EP1470198A2 - Derivate von polymeren f r die metallbehandlung - Google Patents
Derivate von polymeren f r die metallbehandlungInfo
- Publication number
- EP1470198A2 EP1470198A2 EP20020799073 EP02799073A EP1470198A2 EP 1470198 A2 EP1470198 A2 EP 1470198A2 EP 20020799073 EP20020799073 EP 20020799073 EP 02799073 A EP02799073 A EP 02799073A EP 1470198 A2 EP1470198 A2 EP 1470198A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- optionally
- structural element
- alkyl
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/02—Polyamines
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
- C23C22/08—Orthophosphates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/34—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing fluorides or complex fluorides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/173—Macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
Definitions
- the invention relates to compositions for the treatment of metal surfaces, ner driving methods for the anti-corrosion treatment of metal surfaces, and the use of polymers for the treatment of metal surfaces.
- the invention further relates to a composition and a method for depositing metals or metal alloys on plastic surfaces.
- Corrosion of metals is a problem in the manufacture, processing and use of articles containing metals.
- Protective films and corrosion inhibitors are therefore used to slow down or prevent corrosion. While a protective film is permanently applied to the metal, a corrosion inhibitor is preferably added to substances, in particular liquid mixtures, which would cause or accelerate corrosion on contact with the metal. Both the protective films and the corrosion inhibitors can be in the form of polymers or contain polymers. Compositions in which no toxic chromate has to be used are of particular interest. Such compositions are already known from the prior art.
- EP-A 0828 197 relates to formulations for removing photoresists and etching residues from semiconductor surfaces which contain water, at least one amino compound and a corrosion inhibitor.
- the corrosion inhibitor is selected from quaternary ammonium silicates and oligomeric condensation products from one catechol, one Aldehyde or ketone and optionally a phenolic compound, preferably a pyrocatechol-formaldehyde oligomer.
- No. 6,130,289 relates to aqueous phenolic resin dispersions, the phenolic resin resulting from the reaction of a phenolic resin precursor, preferably a resol, and a modifier which has an ionic group, preferably a sulfonate group and a group reactive with the phenolic resin precursor, preferably a hydroxy or hydroxyalkyl group , is obtained.
- a phenolic resin precursor preferably a resol
- a modifier which has an ionic group, preferably a sulfonate group and a group reactive with the phenolic resin precursor, preferably a hydroxy or hydroxyalkyl group is obtained.
- compositions for the surface treatment of metals which result in at least one of the following improvements in the metal surface: improved corrosion protection, improved adhesion for subsequent coating layers (e.g. painting or metal deposition), passivation, smoother surfaces (when shining, pickling, electropolishing). It is also an object of the present invention to provide processes for the surface treatment of metals and of polymers suitable as components for the compositions according to the invention which meet the requirements mentioned. The present invention is also intended to provide additives for the deposition of metals. Furthermore, compositions and methods for the deposition of metals or metal alloys on plastic surfaces are to be provided. This object is achieved by a composition for the treatment of metal surfaces comprising:
- R ' is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may be substituted with alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups may or may be interrupted by heteroatoms, preferably nitrogen or oxygen, or double bonds may contain; R 'is preferably hydrogen or C ⁇ . 6 alkyl, C ⁇ s hydroxyalkyl, Ci- ö aminoalkyl or C 6 - ⁇ o-aryl, in structural element (3)
- R "and R '" are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl,
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated, and in structural element (5)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen ; preferably R is hydrogen or C ⁇ ö -alkyl,. 6 -hydroxyalkyl, C ⁇ - 6 - aminoalkyl or C ⁇ -io-aryl;
- component C optionally surface-active compounds, dispersants, suspending agents and / or emulsifiers as component C.
- This composition according to the invention can be used in all processes for metal treatment, in particular in those in which corrosion of a metal surface can occur.
- Such processes are, for example, the passivation, in particular phosphating, of metal surfaces, preferably chromate-free, the pickling of metal surfaces, the sealing of metal surfaces and the metal deposition on metal surfaces, for example by nickel plating, galvanizing, tin plating, copper plating or alloy deposition.
- the compositions can be used to produce paints or rust converters.
- compositions comprising the polymer used according to the invention have a good inhibitory action and good adhesion of protective films or of a coating layer applied thereon (for example a lacquer layer or chemically) or electrochemically deposited metal layers) on the metal surface.
- a coating layer applied thereon for example a lacquer layer or chemically
- electrochemically deposited metal layers for example a lacquer layer or chemically
- the compositions according to the invention can be used for the deposition of metals on plastic surfaces, for example in the manufacture of printed circuit boards.
- compositions according to the invention are preferably corrosion-inhibiting compositions which are used in processes for the surface treatment of metals in which corrosion of the metal surface can occur or which are intended to prevent corrosion.
- Suitable metal surfaces are generally technically customary materials selected from the group consisting of aluminum and magnesium alloys, steel, copper, zinc, tin, nickel, chromium and technically customary alloys of these metals. Other suitable metal surfaces are precious metals, especially gold and silver and their alloys. Also suitable are generally technically customary metal coatings that can be produced chemically or electrochemically, selected from the group consisting of zinc and its alloys, preferably metallic zinc, zinc iron, zinc / nickel, zinc / manganese or zinc / cobalt.
- compositions according to the invention are used for pickling or passivating, in particular phosphating, metal surfaces, then metal surfaces made of zinc, aluminum, magnesium and / or alloys of these metals with one another or with other alloy components are preferred. In these cases, zinc and aluminum and alloys of these metals with other alloy components are particularly preferred.
- compositions according to the invention are used for the deposition of metals on metal surfaces, then steel surfaces are preferred for galvanizing and depositing zinc alloys as well as for copper plating and nickel plating and copper and steel for tin plating (also Sn alloys). It is conceivable to use the composition according to the invention for the treatment of metal surfaces that are not pretreated. However, it is preferred that the metal surfaces have been cleaned at least before treatment with the composition according to the invention. Cleaning preferably includes degreasing the metal surface. Suitable cleaning or degreasing processes are known to the person skilled in the art. It ⁇ isf also possible to use the composition according to the invention in a process step subsequent to pickling or passivating the metal surface, for example in a coating step. The compositions according to the invention can also be used as cleaning, pickling and polishing formulations which contain additives known to the person skilled in the art and can be used in corresponding processes.
- compositions according to the invention can also be used for the deposition of metals or metal alloys on plastic surfaces.
- present application therefore also relates to compositions for the deposition of metals on plastic surfaces comprising: a) at least one polymer as component A composed of the structural element (1)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or by heteroatoms
- Nitrogen or oxygen may be interrupted or may contain double bonds;
- R is preferably hydrogen or C 1. 6 alkyl, Ci_ 6 - hydroxyalkyl, C ⁇ . 6 -aminoalkyl or -io-aryl, in structural element (3)
- R 'and R'" are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl, cycloalkyl, aryl, aralkyl or alkaryl radicals, particularly preferably hydrogen or Ci 6 alkyl or Ce -io-aryl residues, in structural element (2), (3) and (4)
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated, and in structural element (5)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical, which optionally with alkyl radicals or heteroatom-containing groups, is preferred
- Chloro, hydroxyl or amino groups may be substituted or may be interrupted by heteroatoms, preferably nitrogen or oxygen;
- R is preferably hydrogen or - ö -alkyl, C ⁇ _ 6 -hydroxyalkyl, C ⁇ - 6 - aminoalkyl or C ö -io-aryl;
- component C optionally surface-active compounds, dispersants, suspending agents and / or emulsifiers as component C.
