EP0999934B1 - Jet d'encre a commande thermique - Google Patents

Jet d'encre a commande thermique Download PDF

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Publication number
EP0999934B1
EP0999934B1 EP98933352A EP98933352A EP0999934B1 EP 0999934 B1 EP0999934 B1 EP 0999934B1 EP 98933352 A EP98933352 A EP 98933352A EP 98933352 A EP98933352 A EP 98933352A EP 0999934 B1 EP0999934 B1 EP 0999934B1
Authority
EP
European Patent Office
Prior art keywords
ink
layer
nozzle
actuator
ink jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98933352A
Other languages
German (de)
English (en)
Other versions
EP0999934A4 (fr
EP0999934A1 (fr
Inventor
Kia Silverbrook
Gregory Mcavoy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AUPO8051A external-priority patent/AUPO805197A0/en
Priority claimed from AUPO8040A external-priority patent/AUPO804097A0/en
Priority claimed from AUPO7941A external-priority patent/AUPO794197A0/en
Priority claimed from AUPO8057A external-priority patent/AUPO805797A0/en
Priority claimed from AUPO8033A external-priority patent/AUPO803397A0/en
Priority claimed from AUPO8074A external-priority patent/AUPO807497A0/en
Priority claimed from AUPO8008A external-priority patent/AUPO800897A0/en
Priority claimed from AUPO8043A external-priority patent/AUPO804397A0/en
Priority claimed from AUPO8056A external-priority patent/AUPO805697A0/en
Priority claimed from AUPO8078A external-priority patent/AUPO807897A0/en
Priority claimed from AUPO7951A external-priority patent/AUPO795197A0/en
Priority claimed from AUPO8045A external-priority patent/AUPO804597A0/en
Priority claimed from AUPO8042A external-priority patent/AUPO804297A0/en
Priority claimed from AUPO8050A external-priority patent/AUPO805097A0/en
Priority claimed from AUPO7947A external-priority patent/AUPO794797A0/en
Priority claimed from AUPO7945A external-priority patent/AUPO794597A0/en
Priority claimed from AUPO8064A external-priority patent/AUPO806497A0/en
Priority claimed from AUPO8062A external-priority patent/AUPO806297A0/en
Priority claimed from AUPO8002A external-priority patent/AUPO800297A0/en
Priority claimed from AUPO7943A external-priority patent/AUPO794397A0/en
Priority claimed from AUPO8001A external-priority patent/AUPO800197A0/en
Priority claimed from AUPO8034A external-priority patent/AUPO803497A0/en
Priority claimed from AUPO8007A external-priority patent/AUPO800797A0/en
Priority claimed from AUPO8046A external-priority patent/AUPO804697A0/en
Priority claimed from AUPO7937A external-priority patent/AUPO793797A0/en
Priority claimed from AUPO7948A external-priority patent/AUPO794897A0/en
Priority claimed from AUPO8038A external-priority patent/AUPO803897A0/en
Priority claimed from AUPO7933A external-priority patent/AUPO793397A0/en
Priority claimed from AUPO8011A external-priority patent/AUPO801197A0/en
Priority claimed from AUPO8052A external-priority patent/AUPO805297A0/en
Priority claimed from AUPO8039A external-priority patent/AUPO803997A0/en
Priority claimed from AUPO7952A external-priority patent/AUPO795297A0/en
Priority claimed from AUPO8006A external-priority patent/AUPO800697A0/en
Priority claimed from AUPO8079A external-priority patent/AUPO807997A0/en
Priority claimed from AUPO8010A external-priority patent/AUPO801097A0/en
Priority claimed from AUPO8075A external-priority patent/AUPO807597A0/en
Priority claimed from AUPO7946A external-priority patent/AUPO794697A0/en
Priority claimed from AUPO8037A external-priority patent/AUPO803797A0/en
Priority claimed from AUPO7944A external-priority patent/AUPO794497A0/en
Priority claimed from AUPO8068A external-priority patent/AUPO806897A0/en
Priority claimed from AUPO8503A external-priority patent/AUPO850397A0/en
Priority claimed from AUPO9389A external-priority patent/AUPO938997A0/en
Priority claimed from AUPO9392A external-priority patent/AUPO939297A0/en
Priority claimed from AUPO9393A external-priority patent/AUPO939397A0/en
Priority claimed from AUPO9391A external-priority patent/AUPO939197A0/en
Priority claimed from AUPO9390A external-priority patent/AUPO939097A0/en
Priority claimed from AUPP0892A external-priority patent/AUPP089297A0/en
Priority claimed from AUPP0882A external-priority patent/AUPP088297A0/en
Priority claimed from AUPP0891A external-priority patent/AUPP089197A0/en
Priority claimed from AUPP0894A external-priority patent/AUPP089497A0/en
Priority claimed from AUPP0875A external-priority patent/AUPP087597A0/en
Priority claimed from AUPP0874A external-priority patent/AUPP087497A0/en
Priority claimed from AUPP0889A external-priority patent/AUPP088997A0/en
Priority claimed from AUPP0893A external-priority patent/AUPP089397A0/en
Priority claimed from AUPP0890A external-priority patent/AUPP089097A0/en
Priority claimed from AUPP0888A external-priority patent/AUPP088897A0/en
Priority claimed from AUPP0872A external-priority patent/AUPP087297A0/en
Priority claimed from AUPP0873A external-priority patent/AUPP087397A0/en
Priority claimed from AUPP1396A external-priority patent/AUPP139698A0/en
Priority claimed from AUPP1398A external-priority patent/AUPP139898A0/en
Priority claimed from AUPP2591A external-priority patent/AUPP259198A0/en
Priority claimed from AUPP2593A external-priority patent/AUPP259398A0/en
Priority claimed from AUPP2592A external-priority patent/AUPP259298A0/en
Priority claimed from AUPP3990A external-priority patent/AUPP399098A0/en
Priority claimed from AUPP3989A external-priority patent/AUPP398998A0/en
Priority claimed from AUPP3984A external-priority patent/AUPP398498A0/en
Priority claimed from AUPP3986A external-priority patent/AUPP398698A0/en
Priority claimed from AUPP3991A external-priority patent/AUPP399198A0/en
Priority claimed from AUPP3985A external-priority patent/AUPP398598A0/en
Priority claimed from AUPP3983A external-priority patent/AUPP398398A0/en
Priority claimed from AUPP3987A external-priority patent/AUPP398798A0/en
Priority to EP05109707A priority Critical patent/EP1650030B1/fr
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Priority to EP05109701A priority patent/EP1640162B1/fr
Priority to ES05109756T priority patent/ES2302134T3/es
Priority to EP05109733A priority patent/EP1647402B1/fr
Priority to EP05109763A priority patent/EP1652671B1/fr
Priority to EP05109700A priority patent/EP1637330B1/fr
Priority to EP05109756A priority patent/EP1650031B1/fr
Publication of EP0999934A1 publication Critical patent/EP0999934A1/fr
Publication of EP0999934A4 publication Critical patent/EP0999934A4/fr
Application granted granted Critical
Publication of EP0999934B1 publication Critical patent/EP0999934B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/44—Typewriters or selective printing mechanisms having dual functions or combined with, or coupled to, apparatus performing other functions
    • B41J3/445—Printers integrated in other types of apparatus, e.g. printers integrated in cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1648—Production of print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17596—Ink pumps, ink valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer

