EP1189252A1 - Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz - Google Patents

Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz Download PDF

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Publication number
EP1189252A1
EP1189252A1 EP00119932A EP00119932A EP1189252A1 EP 1189252 A1 EP1189252 A1 EP 1189252A1 EP 00119932 A EP00119932 A EP 00119932A EP 00119932 A EP00119932 A EP 00119932A EP 1189252 A1 EP1189252 A1 EP 1189252A1
Authority
EP
European Patent Office
Prior art keywords
solder
tin
carrier
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00119932A
Other languages
German (de)
English (en)
French (fr)
Inventor
Alexander Etschmaier
Helmut Dr. Wieser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to EP00119932A priority Critical patent/EP1189252A1/de
Priority to AT01980371T priority patent/ATE395715T1/de
Priority to SI200130845T priority patent/SI1317763T1/sl
Priority to DE50113976T priority patent/DE50113976D1/de
Priority to ES01980371T priority patent/ES2302752T3/es
Priority to US10/380,238 priority patent/US7109839B2/en
Priority to EP01980371A priority patent/EP1317763B1/de
Priority to CNB018156037A priority patent/CN100350539C/zh
Priority to PCT/EP2001/010499 priority patent/WO2002023575A1/de
Priority to HU0300734A priority patent/HU226335B1/hu
Priority to BRPI0113834A priority patent/BRPI0113834B1/pt
Priority to PL362409A priority patent/PL202046B1/pl
Priority to CZ20031036A priority patent/CZ299341B6/cs
Publication of EP1189252A1 publication Critical patent/EP1189252A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Definitions