- compositions which are suitable for nickel-plating and copper-plating of plastic surfaces, for example for copper-plating, are preferred
- compositions according to the invention are used for the metallization of the plastic, but may also be used in the pretreatment for the metallization.
- compositions are understood to mean both the ready-to-use compositions and concentrates.
- concentrations given below for the individual components relate to the ready-to-use compositions.
- concentrations of the individual components in concentrates are correspondingly higher.
- Component A is at least one polymer composed of the structural element (1)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which is optionally substituted with alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups can be or can be interrupted by heteroatoms, preferably nitrogen or oxygen, or can contain double bonds; preferably R is hydrogen or Ci- 6 alkyl, C ⁇ _6- hydroxyalkyl, Ci- ö aminoalkyl or C 6 - ⁇ 0 -aryl, in structural element (3)
- R "and R” are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl, cycloalkyl, aryl, aralkyl or alkaryl radicals, particularly preferably hydrogen or C ⁇ _ 6 - alkyl or C ⁇ -io Aryl radicals, in structural element (2), (3) and (4) M each independently of one another are hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably a JE alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated, and in structural element (5)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen ;
- R is preferably hydrogen or C ⁇ - alkyl, C ⁇ _ 6 -hydroxyalkyl, C ⁇ - 6 -aminoalkyl or C 6 _ ⁇ o-aryl.
- the weight average molecular weight of the polymers used according to the invention is generally> 500 g / mol, preferably 1000 to 1,500,000 g / mol.
- the polymers (component A) preferably have the following elemental composition:
- C 20-82% by weight, preferably 30 to 80% by weight, particularly preferably 40 to 70% by weight, H: 2.3-12.5% by weight, preferably 2.3 to 8% by weight, particularly preferably 2.5 to 5.5% by weight, N: 1-61% by weight, preferably 1 to 20% by weight, particularly preferably 1 to 15% by weight, O: 2-50% by weight, preferably 5 to 50% by weight, particularly preferably 20 to 45% by weight, S: 0-18.5% by weight, preferably 0.5 to 18.5% by weight, particularly preferably 5 to 15% by weight, X: 0 ⁇ 46% by weight, preferably 0 to 38% by weight, particularly preferably 1 to 13% by weight, where X denotes any chemical element, preferably one or more of the cations mentioned for M.
- Component A is produced in any manner. Suitable methods are known to the person skilled in the art. In a particularly preferred embodiment, component A is produced by polycondensation. Suitable process conditions for polycondensation are known to the person skilled in the art from the production of phenolic resins, urea resins and melamine resins, which are described, for example, in ULLMANN'S ENCYCLOPEDIA OF INDUSTRIAL CHEMISTRY, SIXTH EDITION, 2000 ELECTRONIC RELEASE, chapter “Phenolic Resins", paragraphs 3 and 4 and in US Pat. No. 4,252,938 and US 4,677,159.
- component A by polycondensation, the following components are generally reacted with one another: a) at least one aldehyde as component Aa, b) at least one aromatic compound which has at least one OM group or one sulfonic acid group, --SO 2 OM, or carries both groups, as component Ab, c) optionally at least one compound selected from diphenols or polyphenols with vicinal OM groups, where the vicinal OH groups can optionally be protected as acetal or ketal, as component Ac, in which component Ab and Ac M each independently represent hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably a Alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated,
- the polycondensation can take place in the presence of a catalyst.
- Suitable catalysts are known to the person skilled in the art.
- a catalyst selected from the group consisting of acids, preferably mineral acids and oxalic acid, and bases, preferably alkali or alkaline earth metal hydroxides, and salts of weak acids and bases is preferably used.
- Suitable aldehydes are aldehydes of the general formula R'CHO, in which R 'is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally contain alkyl radicals and / or heteroatom-containing groups, preferably chloro , Hydroxyl, carboxyl or amino groups, may be substituted and / or may be interrupted by heteroatoms, preferably nitrogen or oxygen, and / or may contain double bonds; preferably R 'is hydrogen or C ⁇ ⁇ - alkyl, C ⁇ _ 6 hydroxyalkyl, C ⁇ e-aminoalkyl or C ö -io-aryl.
- Aldehydes are particularly preferably selected from the group consisting of formaldehyde, ethanal, propanal, butanal, citronellal, benzaldehyde, 2-chlorobenzaldehyde, 2-hydroxybenzaldehyde, 2-propenal, 3,3-dimethylacrolein, 4-methylbenzaldehyde, 4- (l, l -dimethylethyl) - benzaldehyde, anisaldehyde, 4-chlorobenzaldehyde, 3-hydroxy-2,2-dimethyl-propanal, 7-hydroxy-3,7-dimethyl-octanal, n-hexanal, 2-furfural, 3-methyl-4- oxo-2-butenoic acid methyl ester, 3-methylbutanal, 2-ethylhexanal, 2-methylpropanal, 2-phenylpropionaldehyde, 3,7-dimethylocta-2,6-dien-l-
- the aldehyde is generally used in an amount of 20 to 80 mol%, preferably 40 to 60 mol%, based on the total amount of components Aa, Ab, optionally Ac and optionally Ad.
- Suitable aromatic compounds are preferably compounds with an aromatic C 6 . 14 basic structure which, in addition to at least one OM group or at least one sulfonic acid group, -SO 2 OM or both groups, can have further radicals.
- Preferred further radicals are alkyl radicals, preferably Ci- M- alkyl radicals, which can optionally be substituted by alkyl radicals and / or groups containing heteroatoms, preferably chloro, hydroxyl, carboxyl or amino groups, and / or interrupted by heteroatoms, preferably nitrogen or oxygen may be and / or may contain double bonds, and heteroatom-containing radicals such as chloro, hydroxyl, carboxyl or amino groups.
- the number of other residues is variable and depends, among other things, on the ring size of the aromatic compound.
- the number of the residues is preferably 1 to 5, particularly preferably 1 to 3, very particularly preferably 1 or 2. These residues can be in ortho-, meta- or para- Position to the OM group or sulfonic acid group, -SO 2 OM.
- Aromatic compounds are particularly preferably selected from the group consisting of phenol, cresols, p-alkylphenols and p-substituted phenols such as 4- tert-butylphenol, 4-isooctylphenol, 4-hydroxybiphenyl, 4-nonylphenol, isopentylphenol, cyclohexylphenol, dodecylphenol, cashew oil (contains phenols with C 1 - alkenyl substituents in the meta position), [2,2-bis (4-hydroxyphenyl ) propane] (diphenylolpropane), bisphenol A, resorcinol, hydroquinone, phenol ether, phenols with carboxyl substituents such as phenoxyacetic acid, 4,4'-dihydroxydiphenylsulfone, naphthalenesulfonic acid (in particular 2-naphthalenesulfonic acid), naphthol, phenolsulfonic acid (in particular 4-phenols
- aromatic compound which contains at least one OM ′ group is very particularly preferred to use at least one compound selected from phenol, hydroquinone and resorcinol as the aromatic compound which contains at least one OM ′ group.
