EE03728B1 - Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil - Google Patents
Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadilInfo
- Publication number
- EE03728B1 EE03728B1 EEP199900170A EE9900170A EE03728B1 EE 03728 B1 EE03728 B1 EE 03728B1 EE P199900170 A EEP199900170 A EE P199900170A EE 9900170 A EE9900170 A EE 9900170A EE 03728 B1 EE03728 B1 EE 03728B1
- Authority
- EE
- Estonia
- Prior art keywords
- mounting plate
- electronic components
- shielding electronic
- shielding
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9603931A SE511426C2 (sv) | 1996-10-28 | 1996-10-28 | Anordning och förfarande vid avskärmning av elektronik |
PCT/SE1997/001771 WO1998019508A1 (en) | 1996-10-28 | 1997-10-23 | A method and a device for shielding of electronic components on a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
EE9900170A EE9900170A (et) | 1999-12-15 |
EE03728B1 true EE03728B1 (et) | 2002-04-15 |
Family
ID=20404394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EEP199900170A EE03728B1 (et) | 1996-10-28 | 1997-10-23 | Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil |
Country Status (12)
Country | Link |
---|---|
US (1) | US6192577B1 (sv) |
EP (1) | EP0934688B1 (sv) |
JP (1) | JP3920355B2 (sv) |
KR (1) | KR100489860B1 (sv) |
CN (1) | CN1149907C (sv) |
AU (1) | AU735228B2 (sv) |
BR (1) | BR9712584A (sv) |
DE (1) | DE69732045T2 (sv) |
EE (1) | EE03728B1 (sv) |
HK (1) | HK1025211A1 (sv) |
SE (1) | SE511426C2 (sv) |
WO (1) | WO1998019508A1 (sv) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7061774B2 (en) * | 2000-12-18 | 2006-06-13 | Franklin Zhigang Zhang | Computer board with dual shield housing and heat sink expansion zone apparatuses |
US6377475B1 (en) * | 2001-02-26 | 2002-04-23 | Gore Enterprise Holdings, Inc. | Removable electromagnetic interference shield |
US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
JP4195975B2 (ja) * | 2002-10-16 | 2008-12-17 | パナソニック株式会社 | 高周波装置 |
US7242574B2 (en) * | 2002-10-22 | 2007-07-10 | Sullivan Jason A | Robust customizable computer processing system |
WO2004038527A2 (en) * | 2002-10-22 | 2004-05-06 | Isys Technologies | Systems and methods for providing a dynamically modular processing unit |
EP1557075A4 (en) | 2002-10-22 | 2010-01-13 | Sullivan Jason | CONTROL MODULE NOT ASSOCIATED WITH PERIPHERALS HAVING IMPROVED HEAT DISSIPATION PROPERTIES |
EP1445999B1 (en) * | 2003-02-07 | 2007-10-03 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
US8399972B2 (en) | 2004-03-04 | 2013-03-19 | Skyworks Solutions, Inc. | Overmolded semiconductor package with a wirebond cage for EMI shielding |
US20080112151A1 (en) * | 2004-03-04 | 2008-05-15 | Skyworks Solutions, Inc. | Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
US9545009B2 (en) | 2007-05-23 | 2017-01-10 | Spectra Logic, Corporation | Passive alterable electrical component |
US8581113B2 (en) | 2007-12-19 | 2013-11-12 | Bridgewave Communications, Inc. | Low cost high frequency device package and methods |
TWM380706U (en) * | 2009-12-10 | 2010-05-11 | Wistron Corp | Metal shielding casing and the combination thereof with circuit board |
US20120002455A1 (en) * | 2010-06-07 | 2012-01-05 | Sullivan Jason A | Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds |
KR20120045893A (ko) * | 2010-11-01 | 2012-05-09 | 삼성전기주식회사 | 반도체 패키지 모듈 |
US9679869B2 (en) | 2011-09-02 | 2017-06-13 | Skyworks Solutions, Inc. | Transmission line for high performance radio frequency applications |
US20130082365A1 (en) | 2011-10-03 | 2013-04-04 | International Business Machines Corporation | Interposer for ESD, EMI, and EMC |
CN103052285A (zh) * | 2011-10-14 | 2013-04-17 | 成都锐奕信息技术有限公司 | 带屏蔽框和开有减胶槽的卡片式无线定位终端壳体结构 |
CN102365014A (zh) * | 2011-10-20 | 2012-02-29 | 镇江船舶电器有限责任公司 | 电器箱柜面板元件的屏蔽电磁泄漏结构 |
US8948712B2 (en) | 2012-05-31 | 2015-02-03 | Skyworks Solutions, Inc. | Via density and placement in radio frequency shielding applications |
CN104410373B (zh) | 2012-06-14 | 2016-03-09 | 西凯渥资讯处理科技公司 | 包含相关系统、装置及方法的功率放大器模块 |
US9295157B2 (en) | 2012-07-13 | 2016-03-22 | Skyworks Solutions, Inc. | Racetrack design in radio frequency shielding applications |