Definitions

  • the present invention relates to the field of ink jet printing systems.
  • US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency etectro-static field so as to cause drop separation. This technique is still utilised by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al)
  • Piezo-electric ink jet printers are also one form of commonly utilised ink jet printing device. Piezo-electric systems are disclosed by Kyser et. al. in US Patent No. 3946398 (1970) which utilises a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970) which discloses a squeeze mode of operation of a piezo electric crystal, Stemme in US Patent No. 3747120 (1972) discloses a bend mode of piezo-electric operation, Howkins in US Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a sheer mode type of piezo-electric transducer element.
  • the ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in US Patent 4490728. Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media.
  • Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.
  • a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
  • esoteric techniques are also often utilised. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Patent No. 5,208,604), micro-punching, etc.
  • a sacrificial material to build up a mechanical system, within the sacrificial material being subsequently etched away so as to release the required mechanical structure.
  • a suitable common sacrificial material includes silicon dioxide which can be etched away in hydrofluoric acid.
  • MEMS devices are often constructed on silicon wafers having integral electronics such as, for example, using a multi-level metal CMOS layer.
  • the CMOS process includes the construction of multiple layers which may include the utilization of materials which can be attacked by the sacrificial etchant. This often necessitates the construction of passivation layers using extra processing steps so as to protect other layers from possible unwanted attack by a sacrificial etchant.
  • DE-A-19532913 describes a pressure generating member for applying a pressure to an ink, the member having a symmetric configuration and including a buckling body.
  • the buckling body includes a radially extending ribbed portion on its upper surface and no buckling layer beneath it.
  • a heater layer is interposed between insulating layers for heating the buckling body, the buckling body having its peripheral edge portion fixed on a substrate.
  • a center portion of the buckling body is buckled by being heated.
  • An orifice plate is arranged so as to cover the pressure generating member with interposition of a gap defining a cavity for the ink.
  • the orifice plate is provided with a nozzle serving as an ink discharge outlet located in a portion of the orifice plate opposite to the pressure generating member.
  • the present invention relates to ink jet printing and in particular, discloses a new form of ink jet printer which utilises a planar thermoelastic bend actuator to eject ink from a nozzle chamber.
  • an ink jet nozzle comprising a nozzle chamber having an ink ejection port in one wall of the chamber, an ink supply source interconnected to the nozzle chamber and a thermal actuator activated to eject ink from the nozzle chamber via the ink ejection port, the thermal actuator being activated by means of passing a current through a first layer so as to cause it to expand relative to a second layer.
  • the bottom of the actuator can have a hydrophobic surface and during operation the hydrophobic surface causes an air bubble to form under the thermal actuator.
  • the bottom surface of the actuator can be air vented so as to reduce the actuation energy required to eject ink from the nozzle chamber.
  • the air venting comprises a series of small holes underneath the actuator, the holes being interconnected to an air supply channel for the supply of air to the back of the actuator.
  • the area around the bottom surface of the actuator can be constructed from hydrophobic material.
  • the holes are of a size such that, during operation, any fluid is retained within the nozzle chamber.
  • the actuator is attached at one end to the nozzle chamber and the holes are located near the attached end and the actuator is constructed from polytetrafluoroethylene.
  • the actuator can a bottom layer treated in portions so as to form a conductive material.
  • the thermal actuator can comprise a lower planar surface constructed from a highly conductive material interconnected to an upper planar material constructed from an electrically resistive material such that upon passing a current between the planar surface, the thermal actuator is caused to bend towards the ink ejection port so as to thereby cause the ejection of ink from the ink ejection port.
  • the actuator is attached to a substrate and further includes a stiff paddle portion which increases the degree of bending of the actuator near the point where it is attached to the substrate.
  • the stiff paddle is formed of silicon nitride.
  • the actuator further includes an expansion coating having a high coefficient of thermal expansion on top of the upper planar surface so as to increase the amount of bending of the actuator.
  • the expansion coating can comprise substantially polytetrafluoroethylene. Between the upper and lower planar surfaces there is provided a gap, constructed through the utilisation of a sacrificial material which is deposited and subsequently etched away so as to leave the gap. Further, the upper planar surface includes a plurality of etchant holes provided to allow a more rapid etching of the sacrificial layer during construction.
  • the upper planar surface of the actuator comprises substantially Indium Tin Oxide (ITO) whereas the lower planar surface of the actuator comprises substantially a metal layer. Both surfaces are further coated with a passivation material as required.
  • ITO Indium Tin Oxide
  • Both surfaces are further coated with a passivation material as required.
  • the ink jet nozzle construction can be formed on a silicon wafer utilising micro-electro mechanical systems construction techniques.
  • the thermal actuator can comprise two layers of actuator material having a high coefficient of thermal expansion, a top layer being substantially non conductive and a bottom layer being conductive, the thermal actuator being activated by means of passing a current through the bottom layer so as to cause it to expand relative to the top layer, which is cooled by the chamber ink.
  • the bottom layer comprises portions being conductive and portions being non-conductive such that a circuit is formed for the heating of the bottom layer through the interaction of the conductive and non-conductive portions.
  • the resistive circuit is created having predetermined area of low circuit cross-sectional area so as to produce high levels of heating of the actuators in those areas.
  • the non-conductive portions are formed from the same material as the top layer.
  • the thermal actuator can comprise materials having a high Young's modulus which produce a bending motion upon heating thereby causing the ejection paddle to eject ink from the ink ejection port.
  • the thermal actuator can be pivoted so as to increase the degree of travel of the ejection paddle upon actuation of the thermal actuator and can be of a horseshoe shaped form and pivoted substantially around a midpoint.
  • the pivot point can be constructed on a wall of the chamber by means of a thinned membrane, there by allowing the thermal actuator operates in the ambient atmosphere.
  • the nozzle chamber is constructed on a silicon wafer and the ink is supplied through the silicon wafer.
  • the thermal actuator can be constructed from a thin conductive section having a high Young's modulus and a substantially thicker non conductive portion.
  • the thin conductive portion can comprise titanium diboride and the thicker portion can comprise glass.
  • the nozzle chamber walls can include a number of small sacrificial etchant holes for utilization in construction of the arrangement, the holes being of sufficiently small diameter so as to prevent the ejection of ink therefrom.
  • the arrangement can be constructed using micro-electro mechanical systems techniques including a sacrificial etch and the ejection paddle is released in the sacrificial etch to be in a prefiring position.
  • the preferred embodiments and other embodiments will be discussed under separate headings with the heading including an U number for ease of reference.
  • the headings also include a type designator with T indicating thermal, S indicating shutter type and F indicating a field type.
  • an ink jet printer having nozzle chambers.
  • Each nozzle chamber includes a thermoelastic bend actuator that utilises a planar resistive material in the construction of the bend actuator.
  • the bend actuator is activated when it is required to eject ink from a chamber.
  • nozzle arrangement 210 can be formed as part of an array of nozzles fabricated on a semi-conductor wafer utilising techniques known in the production of micro-electro-mechanical systems (MEMS).
  • MEMS micro-electric mechanical system
  • SPIE International Society for Optical Engineering
  • the nozzle arrangement 210 includes a boron doped silicon wafer layer 212 which can be constructed by a back etching a silicon wafer 218 which has buried boron doped EPITAXIAL LAYER.
  • the boron doped layer can be further etched so as to define a nozzle hole 213 and rim 214.
  • the nozzle arrangement 210 includes a nozzle chamber 216 which can be constructed by utilisation of an anisotropic crystallographic etch of the silicon portions 218 of the wafer.
  • a glass layer 220 which can comprise CMOS drive circuitry including a two level metal layer (not shown) so as to provide control and drive circuitry for the thermal actuator.
  • CMOS glass layer 220 On top of the CMOS glass layer 220 is provided a nitride layer 221 which includes side portions 222 which act to passivate lower layers from etching that is utilised in construction of the nozzle arrangement 210.
  • the nozzle arrangement 210 includes a paddle actuator 224 which is constructed on a nitride base 225 which acts to form a rigid paddle for the overall actuator 224.
  • an aluminium layer 227 is provided with the aluminium layer 227 being interconnected via the vias 228 to the lower CMOS circuitry so as to form a first portion of a circuit.
  • the aluminium layer 227 is interconnected at a point 230 to an Indium Tin Oxide (ITO) layer 229 which provides for resistive heating on demand.
  • ITO layer 229 includes a number of etch holes 231 for allowing the etching away of a lower level sacrificial layer which is formed between the layers 227, 229.
  • the ITO layer is further connected to the lower glass CMOS circuitry layer via the via 232.
  • a polytetrafluoroethylene layer which provides for insulation and the further form of rapid expansion of the top layer 229 upon heating as a result of passing a current through the bottom layer 227 and ITO layer 229 (not shown).
  • the back surface of the nozzle arrangement 210 is placed in an ink reservoir so as to allow ink to flow into nozzle chamber 216.
  • a current is passed through the aluminium layer 227 and ITO layer 229.
  • the aluminium layer 227 provides a very low resistance path to the current whereas the ITO layer 229 provides a high resistance path to the current.
  • Each of the layers 227, 229 are passivated by means of coating by a thin nitride layer (not shown) so as to insulate and passivate the layers from the surrounding ink.
  • the top of the actuator 224 expands more rapidly than the bottom portions of the actuator 224.
  • a gap 228 which can be constructed via utilisation of etching of sacrificial layers so as to dissolve away sacrificial material between the two layers.
  • ink is allowed to enter this area and thereby provides a further cooling of the lower surface of the actuator 224 so as to assist in accentuating the bending.
  • the actuator 224 Upon de-activation of the actuator 224, it returns to its quiescent position above the nozzle chamber 216.
  • the nozzle chamber 216 refills due to the surface tension of the ink through the gaps between the actuator 224 and the nozzle chamber 216.
  • the PTFE layer has a high coefficient of thermal expansion and therefore further assists in accentuating any bending of the actuator 224. Therefore, in order to eject ink from the nozzle chamber 216, a current is passed through the planar layers 227, 229 resulting in resistive heating of the top layer 229 which further results in a general bending down of the actuator 224 resulting in the ejection of ink.
  • the nozzle arrangement 210 is mounted on a second silicon chip wafer which defines an ink reservoir channel to the back of the nozzle arrangement 210 for resupply of ink.
  • Fig. 2 there is illustrated an exploded perspective view illustrating the various layers of a nozzle arrangement 210.
  • the arrangement 210 can, as noted previously, be constructed from back etching to the boron doped layer.
  • the actuator 224 can further be constructed through the utilisation of a sacrificial layer filling the nozzle chamber 216 and the depositing of the various layers 225, 227, 229 and optional PTFE layer before sacrificially etching the nozzle chamber 216 in addition to the sacrificial material in area 228.
  • the nitride layer 221 includes side portions 222 which act to passivate the portions of the lower glass layer 220 which would otherwise be attacked as a result of sacrificial etching.
  • an inkjet nozzle having a thermally based actuator which is highly energy efficient.
  • the thermal actuator is located within a chamber filled with ink and relies upon the thermal expansion of materials when an electric current is being passed through them to activate the actuator thereby causing the ejection of ink out of a nozzle provided in the nozzle chamber.
  • FIG. 27 there are illustrated two adjoining inkjet nozzles 2410 constructed in accordance with an embodiment, with Fig. 28 showing an exploded perspective and Fig. 30 and 2404 showing various sectional views.
  • Each nozzle 2410 can be constructed as part of an array of nozzles on a silicon wafer device and can be constructed utilising semiconductor processing techniques in addition to micro machining and micro fabrication process technology (MEMS) and a full familiarity with these technologies is hereinafter assumed.
  • MEMS micro machining and micro fabrication process technology
  • the nozzle chamber 2410 includes a ink ejection port 2411 for the ejection of ink from within the nozzle chamber.
  • Ink is supplied via an inlet port 2412 which has a grill structure fabricated from a series of posts 2414, the grill acting to filter out foreign bodies within the ink supply and also to provide stability to the nozzle chamber structure.
  • a thermal actuator device 2416 which is interconnected to an electric circuit (not shown) which, when thermally actuated, acts as a paddle bending upwards so as to cause the ejection of ink from each ink ejection port 2411.
  • a series of etchant holes e.g.
  • nozzle chamber 2410 are also provided in the top of nozzle chamber 2410, the holes 2418 being provided for manufacturing purposes only so to allow a sacrificial etchant to easily etch away the internal portions of nozzle chamber 2410.
  • the etchant ports 2418 are of a sufficiently small diameter so that the resulting surface tension holds the ink within chamber 2410 such that no ink leaks out via ports 2418.
  • the thermal actuator 2416 is composed primarily of polytetrafluoroethylene (PTFE) which is a generally hydrophobic material.
  • PTFE polytetrafluoroethylene
  • the top layer of the actuator 2416 is treated or coated so as to make it hydrophilic and thereby attract water/ink via inlet port 2412. Suitable treatments include plasma exposure in an ammonia atmosphere.
  • the bottom surface remains hydrophobic and repels the water from the underneath surface of the actuator 2416.
  • Underneath the actuator 2416 is provided a further surface 2419 also composed of a hydrophobic material such as PTFE.
  • the surface 2419 has a series of holes 2420 in it which allow for the flow of air into the nozzle chamber 2410. The diameter of the nozzle holes 2420 again being of such a size so as to restrict the flow of fluid out of the nozzle chamber via surface tension interactions out of the nozzle chamber.
  • the surface 2419 is separated from a lower level 2423 by means of a series of spaced apart posts e.g. 2422 which can be constructed when constructing the layer 2419 utilising an appropriate mask.
  • the nozzle chamber 2410 but for grill inlet port 2412, is walled on its sides by silicon nitride walls e.g. 2425,2426.
  • An air inlet port is formed between adjacent nozzle chambers such that air is free to flow between the walls 2425,2428. Hence, air is able to flow down channel 2429 and along channel 2430 and through holes e.g. 2420 in accordance with any fluctuating pressure influences.
  • the air flow acts to reduce the vacuum on the back surface of actuator 2416 during operation. As a result, less energy is required for the movement of the actuator 2416.
  • the actuator 2416 is thermally actuated so as to move upwards and cause ink ejection.
  • the actuator Upon deactivation of the actuator 2416, the actuator lowers with a corresponding airflow out of port 2420 along channel 2430 and out of channel 2429.
  • Any fluid within nozzle chamber 2410 is firstly repelled by the hydrophobic nature of the bottom side of the surface of actuator 2416 in addition to the top of the surface 2419 which is again hydrophobic.
  • the limited size holes e.g. 2420 further stop the fluid from passing the holes 2420 as a result of surface tension characteristics.
  • a further preferable feature of nozzle chamber 2410 is the utilisation of the nitride posts 2414 to also clamp one end of the surfaces 2416 and 2419 firmly to bottom surface 2420 thereby reducing the likelihood delaminating during operation.
  • Fig. 28 there is illustrated an exploded perspective view of a single nozzle arrangement 2410.
  • the exploded perspective view illustrates the form of construction of each layer of a simple nozzle arrangement 2410.
  • the nozzle arrangement can be constructed on a base silicon wafer 2434 having a top glass layer which includes the various drive and control circuitry and which, for example, can comprise a two level metal CMOS layer with the various interconnects (not shown).
  • CMOS layer two level metal CMOS layer with the various interconnects (not shown).
  • a nitride passivation layer 2423 of approximately one micron thickness which includes a number of vias (not shown) for the interconnection of the subsequent layers to the CMOS layer 2435.
  • the nitride layer is provided primarily to protect lower layers from corrosion or etching, especially where sacrificial etchants are utilized.
  • a one micron PTFE layer 2419 is constructed having the aforementioned holes e.g. 2420 and posts 2422.
  • the structure of the PTFE layer 2419 can be formed by first laying down a sacrificial glass layer (not shown) onto which the PTFE layer 2419 is deposited.
  • the PTFE layer 2419 includes various features, for example, a lower ridge portion 2438 in addition to a hole 2439 which acts as a via for the subsequent material layers.
  • the actuator proper is formed from two PTFE layers 2440,2441.
  • the lower PTFE layer 2440 is made conductive.
  • the PTFE layer 2440 can be made conductive utilising a number of different techniques including:
  • a second PTFE layer 2441 which can be a standard non conductive PTFE layer and can include filling in those areas in the lower PTFE layer e.g. 2443 which are not conductive.
  • the top of the PTFE layer is further treated or coated to make it hydrophilic.
  • a nitride layer can be deposited to form the nozzle chamber proper.
  • the nitride layer can be formed by first laying down a sacrificial glass layer and etching the glass layer to form walls e.g. 2425, 2426 and grilled portion e.g. 2414.
  • the mask utilised results a first anchor portion 2445 which mates with the hole 2439 in layer 2419 so as to fix the layer 2419 to the nitride layer 2423.
  • the bottom surface of the grill 2414 meets with a corresponding step 2447 in the PTFE layer 2441 so as to clamp the end portion of the PTFE layers 2441,2440 and 2439 to the wafer surface so as to guard against delamination.
  • a top nitride layer 2450 can be formed having a number of holes e.g. 2418 and nozzle hole 2411 around which a rim can be etched through etching of the nitride layer 2450. Subsequently, the various sacrificial layers can be etched away so as to release the structure of the thermal actuator.
  • inkjet nozzles 2410 can be created side by side on a single wafer.
  • the ink can be supplied via ink channels etched through the wafer utilising a high density low pressure plasma etching system such as that supplied by Surface Technology Systems of the United Kingdom.
  • a "roof shooting" ink jet print head is constructed utilising a buckle plate actuator for the ejection of ink.
  • the buckle plate actuator is constructed from polytetrafluoroethylene (PTFE) which provides superior thermal expansion characteristics.