- the aromatic compound which contains at least one sulfonic acid group, -SO OM "" is very particularly preferably used at least one compound selected from phenolsulfonic acid and naphthalenesulfonic acid.
- alkali metals preferably sodium or potassium
- alkaline earth metals preferably magnesium or calcium
- Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce or V particularly preferred are sodium, potassium, magnesium, calcium, zinc and manganese.
- the aromatic compound which contains at least one OM group is - if this compound is used - generally in an amount of 7 to 21 mol%, preferably 10 to 15 mol%, based on the total amount of components Aa, Ab, if appropriate Ac and optionally Ad used. If component Ac is additionally used, the stated amount gives the sum of the amounts of component Ac and the aromatic compound which contains at least one OM group.
- the aromatic compound which contains at least one sulfonic acid group, -SO 2 OM, is - insofar as this compound is used - generally in an amount of 10 up to 30 mol%, preferably 15 to 25 mol%, based on the total amount of components Aa, Ab, optionally Ac and optionally Ad.
- At least one aromatic compound which contains at least one OM group and at least one aromatic compound which contains at least one sulfonic acid group, -SO 2 OM, are reacted.
- component Ac can be used.
- Suitable diphenols or polyphenols with vicinal OM groups are preferably selected from the group consisting of pyrocatechol, gallic acid propyl ester, gallic acid n-octyl ester, gallic acid n-dodecyl ester, adrenaline, methyl dopamine, 3-methyl pyrocatechol, dopamine, 1,2-dihydroxy-4 -tert.-butylbenzene, 4- (2 - ((3- (4-hydroxyphenyl) -l-methylpropyl) amino) -ethyl) -l, 2-dihydroxybenzene, 2- (3,4-dihydroxybenzyl) -2 - hydrazinopropionic acid, (3, 4-dihydroxyphenyl) acetic acid, (3, 4-dihydroxyphenyl) acetonitrile, 3,4,5-trihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, 4,5-dihydroxy
- alkali metals preferably sodium or potassium
- alkaline earth metals preferably magnesium or calcium
- Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce or V particularly preferred are sodium, potassium, magnesium, calcium, zinc and manganese.
- Suitable acetals or ketals are preferably selected from the group consisting of 1,3-benzodioxole, 2-methyl-1,3-benzodioxole, 1- (2-methyl-1,3-benzodioxol-2-yl) -2-propanone, 2-methyl-3,4-methylene-dioxy-hydrocinnamaldehyde, 3,4-methylenedioxyphenyl- acetaldehyde, butacid (6-propylpiperonyl-butyl-diethylene glycol ether), piperonyl alcohol, piperonal, piperonylic acid and 2,2-dimethyl-1,3-benzodioxole.
- Pyrocatechol is very particularly preferred.
- the diphenols or polyphenols with vicinal OM groups, where the vicinal OH groups can optionally be protected as acetal or ketal, are - insofar as these compounds are used - in those mentioned under component Ab (aromatic compounds which contain at least one OM 'group) Amounts used.
- Component Ab is the sum of the amounts of component Ac and the aromatic compounds used as component Ab in one embodiment which contain at least one OM group.
- Suitable amine compounds are preferably primary monoamines, R-NH 2 , in which R is an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups can be interrupted by heteroatoms, preferably nitrogen or oxygen; R is preferably C ⁇ . 6 alkyl, Ci. 6 -hydroxyalkyl, C ⁇ -aminoalkyl or C 6 - ⁇ o-aryl.
- compounds with several, preferably 2 to 5, amino groups selected from the group consisting of urea and its derivatives, melamine, diethylenetriamine, triethylenetetramine, diethanolamine and triethanolamine are also suitable as amine compounds.
- secondary amines, R 2 NH can be used as amine compounds, in which the two radicals R independently of one another are those for R have the meaning given.
- tertiary amines R 3 N can be used as additives, in which the three radicals R independently of one another have the meaning indicated for R.
- Amine compounds suitable as component Ad are selected, for example, from the group consisting of urea and its derivatives, melamine, (3-aminopropyl) amino 2-ethanol, 1- (1-naphthyl) ethylamine, 1- (3-aminopropyl) - imidazole, 1- (4-methoxyphenyl) -2- (ethylamino) propane, 1- (4-methoxyphenyl) ethylamine, 1- (4-methylphenyl) ethylamine, l, l-dimethylpropin-2-ylamine, l, -Iminobis-2-propanol, 1,2-diaminoquinone, 1,2-ethanediamine, 1,2-propylenediamine, 1,3,5-tris (3-dimethylaminopropyl) -sym-hexahydro-triazine, 1,3-dimethylaminouracil , 1,3-phenylene-bis-dia
- Aminopropionic acid and its salts 3-azapentane-l, 5-diamine, 3-diethylamino-propylamine, 3-dimethylamino-1-propanol, 3-dimethylaminopropionitrile, 3-ethoxy-l-propylamine, 3-ethoxypropylamine, 3-methoxy-1 -propanamine, 3-methylammopropylamine, 3 -N-methylamino-1 - (2-thienyl) - 1 -propanol, 4- (2- (3 - (4-hydroxyphenyl) 1 - methylpropyl) amino) -ethyl) - 1, 2-dihydroxybenzene, 4- (3,4-dichlorophenyl) -1,3,3,4-tetrahydro-N-methyl-1-naphthalenamine, 4,4'-bis (diethylamino) benzophenone, 4,4'-diaminodiphenylmethane , 4,4'-
- Aminopropyl vinyl ether amino acids (especially arginine, asparagine, aspartate, cysteine, glutamine, histidine, lysine, methionine, serine, threonine, tryptophan, tyrosine), aniline, benzylamine, benzylaminoethyl theophylline, bis- (3-aminopropyl) polytetrahydrofuran, bis ) -methylamine, bis-aminobenzyl-aniline, bis-dimethylaminoethyl ether, bis-hexamethylenetriamine, butyldiglycolamine,
- Chlorophenylethylamine racemate pure cyclohexylamine, cyclopentylamine, diethanolamine, diisopropanolamine, dimethylamine, dimethylaminoethoxyethanol, ethanolamine, ethylamine, ethylenediamine, hexamethylenediamine, homoveratrylamine, isopropanolamine, coconut fatty amine and its ethoxylation products, methoxyisopropylamine-2-methyl-phenyl (phenyl-1-methyl) -phenyl inyl-amine, monoethanolamine, monoisopropanolamine, monoisopropylamine, monomethylamine, N- (2-aminoethyl) -ethanolamine, N- (3-aminopropyl) -1,3-propanediamine, N '- (3-aminopropyl) -N, N-dimethyl - 1,3-propanediamine, N, N, N ', N'-te
- Cyclohexylcyclohexanamine N-ethyl-1, 2-dimethylpropylamine, N-ethylcyclohexylamine, N-ethylethanamine, N-hexyl-1-hexanamine, N-methyl-3-phenyl-3 - (trifluoro-p-tolyloxy) propylamine, N- Methyldiethanolamine, N-methylethanolamine, N-monomethylcyclohexylamm, noradrenaline, N-propyl-1-propanamine, N-sulfoethyl-ethylenediamine sodium salt, N-tridecyl-tridecanamine, branched and linear, octamylamine, oleylamine and its ethoxylation products, p -Aminobenzoesaeuremethyldiglykol, p-Cyanethylmethylamino- benzaldehyde, p-diethylaminobenzal
- Phenyldiethanolamine poly (ethylene glycol / propylene glycol) amine, polyethylene glycol amine, polypropylene glycol amines, Polytetrahy ⁇ ⁇ ofuranamine, Rhodamine 6g, stearylamine and its ethoxylation products, tallow fatty amine and its ethoxylation products, tetramethyl-diamino-diethyl ether, tetramethyl-tri-dididylaminomethanol-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diaminophenylamine-tri-diamin
- At least one amine compound selected from the group consisting of primary, secondary and tertiary, preferably primary, alkylamines, primary, secondary and tertiary, preferably primary, alkanolamines, melamine and urea.