  • the invention first relates to a fuse link, especially for low-voltage high-performance fuses, NH fuses that have at least one fuse element a solder substance in a solder depot of a carrier, in detail according to the generic term of claim 1.
  • a fuse link especially for low-voltage high-performance fuses, NH fuses that have at least one fuse element a solder substance in a solder depot of a carrier, in detail according to the generic term of claim 1.
  • solder on the basis of tin and the carrier on the Base formed by copper.
  • fuse links are common in the market.
  • fuse links on the market usually a tin-cadmium alloy as solder substance.
  • solder substance Common is SnCd 80 20, an alloy with 80 percent by weight Tin and 20 weight percent cadmium.
  • fuse links on the market whose fuse element is a solder substance from SnBi 95 5.
  • the melting times vary the fuse element provided with this solder significantly further than that with conventional SnCd solders.
  • SnBi solders generally tend to melt away. To prevent this, is with a fuse link on the market the solder is covered with a layer containing silicone. Here, the deletion behavior of the fuse link in the decomposition of the silicone due to the carbon atoms deteriorate significantly.
  • solder stopping agent which is a melting of the solder in one
  • solder substance without cadmium is already one organic coating has been provided. This allows you to prevent the solder substances from flowing away without cadmium, by the thermal decomposition of the organic matrix during Melting of the fuse element, i.e. to switch off the fuse, can, however, be an electrically conductive plastic film form, which prevents disconnection of the circuit can be.
  • the invention is based on the object, a fuse link to develop that with a cadmium free Solder works on the fuse element and in which the described Problems, in particular the spread of the switch-off values and the flow of the solder so that the otherwise good properties of cadmium-containing fusible conductor systems be achieved.
  • the solution to the described problem is solved according to the invention initially by a fuse link according to claim 1.
  • the solder contains a tin alloy as an effective substance with two other ingredients, with a first after Weight percent larger component, but after weight percent is smaller than the proportion of the basic substance Tin, after which is selected, the melting temperature of the solder decrease.
  • a second, smaller by weight percent A component is a substance that does not dissolve in the tin, which means when cooling from the liquid to the solid state crystallization nuclei arise that create a fine structure and a coarsening of the structure under load on the fuse prevent.
  • Such a fusible link solder system can be adjusted to a similar spreading behavior as using cadmium and appropriate response times exhibit.
  • the fine structure obviously promotes dissolution of the carrier material, that is, the fuse element, whereby the same melting times and similar melting behavior as with fusible conductors with conventional cadmium-containing Fusible conductor solders can be achieved.
  • the melting process will thereby not exposed to separate energy conversion, so that there is no additional warming.
  • Claims 2 to 6 relate to advantageous developments of the solder fusible link system.
  • the invention is based on the further object of a cadmium-free To further develop the fuse link in such a way that the solder is promoted in its resistance to deliquescence becomes.
  • the described task is solved after the invention by a fuse link according to claim 7.
  • the solder is then used as a solder material in the solder depot Carrier, and / or the carrier provided with an oxide skin.
  • the oxide skin can be formed thermally or chemically. It is sufficient if the oxide skin in the border area between Lot and carrier is formed.
  • the invention further relates to a method of manufacture a fuse link, according to which solder and / or carrier thermal treatment in an oxidizing atmosphere be subjected. It is also a manufacturing process a fuse link is provided, after which the solder and / or the carrier with a solder and / or carrier affine substance is treated. It is particularly suitable a sodium sulfide solution.
  • a substance affine to the solder and / or carrier can be between absorbent rolls soaked in the affine substance be applied.
  • solder material consisting of a Tin-bismuth-copper alloy, a tin-indium-copper alloy or a tin-bismuth-iron alloy.
  • a solder material has been found to be advantageous, which is a tin-bismuth-copper alloy with 10% to 30% bismuth and 0.3% to 1.0% copper, together with tin 99.5%, Rest usual impurities.
  • FIG 2 are compared, left for cadmium-free Lot without copper, right for an embodiment according to the invention with solder containing cadmium and tin bismuth Copper, one fuse element with a narrow point in front of one Solder deposit after the fuse element has responded and when the fuse is interrupted Fuse element reproduced.
  • the response time is on the ordinate of the fuse element in seconds until it is interrupted applied and on the abscissa are tin alloys with the specified ingredients and their proportions. It the results are plotted over several trials.
  • the carrier for the solder was copper.
  • Tin-cadmium serves as an orientation value.
  • Bismuth is used for the cadmium-free alloys with a percentage by weight of 25%, 15% and 5% each with a load of 32 A phase current, here synonymous with 1.6 times the rated current.
  • the proportion of copper is 0.8% each.
  • the amount of tin is 99.5% in the difference, the Rest of the usual contaminants.
  • the first further component of the tin alloy is in one smaller proportion than the proportion of the basic substance Tin. Through this component, the melting temperature of the Lotes reduced. In the present case, bismuth was used for this used.
  • a second component, smaller by weight percent is a substance that does not dissolve in the tin, causing when cooling from the liquid to the solid state crystallization nuclei arise that bring about a fine structure. Here copper was used. From the diagram of FIG 1 is that Scattering behavior of the respective alloy can be seen and for a certain geometry of the fuse element, with a Narrowing in front of the lot, also the time to respond and until you turn it off. These times can be scheduled for a Current load and when using a specific alloy for the solder through the geometry of the fusible conductor and possibly the Type and dimensioning of a constriction in front of the plumb bob strongly influenced become.
  • Fuse links with a solder substance have proven to be well suited the fusible conductor made of tin-bismuth-copper alloy, made of tin-indium-copper alloy and tin-bismuth-iron alloy proved.
  • a tin-indium-copper alloy has also proven to be favorable with the components in proportion and by weight percent: Sn from 70% to 96%, In from 3% to 30%, Cu from 0.3% to 5.0%.
  • FIG 2 are the same geometric for a fuse element Configuration of an interrupted constriction in front of the solder depot reproduced, each in enlargement, the largest Width of the fuse element in nature is 14 mm.
  • the left Illustration was for comparison with a copper fuse element a tin-bismuth solder with about 75% tin and 25% Bismuth used.
  • the right figure of FIG 2 is for a tin-bismuth-copper alloy at 25% bismuth and 0.8% Copper and tin content of 73.7%, a total of 99.5 %, with 0.5% usual impurities, the situation after Interruption of the fusible conductor reproduced by the action of solder. You can imagine that Lot and attacked Fusible conductor in the micrograph a fine structure and clean Have contours. The energy turnover when melting of the fuse element is thus kept low and the formation avoided by heat cracks.
  • the behavior of the proposed three-component alloys can through an oxide skin on the solder in the solder depot and / or on the Fusible conductor, at least in the vicinity of the solder depot be promoted. Through such an oxide skin one can a drainage of the melting solder when the Prevent fuse element in the fuse link. This measure, You can generally use an oxide skin in a targeted manner use with solders that are not inherently stationary are independent of the usual structure of the solder or as Solder serving alloy.
  • Such an oxide skin can be formed thermally or chemically his.
  • the solder and / or the Carriers are treated in an oxidizing atmosphere.