  • PTFE polytetrafluoroethylene
  • the PTFE is heated by an integral, serpentine shaped heater, which preferably is constructed from a resistive material, such as copper.
  • Fig. 46 there is shown a sectional perspective view of an ink jet head 2701 of an embodiment.
  • the ink jet head includes a nozzle chamber 2702 in which ink is stored to be ejected.
  • the chamber 2702 can be independently connected to an ink supply (not shown) for the supply and refilling of the chamber.
  • a buckle plate 2703 which comprises a heater element 2704 which can be an electrically resistive such as copper.
  • the heater element 2704 is encased in a polytetrafluoroethylene layer 2705.
  • the utilisation of the PTFE layer 2705 allows for high rates of thermal expansion and therefore more effective operation of the buckle plate 2703.
  • PTFE has a high coefficient of thermal expansion (77010 -6 ) with the copper having a much lower degree of thermal expansion.
  • the copper layer 2704 is therefore fabricated in a serpentine pattern so as to allow the expansion of the PTFE layer to proceed unhindered.
  • the serpentine fabrication of the heater means that the two coefficients of thermal expansion of the PTFE and the heater material need not be closely matched.
  • the PTFE is primarily chosen for its high thermal expansion properties.
  • the heater coil 2704 is energised thereby heating the PTFE 2705.
  • the PTFE 2705 expands and buckles between end portions 2712, 2713.
  • the buckle causes initial ejection of ink out of a nozzle 2715 located at the top of the nozzle chamber 2702.
  • There is an air bubble between the buckle plate 2703 and the adjacent wall of the chamber which forms due to the hydrophobic nature of the PTFE on the back surface of the buckle plate 2703.
  • An air vent 2717 connects the air bubble to the ambient air through a channel 2718 formed between a nitride layer 2719 and an additional PTFE layer 2720, separated by posts, e.g. 2721, and through holes, e.g. 2722, in the PTFE layer 2720.
  • the air vent 2717 allows the buckle plate 2703 to move without being held back by a reduction in air pressure as the buckle plate 2703 expands. Subsequently, power is turned off to the buckle plate 2703 resulting in a collapse of the buckle plate and the sucking back of some of the ejected ink. The forward motion of the ejected ink and the sucking back is resolved by an ink drop breaking off from the main volume of ink and continuing onto a page. Ink refill is then achieved by surface tension effects across the nozzle part 2715 and a resultant inflow ink into the nozzle chamber 2702 through the grilled supply channel 2716.
  • the nozzle chamber 2702 is ready for refiring.
  • Fig. 47 there is provided an exploded perspective view partly in sections illustrating the construction of a single ink jet nozzle in accordance with an embodiment.
  • the nozzle arrangement 2701 is fabricated on top of a silicon wafer 2725.
  • the nozzle arrangement 2701 can be constructed on the semi-conductor wafer 2725 utilising standard semi-conductor processing techniques in addition to those techniques commonly used for the construction of micro-electro-mechanical systems (MEMS).
  • MEMS micro-electro-mechanical systems
  • CMOS circuitry layer 2726 On top of the silicon layer 2725 is deposited a two level CMOS circuitry layer 2726 which substantially comprises glass, in addition to the usual metal layers.
  • a nitride layer 2719 is deposited to protect and passivate the underlying layer 2726.
  • the nitride layer 2719 also includes vias for the interconnection of the heater element 2704 to the CMOS layer 2726.
  • a PTFE layer 2720 is constructed having the aforementioned holes, e.g. 2722, and posts, e.g. 2721.
  • the structure of the PTFE layer 2720 can be formed by first laying down a sacrificial glass layer (not shown) onto which the PTFE layer 2720 is deposited.
  • the PTFE layer 2720 includes various features, for example, a lower ridge portion 2727 in addition to a hole 2728 which acts as a via for the subsequent material layers.
  • the buckle plate 2703 (Fig. 46) comprises a conductive layer 2731 and a PTFE layer 2732.
  • a first, thicker PTFE layer is deposited onto a sacrificial layer (not shown).
  • a conductive layer 2731 is deposited including contacts 2729, 2730.
  • the conductive layer 2731 is then etched to form a serpentine pattern.
  • a thinner, second PTFE layer is deposited to complete the buckle plate 2703 (Fig. 46) structure.
  • a nitride layer can be deposited to form the nozzle chamber proper.
  • the nitride layer can be formed by first laying down a sacrificial glass layer and etching this to form walls, e.g. 2733, and grilled portions, e.g. 2734.
  • the mask utilised results in a first anchor portion 2735 which mates with the hole 2728 in layer 2720.
  • the bottom surface of the grill, for example 2734 meets with a corresponding step 2736 in the PTFE layer 2732.
  • a top nitride layer 2737 can be formed having a number of holes, e.g.
  • a new form of thermal actuator is utilized for the ejection of drops of ink on demand from an ink nozzle.
  • Fig. 62 to Fig. 65 there will be illustrated the basis of operation of the inkjet printing device utilising the actuator.
  • Fig. 62 there is illustrated 2901, the quiescent position of a thermal actuator 2902 in a nozzle chamber 2903 filled with ink and having a nozzle 2904 for the ejection of ink.
  • the nozzle 2904 has an ink meniscus 2905 in a state of surface tension ready for the ejection of ink.
  • the thermal actuator 2902 is coated on a first surface 2906, facing the chamber 2903, with a hydrophilic material.
  • a second surface 2907 is coated with a hydrophobic material which causes an air bubble 2908 having a meniscus 2909 underneath the actuator 2902.
  • the air bubble 2908 is formed over time by outgassing from the ink within chamber 2903 and the meniscus 2909 is shown in an equilibrium position between the hydrophobic 2907 and hydrophilic 2906 surfaces.
  • the actuator 2902 is fixed at one end 2911 to a substrate 2912 from which it also derives an electrical connection.
  • the actuator 2902 When it is desired to eject a drop from the nozzle 2904, the actuator 2902 is activated as shown in Fig. 63, resulting in a movement in direction 2914, the movement in direction 2914 causes a substantial increase in the pressure of the ink around the nozzle 2904. This results in a general expansion of the meniscus 2905 and the passing of momentum to the ink so as to form a partial drop 2915. Upon movement of the actuator 2902 in the direction 2914, the ink meniscus 2909 collapses generally in the indicated direction 2916.
  • the thermal actuator 2902 is deactivated as illustrated in Fig. 64, resulting in a return of the actuator 2902 in the direction generally indicated by the arrow 2917.
  • the movement back of the actuator 2917 results in a low pressure region being experienced by the ink within the nozzle area 2904.
  • the forward momentum of the drop 2915 and the low pressure around the nozzle 2904 results in the ink drop 2915 being broken off from the main body of the ink.
  • the drop 2915 continues to the print media as required.
  • the movement of the actuator 2902 in the direction 2917 further causes ink to flow in the direction 2919 around the actuator 2902 in addition to causing the meniscus 2909 to move as a result of the ink flow 2919. Further, further ink 2920 is sucked into the chamber 2903 to refill the ejected ink 2915.
  • the actuator 2902 returns to its quiescent with the meniscus 2905 also returning to a state of having a slight bulge.
  • the actuator 2902 is then in a state for refiring of another drop on demand as required.
  • Fig. 245 there is illustrated a cross-section through one form of suitable nozzle chamber.
  • One end 2911 of the actuator 2902 is connected to the substrate 2912 and the other end includes a stiff paddle 2925 for utilisation in ejecting ink.
  • the actuator itself is constructed from four a layer MEMs processing technique. The layers are as follows:
  • Fig. 67 there is illustrated an exploded perspective view of a single ink jet nozzle as constructed in accordance with an embodiment.
  • the construction of a print-head can proceed as follows:
  • the actuation of an actuator for the ejection of ink is based around the utilisation of material having a High Young's modulus.
  • materials are utilised for the ejection of ink which have a high bend efficiency when thermally heated.
  • the inkjet print head is constructed utilising standard MEMS technology and therefore should utilise materials that are common in the construction of semi-conductor wafers.
  • the materials have been chosen through the utilisation of a bend efficiency for actuator devices which can be calculated as the coefficient of thermal expansion times young's modulus divided by the heat capacity and the density.
  • Coefficient of thermal expansion The greater the coefficient of thermal expansion, the greater will be the degree of movement for any particular heating of a thermal actuator.
  • Young's Modulus provides a measure of the tensile or compressive stress of a material and is an indicator of the "strength" of the bending movement. Hence, a material having a high Young's modulus or strength is desirable.
  • Heat capacity In respect of the heat capacity, the higher the heat capacity, the greater the ability of material to absorb heat without deformation. This is an undesirable property in a thermal actuator.
  • Density The denser the material the greater the heat energy required to heat the material and again, this is an undesirable property.
  • Example materials and their corresponding "Bend Efficiencies" are listed in the following table: MATERIAL CTE *10 -6 /K Young's modulus Gpa Heat capacity W/Kg/C Density Kg/M 3 "Bend efficiency" Gold 14.2 80 129 19300 456 PTFE 770 1.3 1024 2130 459 Silicon Nitride 3.3 337 712 3200 488 Osmium 2.6 581 130 22570 515 Tantalum-Tungsten alloy 6.48 186 140 16660 517 Silver 18.9 71 235 10500 544 Platinum 8.8 177 133 21500 545 Copper 16.5 124 385 8960 593 Molybdenum 4.8 323 251 10200 606 Aluminium 23.1 28.9 897 2700 657 Nickel 13.4 206 444 8900 699 Tungsten 4.5 408 132 19300 721 Ruthenium 5.05 394 247 12410 1067 Stainless Steel 20.2 215 500 7850 1106 Iridium 6.8 549 130 22650 1268 High Silicon Brass 3
  • a fulcrum arrangement is utilised to substantially increase the travel of a material upon heating thereby more fully utilizing the effect of the High Young's modulus material.
  • a single nozzle 3201 of an inkjet device constructed in accordance with an embodiment.
  • Fig. 313 illustrates a side perspective view of a single nozzle
  • Fig. 83 is an exploded perspective of the arrangement of Fig. 82.
  • the single nozzle 3201 can be constructed as part of an array of nozzles formed on a silicon wafer 3202 utilising standard MEM processing techniques.
  • CMOS layer 3203 On top of the silicon wafer 3202 is formed a CMOS layer 3203 which can include multiple metal layers formed within glass layers in accordance with the normal CMOS methodologies.
  • the wafer 3202 can contain a number of etched chambers eg. 3233 the chambers being etched through the wafer utilising a deep trench silicon etcher.
  • a suitable plasma etching process can include a deep anisotropic trench etching system such as that available from SDS Systems Limited (See “Advanced Silicon Etching Using High Density Plasmas" by J.K. Bhardwaj, H. Ashraf, page 224 of Volume 2639 of the SPIE Proceedings in Micro Machining and Micro Fabrication Process Technology).
  • An embodiment 3201 includes two arms 3204,3205 which operate in air and are constructed from a thin 0.3 micrometer layer of titanium diboride 3206 on top of a much thicker 5.8 micron layer of glass 3207.
  • the two arms 3204,3205 are joined together and pivot around a point 3209 which is a thin membrane forming an enclosure which in turn forms part of the nozzle chamber 3210.
  • the arms 3204 and 3205 are affixed by posts 3211,3212 to lower aluminium conductive layers of 3214,3215 which can form part of the CMOS layer 3203.
  • the outer surfaces of the nozzle chamber 3218 can be formed from glass or nitride and provides an enclosure for the filling with ink.
  • the outer chamber 3218 includes a number of etchant holes e.g. 3219 which are provided for the rapid sacrificial etchant of internal cavities during construction.
  • a nozzle rim 3220 is further provided around an ink ejection port 3221 for the ejection of ink.
  • the paddle surface 3224 is bent downwards as a result of release of the structure during fabrication.
  • a current is passed through the titanium boride layer 3206 so as to cause heating of this layer along arms 3204 and 3205.
  • the heating generally expands the T 1 B 2 layer of arms 3204 and 3205 which have a high young's modulus.
  • This expansion acts to bend the arms generally downwards, which are in turn being pivoted around the membrane 3209.
  • the pivoting results in a rapid upward bending of the arm 3225 which in turn results in a rapid upward movement of the paddle surface 3224.
  • the upward movement of the paddle surface 3224 causes the ejection of ink from the nozzle chamber 3221.
  • the increase in pressure is insufficient to overcome the surface tension characteristics of the smaller etchant holes 3219 with the result being that ink is ejected from the nozzle chamber hole 3221.
  • the thin titanium diboride strip 3206 has a sufficiently high young's modulus so as to cause the glass layer 3207 to be bent upon heating of the titanium diboride layer 3206.
  • the operation of the inkjet device can be as illustrated in Fig. 84 to Fig. 86.
  • the inkjet nozzle In its quiescent state, the inkjet nozzle is as illustrated in Fig. 84, generally in the bent down position with the ink meniscus 3230 forming a slight bulge and the paddle being pivoted around the membrane wall 3209.
  • the heating of the titanium diboride layers causes it to expand. Subsequently, it is bent by the glass layer 3207 so as to cause the pivoting of the paddle 3224 around the membrane wall 3209 as indicated in Fig. 85.
  • Fig. 86 there is illustrated a portion of a print head 3240 showing a multi-coloured series of inkjet nozzles suitably arranged to form a multi-coloured print head.
  • the portion is shown, partially in section so as to illustrate the through wafer etching process
  • each nozzle has a nozzle chamber having a slotted side wall through which is formed an actuator mechanism attached to a vane within the nozzle chamber such that the actuator can be activated to move the vane within the nozzle chamber to thereby cause ejection of ink from the nozzle chamber.
  • FIG. 101 an example of an ink jet nozzle arrangement 3301 as constructed in accordance with an embodiment.
  • the nozzle arrangement includes a nozzle chamber 3302 normally filled with ink and an actuator mechanism 3303 for actuating a vane 3304 for the ejection of ink from the nozzle chamber 3302 via an ink ejection port 3305.
  • Fig. 101 is a perspective view of the ink jet nozzle arrangement of an embodiment in its idle or quiescent in position.
  • Fig. 102 illustrates a perspective view after actuation of the actuator 3303.
  • the actuator 3303 includes two arms 3306, 3307.
  • the two arms can be formed from titanium di-boride (TiB 2 ) which has a high Young's modulus and therefore provides a large degree of bending strength.
  • a current is passed along the arms 3306, 3307 with the arm 3307 having a substantially thicker portion along most of its length.
  • the arm 3307 is stiff but for in the area of thinned portion 3308 and hence the bending moment is concentrated in the area 3308.
  • the thinned arm 3306 is of a thinner form and is heated by means of resistive heating of a current passing through the arms 3306, 3307.
  • the arms 3306, 3307 are interconnected to electrical circuitry via connections 3310, 3311.
  • the arm 3306 Upon heating of the arm 3306, the arm 3306 is expanded with the bending of the arm 3307 being concentrated in the area 3308. This results in movement of the end of the actuator mechanism 3303 which proceeds through a slot in the wall nozzle chamber 3302. The bending further causes movement of vane 3304 so as to increase the pressure of the ink within the nozzle chamber and thereby cause its subsequent ejection from ink ejection nozzle 3305.
  • the nozzle chamber 3302 is refilled via an ink channel 3313 (Fig. 103) formed in the wafer substrate 3314. After movement of the vane 3304, so as to cause the ejection of ink, the current to arm 3306 is turned off which results in a corresponding back movement of the end vane 3304.
  • the ink within nozzle chamber 3302 is then replenished by means of wafer ink supply channel 3313 which is attached to an ink supply formed on the back of wafer 3314.
  • the refill can be by means of a surface tension reduction effects of the ink within nozzle chamber 3302 across ink ejection port 3305.
  • Fig. 103 illustrates an exploded perspective view of the components of the ink jet nozzle arrangement.
  • an embodiment can be constructed utilising semiconductor processing techniques in addition to micro machining and micro fabrication process technology (MEMS) and a full familiarity with these technologies is hereinafter assumed.
  • MEMS micro machining and micro fabrication process technology
  • MEMS micro-electro mechanical system
  • the nozzles can preferably be constructed by constructing a large array of nozzles on a single silicon wafer at a time.
  • the array of nozzles can be divided into multiple print heads, with each print head itself having nozzles grouped into multiple colours to provide for full colour image reproduction.
  • the arrangement can be constructed via the utilisation of a standard silicon wafer substrate 3314 upon which is deposited an electrical circuitry layer 3316 which can comprise a standard CMOS circuitry layer.
  • the CMOS layer can include an etched portion defining pit 3317.
  • a protective layer (not shown) which comprise silicon nitride or the like.
  • a sacrificial material which is initially suitably etched so as to form cavities for the portion of the thermal actuator 3303 and bottom portion of the vane 3304, in addition to the bottom rim of nozzle chamber 3302. These cavities can then be filled with titanium di-boride.
  • a similar process is used to form the glass portions of the actuator.
  • a further layer of sacrificial material is deposited and suitably etched so as to form the rest of the vane 3304 in addition to a portion of the nozzle chamber walls to the same height of vane 3304.
  • a further sacrificial layer is deposited and etched in a suitable manner so as to form the rest of the nozzle chamber 3302.
  • the top surface of the nozzle chamber is further etched so as to form the nozzle rim rounding the ejection port 3305.
  • the sacrificial material is etched away so as to release the construction of an embodiment. It will be readily evident to those skilled in the art that other MEMS processing steps could be utilized.
  • the thermal actuator and vane portions 3303 and 3304 in addition to the nozzle chamber 3305 are constructed from titanium di-boride.
  • the utilisation of titanium di-boride is standard in the construction of semiconductor systems and, in addition, its material properties, including a high Young's modulus, is utilised to advantage in the construction of the thermal actuator 3303.
  • the actuator 3303 is covered with a hydrophobic material, such as Teflon, so as to prevent any leaking of the liquid out of the slot 3319.
  • the ink channel can be etched through the wafer utilising a high anisotropic silicon wafer etchers. This can be done as an anisotropic crystallographic silicon etch, or an anisotropic dry etch.
  • a dry etch system capable of high aspect ratio deep silicon trench etching such as the Surface Technology Systems (STS) Advance Silicon Etch (ASE) system is recommended for volume production, as the chip size can be reduced over a wet etch.
  • STS Surface Technology Systems
  • ASE Advance Silicon Etch
  • the wet etch is suitable for small volume production where a suitable plasma etch system is not available.
  • ink access can be around the sides of the print head chips. If ink access is through the wafer higher ink flow is possible, and there is less requirement for high accuracy assembly.
  • ink access is around the edge of the chip, ink flow is severely limited, and the print head chips must be carefully assembled onto ink channel chips. This latter process is difficult due to the possibility of damaging the fragile nozzle plate.
  • plasma etching is used, the chips can be effectively diced at the same time. Separating the chips by plasma etching allows them to be spaced as little as 35 micron apart, increasing the number of chips on a wafer.
  • an inkjet printer having a series of ink ejection mechanisms wherein each ink ejection mechanism includes a paddle actuated by a coil actuator, the coil spring actuator having a unique cross section so as to provide for efficient actuation as a coiled thermal actuator.
  • the ink ejection mechanism 3401 includes a chamber 3402 having a rim 3403.
  • the chamber 3402 is normally filled with ink which bulges out around a surface having a border along the edge of rim 3403, the ink being retained within the chamber 3402 by means of surface tension around the rim 3403.