- the amine compound is generally used in an amount of 10 to 30 mol%, preferably 15 to 25 mol%, based on the total amount of components Aa, Ab, optionally Ac and optionally Ad.
- Polymers (component A) are preferably used in the compositions according to the invention, obtainable by reacting a) 20 to 80 mol%, preferably 40 to 60 mol% of at least one aldehyde, preferably formaldehyde or paraformaldehyde as component Aa, b) 7 to 21 mol% , preferably 10 to 15 mol% of at least one aromatic compound which has at least one OM group, preferably phenol, resorcinol or
- Hydroquinone the quantity corresponding to the sum of the aromatic compound which has at least one OM group and the component Ac, O
- Component A is generally present in the compositions according to the invention in an amount of from 0.01 to 400 g / 1, preferably from 0.2 to 100 g / 1, particularly preferably from 1 to 50 g / 1, based on one liter of the Composition used.
- the exact amount of component A depends on the particular method for treating metal surfaces and on the particular metal surface.
- Component B is generally present in the compositions according to the invention in an amount of from 0.01 to 400 g / 1, preferably from 0.2 to 100 g / 1, particularly preferably from 1 to 50 g / 1, based on one liter of the Composition used.
- the exact amount of component A depends on the particular method for treating metal surfaces and on the particular metal surface.
- Component B is generally present in the compositions according to the invention in an amount of from 0.01 to 400 g / 1, preferably from 0.2 to 100 g / 1, particularly preferably from 1 to 50 g / 1, based on one liter of the Composition used.
- the exact amount of component A depends on
- Component B is water or another solvent which is suitable for dissolving or dispersing, suspending or emulsifying the polymer (component A).
- Suitable other solvents besides water are, for example, aliphatic or aromatic solvents such as benzene, toluene and xylene, halogenated solvents such as methylene chloride and chloroform, alcohols such as methanol and ethanol, ethers such as diethyl ether and tetrahydrofuran, polyethers, in particular polyethylene glycol, ketones such as acetone, and mixtures these solvents with each other and / or with water. Water is particularly preferably used exclusively as solvent.
- the pH is determined by the type of application.
- pickling and phosphating baths are generally strongly acidic and galvanic baths are basic or acidic, depending on the type of bath.
- Suitable pH values for the specific applications are known to the person skilled in the art.
- the amount of water or another solvent depends on whether the composition according to the invention is a ready-to-use composition or a concentrate, and on the particular application. Basically, the amount results from the concentrations of the individual components specified for the ready-to-use composition.
- the composition according to the invention can additionally contain surface-active compounds, emulsifiers and / or dispersants.
- Suitable surface-active compounds are surfactants, which can be cationic, anionic, zwitterionic or nonionic.
- Suitable surfactants are, for example, alkyl and alkenyl alkoxylates of the type R-EO n / POM wherein R o- generally linear or branched C 6 -C 3 alkyl radicals, preferably C 8 -C 2 o alkyl radicals and EO represents an ethylene oxide unit and PO stands for a propylene oxide unit, EO and PO in any order can be arranged and n and m are independently of one another> 1 and ⁇ 100, preferably> 3 and ⁇ 50, for example Emulan®, Lutensol® and Plurafac® (from BASF), alkylphenol ethoxylates, EO / PO block copolymers (Pluronic®, from BASF ), Alky
- the amount of these components in the composition according to the invention is generally 0.01-100 g / 1, preferably 0.1 to 20 g / 1.
- composition according to the invention is used for the treatment of metal surfaces and, in addition to components A, B and optionally C:
- compositions are particularly suitable for pickling or passivating, in particular phosphating or as a rust converter for the metal surfaces mentioned in the present application.
- Component D Salts, acids and bases based on transition metal cations, transition metal oxo anions, fluorometallates or lanthanoids are suitable as component D.
- Suitable transition metal cations are in particular fluorometalates of Ti (IV), Zr (IV), Hf (IV) and / or Si (IV), suitable lanthanides, in particular Ce. Tungsten and molybdates are also suitable.
- compositions according to the present application containing component D are particularly suitable either for depositing a corrosion-protective layer on a metal surface or for enhancing the corrosion-protective effect of a corrosion protection layer already deposited on the metal surface.
- the polymers (component A) used according to the invention have an excellent corrosion protection effect in the compositions according to the invention.
- the compositions according to the invention are particularly suitable for coating metal surfaces, a closed film being formed on the metal surface. An impregnation of the metal surface with the polymer is particularly advantageous, the coating mass falling below 0.5 mg / cm 2 with component A. An excellent corrosion inhibition effect is achieved.
- the amount of component D is - if component D is contained in the compositions according to the invention - preferably 0.02 to 20 g / 1.
- compositions according to the invention can furthermore contain at least one acid selected from the group consisting of phosphoric acid, sulfuric acid, sulfonic acids such as methanesulfonic acid, vinylsulfonic acid, allylsulfonic acid, m-nitrobenzenesulfonic acid, naphthalenesulfonic acid and derivatives thereof, nitric acid, hydrofluoric acid and hydrochloric acid.
- the type of acid used depends on the type of treatment of the metal surface.
- phosphoric acid is generally used in phosphating baths for phosphating steel surfaces.
- the composition according to the invention is a phosphating solution.
- Layer-forming phosphating solutions are solutions that have no divalent metals. Such” non-layer-forming “phosphating solutions are, for example, in the form of an iron phosphating solution. If the phosphating solutions contain ions of divalent metals, for example zinc and / or manganese, the phosphating solutions are known as so-called Compositions according to the present application containing nitric acid are particularly suitable for the surface treatment of zinc and its alloys, while compositions containing hydrofluoric acid are particularly suitable for the surface treatment of aluminum and its alloys.
