EP2485244A4 - Druckanwendungsmodul, druckanwendungsvorrichtung und substratbindungsvorrichtung - Google Patents

Druckanwendungsmodul, druckanwendungsvorrichtung und substratbindungsvorrichtung

Info

Publication number
EP2485244A4
EP2485244A4 EP10818577.8A EP10818577A EP2485244A4 EP 2485244 A4 EP2485244 A4 EP 2485244A4 EP 10818577 A EP10818577 A EP 10818577A EP 2485244 A4 EP2485244 A4 EP 2485244A4
Authority
EP
European Patent Office
Prior art keywords
pressure applying
substrate bonding
module
bonding apparatus
applying module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10818577.8A
Other languages
English (en)
French (fr)
Other versions
EP2485244A1 (de
Inventor
Keiichi Tanaka
Shigeto Izumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to EP15150438.8A priority Critical patent/EP2879163A1/de
Publication of EP2485244A1 publication Critical patent/EP2485244A1/de
Publication of EP2485244A4 publication Critical patent/EP2485244A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24595—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness and varying density

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
EP10818577.8A 2009-09-28 2010-09-28 Druckanwendungsmodul, druckanwendungsvorrichtung und substratbindungsvorrichtung Withdrawn EP2485244A4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15150438.8A EP2879163A1 (de) 2009-09-28 2010-09-28 Druckmodul, Druckvorrichtung und Substratverklebungsvorrichtung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009223344 2009-09-28
JP2009233885 2009-10-07
JP2009233882 2009-10-07
PCT/JP2010/005823 WO2011036900A1 (ja) 2009-09-28 2010-09-28 加圧モジュール、加圧装置及び基板貼り合せ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP15150438.8A Division EP2879163A1 (de) 2009-09-28 2010-09-28 Druckmodul, Druckvorrichtung und Substratverklebungsvorrichtung

Publications (2)

Publication Number Publication Date
EP2485244A1 EP2485244A1 (de) 2012-08-08
EP2485244A4 true EP2485244A4 (de) 2014-07-30

Family

ID=43795667

Family Applications (2)

Application Number Title Priority Date Filing Date
EP10818577.8A Withdrawn EP2485244A4 (de) 2009-09-28 2010-09-28 Druckanwendungsmodul, druckanwendungsvorrichtung und substratbindungsvorrichtung
EP15150438.8A Withdrawn EP2879163A1 (de) 2009-09-28 2010-09-28 Druckmodul, Druckvorrichtung und Substratverklebungsvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP15150438.8A Withdrawn EP2879163A1 (de) 2009-09-28 2010-09-28 Druckmodul, Druckvorrichtung und Substratverklebungsvorrichtung

Country Status (7)

Country Link
US (2) US20120251789A1 (de)
EP (2) EP2485244A4 (de)
JP (2) JPWO2011036900A1 (de)
KR (1) KR101809760B1 (de)
CN (2) CN102630334A (de)
TW (1) TWI550680B (de)
WO (1) WO2011036900A1 (de)

Families Citing this family (20)