  • a thermal actuator device 3405 Outside of the chamber 3402 is located a thermal actuator device 3405.
  • the thermal actuator device 3405 is interconnected via a strut 3406 through a hole 3407 to a paddle device within the chamber 3402.
  • the strut 3407 and hole 3406 is treated so as to be hydrophobic.
  • the hole 3407 is provided in a thin elongated form so that surface tension characteristics also assist in stopping any ink from flowing out of the hole 3407.
  • the thermal actuator 3405 comprises a first arm portion 3409 which can be constructed from glass or other suitable material.
  • a second arm portion 3410 can be constructed from material such as titanium diboride which has a large Young's modulus or bending strength and hence, when a current is passed through the titanium diboride layer 3410, it expands with a predetermined coefficient of thermal expansion.
  • the expansion of the thin strip 3410 has a high Young's modulus or bending strength and therefore the thin strip 3410 is able to bend the much thicker strip 3409 which has a substantially lower Young's modulus.
  • Fig. 118 there is illustrated a cross-section of the arm through the line II-II of Fig. 117 illustrating the structure of the actuator 3405.
  • the heater arm 3405 includes two titanium diboride portions 3410a, 3410b forming a circuit around the coil in addition to the glass portion 3409 which also provides for electrical isolation of the two arms, the arms being conductively joined at the strut end.
  • the actuator is deactivated resulting in a general urge for the paddle 3408 to return to its rest position.
  • This results in the ink being sucked back into the chamber 3402 which in turn results in the meniscus necking and breaking off into a meniscus 3412 and ink drop 3414, the drop 3414 proceeding to a paper or film medium (not shown) for marking.
  • the meniscus 3412 has generally a concave shape and surface tension characteristics result in chamber refilling by means of in flow 3413 from an ink supply channel etched through the wafer. The refill being as a consequence of surface tension forces on the meniscus 3412. Eventually the meniscus returns to its quiescent state as illustrated in Fig. 119.
  • Fig. 122 there is illustrated an exploded perspective view of a single ink ejection mechanism 3401 illustrating the various material layers.
  • the ink ejection mechanism 3401 can be formed as part of a large array of mechanisms forming a print head with multiple print heads being simultaneously formed on a silicon wafer.
  • the wafer 3407 is initially processed so as to incorporate a standard CMOS circuitry layer 3418 which provides for the electrical interconnect for the control the conductive portions of the actuator.
  • the CMOS layer 3418 can be completed with a silicon nitride passivation layer so as to protect it from subsequent processing steps in addition to ink flows through channel 3420.
  • the subsequent layers eg.
  • MEMS micro-electro mechanical systems
  • sacrificial aluminium layers in addition to the deposit of the layers 3410 constructed from titanium diboride the layer 3409 constructed from glass material and the nozzle chamber proper 3402 again constructed from titanium diboride.
  • MEMS micro-electro mechanical systems
  • Each of these layers can be built up in a sacrificial material such as aluminium which is subsequently etched away.
  • an ink supply channel eg. 3421 can be etched through the wafer 3417.
  • the etching can be by means of an isotropic crystallagraphic silicon etch or an isotropic dry etch.
  • a dry etch system capable of high aspect ratio silicon trench etching such as the Surface Technology Systems (STS) Advance Silicon Etch (ASE) system is recommended.
  • STS Surface Technology Systems
  • ASE Advance Silicon Etch
  • the nozzle arrangement 3401 can be attached to a ink supply apparatus for supplying ink to the reverse surface of the wafer 3417 so that ink can flow into chamber 3402.
  • nozzle chamber 3402 including rim 3403 in addition to the area surrounding slot 3407 can then be hydrophobically treated so as to reduce the possibility of any ink exiting slot 3407.
  • an inkjet printing arrangement arranged on a silicon wafer.
  • the ink is supplied to a first surface of the silicon wafer by means of channels etched through the back of the wafer to an ink ejection chamber located along the surface of the wafer.
  • the ink ejection chamber is filled with ink and includes a paddle vane attached to an external actuator which is activated so as to compress a portion of the ink within the chamber against a sidewall resulting in the corresponding ejection of the ink from the chamber.
  • Fig. 139 illustrates the ink ejection arrangement 3501 in the quiescent position with Fig. 140 illustrating the preferred arrangement 3501 after activation of the thermal actuator 3507 and Fig. 141 illustrates an exploded perspective of the ink ejection arrangement 3501.
  • ink is supplied to an ink ejection chamber 3502 from an ink supply channel 3503 which is etched through the wafer 3504 and supplies ink to the ejection chamber 3502.
  • a paddle 3506 Located between the supply channel 3503 and the ejection chamber 3502 is a paddle 3506 which is attached to an actuated device 3507, which can comprise a thermal actuator.
  • the actuator 3507 is actuated, the paddle 3506 is caused to move as illustrated in Fig. 140 thereby compressing ink within the ink ejection chamber 3502 resulting in its corresponding ejection from the chamber 3502.
  • the actuator 3507 comprises a coiled arm which is in turn made up of three sub-arm components.
  • Fig. 142 there is illustrated a section through the line IV-IV of Fig. 139 illustrating the structure of the arm which includes an upper conductive arm 3510 and a lower conductive arm 3511.
  • the two arms can be made from conductive titanium diboride which has a high Young's modulus in addition to a suitably high coefficient of thermal expansion.
  • the two arms 3510, 3511 are incased in a silicon nitride portion of the arm 3512.
  • the two arms 3510, 3511 are conductively interconnected at one end 3513 (Fig. 139) of the actuator 3507 and, at the other end they are electrically interconnected 3514, 3515 to control circuitry to a lower CMOS layer 3517 which includes the drive circuitry for activating the actuator 3507.
  • the conductive heating of the arms 3510, 3511 result in a general expansion of these two arms 3510, 3511.
  • the expansion works against the nitride portion 3512 of the arm resulting in an "uncoiling" of the actuator 3507 which in turn results in corresponding movement of the paddle 3506 resulting in the ejection of ink from the nozzle chamber 3502.
  • the nozzle chamber 3502 can include a rim 3518 which, for convenience, can also be constructed also from titanium diboride.
  • the rim includes an arc profile eg. 3519 which is designed to follow the path swept out by paddle 3506 as it expands as a result of actuation of the actuator 3507.
  • the walls of ink ejection chamber 3502 are similarly profiled.
  • the wafer can then be separated into printhead units and interconnected to an ink supply along the back surface of the wafer for the supply of ink to the nozzle arrangement.
  • a portion 3549 of an array of nozzles which can include a three colour output including a first colour series 3550, second colour series 3551 and third colour series 3552.
  • Each colour series is further divided into two rows of ink ejection units with each unit providing for the ink ejection of drops corresponding to a single pixel of a line.
  • a page width array of nozzles can be formed including appropriate bond pads eg. 3555 for providing for an electrical interconnect.
  • the page width printhead can be formed by silicon wafer with multiple print heads being formed simultaneously utilising the aforementioned steps. Subsequently, the print heads can be separated and joined on an ink supply mechanism for supplying ink via the back of the wafer to each ink ejection arrangement, the supply being suitably arranged for providing the separate colours.
  • an inkjet printhead having an array of nozzles wherein the nozzles are grouped in pairs and each pair is provided with a single actuator which is actuated so as to move a paddle type mechanism to force the ejection of ink out of one or other of the nozzle pairs.
  • the paired nozzles eject ink from a single nozzle chamber which is resupplied by means of an ink supply channel.
  • the actuator of an embodiment has unique characteristics so as to simplify the actuation process.
  • a single nozzle chamber 3601 is utilised to supply ink two ink ejection nozzles 3602, 3603.
  • Ink is resupplied to the nozzle chamber 3601 via means of an ink supply channel 3605.
  • ink menisci 3606, 3607 are formed around the ink ejection holes 3602, 3603.
  • the arrangement of Fig. 177 being substantially axially symmetric around a central paddle 3609 which is attached to an actuator mechanism.
  • the paddle 3609 When it is desired to eject ink out of one of the nozzles, say nozzle 3603, the paddle 3609 is actuated so that it begins to move as indicated in Fig. 178.
  • the movement of paddle 3609 in the direction 3610 results in a general compression of the ink on the right hand side of the paddle 3609.
  • the compression of the ink results in the meniscus 3607 growing as the ink is forced out of the nozzles 3603.
  • the meniscus 3606 undergoes an inversion as the ink is sucked back on the left hand side of the actuator 3610 with additional ink 3612 being sucked in from ink supply channel 3605.
  • the paddle actuator 3609 eventually comes to rest and begins to return as illustrated in Fig. 179.
  • the ink 3613 within meniscus 3607 has substantial forward momentum and continues away from the nozzle chamber whilst the paddle 3609 causes ink to be sucked back into the nozzle chamber. Further, the surface tension on the meniscus 3606 results in further in flow of the ink via the ink supply channel 3605.
  • the resolution .of the forces at work in the resultant flows results in a general necking and subsequent breaking of the meniscus 3607 as illustrated in Fig. 180 wherein a drop 3614 is formed which continues onto the media or the like.
  • the paddle 3609 continues to return to its quiescent position.
  • the paddle 3609 returns to its quiescent position and the nozzle chamber refills by means of surface tension effects acting on meniscuses 3606, 3607 with the arrangement of returning to that showing in Fig. 177.
  • the actuator 3609 can be activated to eject ink out of the nozzle 3602 in a symmetrical manner to that described with reference to Fig. 177 to Fig. 181.
  • a single actuator 3609 is activated to provide for ejection out of multiple nozzles.
  • the dual nozzle arrangement has a number of advantages including in that movement of actuator 3609 does not result in a significant vacuum forming on the back surface of the actuator 3609 as a result of its rapid movement.
  • meniscus 3606 acts to ease the vacuum and further acts as a "pump" for the pumping of ink into the nozzle chamber.
  • the nozzle chamber is provided with a lip 3615 (Fig. 178) which assists in equalising the increase in pressure around the ink ejection holes 3603 which allows for the meniscus 3607 to grow in an actually symmetric manner thereby allowing for straight break off of the drop 3614.
  • the actuator 3620 includes a pivot arm attached at the post 3621.
  • the pivot arm includes an internal core portion 3622 which can be constructed from glass.
  • On each side 3623, 3624 of the internal portion 3622 is two separately control heater arms which can be constructed from an alloy of copper and nickel (45% copper and 55% nickel).
  • the utilisation of the glass core is advantageous in that it has a low coefficient thermal expansion and coefficient of thermal conductivity.
  • any energy utilised in the heaters 3623, 3624 is substantially maintained in the heater structure and utilised to expand the heater structure and opposed to an expansion of the glass core 3622.
  • Structure or material chosen to form part of the heater structure preferably has a high "bend efficiency".
  • bend efficiency can be the youngs modulus times the coefficient of thermal expansion divided by the density and by the specific heat capacity.
  • the copper nickel alloy in addition to being conductive has a high coefficient of thermal expansion, a low specific heat and density in addition to a high young's modulus. It is therefore a highly suitable material for construction of the heater element although other materials would also be suitable.
  • Each of the heater elements can comprise a conductive out and return trace with the traces being insulated from one and other along the length of the trace and conductively joined together at the far end of the trace.
  • the current supply for the heater can come from a lower electrical layer via the pivot anchor 3621.
  • a bifurcated portion 3630 which has attached at one end thereof to leaf portions 3631, 3632.
  • one of the arms 3623, 3624 eg. 3623 is heated in air by passing current through it.
  • the heating of the arm results in a general expansion of the arm.
  • the expansion of the arm results in a general bending of the arm 3620.
  • the bending of the arm 3620 further results in leaf portion 3632 pulling on the paddle portion 3609.
  • the paddle 3609 is pivoted around a fulcrum point by means of attachment, to leaf portions 3638, 3639 which are generally thin to allow for minor flexing.
  • the pivoting of the arm 3609 causes ejection of ink from the nozzle hole 3638.
  • the heater is deactivated resulting in a return of the actuator 3620 to its quiescent position and its corresponding return of the paddle 3609 also to is quiescent position.
  • the heater 3624 can be activated with the paddle operating in a substantially symmetric manner.
  • the actuator can be utilised to move the paddle 3609 on demand so as to eject drops out of the ink ejection hole eg. 3638 with the ink refilling via an ink supply channel 3644 located under the paddle 3609.
  • the nozzle arrangement of an embodiment can be formed on a silicon wafer utilising standard semi-conductor fabrication processing steps and micro-electromechanical systems (MEMS) construction techniques.
  • MEMS micro-electromechanical systems
  • MEMS micro-electro mechanical system
  • a large wafer of printheads is constructed at any one time with each printhead providing a predetermined pagewidth capabilities and a single printhead can in turn comprise multiple colors so as to provide for full color output as would be readily apparent to those skilled in the art.
  • FIG. 184 An embodiment can start as illustrated in Fig. 184 with a CMOS processed silicon wafer 3650 which can include a standard CMOS layer 3651 including of the relevant electrical circuitry etc.
  • the processing steps can then be as follows:
  • Fig. 204 there is illustrated a portion 3680 of a full colour printhead which is divided into three series of nozzles 3671, 3672 and 3673. Each series can supply a separate color via means of a corresponding ink supply channel. Each series is further subdivided into two subrows e.g. 3676, 3677 with the relevant nozzles of each subrow being fired simultaneously with one subrow being fired a predetermined time after a second subrow such that a line of ink drops is formed on a page.
  • two subrows e.g. 3676, 3677 with the relevant nozzles of each subrow being fired simultaneously with one subrow being fired a predetermined time after a second subrow such that a line of ink drops is formed on a page.
  • the actuators a formed in a curved relationship with respect to the main nozzle access so as to provide for a more compact packing of the nozzles.
  • the block portion (3621 of Fig. 182) is formed in the wall of an adjacent series with the block portion of the row 3673 being formed in a separate guide rail 3680 provided as an abutment surface for the TAB strip when it is abutted against the guide rail 3680 so as to provide for an accurate registration of the tab strip with respect to the bond pads 3681, 3682 which are provided along the length of the printhead so as to provide for low impedance driving of the actuators.
  • a fulcrum arrangement could be constructed which includes two arms which are pivoted around a thinned wall by means of their attachment to a cross bar. Each arm could be attached to the central cross bar by means of similarly leafed portions to that shown in Fig. 182 and Fig. 183.
  • the distance between a first arm and the thinned wall can be L units whereas the distance between the second arm and wall can be NL units.
  • an inkjet printing system for the projection of ink from a series of nozzles.
  • a single paddle is located within a nozzle chamber and attached to an actuator device.
  • the nozzle is actuated in a first direction, ink is ejected through a first nozzle aperture and when the actuator is activated in a second direction causing the paddle to move in a second direction, ink is ejected out of a second nozzle.
  • a nozzle arrangement 3701 of an embodiment when in its quiescent state In the quiescent state, ink fills a first portion 3702 of the nozzle chamber and a second portion 3703 of the nozzle chamber. The ink fills the nozzle chambers from an ink supply channel 3705 to the point that a meniscus 3706, 3707 is formed around corresponding nozzle holes 3708, 3709.
  • a paddle 3710 is provided within the nozzle chamber 3702 with the paddle 3710 being interconnected to a actuator device 3712 which can comprise a thermal actuator which can be actuated so as to cause the actuator 3712 to bend, as will be become more apparent hereinafter.
  • the actuator 3712 which can comprise a thermal actuator, is activated so as to bend as illustrated in Fig. 222.
  • the bending of actuator 3712 causes the paddle 3710 to rapidly move upwards which causes a substantial increase in the pressure of the fluid, such as ink, within nozzle chamber 3702 and adjacent to the meniscus 3707. This results in a general rapid expansion of the meniscus 3707 as ink slows through the nozzle hole 3709 with result of the increasing pressure.
  • the rapid movement of paddle 3710 causes a reduction in pressure along the back surface of the paddle 3710. This results in general flows as indicated 3717, 3718 from the second nozzle chamber and the ink supply channel.
  • the actuator 3712 is deactivated resulting in the return of the paddle 3710 to its quiescent position as indicated in Fig. 223.
  • the return of the paddle 3710 operates against the forward momentum of the ink adjacent the meniscus 3707 which subsequently results in the breaking off of the meniscus 3707 so as to form the drop 3720 as illustrated in Fig. 223.
  • the drop 3720 continues onto the print media. Further, surface tension effects on the ink meniscus 3707 and ink meniscus 3706 result in ink flows 3721 - 3723 which replenish the nozzle chambers.
  • the paddle 3710 returns to its quiescent position and the situation is again as illustrated in Fig. 221.
  • the actuator 3712 is activated as illustrated in Fig. 234.
  • the actuation 3712 causes the paddle 3710 to move rapidly down causing a substantial increase in pressure in the nozzle chamber 3703 which results in a rapid growth of the meniscus 3706 around the nozzle hole 3708.
  • This rapid growth is accompanied by a general collapse in meniscus 3707 as the ink is sucked back into the chamber 3702. Further, ink flow also occurs into ink supply channel 3705 however, hopefully this ink flow is minimised.
  • the actuator 3712 is deactivated resulting in the return of the paddle 3710 to is quiescent position.
  • the return of the paddle 3710 results in a general lessening of pressure within the nozzle chamber 3703 as ink is sucked back into the area under the paddle 3710.
  • the forward momentum of the ink surrounding the meniscus 3706 and the backward momentum of the other ink within nozzle chamber 3703 is resolved through the breaking off of an ink drop 3725 which proceeds towards the print media.
  • the surface tension on the meniscus 3706 and 3707 results in a general ink inflow from nozzle chamber 3705 resulting, in the arrangement returning to the quiescent state as indicated in Fig. 221.
  • FIG. 221 to Fig. 225 describes a system where a single planar paddle is actuated so as to eject ink from multiple nozzles.
  • nozzle arrangement 3701 can be constructed on a silicon wafer base 3728 through the construction of large arrays of nozzles at one time utilising standard micro electro-mechanical processing techniques.
  • An array of nozzles on a silicon wafer device and can be constructed from the utilising semiconductor processing techniques in addition to micro machining and micro fabrication process technology (MEMS) and a full familiarity with these technologies is hereinafter assumed.
  • MEMS micro machining and micro fabrication process technology
  • MEMS micro-electro mechanical system
  • CMOS processing layer 3729 On top of the silicon wafer 3728 is first constructed a CMOS processing layer 3729 which can provide for the necessary interface circuitry for driving the thermal actuator and its interconnection with the outside world.
