 8 defined and fixed at defined contact points of the surface element 8. Subsequently, a stabilizing surface element made of an insulating and stabilizing agent 9 is fixed on the inside of the thin conductive surface element 8 with the contacted line element 4. This can be done for example by pressing by means of a prepreg or casting a reinforcing layer, for example by means of a synthetic resin and subsequent curing of the composite.
  • the thin surface element 8 is structured, for example, by partial etching away from its outside in such a way that the connection points 5 and / or the at least one conductor track 80 are separated from the remaining surface element 8 and thus electrically insulated from one another.
  • the wire-printed circuit board 1 additionally has, for example, etched conductor tracks 80, which are electrically connected to the connection points 5.
  • the circuit board 1 may have a plurality of layers of the thin and conductive surface element 8, as shown in Fig. 2.
  • the line member 4 is applied to a plate-shaped substrate made of an insulating and stabilizing agent 9, the combine on each of its two Au each have a thin conductive surface element 8.
  • the connection points 5 and conductor tracks 80 are worked out by partial material removal from the thin, conductive surface elements 8.
  • electrical components can be connected to the molded part on the other side of the plate-shaped substrate by means of the through-connection.
  • the conductor element 4 and the conductor track 80 are cast in a wiring plane or arranged on the upper side of the printed circuit boards 1.
  • a combination of etched conductor tracks 80 and connections to a flat line element 4 is realized on the individual circuit board structure 1.
  • etched interconnects 80 can be arranged distributed on printed circuit board sections 2, 3 of the printed circuit board structure 1 such that the line element 4 and no or at least one etched interconnect 80 extend between the individual printed circuit board sections 2, 3.
  • an electrical interconnection can also be realized within a printed circuit board section 2, 3, which contains at least one line element 4 which is assigned to only this printed circuit board section 2, 3.
  • electrical or electronic components can be connected to at least some of the connection points 5 before and / or after the turn.
  • a three-dimensional circuit board structure starting from a flat side of the printed circuit board structure 1 in a forming section 7 between two printed circuit board sections 2, 3 according to a further manufacturing step, preferably transverse to the direction of the between the printed circuit board sections 2, 3 line member 4, a groove 1 1 in the Printed circuit board material or in the insulating material of the circuit board, for example, milled or sawed. Care is taken here that the conductor element 4 connecting the printed circuit board sections 2, 3 is not damaged. It is possible over the line member 4 on the later Biegeinnenseite Bl and / or on the later Biegeau tex BA a few hundred ⁇ PCB material stand to exclude the risk of damage to the conduit member 4 and to ensure better mechanical stabilization of the hinge area.
  • each printed circuit board section 2, 3 can also be assigned its own printed conductor structure and / or line element structure, which is in electrically conductive connection only through the line element 4 with the printed conductor structures and / or line element structures of another printed circuit board section 2, 3.
  • the line element 4 acts as a solid-state joint, since it produces a mechanical connection between the printed circuit board sections 2, 3 in addition to the electrical and on the other hand is flexible. It is also possible, by non-worn printed circuit board material and possibly also not removed portions of embedded in the printed circuit board structure 1 reinforcing layer mechanically reinforce the joint area between the printed circuit board sections 2, 3 and protect the line member 4 from damage during insertion of the groove along the bending edge 6 and at Kinking process to avoid overstretching, overshooting or overstocks.
  • the printed circuit board sections 2, 3 may, for example, contact along the bending edge 6, and the line element 4 extending therebetween is then integrally embedded on both sides in the insulating and stabilizing means 9 and extends over the bending edge 6.
  • the printed circuit board sections 2, 3 can be fixed in position relative to each other, for example by gluing or filling of the groove 11 or attaching angles in order to maintain a three-dimensional shape.
  • connection points 5 and line structures by means of the flat line member 4 to connect together and from a corresponding circuit board, for example by gluing or pressing with a stabilizing surface element produce.
  • the connection points 5 are already known in advance in accordance with the existing circuit layout, the connections of the line element 4 with the actually not yet existing connection points 5 can already be made in advance.
  • the surface of the copper foil 8 provided with the conduit element 4 can then be covered with a mechanically stabilizing and electrically insulating layer of insulating and stabilizing agent 9 For example, by pressing a prepreg having reinforcing mesh embedded therein with the copper foil 8 on the side of the contacted lead member 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de carte de circuits imprimés coudée et/ou pouvant être coudée, comprenant au moins deux parties de carte de circuits imprimés agencées ou pouvant être agencées l'une par rapport à l'autre de manière à former un angle. La structure de carte de circuits imprimés contient au moins un élément conducteur incorporé au moins en grande partie dans la structure de carte de circuits imprimés, s'étendant entre deux points de raccordement et connecté de manière électroconductrice à ces deux points de raccordement. Les deux points de raccordement se trouvent sur des parties différentes de la carte de circuits imprimés, et les parties de carte de circuits imprimés sont et/ou peuvent être coudées l'une par rapport à l'autre en maintenant les connexions entre les points de raccordement et le ou les éléments conducteurs, par pliage du ou des éléments conducteurs selon un bord de pliage entre les parties de carte de circuits imprimés. L'invention vise à améliorer la connexion électrique et mécanique entre les parties de carte de circuits imprimés. A cet effet, l'élément conducteur présente, vu en coupe transversale, une étendue plus grande le long du bord de pliage que perpendiculairement à ce dernier. L'invention concerne également un procédé de fabrication de ladite structure de carte de circuits imprimés.
EP13794857.6A 2012-11-16 2013-11-15 Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure Ceased EP2921037A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012221002.4A DE102012221002A1 (de) 2012-11-16 2012-11-16 Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung
PCT/EP2013/073939 WO2014076233A1 (fr) 2012-11-16 2013-11-15 Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure

Publications (1)

Publication Number Publication Date
EP2921037A1 true EP2921037A1 (fr) 2015-09-23

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EP13794857.6A Ceased EP2921037A1 (fr) 2012-11-16 2013-11-15 Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure

Country Status (6)

Country Link
US (1) US9474149B2 (fr)
EP (1) EP2921037A1 (fr)
JP (1) JP6444881B2 (fr)
CN (1) CN104798449B (fr)
DE (1) DE102012221002A1 (fr)
WO (1) WO2014076233A1 (fr)

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Also Published As

Publication number Publication date
JP2016501441A (ja) 2016-01-18
CN104798449A (zh) 2015-07-22
DE102012221002A1 (de) 2014-05-22
US20150327355A1 (en) 2015-11-12
CN104798449B (zh) 2018-08-14
US9474149B2 (en) 2016-10-18
JP6444881B2 (ja) 2018-12-26
WO2014076233A1 (fr) 2014-05-22

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