DE962129C - Saures Elektrolytbad zur Herstellung elektrolytischer Kupferueberzuege - Google Patents
Saures Elektrolytbad zur Herstellung elektrolytischer KupferueberzuegeInfo
- Publication number
- DE962129C DE962129C DEN5865A DEN0005865A DE962129C DE 962129 C DE962129 C DE 962129C DE N5865 A DEN5865 A DE N5865A DE N0005865 A DEN0005865 A DE N0005865A DE 962129 C DE962129 C DE 962129C
- Authority
- DE
- Germany
- Prior art keywords
- acid electrolyte
- electrolyte bath
- thiourea
- derivative
- bath according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 25
- 229910052802 copper Inorganic materials 0.000 title claims description 25
- 239000010949 copper Substances 0.000 title claims description 25
- 238000000576 coating method Methods 0.000 title claims description 10
- 239000003792 electrolyte Substances 0.000 title claims description 9
- 239000002253 acid Substances 0.000 title claims 7
- 238000004519 manufacturing process Methods 0.000 title claims 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 27
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 18
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 13
- 235000011187 glycerol Nutrition 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 2
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 claims description 2
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical compound NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 2
- 229960001748 allylthiourea Drugs 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- 244000000188 Vaccinium ovalifolium Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2742412X | 1952-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE962129C true DE962129C (de) | 1957-04-18 |
Family
ID=19875526
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEN5864A Expired DE940860C (de) | 1952-07-05 | 1952-07-30 | Saures Elektrolytbad zur Herstellung elektrolytischer Kupferueberzuege |
| DEN5865A Expired DE962129C (de) | 1952-07-05 | 1952-07-30 | Saures Elektrolytbad zur Herstellung elektrolytischer Kupferueberzuege |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEN5864A Expired DE940860C (de) | 1952-07-05 | 1952-07-30 | Saures Elektrolytbad zur Herstellung elektrolytischer Kupferueberzuege |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US2742413A (US06623731-20030923-C00012.png) |
| BE (1) | BE518440A (US06623731-20030923-C00012.png) |
| DE (2) | DE940860C (US06623731-20030923-C00012.png) |
| NL (4) | NL84048C (US06623731-20030923-C00012.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1214069B (de) * | 1957-04-16 | 1966-04-07 | Dehydag Gmbh | Galvanische Kupferbaeder |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
| DE1007592B (de) * | 1955-01-19 | 1957-05-02 | Dehydag Gmbh | Bad zur Herstellung von galvanischen Metallueberzuegen |
| US2853443A (en) * | 1956-04-25 | 1958-09-23 | Westinghouse Electric Corp | Addition agent for acid copper electrolytes |
| US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
| NL238490A (US06623731-20030923-C00012.png) * | 1958-04-26 | |||
| US3770599A (en) * | 1971-05-24 | 1973-11-06 | Oxy Metal Finishing Corp | Acid zinc plating baths |
| US4009087A (en) * | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| US4474649A (en) * | 1982-06-21 | 1984-10-02 | Asarco Incorporated | Method of thiourea addition of electrolytic solutions useful for copper refining |
| JPH02232391A (ja) * | 1988-12-21 | 1990-09-14 | Internatl Business Mach Corp <Ibm> | アデイテイブ鍍金浴および方法 |
| US6565729B2 (en) * | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
| US6551484B2 (en) | 1999-04-08 | 2003-04-22 | Applied Materials, Inc. | Reverse voltage bias for electro-chemical plating system and method |
| US6571657B1 (en) | 1999-04-08 | 2003-06-03 | Applied Materials Inc. | Multiple blade robot adjustment apparatus and associated method |
| US20030213772A9 (en) * | 1999-07-09 | 2003-11-20 | Mok Yeuk-Fai Edwin | Integrated semiconductor substrate bevel cleaning apparatus and method |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| WO2001090446A2 (en) | 2000-05-23 | 2001-11-29 | Applied Materials, Inc. | Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio |
| US6576110B2 (en) | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
| JP2004536217A (ja) * | 2000-10-03 | 2004-12-02 | アプライド マテリアルズ インコーポレイテッド | 金属蒸着のためのエントリーにあたって半導体基板を傾けるための方法と関連する装置 |
| US6610189B2 (en) | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| US20040020780A1 (en) * | 2001-01-18 | 2004-02-05 | Hey H. Peter W. | Immersion bias for use in electro-chemical plating system |
| US6478937B2 (en) | 2001-01-19 | 2002-11-12 | Applied Material, Inc. | Substrate holder system with substrate extension apparatus and associated method |
| US20030146102A1 (en) * | 2002-02-05 | 2003-08-07 | Applied Materials, Inc. | Method for forming copper interconnects |
| US6911136B2 (en) * | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process |
| US20040200725A1 (en) * | 2003-04-09 | 2004-10-14 | Applied Materials Inc. | Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process |
| US20040206628A1 (en) * | 2003-04-18 | 2004-10-21 | Applied Materials, Inc. | Electrical bias during wafer exit from electrolyte bath |
| US20050092602A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a membrane stack |
| US20050092601A1 (en) * | 2003-10-29 | 2005-05-05 | Harald Herchen | Electrochemical plating cell having a diffusion member |
| US20060102467A1 (en) * | 2004-11-15 | 2006-05-18 | Harald Herchen | Current collimation for thin seed and direct plating |
| US20060175201A1 (en) * | 2005-02-07 | 2006-08-10 | Hooman Hafezi | Immersion process for electroplating applications |
| US20100140098A1 (en) * | 2008-05-15 | 2010-06-10 | Solopower, Inc. | Selenium containing electrodeposition solution and methods |
| EP3074552A1 (en) * | 2013-11-25 | 2016-10-05 | Enthone, Inc. | Electrodeposition of copper |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE104111C (US06623731-20030923-C00012.png) * | ||||
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| GB633780A (en) * | 1941-05-24 | 1949-12-30 | Gen Motors Corp | Improvements relating to the electrodeposition of copper |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA477508A (en) * | 1951-10-02 | Brown Henry | Electrodeposition of nickel from acid baths | |
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2196588A (en) * | 1937-05-26 | 1940-04-09 | Du Pont | Electroplating |
| US2315802A (en) * | 1940-04-20 | 1943-04-06 | Harshaw Chem Corp | Nickel plating |
| US2389179A (en) * | 1941-02-21 | 1945-11-20 | Udylite Corp | Electrodeposition of metals |
| US2355505A (en) * | 1941-10-03 | 1944-08-08 | Purdue Research Foundation | Electrodeposition of bright zinc |
| US2462870A (en) * | 1942-07-09 | 1949-03-01 | Gen Motors Corp | Electrodeposition of copper |
| US2472393A (en) * | 1944-09-25 | 1949-06-07 | American Steel & Wire Co | Process and bath for copper coating ferrous metal |
| BE504701A (US06623731-20030923-C00012.png) * | 1950-07-17 | |||
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
-
0
- NL NLAANVRAGE7413473,A patent/NL170871B/xx unknown
- NL NL81606D patent/NL81606C/xx active
- NL NLAANVRAGE7106028,A patent/NL170870B/xx unknown
- BE BE518440D patent/BE518440A/xx unknown
- NL NL84048D patent/NL84048C/xx active
-
1952
- 1952-07-30 DE DEN5864A patent/DE940860C/de not_active Expired
- 1952-07-30 DE DEN5865A patent/DE962129C/de not_active Expired
-
1953
- 1953-04-13 US US348581A patent/US2742413A/en not_active Expired - Lifetime
- 1953-04-13 US US348582A patent/US2742412A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE104111C (US06623731-20030923-C00012.png) * | ||||
| GB633780A (en) * | 1941-05-24 | 1949-12-30 | Gen Motors Corp | Improvements relating to the electrodeposition of copper |
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1214069B (de) * | 1957-04-16 | 1966-04-07 | Dehydag Gmbh | Galvanische Kupferbaeder |
Also Published As
| Publication number | Publication date |
|---|---|
| DE940860C (de) | 1956-03-29 |
| US2742413A (en) | 1956-04-17 |
| BE518440A (US06623731-20030923-C00012.png) | |
| NL84048C (US06623731-20030923-C00012.png) | |
| NL81606C (US06623731-20030923-C00012.png) | |
| NL170871B (nl) | |
| NL170870B (nl) | |
| US2742412A (en) | 1956-04-17 |
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