US10206317B2 (en) * | 2015-06-29 | 2019-02-12 | Microsoft Technology Licensing, Llc | Modular radio frequency shielding |
WO2018130172A1 (zh) * | 2017-01-11 | 2018-07-19 | 宁波舜宇光电信息有限公司 | 线路板和模塑感光组件及其制造方法以及摄像模组和电子设备 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2932015C2 (de) * | 1978-08-07 | 1983-12-29 | Mitsumi Electric Co., Ltd., Tokyo | Abschirmvorrichtung für Hochfrequenzschaltungen |
US4626963A (en) | 1985-02-28 | 1986-12-02 | Rca Corporation | Wave solderable RF shield member for a printed circuit board |
SU1478388A1 (ru) | 1986-02-24 | 1989-05-07 | Предприятие П/Я А-7217 | Экранирующий корпус дл радиоэлектронной аппаратуры |
JPS62162891U (sv) * | 1986-04-03 | 1987-10-16 | ||
US4717990A (en) * | 1986-05-30 | 1988-01-05 | Motorola, Inc. | Double-shielded housing for RF circuitry |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
US4717989A (en) | 1987-03-30 | 1988-01-05 | Motorola Inc. | Heat sink, EMI shield and controller module assembly for a portable radio transceiver |
US4838475A (en) | 1987-08-28 | 1989-06-13 | Motorola, Inc. | Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device |
US4890199A (en) | 1988-11-04 | 1989-12-26 | Motorola, Inc. | Miniature shield with opposing cantilever spring fingers |
FI85794C (sv) | 1989-07-05 | 1992-05-25 | Nokia Mobira Oy | Förfarande för att skydda ett kretskort eller en del därav mot störnin gar som alstrats av elektromagnetisk interferens, och skyddshölje för avändning i förfarandet |
US5054193A (en) * | 1989-08-28 | 1991-10-08 | Hewlett-Packard Company | Printed circuit board fixture and a method of assembling a printed circuit board |
JPH03276337A (ja) | 1990-03-27 | 1991-12-06 | Toshiba Corp | マイクロコントローラ |
US5153379A (en) | 1990-10-09 | 1992-10-06 | Motorola, Inc. | Shielded low-profile electronic component assembly |
FR2674680B1 (fr) * | 1991-03-26 | 1993-12-03 | Thomson Csf | Procede de realisation de connexions coaxiales pour composant electronique, et boitier de composant comportant de telles connexions. |
US5202699A (en) | 1991-05-30 | 1993-04-13 | Confier Corporation | Integrated MMDS antenna and down converter |
FI109960B (sv) | 1991-09-19 | 2002-10-31 | Nokia Corp | Elektronisk anordning |
US5365410A (en) | 1991-10-22 | 1994-11-15 | Nokia Mobile Phones Ltd. | Electromagnetic compatibility enclosure |
SG48844A1 (en) * | 1991-12-27 | 1998-05-18 | Murata Manufacturing Co | Piezoelectric acceleration sensor |
JP2639280B2 (ja) * | 1992-06-10 | 1997-08-06 | 松下電器産業株式会社 | 高密度回路モジュールの製造方法 |
US5369552A (en) | 1992-07-14 | 1994-11-29 | Ncr Corporation | Multi-chip module with multiple compartments |
DE9214394U1 (de) | 1992-10-23 | 1992-12-17 | Siemens AG, 8000 München | Befestigung einer Abschirmung mit einer Leiterplatte |
JPH06164265A (ja) | 1992-11-16 | 1994-06-10 | Toshiba Corp | マイクロ波増幅器 |
US5880403A (en) * | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
JPH07116830A (ja) | 1993-10-26 | 1995-05-09 | Sony Corp | 金属部材の固定方法及び金属部材の固定装置 |
JPH07142906A (ja) | 1993-11-15 | 1995-06-02 | Fuji Elelctrochem Co Ltd | 誘電体フィルタの蓋体取付け構造 |
JPH07212060A (ja) | 1994-01-12 | 1995-08-11 | Matsushita Electric Ind Co Ltd | 回路モジュール |
FI941407A (sv) | 1994-03-25 | 1995-09-26 | Lk Products Oy | Metallfodral för filter |
JP3120655B2 (ja) | 1994-04-13 | 2000-12-25 | 株式会社村田製作所 | シールド用枠体の製造方法 |
JP3621716B2 (ja) | 1994-05-09 | 2005-02-16 | 富士通株式会社 | 高周波プリント回路板ユニット構造 |
JPH08111580A (ja) | 1994-10-12 | 1996-04-30 | Yagi Antenna Co Ltd | シールドケースの基板はんだ付け方法 |
US5599208A (en) | 1994-12-14 | 1997-02-04 | The Whitaker Corporation | Electrical connector with printed circuit board programmable filter |
JP3208075B2 (ja) * | 1996-12-02 | 2001-09-10 | アルプス電気株式会社 | シールドケース |
-
1996
- 1996-10-28 SE SE9603931A patent/SE511426C2/sv not_active IP Right Cessation
-
1997
- 1997-10-20 US US08/954,606 patent/US6192577B1/en not_active Expired - Lifetime
- 1997-10-23 DE DE69732045T patent/DE69732045T2/de not_active Expired - Lifetime
- 1997-10-23 WO PCT/SE1997/001771 patent/WO1998019508A1/en active IP Right Grant
- 1997-10-23 AU AU48887/97A patent/AU735228B2/en not_active Ceased
