DE69935810D1 - Verfahren zur herstellung einer laminierten struktur - Google Patents

Verfahren zur herstellung einer laminierten struktur

Info

Publication number
DE69935810D1
DE69935810D1 DE69935810T DE69935810T DE69935810D1 DE 69935810 D1 DE69935810 D1 DE 69935810D1 DE 69935810 T DE69935810 T DE 69935810T DE 69935810 T DE69935810 T DE 69935810T DE 69935810 D1 DE69935810 D1 DE 69935810D1
Authority
DE
Germany
Prior art keywords
producing
laminated structure
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935810T
Other languages
English (en)
Other versions
DE69935810T2 (de
Inventor
Joel D Oxman
Michael A Kropp
Peter B Hogerton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE69935810D1 publication Critical patent/DE69935810D1/de
Application granted granted Critical
Publication of DE69935810T2 publication Critical patent/DE69935810T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0092—Metallizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • B32B2429/02—Records or discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01037—Rubidium [Rb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69935810T 1999-07-30 1999-11-30 Verfahren zur herstellung einer laminierten struktur Expired - Lifetime DE69935810T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US365289 1999-07-30
US09/365,289 US6395124B1 (en) 1999-07-30 1999-07-30 Method of producing a laminated structure
PCT/US1999/028245 WO2001009262A1 (en) 1999-07-30 1999-11-30 Method of producing a laminated structure

Publications (2)

Publication Number Publication Date
DE69935810D1 true DE69935810D1 (de) 2007-05-24
DE69935810T2 DE69935810T2 (de) 2007-12-27

Family

ID=23438259

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69935810T Expired - Lifetime DE69935810T2 (de) 1999-07-30 1999-11-30 Verfahren zur herstellung einer laminierten struktur

Country Status (7)