- the amount of acid used can vary depending on the application. In general, if component E is contained in the compositions according to the invention, 0.2 to 200 g / 1, preferably 2 to 100 g / 1, of component E are used.
- compositions according to the invention can contain at least one further corrosion inhibitor.
- Suitable corrosion inhibitors are selected from the group consisting of buti ⁇ dibT, benztriazole, aldehydes, amine carboxylates, amino and nitrophenols, amino alcohols, aminobenzimidazole, aminoimidazolines, aminotriazole, benzimidazolamines, benzothiazoles, and derivatives of benzene amidazoles, carbonic acids, and benzamediazines their esters, quinoline derivatives, dibenzyl sulfoxide, dicarboxylic acids and their esters, diisobutenyl succinic acid, dithiophosphonic acid, fatty amines and fatty acid amides, guanidine derivatives, urea and its derivatives, lauryl pyridinium chloride, maleic acid amides, mercaptobenzimidonyl acid, phylsulfonamide, e
- Butynediol and benzotriazole are preferably used as further corrosion inhibitors.
- the corrosion inhibitors if they are used at all in the compositions, are used in an amount of generally 0.01 to 50 g / 1, preferably 0.1 to 20 g / 1, particularly preferably 1 to 10 g / 1.
- compositions according to the invention are preferably free of Cr (VI). If the compounds mentioned (component G) are nevertheless used, compounds selected from Fe, Zn, Zr and Ca are preferably used.
- the amount of these compounds in the compositions according to the invention - if these compounds are present at all - is generally 0.01 to 100 g / 1, preferably 0.1 to 50 g / 1, particularly preferably 1 to 20 g / 1.
- the compositions according to the invention can contain further auxiliaries and additives.
- auxiliaries and additives include conductivity pigments or conductive fillers, for example iron phosphide, vanadium carbide, titanium nitride, carbon black, graphite, molybdenum disulfide or barium sulfate doped with tin or antimony, with iron phosphide being preferred.
- conductivity pigments or conductive fillers are used in the compositions according to the invention to improve the welding Ability of the metal surfaces to be treated or to improve a subsequent coating with electrocoat.
- silica suspensions can be used, particularly when the compositions are used to treat aluminum-containing surfaces.
- additives are generally in finely divided form, i.e. their average particle diameters are generally 0.005 to 5 ⁇ m, preferably 0.05 to 2.5 ⁇ m.
- the amount of auxiliaries and additives is generally 0.1 to 50, preferably 2 to 35% by weight, based on the total mass of the compositions according to the invention.
- compositions according to the invention can furthermore contain additives to improve the forming behavior, for example wax-based derivatives based on natural or synthetic waxes, e.g. Waxes based on acrylic acid, polyethylene, polytetrafluoroethylene (PTFE) waxes or wax derivatives or paraffins and their oxidation products.
- Waxes based on acrylic acid, polyethylene, polytetrafluoroethylene (PTFE) waxes or wax derivatives or paraffins and their oxidation products.
- compositions according to the invention may contain polymer dispersions based on styrene, 4-hydroxystyrene, butadiene, acrylic acid, acrylic esters, acrylic acid amides, acrylates, methacrylic acid, methacrylic acid esters, methacrylic acid amides, methacrylates and derivatives of acrylamide. It is furthermore possible for the compositions according to the invention to contain polyurethane dispersions and polyester uretane dispersions or polyurea dispersions.
- compositions according to the invention are polyethylene glycols, polypropylene glycols, copolymers of ethylene oxide and copolymers of propylene oxide.
- compositions according to the invention are used in powder coatings, they can additionally contain epoxy resins and / or condensation resins of formaldehyde with phenol, urea, melamine, phenolsulfonic acid or naphthalenesulfonic acid.
- compositions according to the invention are used in rust converters, they can additionally contain polyvinyl butyral.
- compositions according to the invention containing component A can be used in all applications for the treatment of metal surfaces, in particular in those applications in which the corrosion of metal surfaces can be a problem.
- examples of such applications are paint stripping, metal pickling, electropolishing, chemical deburring, chemical and electrochemical metal deposition (in particular of Cu, Ni, Pd, Zn, Co, Mn, Fe, Mg, Sn, Pb, Bi, Ag, Au and their alloys), Conversion layer formation (in particular no-rinse conversion layer formation, i.e.
- the type of application corresponds to technically customary methods with the addition that the compositions according to the invention are used together with other components which are technically customary for the corresponding application, or that they are brought into contact with the metal in additional treatment steps, such as spraying, dipping, painting or electro-coating using suitable formulations of the corrosion-inhibiting compositions according to the invention, such as solutions, emulsions, dispersions, suspensions or aerosols.
- compositions for metal deposition comprising, in addition to components A, B and, if appropriate, C:
- compositions according to the invention are particularly suitable for the deposition of metals or metal alloys on metal or plastic surfaces. Suitable metal surfaces have already been mentioned above.
- the deposition of metals or metal alloys on plastic surfaces is preferably carried out in the manufacture of printed circuit boards. The deposition is preferably carried out in a chemical or electrochemical process.
- Suitable metal oxides or metal salts are the oxides or salts of metals selected from the group consisting of Zn, Ni, Cu, Au, Pd, Sn, Co, Mn, Fe, Mg, Pb, Bi and Ag.
- the metals can be deposited in the form of the metal used or - if different metals are used - in the form of alloys of the metals mentioned with one another or with other metals.
- Preferred alloys are CuZn, CuSn, CuNi, SnPb, SnAgBiCu, SnAgCu, SnBi, SnAg, SnCu, NiPd, ZnFe, ZnNi, ZnCo and ZnMn.
- the stated constituents of the alloys can be contained in the alloy in any concentration.
- Zn, Cu and Ni and alloys of these metals are particularly preferably deposited with other metals or with one another.
- Ni and Cu are particularly preferred when depositing metals or metal alloys on plastic surfaces.
- the metals can be used as metal salts selected from the corresponding sulfates, sulfonic acid salts, chlorides, carbonates, sulfamates, fluoroborates, cyanides and acetates.
- the concentration of the metal ions in the compositions according to the invention is generally 0.01 to 100 g / 1, preferably 0.1 to 50 g / 1, particularly preferably 2 to 20 g / 1, based on the amount of the metal used.
- Component J is generally 0.01 to 100 g / 1, preferably 0.1 to 50 g / 1, particularly preferably 2 to 20 g / 1, based on the amount of the metal used.
- compositions according to the invention can optionally additionally contain a complexing agent.
- Suitable complexing agents are e.g. Ethylenediaminetetraacetic acid (EDTA), ethylenediamine (ED), citric acid and salts of the compounds mentioned.
- compositions according to the invention can optionally further contain at least one acid or an alkali metal or alkaline earth metal salt of the corresponding acid, preferably selected from the group consisting of HNO 3 , H 2 SO, H 3 PO 4 , formic acid and acetic acid.
- the acid is generally used in an amount of 0.5 to 700 g / 1, preferably 5 to 200 g / 1.
- compositions according to the invention may contain further additives, which may vary depending on the intended use, the metal to be deposited, the objective and the method used.
