SE9603931L - Anordning och förfarande vid avskärmning av elektronik - Google Patents

Anordning och förfarande vid avskärmning av elektronik

Info

Publication number
SE9603931L
SE9603931L SE9603931A SE9603931A SE9603931L SE 9603931 L SE9603931 L SE 9603931L SE 9603931 A SE9603931 A SE 9603931A SE 9603931 A SE9603931 A SE 9603931A SE 9603931 L SE9603931 L SE 9603931L
Authority
SE
Sweden
Prior art keywords
components
contact surface
shielded
assembly base
shielding
Prior art date
Application number
SE9603931A
Other languages
Unknown language ( )
English (en)
Other versions
SE511426C2 (sv
SE9603931D0 (sv
Inventor
Anders Larsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9603931A priority Critical patent/SE511426C2/sv
Publication of SE9603931D0 publication Critical patent/SE9603931D0/sv
Priority to US08/954,606 priority patent/US6192577B1/en
Priority to BR9712584-9A priority patent/BR9712584A/pt
Priority to EP97911543A priority patent/EP0934688B1/en
Priority to EEP199900170A priority patent/EE03728B1/xx
Priority to PCT/SE1997/001771 priority patent/WO1998019508A1/en
Priority to JP52035898A priority patent/JP3920355B2/ja
Priority to DE69732045T priority patent/DE69732045T2/de
Priority to CNB971810117A priority patent/CN1149907C/zh
Priority to KR10-1999-7003646A priority patent/KR100489860B1/ko
Priority to AU48887/97A priority patent/AU735228B2/en
Publication of SE9603931L publication Critical patent/SE9603931L/sv
Publication of SE511426C2 publication Critical patent/SE511426C2/sv
Priority to HK00104383A priority patent/HK1025211A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
SE9603931A 1996-10-28 1996-10-28 Anordning och förfarande vid avskärmning av elektronik SE511426C2 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9603931A SE511426C2 (sv) 1996-10-28 1996-10-28 Anordning och förfarande vid avskärmning av elektronik
US08/954,606 US6192577B1 (en) 1996-10-28 1997-10-20 Method for shielding of electronics
AU48887/97A AU735228B2 (en) 1996-10-28 1997-10-23 A method and a device for shielding of electronic components on a circuit board
JP52035898A JP3920355B2 (ja) 1996-10-28 1997-10-23 回路基板上の電子的構成要素を遮蔽する方法と装置
EP97911543A EP0934688B1 (en) 1996-10-28 1997-10-23 A method and a device for shielding of electronic components on a circuit board
EEP199900170A EE03728B1 (et) 1996-10-28 1997-10-23 Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil
PCT/SE1997/001771 WO1998019508A1 (en) 1996-10-28 1997-10-23 A method and a device for shielding of electronic components on a circuit board
BR9712584-9A BR9712584A (pt) 1996-10-28 1997-10-23 Processo em um sistema eletrônico de proporcionar uma blindagem confiável de componentes sobre uma base de montagem, e, aparelhos em um sistema eletrônico para efetuar a blindagem de componentes sobre uma base de montagem com uma unidade de blindagem e para proteger componentes sobre uma base de montagem com uma unidade de blindagem
DE69732045T DE69732045T2 (de) 1996-10-28 1997-10-23 Verfahren und Vorrichtung zur Abschirmung von elektronischen Bausteinen auf einer Leiterplatte
CNB971810117A CN1149907C (zh) 1996-10-28 1997-10-23 用来屏蔽电路板上的电子元件的方法和装置
KR10-1999-7003646A KR100489860B1 (ko) 1996-10-28 1997-10-23 회로 기판상의 전자 부품의 차폐 방법 및 장치
HK00104383A HK1025211A1 (en) 1996-10-28 2000-07-18 A method and a device for shielding of electronic components on a circuit board.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9603931A SE511426C2 (sv) 1996-10-28 1996-10-28 Anordning och förfarande vid avskärmning av elektronik

Publications (3)

Publication Number Publication Date
SE9603931D0 SE9603931D0 (sv) 1996-10-28
SE9603931L true SE9603931L (sv) 1998-04-29
SE511426C2 SE511426C2 (sv) 1999-09-27