Country Link
US (3) US6395124B1 (de)
EP (1) EP1200533B1 (de)
JP (1) JP2003506860A (de)
KR (1) KR100672791B1 (de)
AU (1) AU1835300A (de)
DE (1) DE69935810T2 (de)
WO (1) WO2001009262A1 (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3919972B2 (ja) * 1998-07-31 2007-05-30 セイコーエプソン株式会社 半導体装置の製造方法
US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
CN101906274B (zh) * 1999-08-25 2012-05-30 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
WO2001053065A1 (en) * 2000-01-18 2001-07-26 Trid Store Ip, Llc Manufacturing method for multilayer fluorescent information carriers
SG106050A1 (en) * 2000-03-13 2004-09-30 Megic Corp Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
US6559537B1 (en) * 2000-08-31 2003-05-06 Micron Technology, Inc. Ball grid array packages with thermally conductive containers
JP2004509479A (ja) 2000-09-19 2004-03-25 ナノピアス・テクノロジーズ・インコーポレイテッド 無線周波数識別装置における複数の部品および複数のアンテナを組み立てる方法
US20040087128A1 (en) * 2000-10-24 2004-05-06 Neuhaus Herbert J Method and materials for printing particle-enhanced electrical contacts
US7122908B2 (en) * 2001-02-01 2006-10-17 Micron Technology, Inc. Electronic device package
JP3627011B2 (ja) * 2001-02-13 2005-03-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 接合方法
JP5280597B2 (ja) * 2001-03-30 2013-09-04 サンスター技研株式会社 一液加熱硬化型エポキシ樹脂組成物および半導体実装用アンダーフィル材
US20020151164A1 (en) * 2001-04-12 2002-10-17 Jiang Hunt Hang Structure and method for depositing solder bumps on a wafer
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US20030123302A1 (en) * 2001-06-05 2003-07-03 Thompson Robert F. Limited play optical devices with interstitial reactive layer and methods of making same
US6573592B2 (en) * 2001-08-21 2003-06-03 Micron Technology, Inc. Semiconductor die packages with standard ball grid array footprint and method for assembling the same
US6582990B2 (en) * 2001-08-24 2003-06-24 International Rectifier Corporation Wafer level underfill and interconnect process
US20030116860A1 (en) * 2001-12-21 2003-06-26 Biju Chandran Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses
US7235886B1 (en) 2001-12-21 2007-06-26 Intel Corporation Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
US20030132528A1 (en) * 2001-12-28 2003-07-17 Jimmy Liang Method and apparatus for flip chip device assembly by radiant heating
US20030132513A1 (en) * 2002-01-11 2003-07-17 Motorola, Inc. Semiconductor package device and method
US7723162B2 (en) * 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
JP4037197B2 (ja) * 2002-07-17 2008-01-23 富士フイルム株式会社 半導体撮像装置実装構造体の製造方法
DE10232636A1 (de) * 2002-07-18 2004-02-12 Delo Industrieklebstoffe Gmbh & Co. Kg Verfahren und Klebstoff zur Flip-Chip-Kontaktierung
US6884315B2 (en) * 2002-08-20 2005-04-26 Ucb, S.A. Method for bonding DVD layers
US7521115B2 (en) * 2002-12-17 2009-04-21 Intel Corporation Low temperature bumping process
US7094307B2 (en) * 2003-01-06 2006-08-22 Joan Morris Methods for coating surfaces with metal and products made thereby
US6943058B2 (en) * 2003-03-18 2005-09-13 Delphi Technologies, Inc. No-flow underfill process and material therefor
US7166491B2 (en) 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US20050056946A1 (en) * 2003-09-16 2005-03-17 Cookson Electronics, Inc. Electrical circuit assembly with improved shock resistance
DE10348253B3 (de) * 2003-10-16 2005-02-17 Robert Bosch Gmbh Verfahren zum Einkleben eines Chips in ein Premold-Gehäuse und zugehöringe Vorrichtung
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
US7262228B2 (en) * 2003-11-21 2007-08-28 Curators Of The University Of Missouri Photoinitiator systems with anthracene-based electron donors for curing cationically polymerizable resins
US7298235B2 (en) * 2004-01-13 2007-11-20 Raytheon Company Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
US20050196604A1 (en) * 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
ES2397640T3 (es) * 2004-05-22 2013-03-08 3M Innovative Properties Company Tarjetas y laminados que incorporan películas ópticas de multi-capa
US7098465B1 (en) * 2004-06-25 2006-08-29 Henkel Corporation Integrated inert gas for electromagnetic energy spot curing system
FR2872590B1 (fr) * 2004-07-02 2006-10-27 Essilor Int Procede de realisation d'un verre ophtalmique et composant optique adapte pour la mise en oeuvre de ce procede
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7294827B2 (en) * 2004-09-21 2007-11-13 Delphi Technologies, Inc. Electronic module with light-blocking features
FR2875995B1 (fr) * 2004-09-24 2014-10-24 Oberthur Card Syst Sa Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport
US7837821B2 (en) 2004-10-13 2010-11-23 Rheonix, Inc. Laminated microfluidic structures and method for making
WO2006043922A1 (en) * 2004-10-13 2006-04-27 Kionix, Inc. Laminated microfluidic structures and method for making
US7608160B2 (en) * 2004-10-13 2009-10-27 Rheonix, Inc. Laminated microfluidic structures and method for making
DE102005010109A1 (de) * 2005-03-02 2006-09-07 Basf Ag Modifizierte Polyolefinwachse
US20060196948A1 (en) * 2005-03-04 2006-09-07 Weber Michael F Light transmissive cards with suppression of UV-induced fluorescence
GB0505824D0 (en) * 2005-03-22 2005-04-27 Conductive Inkjet Tech Ltd Treatment of items