  • the CMOS layer 3729 being suitably passivated so as to protect it from subsequent MEMS processing techniques.
  • the walls eg. 3730 can be formed from glass (Si02)
  • the paddle 3710 includes a thinned portion 3732 for more efficient operation.
  • a sacrificial etchant hole 3733 is provided for allowing more effective etching of sacrificial etchants within the nozzle chamber 3702.
  • the ink supply channel 3705 is generally provided for interconnecting an ink supply conduit 3734 which can be etched through the wafer 3728 by means of utilisation of a deep anisotropic trench etcher such as that available from Silicon Technology Systems of the United Kingdom.
  • the arrangement 3701 further includes a thermal actuator device eg. 3712 which includes two arms comprising an upper arm 3736 and a lower arm 3737 formed around a glass core 3738.
  • Both upper and lower arm heaters 3736, 3737 can comprise a 0.4 ⁇ m film of 60% copper and 40% nickel hereinafter known as (Cupronickel) alloy. Copper and nickel is used because it has a high bend efficiency and is also highly compatible with standard VLSI and MEMS processing techniques.
  • the bend efficiency can be calculated as the square of the coefficient of the thermal expansion times the Young's modulus, divided by the density and divided by the heat capacity. This provides a measure of the amount of "bend energy" produced by a material per unit of thermal (and therefore electrical) energy supplied.
  • the core can be fabricated from glass which also has many suitable properties in acting as part of the thermal actuator.
  • the actuator 3712 includes a thinned portion 3740 for providing an interconnect between the actuator and the paddle 3710.
  • the thinned portion 3740 provides for non-destructive flexing of the actuator 3712.
  • a current is passed down through the top cupronickel layer causing it to be heated and expand. This in turn causes a general bending due to the thermocouple relationship between the layers 3736 and 3738.
  • the bending down of the actuator 3736 also causes thinned portion 3740 to move downwards in addition to the portion 3741.
  • the paddle 3710 is pivoted around the wall 3741 which can, if necessary, include slots for providing for efficient bending.
  • the heater coil 3737 can be operated so as to cause the actuator 3712 to bend up with the consequential movement upon the paddle 3710.
  • a pit 3739 is provided adjacent to the wall of the nozzle chamber to ensure that any ink outside of the nozzle chamber has minimal opportunity to "wick" along the surface of the printhead as, the wall 3741 can be provided with a series of slots to assist in the flexing of the fulcrum.
  • the printheads can then be inserted in an ink chamber moulding, tab bonded and a PTFE hydrophobic layer evaporated over the surface so as to provide for a hydrophobic surface.
  • Fig. 245 there is illustrated a portion of a page with printhead including a series of nozzle arrangements as constructed in accordance with the principles of an embodiment.
  • the array 3760 has been constructed for three colour output having a first row 3761 a second row 3762 and a third row 3763.
  • a series of bond pads, eg. 3764, 3765 are provided at the side for tab automated bonding to the printhead.
  • Each row 3761, 3762, 3763 can be provided with a different colour ink including cyan, magenta and yellow for providing full colour output.
  • the nozzles of each row 3761 - 3763 are further divided into sub rows eg. 3768, 3769.
  • a glass strip 3770 can be provided for anchoring the actuators of the row 3763 in addition to providing for alignment for the bond pad 3764, 3765.
  • the CMOS circuitry can be provided so as to fire the nozzles with the correct timing relationships. For example, each nozzle in the row 3768 is fired together followed by each nozzle in the row 3769 such that a single line is printed.
  • an embodiment provides for an extremely compact arrangement of an inkjet printhead which can be made in a highly inexpensive manner in large numbers on a single silicon wafer with large numbers of printheads being made simultaneously. Further, the actuation mechanism provides for simplified complexity in that the number of actuators is halved with the arrangement of an embodiment.
  • An embodiment of the present invention includes an inkjet arrangement wherein a single actuator drives two output nozzles.
  • a single actuator drives two output nozzles.
  • ink is ejected out of a first nozzle and when the actuator is driven in a second direction, ink is ejected out of a second nozzle.
  • the paddle actuator is interconnected via a slot in the nozzle chamber wall to a rigid thermal actuator which can be actuated so as to cause the ejection of ink from the ink ejection holes.
  • the nozzle arrangement 3801 includes two ink ejection ports 3802, 3803 for the ejection of ink from within a nozzle chamber.
  • the nozzle chamber further includes first and second chamber portions 3805, 3806 in addition to an etched cavity 3807 which, during normal operation, are normally filled with ink supplied via an ink inlet channel 3808.
  • the ink inlet channel 3808 is in turn connected to an ink supply channel 3809 etched through a silicon wafer.
  • an actuator paddle 3810 which is interconnected through a slot 3812 in the chamber wall to an actuator arm 3 813 which is actuated by means of thermal actuators 3814, 3815 which are in turn connected to a substrate 3817 via an end block portion 3818 with the substrate 3817 providing the relevant electrical interconnection for the heaters 3814, 3815.
  • the actuator arm 3813 can be actuated by the thermal actuators 3814, 3815 to move up and down so as to eject ink via the nozzle holes 3802 or 3803.
  • a series of holes eg. 3820 - 3822 are also provided in top of the nozzle plate.
  • the holes 3820 - 3822 assist in the etching of sacrificial layers during construction in addition to providing for "breathing" assistance during operation of the nozzle arrangement 3801.
  • the two chambers 3805, 3806 are separated by a baffle 3824 and the paddle arm 3810 includes a end lip portion 3825 in addition to a plug portion 3826.
  • the plug portion 3826 is designed to mate with the boundary of the ink inlet channel 3808 during operation.
  • FIG. 264 illustrates a cross sectional view of the nozzle arrangement during various stages of operation.
  • Fig. 264 there is shown the nozzle arrangement 3801 when in its quiescent position. In this state, the paddle 3810 is idle and ink fills the nozzle chamber so as to form menisci 3829 - 3833 and 3837.
  • the bottom heater 3815 When it is desired to eject a drop out of the nozzle port 3803, as indicated in Fig. 266, the bottom heater 3815 is actuated.
  • the two heaters 3814, 3815 can be constructed from the same material and normally exist in a state of balance when the paddle 3810 is in its quiescent position. As noted previously, when it is desired to eject a drop out of nozzle chamber 3803, the heater 3815 is actuated which causes a rapid upwards movement of the actuator paddle 3810. This causes a general increase in pressure in the area in front of the actuator paddle 3810 which further causes a rapid expansion in the meniscus 3830 in addition to a much less significant expansion in the menisci 3831 - 3833 (due to their being of a substantially smaller radius).
  • the substantial decrease in pressure around the back surface of the paddle 3810 causes a general inflow of ink from the nozzle chamber 3808 in addition to causing a general collapse in the meniscus 3829 and a corresponding flow of ink 3835 around the baffle 3824.
  • a slight bulging also occurs in the meniscus 3837 around the slot in the side wall 3812.
  • the heater 3815 is merely pulsed and turned off when it reaches its maximum extent.
  • the paddle actuator 3810 rapidly begins to return to its quiescent position causing the ink around the ejection port 3803 to begin to flow back into the chamber.
  • the forward momentum of the ink in the expanded meniscus and the backward pressure exerted by actuator paddle 3810 results in a general necking of the meniscus and the subsequent breaking off of a separate drop 3839 which proceeds to the print media.
  • the menisci 3829, 3831, 3832 and 3833 each of a generally concave shape exert a further force on the ink within the nozzle chamber which begins to draw ink in from the ink inlet channel 3808 so as to replenish the nozzle chamber.
  • the nozzle arrangement returns to the quiescent position which is as previously illustrated in respect of Fig. 264.
  • Fig. 267 when it is desired to eject a droplet of ink out of the ink ejection port 3802, the thermal actuator 3814 is actuated resulting in a general expansion of the thermal, actuator 3814 which in turn causes a rapid downward movement of the actuator paddle 3810.
  • the rapid downward movement causes a substantial increase in pressure within the cavity 3807 which in turn results in a general rapid expansion of the meniscus 3829.
  • the end plug portion 3826 results in a general blocking of the ink supply channel 3 808 stopping fluid from flowing back down the ink supply channel 3808. This further assists in causing ink to flow towards the cavity 3807.
  • 264 are drawn generally into the nozzle chamber and may unite so as to form a single meniscus 3840.
  • the meniscus 3837 is also drawn into the chamber.
  • the heater 3814 is merely pulsed, which as illustrated in Fig. 268 results in a rapid return of the paddle 3810 to its quiescent position.
  • the return of the paddle 3810 results in a general reduction in pressure within the cavity 3807 which in turn results in the ink around the nozzle 3802 beginning to flow 3843 back into the nozzle chamber.
  • the forward momentum of the ink around the meniscus 3829 in addition to the backflow 3843 results in a general necking of the meniscus and the formation of an ink drop 3842 which separates from the main body of the ink and continues to the print media.
  • the return of the actuator paddle 3810 further results in plugging portion 3826 "unplugging" the ink supply channel 3808.
  • the general reduction in pressure in addition to the collapsed menisci 3840, 3837 and 3829 results in a flow of ink from the ink inlet channel 3808 into the nozzle chamber so as to cause replenishment of the nozzle chamber and return to the quiescent state as illustrated in Fig. 265.
  • each nozzle eg. 3802, 3803, 3820, 3821, 3822, 3812 etc. includes a nozzle rim around its outer periphery.
  • the nozzle rim acts to stop wicking of the meniscus formed across the nozzle rim.
  • the actuator arm 3813 is provided with a wick minimisation protrusion eg. 3844 in addition to a series of pits eg. 3845 which were again shaped so as to minimise wicking along the surfaces surrounding the actuator arms 3813.
  • the nozzle arrangement of an embodiment can be formed on a silicon wafer utilising standard semi-conductor fabrication processing steps and micro-electromechanical systems (MEMS) construction techniques.
  • MEMS micro-electromechanical systems
  • MEMS micro-electro mechanical system
  • a large wafer of printheads is constructed at any one time with each printhead providing a predetermined pagewidth capabilities and a single printhead can in turn comprise multiple colors so as to provide for full color output as would be readily apparent to those skilled in the art.
  • CMOS processed silicon wafer 3850 which can include a standard CMOS layer 3851 of the relevant electrical circuitry etc.
  • the processing steps can then be as follows:
  • the printheads can then be washed and inserted in an ink chamber moulding for providing an ink supply to the back of the wafer so to allow ink to be supplied via the ink supply channel.
  • the printhead can then have one edge along its surface TAB bonded to external control lines and preferably a thin anti-corrosion layer of ECR diamond-like carbon deposited over its surfaces so as to provide for anti corrosion capabilities.
  • Fig. 289 there is illustrated a portion 3 880 of a full-colour printhead which is divided into three series of nozzles 3881, 3882 and 3883.
  • Each series can supply a separate color via means of a corresponding ink supply channel.
  • Each series is further subdivided into two subrows 3886, 3887 with the relevant nozzles of each subrow being fired simultaneously with one subrow being fired a predetermined time after a second subrow such that a line of ink drops is formed on a page.
  • the actuators a formed in a curved relationship with respect to the main nozzle access so as to provide for a more compact packing of the nozzles.
  • the block portion (3818) of Fig. 264 is formed in the wall of an adjacent series with the block portion of the row 3883 being formed in a separate guide rail 3890 provided as an abutment surface for the TAB strip when it is abutted against the guide rail 3890 so as to provide for an accurate registration of the tab strip with respect to the bond pads 3891, 3892 which are provided along the length of the printhead so as to provide for low impedance driving of the actuators.
  • an embodiment provides for a compact form of manufacture of an inkjet printhead which includes a dual nozzle single actuator system.
  • an inkjet printing system having an ink ejection nozzle arrangement such that a paddle actuator type device is utilised to eject ink from a refillable nozzle chamber.
  • the paddle is generally of a "cupped" shape.
  • the cup shape provides for the alleviation of a number of the aforementioned problems.
  • the paddle is interconnected to a thermal actuator device which is thermally actuated by means of passing a current through a portion of the thermal actuator, so as to cause the ejection of ink therefrom.
  • the cupped paddle allows for a suitable construction process which does not require the formation of thick surface layers during the process of construction. This means that thermal stresses across a series of devices constructed on a single wafer are minimised.
  • FIG. 311 there is illustrated an inkjet nozzle arrangement 3901 having a nozzle chamber 3902 which is normally filled with ink from a supply channel 3903 such that a meniscus 3904 forms across the ink ejection aperture of the nozzle arrangement.
  • a cupped paddle actuator 3905 is provided and interconnected to an actuator arm 3906 which, when in a quiescent position, is bent downwards.
  • the lower surface of the actuator arm 3906 includes a heater element 3908 which is constructed of material having a high "bend efficiency".
  • the heater element has a high bend efficiency wherein the bend efficiency is defined as:
  • a suitable material can be a copper nickel alloy of 60% copper and 40% nickel, hereinafter called (cupronickel) which can be formed below a glass layer so as to bend the glass layer.
  • cupronickel a copper nickel alloy of 60% copper and 40% nickel
  • the arm 3906 In its quiescent position, the arm 3906 is bent down by the element 3908.
  • a current is passed through the actuator arm 3908 by means of an interconnection provided by a post 3909.
  • the heater element 3908 is heated and expands with a high bend efficiency thereby causing the arm 3906 to move upwards as indicated in Fig. 312.
  • the upward movement of the actuator arm 3906 causes the cupped paddle 3905 to also move up which results in a general increase in pressure within the nozzle chamber 3902 in the area surrounding the meniscus 3904. This results in a general outflow of ink and a bulging of the meniscus 3904.
  • the heater element 3908 is turned off which results in the general return of the arm 3906 to its quiescent position which further results in a downward movement of the cupped paddle 3905.
  • the forward momentum of the ink surrounding the meniscus and the backward momentum of the ink 3911 results in a general necking of the meniscus and the formation of a drop 3912 which proceeds to the surface of the page.
  • the shape of the meniscus 3904 results in a subsequent inflow of ink via the inlet channel 3903 which results in a refilling of the nozzle chamber 3902.
  • a single nozzle arrangement 3901 in greater detail.
  • the nozzle arrangement 3901 includes a nozzle chamber 3902 which is normally filled with ink. Inside the nozzle chamber 3902 is a paddle actuator 3905 which divides the nozzle chamber from an ink refill supply channel 3903 which supplies ink from a back surface of a silicon wafer 3914.
  • an actuator arm 3906 which includes a glass core portion and an external cupronickel portion 3908.
  • the actuator arm 3906 interconnects with the paddle 3905 by means of a slot 3919 located in one wall of the nozzle chamber 3902.
  • the slot 3919 is of small dimensions such that surface tension characteristics retain the ink within the nozzle chamber 3902.
  • the external portions of the arrangement 3901 are further treated so as to be strongly hydrophobic.
  • a pit 3921 is provided around the slot 3919.
  • the pit includes a ledge 3922 with the pit and ledge interacting so as to minimise the opportunities for "wicking" along the actuator arm 3906.
  • the arm 3906 includes a thinned portion 3924 adjacent to the nozzle chamber 3902 in addition to a right angled wall 3925.
  • the surface of the paddle actuator 3905 includes a slot 3911.
  • the slot 3911 aids in allowing for the flow of ink from the back surface of paddle actuator 3905 to a front surface. This is especially the case when initially the arrangement is filled with air and a liquid is injected into the refill channel 3903.
  • the dimensions of the slot are such that, during operation of the paddle for ejecting drops, minimal flow of fluid occurs through the slot 3911.
  • the paddle actuator 3905 is housed within the nozzle chamber and is actuated so as to eject ink from the nozzle 3927 which in turn includes a rim 3928.
  • the rim 3928 assists in minimising wicking across the top of the nozzle chamber 3902.
  • the cupronickel element 3908 is interconnected through a post portion 3909 to a lower CMOS layer 3915 which provides for the electrical control of the actuator element.
  • Each nozzle arrangement 3901 can be constructed as part of an array of nozzles on a silicon wafer device and can be constructed from the utilising semiconductor processing techniques in addition to micro machining and micro fabrication process technology (MEMS) and a full familiarity with these technologies is hereinafter assumed.
  • MEMS micro machining and micro fabrication process technology
  • MEMS micro-electro mechanical system
  • Fig. 316(a) and 6b there is shown an initial processing step which utilizes a mask having a region as specified in Fig. 316(a).
  • the initial starting material is preferably a silicon wafer 3914 having a standard 0.25 micron CMOS layer 3915 which includes drive electronics (not shown), the structure of the drive on electronics being readily apparent to those skilled in the art of CMOS integrated circuit designs.
  • the first step in the construction of a single nozzle is to pattern and etch a pit 3928 to a depth of 13 micron using the mask pattern having regions specified 3929 as illustrated in Fig. 316(a).
  • a 3 micron layer of the sacrificial material 3930 is deposited.
  • the sacrificial material can comprise aluminium.
  • the sacrificial material 3930 is then etched utilising a mask pattern having portions 3931 and 3932 as indicated at Fig. 317(a).
  • a very thin 0.1 ⁇ m layer of a corrosion barrier material (for example, silicon nitride) is deposited 3934 and subsequently etched so as to form the heater element 3935.
  • the etch utilises a third mask having mask regions specified 3936 and 3937 in Fig. 318(a).
  • a 1.1 micron layer of heater material which can comprise a 60% copper 40% nickel alloy is deposited 3939 utilising a mask having a resultant mask region as illustrated in Fig. 319(a).
  • the corrosion barrier can again comprise silicon nitride.
  • a 3.4 ⁇ m layer of glass 3942 is deposited.
  • the glass and nitride can then be etched utilising a mask as specified 3943 in Fig. 320(a).
  • the glass layer 3942 includes, as part of the deposition process, a portion 3944 which is a result of the deposition process following the lower surface profile.
  • a 6 ⁇ m layer of sacrificial material such as aluminium is deposited 3945 as indicated in Fig. 321(b). This layer is planarized to approximately 4 ⁇ m minimum thickness utilising a Chemical Mechanical Planarization (CMP) process.
  • CMP Chemical Mechanical Planarization
  • the sacrificial material layer is etched utilizing a mask having regions 3948, 3949 as illustrated in Fig. 321(a) so as to form portions of the nozzle wall and post.
  • a 3m layer of glass 3950 is deposited.
  • the 3 ⁇ m layer is patterned and etched to a depth of 1 ⁇ m using a mask having a region specified 3951 as illustrated in Fig. 322(b) so as to form a nozzle rim.
  • the glass layer is etched utilising a further mask as illustrated in Fig. 322(a) which leaves glass portions eg. 3953 to form the nozzle chamber wall and post portion 3954.
  • the backside of the wafer is patterned and etched so as to form an ink supply channel 3903.
  • the mask utilised can have regions 3956 as specified in Fig. 324(a).
  • the etch through the backside of the wafer can preferably utilize a high quality deep anisotropic etching system such as that available from Silicon Technology Systems of the United Kingdom.