Landscapes

  • Fuses (AREA)
  • Coating With Molten Metal (AREA)
EP00119932A 2000-09-13 2000-09-13 Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz Withdrawn EP1189252A1 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
EP00119932A EP1189252A1 (de) 2000-09-13 2000-09-13 Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
AT01980371T ATE395715T1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz
SI200130845T SI1317763T1 (sl) 2000-09-13 2001-09-11 Varovalni vloĹľek, postopek za njegovo izdelavo in snov za spajkanje
DE50113976T DE50113976D1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz
ES01980371T ES2302752T3 (es) 2000-09-13 2001-09-11 Cartucho fusible, procedimiento para fabricarlo y sustancia de soldadura.
US10/380,238 US7109839B2 (en) 2000-09-13 2001-09-11 Fuse link, method for the production thereof and soldering substance
EP01980371A EP1317763B1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz
CNB018156037A CN100350539C (zh) 2000-09-13 2001-09-11 保险丝、其制造方法与焊料
PCT/EP2001/010499 WO2002023575A1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz
HU0300734A HU226335B1 (en) 2000-09-13 2001-09-11 Fuse link, method for the production thereof and soldering substance
BRPI0113834A BRPI0113834B1 (pt) 2000-09-13 2001-09-11 cartucho fusível, processo para a sua fabricação e substância de solda
PL362409A PL202046B1 (pl) 2000-09-13 2001-09-11 Wkładka bezpiecznikowa, sposób jej wytwarzania i substancja lutownicza dla wkładek bezpiecznikowych
CZ20031036A CZ299341B6 (cs) 2000-09-13 2001-09-11 Pojistková vložka, zpusob její výroby a pájecí materiál

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00119932A EP1189252A1 (de) 2000-09-13 2000-09-13 Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz

Publications (1)

Publication Number Publication Date
EP1189252A1 true EP1189252A1 (de) 2002-03-20

Family

ID=8169826

Family Applications (2)

Application Number Title Priority Date Filing Date
EP00119932A Withdrawn EP1189252A1 (de) 2000-09-13 2000-09-13 Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
EP01980371A Expired - Lifetime EP1317763B1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP01980371A Expired - Lifetime EP1317763B1 (de) 2000-09-13 2001-09-11 Sicherungseinsatz, verfahren zu seiner herstellung und lotsubstanz

Country Status (12)

Country Link
US (1) US7109839B2 (cs)
EP (2) EP1189252A1 (cs)
CN (1) CN100350539C (cs)
AT (1) ATE395715T1 (cs)
BR (1) BRPI0113834B1 (cs)
CZ (1) CZ299341B6 (cs)
DE (1) DE50113976D1 (cs)
ES (1) ES2302752T3 (cs)
HU (1) HU226335B1 (cs)
PL (1) PL202046B1 (cs)
SI (1) SI1317763T1 (cs)
WO (1) WO2002023575A1 (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1557476A1 (en) * 2004-01-15 2005-07-27 ETI Elektroelement d.d. Low melting point alloy of tin, bismuth and antimony for fusible elements of low voltage fuses
DE102006040661A1 (de) * 2006-08-30 2008-03-13 Robert Bosch Gmbh Strom-Überlastschutz eines Bürstenapparates
WO2008116681A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Schmelzlegierungselement, thermosicherung mit einem schmelzlegierungselement sowie verfahren zum herstellen einer thermosicherung

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005171371A (ja) * 2003-12-15 2005-06-30 Uchihashi Estec Co Ltd 合金型温度ヒューズ及び温度ヒューズエレメント用線材
US8454254B2 (en) 2007-11-28 2013-06-04 Kinesis Corporation Support accessory for split keyboard
KR20090090161A (ko) * 2008-02-20 2009-08-25 삼성전자주식회사 전기적 퓨즈 소자
KR20090112390A (ko) * 2008-04-24 2009-10-28 삼성전자주식회사 전기적 퓨즈 소자
JP7231527B2 (ja) * 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703352A (en) * 1953-08-13 1955-03-01 Chase Shawmut Co Fuse and fuse link of the time lag type
GB840655A (en) * 1955-08-23 1960-07-06 Licencia Talalmanyokat Improvements in or relating to electrical safety fuses
US3627517A (en) * 1967-12-16 1971-12-14 Gen Electric Canada Ternary fusible alloy
DE2551627A1 (de) * 1975-11-18 1977-06-02 Borchart Hans F Dipl Ing Schmelzleiter fuer traege elektrische schmelzsicherungen
US6075434A (en) * 1998-02-04 2000-06-13 Ferraz S.A. Fusible element for an electrical fuse