- Suitable additives are 1- (2-vinylpyridinium) -2-ethylsulfobetaine, l, l-dimethyl-2-propynyl-l-amine, 1-pyridinium-2-ethylsulfobetaine, 1-pyridinium-2-hydroxy-3-propylsulfobetaine , 1-pyridinium-3-propylsulfobetaine, 2,2'-dichlorodiethyl ether, 2,5-dimethyl-3-hexyne-2,5-diol, 2-butyne-1,4-diol, 2-butyne-1,4- diol ethoxylate, 2-butyne-l, 4-diol propoxylate, 3- (2-benzothiazolylthio) -l-propanes
- Methylamido sulfonic acid N, N, N ', N , -Tetrakis (2-hydroxypropyl) ethylenediamine, N, N-diethyl-2-propyne-1-amine, N, N-diethyl-4-amino-2-butyne-1 -ol, N, N-dimethyl-2-propyne-l-amine, N-2-ethylhexyl-3-aminosulfopropionic acid, N-allylpyridinium cliloride, sodium salt of sulfated alkylphenol ethoxylates, sodium 2-ethylhexyl sulfate, nicotinic acid, nitrilotriacetic acid and salts derived therefrom , Nitrobenzenesulfonic acid sodium salt, N-methallylpyridinium chloride, ortho-chlorobenzaldehyde, phosphonium salts, phthalic acid amides,
- Natriximhypophosphit NaBELi
- dimethylaminoborane diethylaminoborane
- hydrazine formaldehyde
- urotropin palladium chloride
- sodium stannate HFxBF 3
- polyethylene glycols with a molecular weight of 100-1000000 g / mol block copolymers of ethylene oxide and propylene oxide, for example, BASF Corporation brands, e.g. Pluronic Aktiengesellschaft brands , Ludwigshafen Rh., And statistical copolymers of ethylene oxide and propylene oxide, in particular with molecular weights in the range 100-2000 g / mol.
- metal deposits in particular are possible by electrochemical or chemical means. Whether an electrochemical or chemical deposition is carried out depends on the metal, the metal surface and the desired result.
- the present application also relates to a method for treating a metal surface, the metal surface being brought into contact with a polymer (component A), composed of: the structural element (1)
- R ' is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or by heteroatoms Nitrogen or oxygen, may be interrupted or may contain double bonds; R is preferably hydrogen or C 6 alkyl, C 6 hydroxyalkyl, C 6 aminoalkyl or C 1-0 aryl, in structural element (3)
- R "and R '" any residues having a molecular weight of ⁇ 200 g / mol, preferably each independently hydrogen, alkyl, cycloalkyl, aryl, aralkyl or alkaryl groups, more preferably hydrogen or C ⁇ ⁇ - alkyl or Ce -io-aryl residues, in structural element (2), (3) and (4)
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated, and in structural element (5)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which may optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen; preferably, R is hydrogen or C ⁇ _ 6 - alkyl, C ⁇ - 6 hydroxyalkyl, C ⁇ _ 6 aminoalkyl or C ö -io-aryl.
- Suitable methods are e.g. Paint stripping, metal pickling, electropolishing, chemical deburring, chemical and electrochemical metal deposition, conversion layer formation (in particular no-rinse conversion layer formation), corrosion protection (in particular on copper, for example in the manufacture of printed circuit boards and on steel), lubrication and greasing (in particular in cold forming) ).
- the polymer in the process according to the invention, can be present in solution, emulsion, suspension or aerosol.
- the polymer (component A) is preferably present in one of the compositions according to the invention mentioned above.
- the type of application corresponds to technically customary methods with the addition that the polymers (component A) used according to the invention are used together with other components which are technically customary for the corresponding application, or that they are brought into contact with the metal in additional treatment steps, such as spraying , Dipping, painting or electro-painting using suitable formulations of the polymers.
- a metal surface is brought into contact with a composition comprising the components
- the treatment of the metal surfaces is carried out by spraying a composition according to the invention onto the metal surface or dipping the metal surface into a composition according to the invention, depending on the number, size and shape of the parts to be treated.
- compositions according to the invention containing phosphoric acid as component E can be applied by a "roll-on” or “dry-in-place” or “no-rinse” method, the phosphating composition according to the invention being applied the metal strip is applied and dried without rinsing, a polymer film being formed.
- Another subject of the present application is a method comprising the
- the treatment of the metal surface in step e) can be passivation, in particular phosphating, by methods known to the person skilled in the art.
- a protective layer, film or impregnation is applied to the metal. If phosphating is carried out in step e), post-treatment of the metal surface in step g) with passivating additives is possible.
- washing with water takes place between the individual process steps in order to avoid contamination of the solution required for the respective subsequent step with components of the solution used in the previous step.
- step a) cleaning and treating the metal surface in the presence of the polymer used according to the invention (component A), preferably passivating (step e)) can also be carried out in one step, i.e. with a formulation which contains the composition according to the invention in addition to the usual cleaning agents.
- the metal surface can be provided with a lacquer.
- the painting is also carried out by methods known to those skilled in the art.
- a further preferred embodiment of the present application relates to a method for the deposition of metals or metal alloys on a metal surface, the metal surface being brought into contact with a composition which contains components A, B and optionally C, or with a composition which in addition to components A, B and optionally C as further components, components I, optionally J, optionally K and optionally contains L.
- Suitable components A, B, C, I, J, K, L have already been mentioned above.
- Another embodiment of the present application relates to a method for the deposition of metals or metal alloys on a plastic surface, the plastic surface being brought into contact with a polymer (component A), composed of
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxy or amino groups, or by heteroatoms, preferably nitrogen or oxygen, may be interrupted or contain double bonds; preferably R is hydrogen or C ⁇ ö alkyl, C ⁇ - 6 hydroxyalkyl, Ci ö aminoalkyl or C ⁇ o aryl, in structural element (3)
- R "and R” are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl, cycloalkyl, aryl,
- Aralkyl or alkaryl radicals particularly preferably hydrogen or C 6 alkyl or Ce-iyl radicals, in structural element (2), (3) and (4)
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or Zn, Zr, Cr, Mn, Fe, Co, Ni, Cu, Al, Ce, V, particularly preferably magnesium, calcium, zinc or manganese, if there are sufficient negative charges to be compensated, and in structural element (5)
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen ; preferably R is hydrogen or CI_ 6 alkyl, C ⁇ _ 6 hydroxyalkyl, aminoalkyl, or C-e-6 - ⁇ o-aryl.
- the plastic surface is preferably brought into contact with a composition which contains components A, B and optionally C, or with a composition which is in addition to the
- Suitable components A, B, C, I, J, K, L have already been mentioned above.
- a deposition of metals or metal alloys on a plastic surface is generally carried out in a plastic metallization, in particular in the production of printed circuit boards.
- the deposition of metals or metal alloys on metal or plastic surfaces takes place chemically or electrochemically in a particularly preferred embodiment.
- Such methods are known to the person skilled in the art.
- Chemical or electrochemical gold deposition, chemical or electrochemical copper deposition, chemical or electrochemical nickel deposition, chemical palladium deposition, electrochemical zinc deposition, electrochemical tin deposition are particularly preferably carried out in the process according to the invention.