DE102005029407B4 (de) * 2005-06-24 2008-06-19 Mühlbauer Ag Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
EP2581224B1 (de) * 2005-08-18 2014-12-17 Toray Industries, Inc. Laminatfolie und geformter Gegenstand
CN101313636B (zh) * 2005-11-21 2011-04-20 松下电器产业株式会社 制造安装有电子部件的回路基板的方法
US20070142498A1 (en) * 2005-12-20 2007-06-21 Brennan Joan V Dental compositions including thermally responsive additives, and the use thereof
US7896650B2 (en) * 2005-12-20 2011-03-01 3M Innovative Properties Company Dental compositions including radiation-to-heat converters, and the use thereof
US8026296B2 (en) 2005-12-20 2011-09-27 3M Innovative Properties Company Dental compositions including a thermally labile component, and the use thereof
US7776940B2 (en) * 2005-12-20 2010-08-17 3M Innovative Properties Company Methods for reducing bond strengths, dental compositions, and the use thereof
MX2008012939A (es) * 2006-04-04 2009-01-16 Saint Gobain Abrasives Inc Articulos abrasivos curados con radiacion infrarroja, y metodo de fabricacion de los mismos.
US7636193B2 (en) * 2006-05-02 2009-12-22 3M Innovative Properties Company Visible light-transmissive IR filter with distorted portions
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
TWI414580B (zh) * 2006-10-31 2013-11-11 Sumitomo Bakelite Co 黏著帶及使用該黏著帶而成之半導體裝置
IL188311A (en) * 2007-01-22 2011-05-31 Erowa Ag System and method for joining non-transparent parts by means of a radiation curable adhesive
US7498198B2 (en) * 2007-04-30 2009-03-03 International Business Machines Corporation Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
WO2009031262A1 (ja) * 2007-09-03 2009-03-12 Panasonic Corporation 配線基板
US20090189296A1 (en) * 2008-01-30 2009-07-30 Chipmos Technologies Inc. Flip chip quad flat non-leaded package structure and manufacturing method thereof and chip package structure
CN102084482B (zh) * 2008-03-19 2013-05-29 汉高公司 以浸渍工艺使用施加于焊接触点上的助熔底部填充组合物制造半导体包装物或线路组件的方法
EP2307518A4 (de) * 2008-07-03 2014-03-19 3M Innovative Properties Co Fixierte schleifkörner und daraus hergestellte erzeugnisse
JP2010062269A (ja) * 2008-09-02 2010-03-18 Three M Innovative Properties Co ウェーハ積層体の製造方法、ウェーハ積層体製造装置、ウェーハ積層体、支持層剥離方法、及びウェーハの製造方法
DE102009004724A1 (de) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil
EP2419243A1 (de) * 2009-04-17 2012-02-22 3M Innovative Properties Company Metallteilchentransferkörper, metallmodifziertes substrat und herstellungs- und verwendungsverfahren dafür
US8369668B1 (en) * 2009-04-23 2013-02-05 Superior Essex Communications Lp Water blocked fiber optic cable
WO2011010738A1 (ja) * 2009-07-24 2011-01-27 Taga Yasunori 接合構造体の製造方法および接合構造体
JP2011040512A (ja) * 2009-08-10 2011-02-24 Murata Mfg Co Ltd 回路基板の製造方法
US20110116242A1 (en) * 2009-11-18 2011-05-19 Seagate Technology Llc Tamper evident pcba film
US20130004967A1 (en) 2009-11-23 2013-01-03 Halverson Kurt J Microwell array articles and methods of use
KR101097065B1 (ko) 2010-05-14 2011-12-22 (주)스마트이노베이션 디스플레이 카드 제조용 수지 조성물 및 이를 이용한 디스플레이 카드 제조방법
US8816211B2 (en) * 2011-02-14 2014-08-26 Eastman Kodak Company Articles with photocurable and photocured compositions
JP6426470B2 (ja) 2011-05-25 2018-11-21 スリーエム イノベイティブ プロパティズ カンパニー 光制御フィルム
WO2013042203A1 (ja) * 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
MY184782A (en) * 2011-11-03 2021-04-21 Malaysian Palm Oil Board A method to produce copolymers of tetrahydrofuran and epoxidized natural oils
US9435978B1 (en) 2012-06-14 2016-09-06 Superior Essex Communications Lp Water-resistant optical fiber cables
DE102014205581A1 (de) * 2013-06-06 2014-12-11 Tesa Se Verfahren zum Verkleben mittels hitzeaktivierbarer Klebemassen
KR101719883B1 (ko) * 2013-12-25 2017-03-24 도아고세이가부시키가이샤 광 경화성 접착제 조성물, 편광판과 그 제조법, 광학 부재 및 액정 표시 장치
US9701792B2 (en) * 2014-03-19 2017-07-11 The Regents Of The University Of Colorado, A Body Corporate Composite compositions and methods of preparing and using same
JP6571923B2 (ja) * 2014-10-31 2019-09-04 浜松ホトニクス株式会社 レーザー光照射による硬化物の製造方法
US9899238B2 (en) * 2014-12-18 2018-02-20 Intel Corporation Low cost package warpage solution
US20170176116A1 (en) * 2015-12-18 2017-06-22 Renee Wu Formable interface and shielding structures
JP6673689B2 (ja) * 2015-12-21 2020-03-25 株式会社アルバック レーザー加工装置、レーザー加工方法、および、接合体の製造方法
EP3397712A1 (de) 2015-12-29 2018-11-07 3M Innovative Properties Company Verfahren zur generativen fertigung von haftstoffen und haftartikeln
JP2019532165A (ja) 2016-09-14 2019-11-07 スリーエム イノベイティブ プロパティズ カンパニー 速硬化性光学接着剤
EP3641720B1 (de) 2017-06-20 2022-06-29 3M Innovative Properties Company Strahlungshärtbare zusammensetzung für additive herstellungsverfahren
WO2019005022A1 (en) * 2017-06-28 2019-01-03 3M Innovative Properties Company ADDITIVE MANUFACTURING METHODS FOR ADHESIVES AND ADHESIVE ARTICLES
JP7255497B2 (ja) * 2017-12-28 2023-04-11 株式会社レゾナック 封止組成物及び半導体装置
JP7423423B2 (ja) 2020-05-28 2024-01-29 株式会社日立製作所 半導体検出器およびその製造方法
US20220236640A1 (en) * 2021-01-28 2022-07-28 Canon Kabushiki Kaisha Photocurable composition comprising an organic ionic compound
WO2022211805A1 (en) * 2021-03-31 2022-10-06 Ncc Nano, Llc Method for attaching and detaching substrates during integrated circuit manufacturing