  • the etching process also results in the dicing of the wafer into its separate printheads at the same time.
  • the sacrificial material can be etched away so as to release the actuator structure.
  • the actuator 3906 bends downwards due to its release from thermal stresses built up during deposition.
  • the printhead can then be cleaned and mounted in a moulded ink supply system for the supply of ink to the back surface of the wafer.
  • a TAB film for suppling electric control to an edge of the printhead can then be bonded utilizing normal TAB bonding techniques.
  • the surface area can then be hydrophobically treated and finally the ink supply channel and nozzle chamber filled with ink for testing.
  • a pagewidth printhead having a repetitive structure 3960 can be constructed for full colour printing.
  • Fig. 326 shows a portion of the final printhead structure and includes three separate groupings 3961-3963 with one grouping for each colour and each grouping eg. 3963 in turn consisting of two separate rows of inkjet nozzles 3965, 3966 which are spaced apart in an interleaved pattern.
  • the nozzle 3965, 3966 are fired at predetermined times so as to form an output image as would be readily understood by those skilled in the art of construction of inkjet printhead.
  • Each nozzle eg.
  • 3968 includes its own actuator arm 3969 which, in order to form an extremely compact arrangement, is preferably formed so as to be generally bent with respect to the line perpendicular to the row of nozzles.
  • a three colour arrangement is provided which has one of the groups 3961-3963 dedicated to cyan, magenta and another yellow colour printing. Obviously, four colour printing arrangements can be constructed if required.
  • a series of bond pads eg. 3971 are formed along the side for the insertion of a tape automated bonding (TAB) strip which can be aligned by means of alignment rail eg. 3972 which is constructed along one edge of the printhead specifically for this purpose.
  • TAB tape automated bonding
  • a nozzle chamber having ink within it and a thermal actuator device interconnected to a paddle the thermal actuator device being actuated so as to eject from the nozzle chamber.
  • An embodiment includes a particular thermal actuator structure which includes a series of tapered actuator heater arms for providing conductive heating of a conductive trace.
  • the actuator arm is interconnected to a paddle by a slotted wall in the nozzle chamber.
  • the actuator arm has a mating shape so as to mate substantially with the surfaces of the slot in the nozzle chamber wall.
  • a nozzle chamber 4001 is provided filled with ink 4002 by means of an ink inlet channel 4003 which can be etched through a wafer substrate on which the nozzle chamber 4001 rests.
  • the nozzle chamber 4001 further includes an ink ejection aperture 4004 around which an ink meniscus forms.
  • a paddle type device 4007 which is interconnected to an actuator arm 4008 through a slot in the wall of the nozzle chamber 4001.
  • the actuator arm 4008 includes a heater means eg. 4009 located adjacent to a post end portion 4010 of the actuator arm.
  • the post 4010 being fixed to a substrate.
  • the heater means 4009 is heated so as to undergo thermal expansion.
  • the heater means itself or the other portions of the actuator arm 4008 are built from materials having a high bend efficiency.
  • a suitable material for the heater elements is a copper nickel alloy which can be formed so as to bend a glass material.
  • the heater means is ideally located adjacent the post end portion 4010 such that the effects of activation are magnified at the paddle end 4007 such that small thermal expansions near post 4010 result in large movements of the paddle end.
  • the heating 4009 and consequential paddle movement causes a general increase in pressure around the ink meniscus 4005 which expands, as illustrated in Fig. 340, in a rapid manner.
  • the heater current is pulsed and ink is ejected out of the nozzle 4004 in addition to flowing in from the ink channel 4003.
  • the paddle 4007 is deactivated to again return to its quiescent position.
  • the deactivation causes a general reflow of the ink into the nozzle chamber.
  • the forward momentum of the ink outside the nozzle rim and the corresponding backflow results in a general necking and breaking off of the drop 4012 which proceeds to the print media.
  • the collapsed meniscus 4005 results in a general sucking of ink into the nozzle chamber 4002 via the in flow channel 4003.
  • the nozzle chamber is refilled such that the position in Fig. 339 is again reached and the nozzle chamber is subsequently ready for the ejection of another drop of ink.
  • Fig. 342 there is illustrated a view of a single nozzle arrangements of an embodiment.
  • the arrangement of Fig. 342 has a number in the structures which aid and assist in the low energy operation of the paddle.
  • the actuator 4008 includes a series of tapered heater sections eg. 4015 which comprise an upper glass portion (amorphous silicon dioxide) 4016 formed on top of a titanium nitride layers 4017.
  • a copper nickel alloy layer hereinafter called cupronickel
  • the titanium nitride layer 4017 is in a tapered form and, as such, resistive heating takes place near the post end portion 4010. Adjacent titanium nitride/glass portions are interconnected at block portion 4019 which also provides for a mechanical structural support for the actuator arm.
  • the heater means ideally includes a plurality of tapered portions 4015 which are elongated and spaced apart such that, upon heating, the bending force exhibited along the axis of the actuator arm is maximized.
  • the slots between adjacent tapered portions allow for slight differential operation of each thermal actuator with respect to adjacent actuators.
  • the block portion 4019 is interconnected to an arm portion 4020.
  • the arm 4020 is in turn connected to the paddle 4007 inside the nozzle chamber 4001 by means of a slot eg. 4022 formed in the side of the nozzle chamber 4001.
  • the formation of the slot 4022 is designed generally to mate with the surfaces of the arm 4020 so as to minimise opportunities for the outflow of ink around this arm.
  • the ink is held generally within the nozzle chamber 4001 via surface tension effects around the slot 4022.
  • a conductive current is passed through the titanium nitride layer 4017 via vias within the block portion 4010 connecting to a lower CMOS layer 4006 which provides for the necessary power and control circuitry for the nozzle arrangement.
  • the conductive current results in heating of the nitride layer 4017 adjacent to the post portion 4010 which results in a general upward bending of the arm 4008 and the consequential ejection of ink out of the nozzle 4004.
  • the ejected drop being printed on page in the usual manner for an inkjet printer as previously described.
  • an array of ink ejection devices can be subsequently formed so as to create a single printhead.
  • Fig. 343 there is illustrated an array views which comprises multiple ink ejection nozzle arrangements 4001 laid out in interleaved lines so as to form a printhead array.
  • different types of arrays can be formulated including full color arrays etc.
  • An embodiment achieves a particular balance between utilisation of the standard semi-conductor processing material such as titanium nitride and glass in a MEMS process.
  • the standard semi-conductor processing material such as titanium nitride and glass in a MEMS process.
  • the skilled person may make other choices of materials and design features where the economics are justified.
  • a copper nickel alloy of 50% copper and 50% nickel may be more advantageously deployed as the conductive heating compound as it is likely to have higher levels of bend efficiency.
  • other design structures may be employed where it is not necessary to provide for such a simple form of manufacture.
  • a nozzle chamber having ink within it and a thermal actuator device interconnected to a panel the thermal actuator device being actuated so as to eject ink from the nozzle chamber.
  • An embodiment includes a particular thermal actuator structure which includes a tapered heater structure arms for providing positional heating of a conductive heater layer row.
  • the actuator arm is interconnected to a paddle by a slotted wall in the nozzle chamber.
  • the actuator arm has a mating shape so as to mate substantially with the surfaces of the slot in the nozzle chamber wall.
  • a nozzle chamber 4101 is provided filled with ink 4102 by means of an ink inlet channel 4103 which can be etched through a wafer substrate on which the nozzle chamber 4101 rests.
  • the nozzle chamber 4101 includes an ink ejection aperture 4104 around which an ink meniscus forms.
  • a paddle type device 4107 which is interconnected to an actuator arm 4108 through a slot in the wall of the nozzle chamber 4101.
  • the actuator arm 4108 includes a heater means eg. 4109 located adjacent to a post end portion 4110 of the actuator arm.
  • the post 4110 being fixed to a substrate.
  • the heater means 4109 is heated so as to undergo thermal expansion.
  • the heater means itself or the other portions of the actuator arm 4108 are built from materials having a high bend efficiency.
  • a suitable material for the heater elements is a copper nickel alloy which can be formed so as to bend a glass material.
  • the heater means is ideally located adjacent the post end portion 4110_ such that the effects of activation are magnified at the paddle end 4107 such that small thermal expansions near post 4110 result in large movements of the paddle end.
  • the heating 4109 causes a general increase in pressure around the ink meniscus 4105 which expands, as illustrated in Fig. 356, in a rapid manner.
  • the heater current is pulsed and ink is ejected out of the nozzle 4104 in addition to flowing in from the ink channel 4103. Subsequently, the paddle 4107 is deactivated to again return to its quiescent position. The deactivation causes a general reflow of the ink into the nozzle chamber.
  • the forward momentum of the ink outside the nozzle rim and the corresponding backflow results in a general necking and breaking off of the drop 4112 which proceeds to the print media.
  • the collapsed meniscus 4105 results in a general sucking of ink into the nozzle chamber 4102 via the in flow channel 4103.
  • the nozzle chamber is refilled such that the position in Fig. 355 is again reached and the nozzle chamber is subsequently ready for the ejection of another drop of ink.
  • a single nozzle arrangement 4120 of an embodiment includes an actuator arm 4121 which includes a bottom arm 4122 which is constructed from a conductive material such as a copper nickel alloy (hereinafter called cupronickel) or titanium nitride (TiN).
  • the layer 4122 as will become more apparent hereinafter includes a tapered end portion near the end post 4124. The tapering of the layer 4122 near this end means that any conductive resistive heating occurs near the post portion 4124.
  • the layer 4122 is connected to the lower CMOS layers 4126 which are formed in the standard manner on a silicon substrate surface 4127.
  • the actuator arm 4121 is interconnected to an ejection paddle which is located within a nozzle chamber 4128.
  • the nozzle chamber includes an ink ejection nozzle 4129 from which ink is ejected an includes a convoluted slot arrangement 4130 which is constructed such that the actuator arm 4121 is able to move up and down whilst causing minimal pressure fluctuations in the area of the nozzle chamber 4128 around the slotted interconnect 4130.
  • Fig. 359 illustrates a sectional view through a single nozzle and illustrates more clearly the internal structure of the nozzle chamber which includes the paddle 4132 attached to the actuator arm 4121 by means of arm 4133.
  • the actuator arm 4121 includes, as noted previously, a bottom conductive strip portion 4122. Additionally, a second top strip portion 4125 is also provided.
  • a second layer 4125 of the same material as the first layer 4122 allows for more accurate control of the actuator position as will be described with reference to Fig. 360 and Fig. 361.
  • Fig. 360 there is illustrated the example where a high Young's Modulus material 4140 is deposited utilizating standard semiconductor deposition techniques and on top of which is further deposited a second layer 4141 having a much lower Young's Modulus.
  • the deposition is likely to occur at a high temperature.
  • the two layers are likely to have different coefficients of thermal expansion and different Young's Modulus.
  • the thermal stresses are likely to cause bending of the two layers of material as shown 4142.
  • one important attribute of an embodiments includes the slotted arrangement 4130.
  • the slotted arrangement results in the actuator arm 4121 moving up and down thereby causing the paddle 4132 to also move up and down resulting in the ejection of ink.
  • the slotted arrangements 4130 results in minimum ink outflow through the actuator arm interconnection and also results in minimal pressure increases in this area.
  • the base 4133 of the actuator arm is extended out so as to form an extended interconnect with the paddle surface thereto providing for better attachment.
  • the face 4133 is connected to a block arm 4136 which is provided to provide a high degree of rigidity.
  • the actuator arm 4136 and the wall of the nozzle chamber 4128 have a general corrugated nature so as to reduce any flow of ink through the interconnection.
  • the exterior surface of the nozzle chamber adjacent the block portion 4136 has a rim eg. 4138 so to minimize wicking of ink outside of the nozzle chamber.
  • a pit 4137 is also provided for this purpose. The pit 4137 being formed in the lower CMOS layers 4126.
  • An ink supply channel 4139 is provided by means of back etching through the wafer to the back surface of the nozzle.
  • Fig. 362 to Fig. 369 there will now be described the manufacturing steps utilizing the construction of a single nozzle in accordance with an embodiment.
  • micro-electro mechanical techniques for a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceeding of the SPIE (International Society for Optical Engineering) including volumes 2642 and 2882 which contain the proceedings of recent advances and conferences in this field.
  • SPIE International Society for Optical Engineering
  • the heater element has a tapered portion adjacent the post 4173 so as to ensure maximum heating occurs near the post.
  • inkjet printhead structures can be formed.
  • a portion of a single color printhead having two spaced apart rows 4190, 4191, with the two rows being interleaved so as to provide for a complete line of ink to be ejected in two stages.
  • a guide rail 4192 is provided for proper alignment of a TAB film with bond pads 4193.
  • a second protective barrier 4194 can also preferably be provided.
  • adjacent actuator arms are interleaved and reversed.
  • Fig. 372 there is illustrated a full color printhead arrangement which includes three series of inkjet nozzles 4194, 4196, one each devoted to a separate color. Again, guide rails 4198, 4199 are provided in addition to bond pads, eg. 4200.
  • Fig. 373 there is illustrated a general plan of the layout of a portion of a full color printhead which clearly illustrates the interleaved nature of the actuator arms.
  • the presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
  • the embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.
  • thermal inkjet The most significant problem with thermal inkjet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal inkjet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.
  • piezoelectric inkjet The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per print head, but is a major impediment to the fabrication of pagewide print heads with 19,200 nozzles.
  • the inkjet technologies used meet the stringent requirements of in camera digital color printing and other high quality, high speed, low cost printing applications.
  • new inkjet technologies have been created.
  • the target features include:
  • inkjet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems
  • the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing.
  • the print head is 100 mm long, with a width which depends upon the inkjet type.
  • the smallest print head designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm.
  • the print heads each contain 19,200 nozzles plus data and control circuitry.
  • Ink is supplied to the back of the print head by injection molded plastic ink channels.
  • the molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool.
  • Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer.
  • the print head is connected to the camera circuitry by tape automated bonding.
  • inkjet configurations can readily be derived from these 45 examples by substituting alternative configurations along one or more of the 11 axes.
  • Most of the IJ01 to IJ45 examples can be made into inkjet print heads with characteristics superior to any currently available inkjet technology.
  • Suitable applications include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.
  • the present application may utilize advanced semiconductor fabrication techniques in the construction of large arrays of ink jet printers. Suitable manufacturing techniques are described in the following Australian provisional patent specifications: Australian Provisional Number Filing Date Title PO7935 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM01) PO7936 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM02) PO7937 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM03) PO8061 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM04) PO8054 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM05) PO8065 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM06) PO8055 15-Jul-97 A Method of Manufacture of an Image Creation Apparatus (IJM
  • the present application may utilize an ink delivery system to the ink jet head.
  • Delivery systems relating to the supply of ink to a series of ink jet nozzles are described in the following Australian provisional patent specifications: Australian Provisional Number Filing Date Title PO8003 15-Jul-97 Supply Method and Apparatus (F1) PO8005 15-Jul-97 Supply Method and Apparatus (F2) PO9404 23-Sep-97 A Device and Method (F3)
  • the present application may utilize advanced semiconductor microelectromechanical techniques in the construction of large arrays of ink jet printers. Suitable microelectromechanical techniques are described in the following Australian provisional patent specifications: Australian Provisional Number Filing Date Title PO7943 15-Jul-97 A device (MEMS01) PO8006 15-Jul-97 A device (MEMS02) PO8007 15-Jul-97 A device (MEMS03) PO8008 15-Jul-97 A device (MEMS04) PO8010 15-Jul-97 A device (MEMS05) PO8011 15-Jul-97 A device (MEMS06) PO7947 15-Jul-97 A device (MEMS07) PO7945 15-Jul-97 A device (MEMS08) PO7944 15-Jul-97 A device (MEMS09) PO7946 15-Jul-97 A device (MEMS10) PO9393 23-Sep-97 A Device and Method (MEMS11) PP0875 12-Dec-97 A Device (MEMS12) PP08
  • the present application may include the utilization of a disposable camera system such as those described in the following Australian provisional patent specifications: Australian Provisional Number Filing Date Title PP0895 12-Dec-97 An Image Creation Method and Apparatus (IR01) PP0870 12-Dec-97 A Device and Method (IR02) PP0869 12-Dec-97 A Device and Method (IR04) PP0887 12-Dec-97 Image Creation Method and Apparatus (IR05) PP0885 12-Dec-97 An Image Production System (IR06) PP0884 12-Dec-97 Image Creation Method and Apparatus (IR10) PP0886 12-Dec-97 Image Creation Method and Apparatus (IR12) PP0871 12-Dec-97 A Device and Method (IR13) PP0876 12-Dec-97 An Image Processing Method and Apparatus (IR14) PP0877 12-Dec-97 A Device and Method (IR16) PP0878 12-Dec-97 A Device and Method (IR17) PP0879 12-Dec-97 A Device and
  • the present application may include the utilization of a data distribution system such as that described in the following Australian provisional patent specifications incorporated here by cross-reference: Australian Provisional Number Filing Date Title PP2370 16-Mar-98 Data Processing Method and Apparatus (Dot01) PP2371 16-Mar-98 Data Processing Method and Apparatus (Dot02)
  • the present application may include the utilization of camera and data processing techniques such as an Artcam type device as described in the following Australian provisional patent specifications: Australian Provisional Number Filing Date Title PO7991 15-Jul-97 Image Processing Method and Apparatus (ART01) PO8505 11-Aug-97 Image Processing Method and Apparatus (ART01a) PO7988 15-Jul-97 Image Processing Method and Apparatus (ART02) PO7993 15-Jul-97 Image Processing Method and Apparatus (ART03) PO8012 15-Jul-97 Image Processing Method and Apparatus (ART05) PO8017 15-Jul-97 Image Processing Method and Apparatus (ART06) PO8014 15-Jul-97 Media Device (ART07) PO8025 15-Jul-97 Image Processing Method and Apparatus (ART08) PO8032 15-Jul-97 Image Processing Method and Apparatus (ART09) PO7999 15-Jul-97 Image Processing Method and Apparatus (ART10) PO7998 15-Jul-97