Family Cites Families (14)

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US3236976A (en) * 1961-06-22 1966-02-22 Gen Electric Fuse device
CS265255B1 (cs) * 1987-03-02 1989-10-13 Jindrich Kadlec Tavný vodič elektrické výkonové pojistky
CS363190A2 (en) * 1989-07-24 1991-08-13 Schrack Telecom Thermal cut-out
JP2747877B2 (ja) * 1993-10-28 1998-05-06 矢崎総業株式会社 遅断ヒューズ及びその製造方法
EP0834376A4 (en) * 1995-06-20 2003-01-22 Matsushita Electric Industrial Co Ltd BRAZING SUPPLY METAL, WELDED ELECTRONIC COMPONENT AND ELECTRONIC CIRCUIT PLATE
JP3242835B2 (ja) * 1996-03-29 2001-12-25 矢崎総業株式会社 ヒューズ及びその製造方法
GB9701819D0 (en) * 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy
US6160471A (en) * 1997-06-06 2000-12-12 Littlelfuse, Inc. Fusible link with non-mechanically linked tab description
JPH1125829A (ja) * 1997-07-04 1999-01-29 Yazaki Corp 温度ヒューズ及び車両用ワイヤハーネスの異常検出装置
US6064293A (en) * 1997-10-14 2000-05-16 Sandia Corporation Thermal fuse for high-temperature batteries
JP2000073154A (ja) * 1998-08-27 2000-03-07 Totoku Electric Co Ltd はんだめっき線
EP1134769A1 (en) * 2000-03-08 2001-09-19 Cooper Bussmann UK Limited A method of applying M-effect material
DE10022241A1 (de) * 2000-05-08 2001-11-15 Abb Research Ltd Schmelzleiter und Verfahren zu seiner Herstellung sowie Sicherungsleiter und Sicherung
JP2001325867A (ja) * 2000-05-18 2001-11-22 Sorudaa Kooto Kk 温度ヒューズおよび温度ヒューズ素子用線材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703352A (en) * 1953-08-13 1955-03-01 Chase Shawmut Co Fuse and fuse link of the time lag type
GB840655A (en) * 1955-08-23 1960-07-06 Licencia Talalmanyokat Improvements in or relating to electrical safety fuses
US3627517A (en) * 1967-12-16 1971-12-14 Gen Electric Canada Ternary fusible alloy
DE2551627A1 (de) * 1975-11-18 1977-06-02 Borchart Hans F Dipl Ing Schmelzleiter fuer traege elektrische schmelzsicherungen
US6075434A (en) * 1998-02-04 2000-06-13 Ferraz S.A. Fusible element for an electrical fuse

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1557476A1 (en) * 2004-01-15 2005-07-27 ETI Elektroelement d.d. Low melting point alloy of tin, bismuth and antimony for fusible elements of low voltage fuses
DE102006040661A1 (de) * 2006-08-30 2008-03-13 Robert Bosch Gmbh Strom-Überlastschutz eines Bürstenapparates
WO2008116681A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Schmelzlegierungselement, thermosicherung mit einem schmelzlegierungselement sowie verfahren zum herstellen einer thermosicherung

Also Published As

Publication number Publication date
PL202046B1 (pl) 2009-05-29
PL362409A1 (en) 2004-11-02
CN100350539C (zh) 2007-11-21
CN1455942A (zh) 2003-11-12
US20040027226A1 (en) 2004-02-12
CZ20031036A3 (cs) 2003-09-17
BRPI0113834B1 (pt) 2015-09-15
EP1317763A1 (de) 2003-06-11
BR0113834A (pt) 2004-09-28
HU226335B1 (en) 2008-09-29
EP1317763B1 (de) 2008-05-14
CZ299341B6 (cs) 2008-06-25
HUP0300734A2 (hu) 2003-09-29
ES2302752T3 (es) 2008-08-01
DE50113976D1 (de) 2008-06-26
SI1317763T1 (sl) 2008-10-31
US7109839B2 (en) 2006-09-19
ATE395715T1 (de) 2008-05-15
WO2002023575A1 (de) 2002-03-21
HUP0300734A3 (en) 2005-12-28

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