EP1145290A1 - Vorrichtung und verfahren zum behandeln von substraten - Google Patents

Vorrichtung und verfahren zum behandeln von substraten

Info

Publication number
EP1145290A1
EP1145290A1 EP99957315A EP99957315A EP1145290A1 EP 1145290 A1 EP1145290 A1 EP 1145290A1 EP 99957315 A EP99957315 A EP 99957315A EP 99957315 A EP99957315 A EP 99957315A EP 1145290 A1 EP1145290 A1 EP 1145290A1
Authority
EP
European Patent Office
Prior art keywords
nozzle
substrate
nozzles
fluid
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99957315A
Other languages
German (de)
English (en)
French (fr)
Inventor
Joachim Pokorny
Andreas STEINRÜCKE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Microtech GmbH
Original Assignee
Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Publication of EP1145290A1 publication Critical patent/EP1145290A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
EP99957315A 1998-12-22 1999-11-18 Vorrichtung und verfahren zum behandeln von substraten Withdrawn EP1145290A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19859466A DE19859466C2 (de) 1998-12-22 1998-12-22 Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859466 1998-12-22
PCT/EP1999/008862 WO2000038220A1 (de) 1998-12-22 1999-11-18 Vorrichtung und verfahren zum behandeln von substraten

Publications (1)

Publication Number Publication Date
EP1145290A1 true EP1145290A1 (de) 2001-10-17

Family

ID=7892262

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99957315A Withdrawn EP1145290A1 (de) 1998-12-22 1999-11-18 Vorrichtung und verfahren zum behandeln von substraten

Country Status (7)

Country Link
US (1) US6805754B1 (ja)
EP (1) EP1145290A1 (ja)
JP (1) JP2002533920A (ja)
KR (1) KR20010092757A (ja)
DE (1) DE19859466C2 (ja)
TW (1) TW449774B (ja)
WO (1) WO2000038220A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110424032A (zh) * 2019-09-10 2019-11-08 江苏师范大学 一种用于压力机主轴修复的射流电沉积装置及其方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19911084C2 (de) * 1999-03-12 2002-01-31 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE10162191A1 (de) * 2001-12-17 2003-06-18 Wolfgang Coenen Automatisches Vielkanalätzsystem
DE10235020B4 (de) * 2002-07-31 2004-08-26 Christian-Albrechts-Universität Zu Kiel Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben
JP4747691B2 (ja) * 2005-06-24 2011-08-17 東京エレクトロン株式会社 半導体装置の製造方法
US7470638B2 (en) * 2006-02-22 2008-12-30 Micron Technology, Inc. Systems and methods for manipulating liquid films on semiconductor substrates
US8572891B2 (en) * 2009-10-02 2013-11-05 Magna Closures Inc. Vehicular anti-pinch system with rain compensation
JP5671261B2 (ja) * 2010-06-04 2015-02-18 東京応化工業株式会社 被処理体の処理方法
JP5646354B2 (ja) * 2011-01-25 2014-12-24 東京エレクトロン株式会社 液処理装置および液処理方法
JP2014128776A (ja) * 2012-12-28 2014-07-10 Hoei Service Co Ltd タイルカーペット洗浄装置、及び、タイルカーペット洗浄方法
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법
CN105565240B (zh) * 2016-02-16 2018-07-03 苏州市冯氏实验动物设备有限公司 洗瓶灌装一体机

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US3902513A (en) * 1971-07-06 1975-09-02 Ppg Industries Inc Angled crossfire rinses
US4118303A (en) * 1976-08-30 1978-10-03 Burroughs Corporation Apparatus for chemically treating a single side of a workpiece
JPS62133097A (ja) * 1985-12-04 1987-06-16 Nippon Denso Co Ltd 半導体ウエハのめつき装置
DE3820591A1 (de) * 1988-06-16 1989-12-21 Texas Instruments Deutschland Vorrichtung zum nassaetzen von duennen filmen
JP3112700B2 (ja) * 1991-05-08 2000-11-27 啓一郎 菅沼 半導体製造方法並びにその装置
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
JPH05109690A (ja) * 1991-10-18 1993-04-30 Fujitsu Ltd 半導体ウエーハエツチング装置
US5372652A (en) 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
JP3289459B2 (ja) * 1993-12-29 2002-06-04 カシオ計算機株式会社 メッキ方法及びメッキ装置
DE19522525A1 (de) * 1994-10-04 1996-04-11 Kunze Concewitz Horst Dipl Phy Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen
JP3452676B2 (ja) 1995-02-15 2003-09-29 宮崎沖電気株式会社 半導体ウエハ面のパーティクルの除去装置及びそれを用いた半導体ウエハ面のパーティクルの除去方法
US5807469A (en) * 1995-09-27 1998-09-15 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
US5879576A (en) 1996-05-07 1999-03-09 Hitachi Electronics Engineering Co., Ltd. Method and apparatus for processing substrates
JPH1057877A (ja) 1996-05-07 1998-03-03 Hitachi Electron Eng Co Ltd 基板処理装置及び基板処理方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0038220A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110424032A (zh) * 2019-09-10 2019-11-08 江苏师范大学 一种用于压力机主轴修复的射流电沉积装置及其方法

Also Published As

Publication number Publication date
DE19859466A1 (de) 2000-07-06
TW449774B (en) 2001-08-11
US6805754B1 (en) 2004-10-19
WO2000038220A1 (de) 2000-06-29
DE19859466C2 (de) 2002-04-25
JP2002533920A (ja) 2002-10-08
KR20010092757A (ko) 2001-10-26

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