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Claims (36)

  1. Buse de jet d'encre comprenant:
    une chambre de buse (216) ayant un orifice d'éjection d'encre (213) dans une paroi de ladite chambre;
    une source d'amenée d'encre interconnectée à ladite chambre de buse (216);
    un actionneur thermique (224) activé pour éjecter l'encre de ladite chambre de buse par ledit orifice d'éjection d'encre, caractérisée en ce que l'actionneur thermique est activé au moyen du passage d'un courant à travers une première couche (229) de l'actionneur de façon à l'amener à se dilater relativement à la seconde couche (227) de l'actionneur.
  2. Buse de jet d'encre selon la revendication 1, ou la première couche (229) comporte une surface hydrophobe, et où pendant le fonctionnement, ladite surface hydrophobe provoque la formation d'une bulle d'air adjacente à la première couche (229).
  3. Buse de jet d'encre selon la revendication 1 ou la revendication 2, où une surface de la première couche (229) dudit actionneur est aérée (231) de manière à réduire l'énergie d'actionnement requise pour éjecter l'encre de ladite chambre de buse (216).
  4. Buse de jet d'encre selon la revendication 3, où ladite aération comprend une série de petites trous (231) dans l'actionneur, lesdits trous étant interconnectés à un canal d'amenée d'air pour l'amenée d'air à l'actionneur adjacent à la première couche.
  5. Buse de jet d'encre selon la revendication 4, où la zone autour de la surface de la première couche (229) est réalisée en un matériau hydrophobe.
  6. Buse de jet d'encre selon la revendication 4 ou la revendication 5, où lesdits trous (231) sont d'une taille telle que pendant le fonctionnement, tout fluide soit retenu dans ladite chambre de buse.
  7. Buse de jet d'encre selon l'une des revendications 4 à 6, où l'actionneur (224) est fixé à une extrémité (235) à ladite chambre de buse, et lesdits trous se situent près de l'extrémité attachée.
  8. Buse de jet d'encre selon la revendication 1 à 7, où ledit actionneur (224) est réalisé en polytétrafluoroéthylène.
  9. Buse de jet d'encre selon la revendication 23, où la première couche (229) est traitée en portions de manière à former un matériau conducteur.
  10. Buse de jet d'encre selon la revendication 1,
       la seconde couche (227) étant réalisée en un matériau hautement conducteur interconnecté à la première couche (229) réalisée en un matériau électriquement résistant de sorte que lors du passage du courant, ledit actionneur thermique est amené à se plier vers ledit orifice d'éjection d'encre (231) de manière à provoquer l'éjection d'encre dudit orifice d'éjection d'encre.
  11. Buse de jet d'encre selon la revendication 10, où ledit actionneur est fixé à un substrat (220,221) et comprend en outre une portion de palette rigide (225) qui augmente le degré de pliage dudit actionneur (224) près du point (235) où il est fixé au substrat.
  12. Buse de jet d'encre selon la revendication 11, où ladite palette rigide (225) est réalisée en nitrure de silicium.
  13. Buse de jet d'encre selon la revendication 10 à 12, où ledit actionneur (224) comprend en outre un revêtement d'expansion ayant un coefficient élevé de dilatation thermique sur une surface de la première couche (229) de manière à augmenter la quantité de pliage dudit actionneur.
  14. Buse de jet d'encre selon la revendication 13, où ledit revêtement d'expansion comprend sensiblement du polytétrafluoroéthylène.
  15. Buse de jet d'encre selon la revendication 10 à 14, où entre ladite seconde couche (227) et ladite première couche (229) est réalisé un espace, construit par l'utilisation d'un matériau sacriciel qui est déposé et ensuite enlevé par attaque de manière à laisser subsister ledit espace.
  16. Buse de jet d'encre selon la revendication 15, où ladite seconde couche comprend une pluralité de trous de réactif d'attaque réalisé de manière à permettre une attaque plus rapide de ladite couche sacricielle pendant la construction.
  17. Buse de jet d'encre selon la revendication 10 à 16, où ladite première couche (229) comprend sensiblement de l'oxyde indium d'étain (ITO).
  18. Buse de jet d'encre selon la revendication 10 à 17, où la seconde couche (227) comprend sensiblement une couche métallique.
  19. Buse de jet d'encre selon la revendication 10 à 18, où lesdites couches (227,229) sont revêtues en outre d'un matériau de passivation, selon ce qui est requis.
  20. Buse de jet d'encre selon la revendication 10 à 19, où ladite buse de jet d'encre est formée sur une plaquette de silicium utilisant des techniques de construction de systèmes micro-électro-mécaniques.
  21. Buse de jet d'encre selon la revendication 1, les couches (227,229) ayant un coefficient élevé de dilatation thermique, la seconde couche (227) étant sensiblement non conductrice et la première couche (229) étant conductrice, l'actionneur thermique étant activé par le passage d'un courant à travers la première couche de manière à l'amener à se dilater relativement à la seconde couche, qui est refroidie par de l'encre à base d'eau.
  22. Buse de jet d'encre selon la revendication 21, où ladite première couche (229) comprend des portions qui sont conductrices et des portions qui sont non conductrices de sorte qu'un circuit est formé pour le chauffage de la première couche (229) par l'interaction desdites portions conductrices et non conductrices.
  23. Buse de jet d'encre selon la revendication 22, où ledit circuit résistif est créé ayant une surface prédéterminée d'une aire réduite en section transversale de circuit de manière à produire des niveaux de chauffage élevés desdits actionneurs (224) dans ces zones.
  24. Buse de jet d'encre selon la revendication 22 ou 23, où lesdites portions non conductrices sont réalisées dans le même matériau que la seconde couche.
  25. Buse de jet d'encre selon la revendication 11, où l'actionneur thermique (224) comprend des matériaux ayant un module de Young élevé qui produisent un mouvement de pliage lors du chauffage en amenant ainsi la palette d'éjection à éjecter l'encre dudit orifice d'éjection d'encre.
  26. Buse de jet d'encre selon la revendication 25, où ledit actionneur thermique (224) est amené à pivoter de manière à augmenter le degré de déplacement de ladite palette d'éjection lors de l'actionnement dudit actionneur thermique.
  27. Buse de jet d'encre selon la revendication 25 à 26, où ledit mécanisme d'actionneur est réalisé en une forme de fer à cheval et est amené à pivoter sensiblement autour d'un point médian.
  28. Buse de jet d'encre selon la revendication 25 à 27, où ledit pivot est réalisé sur une paroi de ladite chambre.
  29. Buse de jet d'encre selon la revendication 28, où ladite paroi comprend une membrane amincie.
  30. Buse de jet d'encre selon la revendication 25 à 29, où ledit actionneur thermique fonctionne dans l'atmosphère ambiante.
  31. Buse de jet d'encre selon la revendication 25 à 29, où ladite chambre de buse est réalisée sur une plaquette de silicium, et ladite encre est fournie à travers ladite plaquette de silicium.
  32. Buse de jet d'encre selon la revendication 25 à 31, où ledit actionneur thermique est réalisé à partir d'une section conductrice mince ayant un module de Young élevé et une portion non conductrice sensiblement plus épaisse.
  33. Buse de jet d'encre selon la revendication 32, où ladite portion conductrice mince comprend sensiblement du diborure de titane.
  34. Buse de jet d'encre selon la revendication 32, où ladite portion plus épaisse comprend sensiblement du verre.
  35. Buse de jet d'encre selon la revendication 25 à 34, où lesdites parois de chambre de buse comprennent un nombre de petits trous sacrificiels de réactif d'attaque pour l'utilisation pour la construction de ladite buse, lesdits trous étant d'un diamètre suffisamment petit pour empêcher l'éjection d'encre de ceux-ci.
  36. Buse de jet d'encre selon la revendication 25 à 35, où ladite buse est construite en utilisant des techniques de systèmes micro-électro mécaniques incluant une attaque sacrificielle, et ladite palette d'éjection est libérée lors de ladite attaque sacrificielle pour se trouver dans une position avant le tir.
EP98933352A 1997-07-15 1998-07-15 Jet d'encre a commande thermique Expired - Lifetime EP0999934B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP05109700A EP1637330B1 (fr) 1997-07-15 1998-07-15 Élément thermique d'actuation avec ondulations
EP05109763A EP1652671B1 (fr) 1997-07-15 1998-07-15 Chambre de buse de jet d'encre avec deux trous d'éjection de liquide et avec pagaie mobile
EP05109733A EP1647402B1 (fr) 1997-07-15 1998-07-15 Dispositif de buse de jet d'encre avec mécanisme d'actuation dans la chambre entre buse et ravitaillement d'encre
EP05109707A EP1650030B1 (fr) 1997-07-15 1998-07-15 Chambre de buse avec pagaie et actuateur thermique en dehors
EP05109756A EP1650031B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec fente dans une paroi de côté et aile mobile
ES05109756T ES2302134T3 (es) 1997-07-15 1998-07-15 Boquilla de inyeccion de tinta con ranuras laterales y panel desplazable.
EP05109701A EP1640162B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec des pagaies formant une part du mur