- the processes mentioned also include their alloys with other elements; CuZn, CuSn, CuNi, SnPb, SnAgBiCu, SnAgCu, SnBi, SnAg, SnCu, NiPd, ZnFe, ZnNi, ZnCo, ZnMn are particularly preferred, the components of the alloy mentioned being able to be contained in the alloy in any concentration. According to the invention are also. Processes in which conductive polymers are deposited, which in the broadest sense are regarded as metals. One such conductive polymer is polypyrrole.
- Further embodiments of the process according to the invention are, for example, cleaning, etching, glossing and pickling processes, in which, in addition to the use of component A according to the invention, acids, oxidizing agents and corrosion inhibitors as well as dissolved metal salts are used at the same time, and processes for producing printed circuit boards in which compositions containing the Component A both in the metallization of the circuit board including the holes contained therein as well can be used for surface treatment of the circuit board.
- Compositions containing component A can be used on the one hand in the surface treatment of metals present on the printed circuit board, for example with the aim of protecting against corrosion or in improving the solderability, as well as in processes in which non-conductive surfaces are used in the context of metal deposition with those used according to the invention Compositions containing component A are treated, for example with the aim of through-contacting printed circuit boards.
- polymer (component A) used according to the invention in the processes mentioned, in particular for pickling or passivating, in particular phosphating metal surfaces or for depositing metals on metal or plastic surfaces, it is possible to use the polymers (component A) used according to the invention everywhere add where corrosion protection is desired.
- Another object of the present application is the use of polymers (component A) built up from
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally be substituted with alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen, or can contain double bonds; preferably R is hydrogen or C ⁇ - 6 alkyl, C ⁇ ö hydroxyalkyl, C ⁇ _ 6 aminoalkyl or C 6 - ⁇ o-aryl, in Slrukturelement (3)
- R "and R '" are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl, cycloalkyl, aryl, aralkyl or alkaryl radicals, particularly preferably hydrogen or C ⁇ _ 6 -
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen ;
- R is preferably hydrogen or C 6 -alkyl, C 6 -hydroxyalkyl, Ci-e-aminoalkyl or C 6 -o-aryl, for the treatment of metal.
- the polymers (component A) are preferably used to inhibit corrosion of metal surfaces.
- Another preferred use relates to the use of polymers composed of
- R ' is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical with less than 31 carbon atoms, which may optionally be substituted with alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups or can be interrupted by heteroatoms, preferably nitrogen or oxygen, or can contain double bonds; preferably R is hydrogen or C ⁇ _ 6 alkyl, C ⁇ hydroxyalkyl, C ⁇ . 6- aminoalkyl in structural element (3)
- R "and R” are any radicals with a molecular weight of ⁇ 200 g / mol, preferably independently of one another hydrogen, alkyl, cycloalkyl, aryl, aralkyl or alkaryl radicals, particularly preferably hydrogen or C ⁇ -6-
- M each independently represents hydrogen or a cation, preferably an alkali metal cation, particularly preferably a sodium or potassium ion, or a divalent or polyvalent cation, preferably an alkaline earth metal cation or
- R is hydrogen, an alkyl, cycloalkyl, aryl, aralkyl or alkaryl radical which can optionally be substituted by alkyl radicals or heteroatom-containing groups, preferably chloro, hydroxyl or amino groups, or can be interrupted by heteroatoms, preferably nitrogen or oxygen ;
- R is preferably hydrogen or C 6 alkyl, C 6 hydroxyalkyl, C 6 amino alkyl or C 6 .o aryl, for the deposition of metals or metal alloys on a plastic surface.
- the polymers are used in the following formulations for metal treatment by customary industrial processes.
- a Alluummiinniiuummbblech is anodized at a current density of 15 A / dm and 100 ° C in a solution of the following composition: H 3 PO 4 70% by weight, H 2 SO 4 10% by weight, HNO 3 4% by weight, boric acid 0.5% by weight, NH 5 F 2 16% by weight, polymer 4 9.5% by weight.
- Example BIO cast iron is immersed in a solution consisting of 10% H 2 SO 4 and 30% by weight of polymer 5 at room temperature for 15 s.
- Example B12 Electrochemical zinc alloy deposition
- Galvanic baths of the following composition are used for the electrochemical deposition of an alloy layer made of zinc and a further metal M at 40 ° C. and a current density of 1.5 A / dm 2 . 10 g / L zinc, as zinc oxide 2 g / L metal M, as sulfate 100 g / L sodium hydroxide 13 g / L cärboxymethylated Pölyethyle ⁇ imiri, Nä salt, from example " 1
- the metal M is optionally cobalt, iron, nickel or manganese.
- Examples B1 to B1 are tested in the salt spray test and have a service life that is 5-30% longer than in comparable processes in which the polymers used according to the invention are not used.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Paints Or Removers (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Removal Of Specific Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10163892A DE10163892A1 (de) | 2001-12-27 | 2001-12-27 | Derivate von Polymeren für die Metallbehandlung |
DE10163892 | 2001-12-27 | ||
PCT/EP2002/014784 WO2003056061A2 (de) | 2001-12-27 | 2002-12-27 | Derivate von polymeren für die metallbehandlung |
Publications (1)
Publication Number | Publication Date |
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EP1470198A2 true EP1470198A2 (de) | 2004-10-27 |
Family
ID=7710819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20020799073 Withdrawn EP1470198A2 (de) | 2001-12-27 | 2002-12-27 | Derivate von polymeren f r die metallbehandlung |
Country Status (11)
Country | Link |
---|---|
US (1) | US7390847B2 (de) |
EP (1) | EP1470198A2 (de) |
JP (1) | JP2005529189A (de) |
KR (1) | KR20040071270A (de) |
CN (1) | CN1620485A (de) |
AU (1) | AU2002364300A1 (de) |
CA (1) | CA2472116A1 (de) |