- 1997-10-23 EP EP97911543A patent/EP0934688B1/en not_active Expired - Lifetime
- 1997-10-23 CN CNB971810117A patent/CN1149907C/zh not_active Expired - Fee Related
- 1997-10-23 BR BR9712584-9A patent/BR9712584A/pt not_active Application Discontinuation
- 1997-10-23 EE EEP199900170A patent/EE03728B1/xx not_active IP Right Cessation
- 1997-10-23 KR KR10-1999-7003646A patent/KR100489860B1/ko not_active IP Right Cessation
- 1997-10-23 JP JP52035898A patent/JP3920355B2/ja not_active Expired - Lifetime
-
2000
- 2000-07-18 HK HK00104383A patent/HK1025211A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SE9603931D0 (sv) | 1996-10-28 |
JP2001504990A (ja) | 2001-04-10 |
AU4888797A (en) | 1998-05-22 |
US6192577B1 (en) | 2001-02-27 |
SE9603931L (sv) | 1998-04-29 |
HK1025211A1 (en) | 2000-11-03 |
BR9712584A (pt) | 1999-10-26 |
AU735228B2 (en) | 2001-07-05 |
WO1998019508A1 (en) | 1998-05-07 |
DE69732045D1 (de) | 2005-01-27 |
EP0934688B1 (en) | 2004-12-22 |
CN1242138A (zh) | 2000-01-19 |
EP0934688A1 (en) | 1999-08-11 |
EE9900170A (et) | 1999-12-15 |
DE69732045T2 (de) | 2005-06-23 |
CN1149907C (zh) | 2004-05-12 |
KR20000052821A (ko) | 2000-08-25 |
SE511426C2 (sv) | 1999-09-27 |
JP3920355B2 (ja) | 2007-05-30 |
KR100489860B1 (ko) | 2005-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EE9900170A (et) | Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil | |
EP0903060A4 (en) | DEVICE AND METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ON A SUBSTRATE | |
EP0948250A4 (en) | ELECTRONIC COMPONENT AND ASSEMBLY METHOD AND DEVICE | |
IL125650A0 (en) | Apparatus and method for spray-cooling an electronic module | |
IL125147A0 (en) | Apparatus and method for spray-cooling an electronic module | |
ZA95977B (en) | A method and apparatus for shielding an electrical circuit that is disposed on a substrate | |
HK1033348A1 (en) | A method and apparatus for an adjustable hinged detent for electronic apparatus | |
SG52954A1 (en) | Method for protecting electronic circuit components and assemblies using a metallized flexible enclosure | |
AU6731794A (en) | Method and apparatus for electronic licensing | |
TW421413U (en) | Electronic apparatus and surface mounting devices therefor | |
EP0934552A4 (en) | METHOD AND DEVICE FOR ELECTRONIC FILM DEVELOPMENT | |
HK1017228A1 (en) | Device and method for mounting electronic parts | |
EP0743530A3 (en) | Test device for electronic components | |
HK1021236A1 (en) | Device for protecting an electronic apparatus | |
EP0862355A4 (en) | INSTALLATION DEVICE FOR ELECTRONIC PARTS | |
EP0838992A4 (en) | METHOD AND DEVICE FOR FITTING ELECTRONIC COMPONENTS | |
EP0926942A4 (en) | DEVICE AND METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS | |
EP0459831A3 (en) | Method and device for mounting components on a printed circuit board | |
SG47037A1 (en) | Mounting apparatus for electronic component | |
SG71687A1 (en) | Electronic component mounting apparatus and method | |
EP0487315A3 (en) | Method and apparatus for electronic component mounting | |
EP0835050A4 (en) | METHOD AND DEVICE FOR FITTING ELECTRONIC COMPONENTS | |
DE69401459D1 (de) | Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten | |
GB9603536D0 (en) | A system and a method for mounting electronic components | |
HK1012043A1 (en) | Dustproof structure for an electronic apparatus having a display |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
KB4A | Valid patent at the end of a year |
Effective date: 20021231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20031231 |
|
HE1A | Change of address | ||
KB4A | Valid patent at the end of a year |
Effective date: 20041231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20051231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20061231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20071231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20081231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20091231 |
|
KB4A | Valid patent at the end of a year |
Effective date: 20101231 |
|
MM4A | Lapsed by not paying the annual fees |
Effective date: 20141023 |