Family

ID=20404394

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9603931A SE511426C2 (sv) 1996-10-28 1996-10-28 Anordning och förfarande vid avskärmning av elektronik

Country Status (12)

Country Link
US (1) US6192577B1 (sv)
EP (1) EP0934688B1 (sv)
JP (1) JP3920355B2 (sv)
KR (1) KR100489860B1 (sv)
CN (1) CN1149907C (sv)
AU (1) AU735228B2 (sv)
BR (1) BR9712584A (sv)
DE (1) DE69732045T2 (sv)
EE (1) EE03728B1 (sv)
HK (1) HK1025211A1 (sv)
SE (1) SE511426C2 (sv)
WO (1) WO1998019508A1 (sv)

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CN1729734B (zh) * 2002-10-22 2011-01-05 贾森·A·沙利文 用于提供动态模块处理单元的系统及方法
BR0315624A (pt) 2002-10-22 2005-08-23 Jason A Sullivan Sistema de processamento em computador personalizável robusto
EP1445999B1 (en) * 2003-02-07 2007-10-03 Sony Ericsson Mobile Communications AB A method of providing a PWB with a shield can and a PWB therefor
US20080112151A1 (en) * 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US8399972B2 (en) 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US9545009B2 (en) 2007-05-23 2017-01-10 Spectra Logic, Corporation Passive alterable electrical component
US8581113B2 (en) 2007-12-19 2013-11-12 Bridgewave Communications, Inc. Low cost high frequency device package and methods
TWM380706U (en) * 2009-12-10 2010-05-11 Wistron Corp Metal shielding casing and the combination thereof with circuit board
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
KR20120045893A (ko) * 2010-11-01 2012-05-09 삼성전기주식회사 반도체 패키지 모듈
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US20130082365A1 (en) 2011-10-03 2013-04-04 International Business Machines Corporation Interposer for ESD, EMI, and EMC
CN103052285A (zh) * 2011-10-14 2013-04-17 成都锐奕信息技术有限公司 带屏蔽框和开有减胶槽的卡片式无线定位终端壳体结构
CN102365014A (zh) * 2011-10-20 2012-02-29 镇江船舶电器有限责任公司 电器箱柜面板元件的屏蔽电磁泄漏结构
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
EP3567629A3 (en) 2012-06-14 2020-01-22 Skyworks Solutions, Inc. Power amplifier modules including related systems, devices, and methods
CN104885216B (zh) 2012-07-13 2017-04-12 天工方案公司 在射频屏蔽应用中的轨道设计
US10206317B2 (en) * 2015-06-29 2019-02-12 Microsoft Technology Licensing, Llc Modular radio frequency shielding
EP3570651A4 (en) 2017-01-11 2020-11-18 Ningbo Sunny Opotech Co., Ltd. CIRCUIT BOARD, SHAPED LIGHT SENSITIVE ASSEMBLY AND MANUFACTURING METHOD FOR IT, PHOTOGRAPHY MODULE AND ELECTRONIC DEVICE

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Also Published As

Publication number Publication date
CN1242138A (zh) 2000-01-19
SE511426C2 (sv) 1999-09-27
EP0934688A1 (en) 1999-08-11
US6192577B1 (en) 2001-02-27
HK1025211A1 (en) 2000-11-03
EE9900170A (et) 1999-12-15
DE69732045T2 (de) 2005-06-23
AU735228B2 (en) 2001-07-05
KR100489860B1 (ko) 2005-05-17
EE03728B1 (et) 2002-04-15
DE69732045D1 (de) 2005-01-27
JP2001504990A (ja) 2001-04-10
CN1149907C (zh) 2004-05-12
KR20000052821A (ko) 2000-08-25
AU4888797A (en) 1998-05-22
JP3920355B2 (ja) 2007-05-30
SE9603931D0 (sv) 1996-10-28
EP0934688B1 (en) 2004-12-22
BR9712584A (pt) 1999-10-26
WO1998019508A1 (en) 1998-05-07

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