Applications Claiming Priority (143)

Application Number Priority Date Filing Date Title
AUPO794497 1997-07-15
AUPO8039A AUPO803997A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ24)
AUPO8056A AUPO805697A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ10)
AUPO804297 1997-07-15
AUPO7941A AUPO794197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM24)
AUPO804597 1997-07-15
AUPO8057A AUPO805797A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ09)
AUPO806497 1997-07-15
AUPO8042A AUPO804297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ29)
AUPO801097 1997-07-15
AUPO8050A AUPO805097A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM19)
AUPO7947A AUPO794797A0 (en) 1997-07-15 1997-07-15 A device (MEMS07)
AUPO7945A AUPO794597A0 (en) 1997-07-15 1997-07-15 A device (MEMS08)
AUPO089397 1997-07-15
AUPO8064A AUPO806497A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ30)
AUPO800897 1997-07-15
AUPO087397 1997-07-15
AUPO939097 1997-07-15
AUPO8062A AUPO806297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ22)
AUPO8002A AUPO800297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ20)
AUPO793797 1997-07-15
AUPO850397 1997-07-15
AUPO793397 1997-07-15
AUPO800297 1997-07-15
AUPO800697 1997-07-15
AUPO7943A AUPO794397A0 (en) 1997-07-15 1997-07-15 A device (MEMS01)
AUPO938997 1997-07-15
AUPO803397 1997-07-15
AUPO8001A AUPO800197A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ17)
AUPO8034A AUPO803497A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ23)
AUPO939297 1997-07-15
AUPO806297 1997-07-15
AUPO8007A AUPO800797A0 (en) 1997-07-15 1997-07-15 A device (MEMS03)
AUPO8046A AUPO804697A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM30)
AUPP089197 1997-07-15
AUPO804397 1997-07-15
AUPO807497 1997-07-15
AUPO7937A AUPO793797A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM03)
AUPO805697 1997-07-15
AUPO800197 1997-07-15
AUPO7948A AUPO794897A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM21)
AUPO803897 1997-07-15
AUPO8038A AUPO803897A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ18)
AUPO8043A AUPO804397A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ28)
AUPO803497 1997-07-15
AUPO8040A AUPO804097A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ03)
AUPO804097 1997-07-15
AUPO794397 1997-07-15
AUPO795197 1997-07-15
AUPO807597 1997-07-15
AUPO8052A AUPO805297A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM20)
AUPO8078A AUPO807897A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM09)
AUPO7952A AUPO795297A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM29)
AUPO794897 1997-07-15
AUPO8006A AUPO800697A0 (en) 1997-07-15 1997-07-15 A device (MEMS02)
AUPO805097 1997-07-15
AUPO807997 1997-07-15
AUPO795297 1997-07-15
AUPO800797 1997-07-15
AUPO8079A AUPO807997A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM18)
AUPO8010A AUPO801097A0 (en) 1997-07-15 1997-07-15 A device (MEMS05)
AUPO801197 1997-07-15
AUPO939197 1997-07-15
AUPO8075A AUPO807597A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM17)
AUPO803997 1997-07-15
AUPO939397 1997-07-15
AUPO7946A AUPO794697A0 (en) 1997-07-15 1997-07-15 A device (MEMS10)
AUPO8037A AUPO803797A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ27)
AUPO805197 1997-07-15
AUPO794697 1997-07-15
AUPO806897 1997-07-15
AUPO805297 1997-07-15
AUPO794597 1997-07-15
AUPO7944A AUPO794497A0 (en) 1997-07-15 1997-07-15 A device (MEMS09)
AUPO8068A AUPO806897A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ21)
AUPP088897 1997-07-15
AUPO8045A AUPO804597A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM28)
AUPO794797 1997-07-15
AUPO7951A AUPO795197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM22)
AUPO8051A AUPO805197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM27)
AUPO8011A AUPO801197A0 (en) 1997-07-15 1997-07-15 A device (MEMS06)
AUPO7933A AUPO793397A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation_apparatus (IJM10)
AUPO803797 1997-07-15
AUPO8008A AUPO800897A0 (en) 1997-07-15 1997-07-15 A device (MEMS04)
AUPO807897 1997-07-15
AUPO805797 1997-07-15
AUPO8074A AUPO807497A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM23)
AUPO8033A AUPO803397A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ19)
AUPO804697 1997-07-15
AUPO8503A AUPO850397A0 (en) 1997-08-11 1997-08-11 A method of manufacture of an image creation apparatus (ijm30a)
AUPO9390A AUPO939097A0 (en) 1997-09-23 1997-09-23 A method of manufacture of an image creation apparatus (IJM31)
AUPO9391A AUPO939197A0 (en) 1997-09-23 1997-09-23 Image creation method and apparatus (IJ32)
AUPO9393A AUPO939397A0 (en) 1997-09-23 1997-09-23 A device and method (MEMS11)
AUPO9392A AUPO939297A0 (en) 1997-09-23 1997-09-23 A method of manufacture of an image creation apparatus (IJM32)
AUPO9389A AUPO938997A0 (en) 1997-09-23 1997-09-23 Image creation method and apparatus (IJ31)
AUPP0890A AUPP089097A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ35)
AUPP0888A AUPP088897A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ33)
AUPP089497 1997-12-12
AUPP0872A AUPP087297A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJM36)
AUPP087297 1997-12-12
AUPP088997 1997-12-12
AUPP0873A AUPP087397A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ36)
AUPP088297 1997-12-12
AUPP0889A AUPP088997A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM35)
AUPP0882A AUPP088297A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM37)
AUPP0875A AUPP087597A0 (en) 1997-12-12 1997-12-12 A device (MEMS12)
AUPP0892A AUPP089297A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ38)
AUPP0893A AUPP089397A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ37)
AUPP089097 1997-12-12
AUPP089297 1997-12-12
AUPP087497 1997-12-12
AUPP0894A AUPP089497A0 (en) 1997-12-12 1997-12-12 An interconnection system (MEMS13)
AUPP087597 1997-12-12
AUPP0891A AUPP089197A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ34)
AUPP0874A AUPP087497A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM38)
AUPP1398A AUPP139898A0 (en) 1998-01-19 1998-01-19 An image creation method and apparatus (ij39)
AUPP1396A AUPP139698A0 (en) 1998-01-19 1998-01-19 A method of manufacture of an image creation apparatus (ijm39)
AUPP139898 1998-01-19
AUPP139698 1998-01-19
AUPP259398 1998-03-25
AUPP259298 1998-03-25
AUPP259198 1998-03-25
AUPP2592A AUPP259298A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJ40)
AUPP2593A AUPP259398A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJ41)
AUPP2591A AUPP259198A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJM41)
AUPP3989A AUPP398998A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm40)
AUPP3987A AUPP398798A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij43)
AUPO794197 1998-06-09
AUPP3990A AUPP399098A0 (en) 1998-06-09 1998-06-09 A method of manufacture of image creation apparatus (ijm42)
AUPP398498 1998-06-09
AUPP3983A AUPP398398A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij45)
AUPP3985A AUPP398598A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij44)
AUPP3991A AUPP399198A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij42)
AUPP3986A AUPP398698A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm43)
AUPP3984A AUPP398498A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm44)
AUPP398798 1998-06-09
AUPP399098 1998-06-09
AUPP399198 1998-06-09
AUPP398598 1998-06-09
AUPP398998 1998-06-09
AUPP398698 1998-06-09
AUPP398398 1998-06-09
PCT/AU1998/000550 WO1999003681A1 (fr) 1997-07-15 1998-07-15 Jet d'encre a commande thermique

Related Child Applications (6)

Application Number Title Priority Date Filing Date
EP05109733A Division EP1647402B1 (fr) 1997-07-15 1998-07-15 Dispositif de buse de jet d'encre avec mécanisme d'actuation dans la chambre entre buse et ravitaillement d'encre
EP05109756A Division EP1650031B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec fente dans une paroi de côté et aile mobile
EP05109700A Division EP1637330B1 (fr) 1997-07-15 1998-07-15 Élément thermique d'actuation avec ondulations
EP05109701A Division EP1640162B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec des pagaies formant une part du mur
EP05109707A Division EP1650030B1 (fr) 1997-07-15 1998-07-15 Chambre de buse avec pagaie et actuateur thermique en dehors
EP05109763A Division EP1652671B1 (fr) 1997-07-15 1998-07-15 Chambre de buse de jet d'encre avec deux trous d'éjection de liquide et avec pagaie mobile

Publications (3)

Publication Number Publication Date
EP0999934A1 EP0999934A1 (fr) 2000-05-17
EP0999934A4 EP0999934A4 (fr) 2001-06-27
EP0999934B1 true EP0999934B1 (fr) 2005-10-26

Family

ID=27587066

Family Applications (5)

Application Number Title Priority Date Filing Date
EP98933352A Expired - Lifetime EP0999934B1 (fr) 1997-07-15 1998-07-15 Jet d'encre a commande thermique
EP05109707A Expired - Lifetime EP1650030B1 (fr) 1997-07-15 1998-07-15 Chambre de buse avec pagaie et actuateur thermique en dehors
EP05109756A Expired - Lifetime EP1650031B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec fente dans une paroi de côté et aile mobile
EP05109701A Expired - Lifetime EP1640162B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec des pagaies formant une part du mur
EP05109700A Expired - Lifetime EP1637330B1 (fr) 1997-07-15 1998-07-15 Élément thermique d'actuation avec ondulations

Family Applications After (4)

Application Number Title Priority Date Filing Date
EP05109707A Expired - Lifetime EP1650030B1 (fr) 1997-07-15 1998-07-15 Chambre de buse avec pagaie et actuateur thermique en dehors
EP05109756A Expired - Lifetime EP1650031B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec fente dans une paroi de côté et aile mobile
EP05109701A Expired - Lifetime EP1640162B1 (fr) 1997-07-15 1998-07-15 Buse de jet d'encre avec des pagaies formant une part du mur
EP05109700A Expired - Lifetime EP1637330B1 (fr) 1997-07-15 1998-07-15 Élément thermique d'actuation avec ondulations

Country Status (5)

Country Link
EP (5) EP0999934B1 (fr)
JP (1) JP4160250B2 (fr)
AT (4) ATE386638T1 (fr)
ES (1) ES2302134T3 (fr)
WO (1) WO1999003681A1 (fr)

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ATE359915T1 (de) 2007-05-15
JP2003521389A (ja) 2003-07-15
EP1650031B1 (fr) 2008-02-20
EP0999934A4 (fr) 2001-06-27
EP1640162B1 (fr) 2007-03-28
ATE409119T1 (fr) 2008-10-15
ES2302134T3 (es) 2008-07-01
WO1999003681A1 (fr) 1999-01-28
ATE386638T1 (de) 2008-03-15
JP4160250B2 (ja) 2008-10-01
ATE358019T1 (de) 2007-04-15
EP1640162A1 (fr) 2006-03-29
EP0999934A1 (fr) 2000-05-17
EP1650030B1 (fr) 2008-09-24
EP1650031A1 (fr) 2006-04-26
EP1637330B1 (fr) 2007-04-18
EP1637330A1 (fr) 2006-03-22
EP1650030A1 (fr) 2006-04-26

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