EP2548225B1 - System-in-package using embedded-die coreless substrates, and processes of forming same - Google Patents

System-in-package using embedded-die coreless substrates, and processes of forming same Download PDF

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Publication number
EP2548225B1
EP2548225B1 EP11756940.0A EP11756940A EP2548225B1 EP 2548225 B1 EP2548225 B1 EP 2548225B1 EP 11756940 A EP11756940 A EP 11756940A EP 2548225 B1 EP2548225 B1 EP 2548225B1
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EP
European Patent Office
Prior art keywords
die
embedded
substrate
coreless
disposed
Prior art date
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Application number
EP11756940.0A
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German (de)
English (en)
French (fr)
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EP2548225A4 (en
EP2548225A2 (en
Inventor
John S. Guzek
Vijay Nair
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Intel Corp
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Intel Corp
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Publication of EP2548225A4 publication Critical patent/EP2548225A4/en
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Publication of EP2548225B1 publication Critical patent/EP2548225B1/en
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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EP11756940.0A 2010-03-17 2011-03-16 System-in-package using embedded-die coreless substrates, and processes of forming same Active EP2548225B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/725,925 US8891246B2 (en) 2010-03-17 2010-03-17 System-in-package using embedded-die coreless substrates, and processes of forming same
PCT/US2011/028689 WO2011116106A2 (en) 2010-03-17 2011-03-16 System-in-package using embedded-die coreless substrates, and processes of forming same

Publications (3)

Publication Number Publication Date
EP2548225A2 EP2548225A2 (en) 2013-01-23
EP2548225A4 EP2548225A4 (en) 2013-12-25
EP2548225B1 true EP2548225B1 (en) 2018-02-28

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EP11756940.0A Active EP2548225B1 (en) 2010-03-17 2011-03-16 System-in-package using embedded-die coreless substrates, and processes of forming same

Country Status (7)

Country Link
US (1) US8891246B2 (ko)
EP (1) EP2548225B1 (ko)
KR (1) KR101374463B1 (ko)
CN (1) CN102812550B (ko)
SG (1) SG183401A1 (ko)
TW (1) TWI546904B (ko)
WO (1) WO2011116106A2 (ko)

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US8891246B2 (en) 2014-11-18
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