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656314A (en) 1982-02-08 1987-04-07 Industrial Science Associates Printed circuit
US4735632A (en) 1987-04-02 1988-04-05 Minnesota Mining And Manufacturing Company Coated abrasive binder containing ternary photoinitiator system
US5021585A (en) * 1989-06-14 1991-06-04 Hughes Aircraft Company Aromatic polyimide silanol compounds, precursors and polymers thereof
JPH0738502B2 (ja) 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
DE3939628A1 (de) 1989-11-30 1991-06-06 Siemens Ag Verfahren zur befestigung von bauelementen und integrierten halbleiterschaltungen auf schichtschaltungen
JP2547895B2 (ja) 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
CA2038117A1 (en) * 1990-03-29 1991-09-30 Mahfuza B. Ali Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith
JPH05144086A (ja) 1991-11-18 1993-06-11 Pioneer Electron Corp 光記録デイスク
JP3442776B2 (ja) * 1992-12-21 2003-09-02 株式会社アーデル 可視光重合型接着剤用光重合開始剤組成物
JP3098362B2 (ja) 1993-09-16 2000-10-16 ローム株式会社 サーマルヘッド
JPH07106723A (ja) 1993-10-07 1995-04-21 Sumitomo Electric Ind Ltd フレキシブルプリント配線板および部品の実装方法
US5856373A (en) 1994-10-31 1999-01-05 Minnesota Mining And Manufacturing Company Dental visible light curable epoxy system with enhanced depth of cure
JPH08291273A (ja) * 1995-04-21 1996-11-05 Three Bond Co Ltd 光硬化性組成物
US5798015A (en) 1995-06-05 1998-08-25 Kimberly-Clark Worldwide, Inc. Method of laminating a structure with adhesive containing a photoreactor composition
JP3285294B2 (ja) 1995-08-08 2002-05-27 太陽誘電株式会社 回路モジュールの製造方法
US5663593A (en) * 1995-10-17 1997-09-02 National Semiconductor Corporation Ball grid array package with lead frame
JP3731227B2 (ja) 1995-10-20 2006-01-05 富士通株式会社 半導体装置の製造方法
EP0810592B1 (de) 1996-05-31 2003-01-02 Ushiodenki Kabushiki Kaisha Verfahren und Vorrichtung zum Zusammenleimen von Platten miteinander
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US5796050A (en) * 1997-02-05 1998-08-18 International Business Machines Corporation Flexible board having adhesive in surface channels
JPH111507A (ja) * 1997-06-13 1999-01-06 Tokuyama Sekiyu Kagaku Kk 光重合性組成物、その接着剤及び積層体
JPH1197482A (ja) * 1997-09-16 1999-04-09 Hitachi Chem Co Ltd 電極の接続方法および電極の接続構造