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Publication number Priority date Publication date Assignee Title
TWI578409B (zh) * 2011-12-08 2017-04-11 尼康股份有限公司 A pressing device, a substrate bonding device and a superimposing substrate
PT2891173T (pt) 2012-08-31 2019-06-28 Semiconductor Tech & Instruments Pte Ltd Sistema multifuncional de manuseamento de bolachas e de molduras de película
JP5956933B2 (ja) 2013-01-15 2016-07-27 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US9058974B2 (en) * 2013-06-03 2015-06-16 International Business Machines Corporation Distorting donor wafer to corresponding distortion of host wafer
US9947637B2 (en) 2013-11-01 2018-04-17 Nikon Corporation System and method for clamping wafers together in alignment using pressure
KR101697487B1 (ko) * 2013-11-26 2017-02-01 안성룡 글래스 합착장치
CH708932B1 (de) * 2013-12-09 2017-04-13 Besi Switzerland Ag Niederhalter zum Niederhalten der Substratplätze eines Substrats zwecks Montage von Halbleiterbauteilen.
US10486551B2 (en) * 2015-03-30 2019-11-26 Fujikura Ltd. Load-detecting device with pressed surface movable relative to mount surface
KR101741828B1 (ko) * 2015-11-30 2017-05-31 주식회사 아이에스시 푸셔장치
KR101636069B1 (ko) * 2015-12-08 2016-07-11 주식회사 라파스 마이크로구조체 제조방법
JP2018010925A (ja) * 2016-07-12 2018-01-18 東京エレクトロン株式会社 接合装置
TWI607207B (zh) * 2016-12-22 2017-12-01 矽品精密工業股份有限公司 模封設備
CN108511363B (zh) * 2017-02-28 2020-09-11 上海微电子装备（集团）股份有限公司 一种键合装置
KR102395194B1 (ko) 2017-06-21 2022-05-06 삼성전자주식회사 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템
CN109052315B (zh) * 2018-08-01 2021-07-23 南方科技大学 一种二维材料的转移系统
US11587807B2 (en) * 2018-10-28 2023-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Annealing apparatus and method thereof
KR102619624B1 (ko) 2018-11-13 2023-12-29 삼성전자주식회사 기판합착 장치 및 방법
JP7488062B2 (ja) * 2020-03-02 2024-05-21 東京エレクトロン株式会社 接合装置、接合システム、接合方法および記憶媒体
KR20220029052A (ko) 2020-09-01 2022-03-08 삼성전자주식회사 레이저 본딩 시스템 및 레이저 본딩 장치
WO2023032166A1 (ja) * 2021-09-03 2023-03-09 ヤマハロボティクスホールディングス株式会社 部材間接合装置及び接合部材製造方法

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JP2009049066A (ja) * 2007-08-14 2009-03-05 Nikon Corp ウェハ接合装置

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US4003A (en) * 1845-04-16 Cochrane
JP2501493B2 (ja) 1990-06-05 1996-05-29 株式会社名機製作所 板体プレス装置
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JP4866582B2 (ja) 2005-09-01 2012-02-01 株式会社ケミトロニクス 圧着機構
TW200733226A (en) * 2006-01-18 2007-09-01 Shibaura Mechatronics Corp Apparatus for treating substrates and method of treating substrates
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KR101422867B1 (ko) * 2006-06-29 2014-07-23 가부시키가이샤 니콘 웨이퍼 접합 장치
KR101367661B1 (ko) 2006-08-25 2014-02-27 엘아이지에이디피 주식회사 척의 평행도 및 평편도 조절유닛을 가진 기판 합착장치
JP5347235B2 (ja) * 2007-04-05 2013-11-20 株式会社ニコン 基板接合装置および基板接合方法
JP4247296B1 (ja) * 2008-02-22 2009-04-02 三菱重工業株式会社 積層接合装置および積層接合方法
JP5434471B2 (ja) * 2009-10-21 2014-03-05 株式会社ニコン 加圧装置、基板接合装置、加圧方法および基板接合方法

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2008262971A (ja) * 2007-04-10 2008-10-30 Nikon Corp 基板ホルダ、基板接合装置および基板接合方法
JP2009049066A (ja) * 2007-08-14 2009-03-05 Nikon Corp ウェハ接合装置

Non-Patent Citations (1)

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Title
See also references of WO2011036900A1 *

Also Published As

Publication number Publication date
TW201135802A (en) 2011-10-16
WO2011036900A1 (ja) 2011-03-31
TWI550680B (zh) 2016-09-21
EP2485244A1 (de) 2012-08-08
JP6070662B2 (ja) 2017-02-01
CN104377151B (zh) 2019-01-01
JPWO2011036900A1 (ja) 2013-02-14
CN104377151A (zh) 2015-02-25
US9498944B2 (en) 2016-11-22
CN102630334A (zh) 2012-08-08
KR101809760B1 (ko) 2017-12-15
KR20120091095A (ko) 2012-08-17
US20140262045A1 (en) 2014-09-18
JP2015043432A (ja) 2015-03-05
EP2879163A1 (de) 2015-06-03
US20120251789A1 (en) 2012-10-04

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