DE (1) | DE10163892A1 (de) |
MX (1) | MXPA04006292A (de) |
PL (1) | PL369934A1 (de) |
WO (1) | WO2003056061A2 (de) |
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DE10163892A1 (de) * | 2001-12-27 | 2003-07-17 | Basf Ag | Derivate von Polymeren für die Metallbehandlung |
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EP1836330A1 (de) * | 2005-01-14 | 2007-09-26 | Henkel Kommanditgesellschaft Auf Aktien | Stabile, nichtchromatische, passivierte organische dünnschichtelemente |
ES2273581B1 (es) * | 2005-06-23 | 2008-02-01 | Kao Corporation, S.A. | Inhibidor de corrosion para acidos. |
US20070069182A1 (en) * | 2005-09-26 | 2007-03-29 | Halliburton Energy Services, Inc. | Corrosion inhibitor compositions and associated methods |
US20070071887A1 (en) * | 2005-09-26 | 2007-03-29 | Halliburton Energy Services, Inc. | Methods of inhibiting corrosion of a metal surface |
WO2008031781A2 (de) * | 2006-09-15 | 2008-03-20 | Basf Se | Verfahren zur verwendung von quartäre ammoniumgruppen und harnstoffgruppen umfassenden polymeren als korrosionsinhibitor für kupferoberflächen |
EP1927648A1 (de) * | 2006-12-01 | 2008-06-04 | Rolex Sa | Hydrophobe und oleophobe ultradünne Schicht, Herstellungsverfahren und Anwendung beim Uhrenbau als Epilame |
US7994101B2 (en) * | 2006-12-12 | 2011-08-09 | Halliburton Energy Services, Inc. | Corrosion inhibitor intensifier compositions and associated methods |
WO2009039485A1 (en) * | 2007-09-20 | 2009-03-26 | University Of Utah Research Foundation | Electrochemical deposition of polymers on metal substrates |
US8058211B2 (en) * | 2007-12-12 | 2011-11-15 | Halliburton Energy Services, Inc. | Corrosion inhibitor intensifier compositions and associated methods |
JP2010070838A (ja) | 2008-09-22 | 2010-04-02 | Rohm & Haas Electronic Materials Llc | 金属表面処理水溶液および金属表面のウィスカ抑制方法 |
JP5471276B2 (ja) * | 2009-10-15 | 2014-04-16 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
SG10201508015RA (en) | 2010-10-06 | 2015-10-29 | Entegris Inc | Composition and process for selectively etching metal nitrides |
US9303186B1 (en) * | 2014-10-16 | 2016-04-05 | International Business Machines Corporation | PHT powder coating materials |
WO2016120671A1 (fr) | 2015-01-30 | 2016-08-04 | Arcelormittal | Procédé de préparation d'une tôle revêtue comprenant l'application d'une solution aqueuse comprenant un aminoacide et utilisation associée pour améliorer les propriétés tribologiques |
WO2016120669A1 (fr) | 2015-01-30 | 2016-08-04 | Arcelormittal | Procédé de préparation d'une tôle revêtue comprenant l'application d'une solution aqueuse comprenant un aminoacide et utilisation associée pour améliorer la résistance à la corrosion |
WO2016120670A1 (fr) | 2015-01-30 | 2016-08-04 | Arcelormittal | Procédé de préparation d'une tôle revêtue comprenant l'application d'une solution aqueuse comprenant un aminoacide et utilisation associée pour améliorer la compatibilité avec un adhésif |
CN107794533A (zh) * | 2016-08-31 | 2018-03-13 | 天津市民兴科技发展有限公司 | 一种除油除锈清洗剂及其制备方法 |
EP3559311A4 (de) * | 2016-12-22 | 2020-08-19 | Henkel AG & Co. KGaA | Verwendung von vorgeformten reaktionsprodukten aus catecholverbindungen und funktionalisierten co-reaktandverbindungen zur verringerung der oxidation von blanken metalloberflächen |
EP3558667B1 (de) * | 2016-12-22 | 2024-03-20 | Henkel AG & Co. KGaA | Behandlung von konversionsbeschichteten metallsubstraten mit vorgeformten reaktionsprodukten von catecholverbindungen und funktionalisierten co-reaktandverbindungen |
EP3559312B1 (de) * | 2016-12-22 | 2024-04-24 | Henkel AG & Co. KGaA | Reaktionsprodukte von catecholverbindungen und funktionalisierte co-reaktandverbindungen für metallvorbehandlungsanwendungen |
KR102358817B1 (ko) * | 2017-07-04 | 2022-02-09 | 한국전자통신연구원 | 광소자의 제조 방법 |
JP6976601B2 (ja) * | 2017-08-22 | 2021-12-08 | 国立研究開発法人物質・材料研究機構 | コーティング膜の形成方法、プライマー処理方法、コンクリートの補修方法及び道路の敷設方法 |
CN107645852B (zh) * | 2017-09-18 | 2020-01-14 | 乐凯特科技铜陵有限公司 | 一种高频印制电路板用双面铜箔表面处理工艺 |
CN107541721B (zh) * | 2017-09-28 | 2019-10-18 | 江西理工大学 | 一种化学镀铜镀液 |
CN110760300B (zh) * | 2018-07-25 | 2021-08-27 | 中国石油天然气股份有限公司 | 一种油井高温酸化缓蚀剂、其制备方法及应用 |
CN110305275B (zh) * | 2019-07-08 | 2021-11-16 | 金陵科技学院 | 氨甲基膦基脲醛低聚物钢筋阻锈剂的制备方法 |
CN111270242B (zh) * | 2020-02-12 | 2022-08-05 | 首钢集团有限公司 | 一种环保型气相缓蚀剂及其制备方法 |
CN117384503B (zh) * | 2023-10-13 | 2024-05-10 | 青岛恩泽化工有限公司 | 一种高效缓释防闪锈剂的制备方法及其应用 |
CN117363134B (zh) * | 2023-10-31 | 2024-06-25 | 浙江鱼童新材料股份有限公司 | 一种环氧带锈涂料 |
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JP2000327387A (ja) * | 1999-05-13 | 2000-11-28 | Mitsui Chemicals Inc | セメント混和剤 |
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DE10163892A1 (de) * | 2001-12-27 | 2003-07-17 | Basf Ag | Derivate von Polymeren für die Metallbehandlung |
-
2001
- 2001-12-27 DE DE10163892A patent/DE10163892A1/de not_active Withdrawn
-
2002
- 2002-12-27 CN CNA02828044XA patent/CN1620485A/zh active Pending
- 2002-12-27 KR KR10-2004-7010240A patent/KR20040071270A/ko not_active Application Discontinuation
- 2002-12-27 CA CA002472116A patent/CA2472116A1/en not_active Abandoned
- 2002-12-27 PL PL02369934A patent/PL369934A1/xx unknown
- 2002-12-27 US US10/500,306 patent/US7390847B2/en not_active Expired - Fee Related
- 2002-12-27 JP JP2003556575A patent/JP2005529189A/ja active Pending
- 2002-12-27 EP EP20020799073 patent/EP1470198A2/de not_active Withdrawn
- 2002-12-27 AU AU2002364300A patent/AU2002364300A1/en not_active Abandoned
- 2002-12-27 WO PCT/EP2002/014784 patent/WO2003056061A2/de active Application Filing
-
2004
- 2004-06-25 MX MXPA04006292A patent/MXPA04006292A/es not_active Application Discontinuation
Non-Patent Citations (1)
Title |
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See references of WO03056061A2 * |
Also Published As
Publication number | Publication date |
---|---|
CA2472116A1 (en) | 2003-07-10 |
DE10163892A1 (de) | 2003-07-17 |
US20050121114A1 (en) | 2005-06-09 |
KR20040071270A (ko) | 2004-08-11 |
US7390847B2 (en) | 2008-06-24 |
WO2003056061A2 (de) | 2003-07-10 |
PL369934A1 (en) | 2005-05-02 |
WO2003056061A3 (de) | 2004-01-29 |
AU2002364300A8 (en) | 2003-07-15 |
MXPA04006292A (es) | 2004-10-04 |
AU2002364300A1 (en) | 2003-07-15 |
JP2005529189A (ja) | 2005-09-29 |
CN1620485A (zh) | 2005-05-25 |
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