Also Published As

Publication number Publication date
KR20020034172A (ko) 2002-05-08
KR100672791B1 (ko) 2007-01-23
US6395124B1 (en) 2002-05-28
JP2003506860A (ja) 2003-02-18
US6692611B2 (en) 2004-02-17
EP1200533B1 (de) 2007-04-11
AU1835300A (en) 2001-02-19
US20020062919A1 (en) 2002-05-30
US20040134604A1 (en) 2004-07-15
WO2001009262A1 (en) 2001-02-08
DE69935810T2 (de) 2007-12-27
EP1200533A1 (de) 2002-05-02
US20020066528A1 (en) 2002-06-06

Similar Documents

Publication Publication Date Title
DE69935810D1 (de) Verfahren zur herstellung einer laminierten struktur
DE69906491D1 (de) VERFAHREN ZUR HERSTELLUNG EINER SiCOI-STRUKTUR
DE69932665D1 (de) Verfahren zur Herstellung einer Verbindungsstruktur
DE60201869D1 (de) Verfahren zur Herstellung einer Struktur
DE60016701D1 (de) Verfahren zur Herstellung einer vacuumverpackten mikro-elektro-mechanischen Struktur
DE69826934D1 (de) Verfahren zur Herstellung einer Doppel-Damaszener Struktur
DE60125755D1 (de) Verfahren zur herstellung einer flexodruckplatte
DE60030949D1 (de) Verfahren zur herstellung einer karte
DE60118126D1 (de) Verfahren zur Herstellung einer Spiegelstruktur
DE60038095D1 (de) Verfahren zur Herstellung einer trägerfreien Kristallschicht
DE60127012D1 (de) Verfahren zur Herstellung einer photonischen Kristallstruktur
DE60129153D1 (de) Verbindungskonstruktion und verfahren zur herstellung einer verbindungskonstruktion
DE60031761D1 (de) Verfahren zur herstellung einer harzzusammensetzung
DE59914827D1 (de) Verfahren zur herstellung einer bond-draht-verbindung
DE69940737D1 (de) Verfahren zur herstellung einer halbleiteranordnung
DE60327616D1 (de) Verfahren zur herstellung einer wabenstruktur
DE60014333D1 (de) Verfahren zur herstellung einer glasplatte und glasplatte
DE69934680D1 (de) Verfahren zur herstellung einer schicht
ATE266985T1 (de) Verfahren zur herstellung einer prothese
DE60032660D1 (de) Verfahren zur Herstellung einer planaren Heterostruktur
DE60116839D1 (de) Verfahren zur Herstellung einer Spiegelstruktur
DE60134220D1 (de) Verfahren zur herstellung einer heteroübergang-bicmos-integrierter schaltung
DE69942186D1 (de) Verfahren zur herstellung einer halbleiteranordnung
DE50212172D1 (de) Verfahren zur Herstellung einer Lordosenstütze
DE60012389D1 (de) Verfahren zur Herstellung einer Gassperrfolie

Legal Events

Date Code Title Description
8364 No opposition during term of opposition