DE69932496D1 - Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung - Google Patents

Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung

Info

Publication number
DE69932496D1
DE69932496D1 DE69932496T DE69932496T DE69932496D1 DE 69932496 D1 DE69932496 D1 DE 69932496D1 DE 69932496 T DE69932496 T DE 69932496T DE 69932496 T DE69932496 T DE 69932496T DE 69932496 D1 DE69932496 D1 DE 69932496D1
Authority
DE
Germany
Prior art keywords
adjustable
support plate
mechanical polishing
chemical mechanical
polishing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69932496T
Other languages
English (en)
Other versions
DE69932496T2 (de
Inventor
Steven M Zuniga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69932496D1 publication Critical patent/DE69932496D1/de
Application granted granted Critical
Publication of DE69932496T2 publication Critical patent/DE69932496T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69932496T 1998-12-30 1999-12-30 Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung Expired - Lifetime DE69932496T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US114182 1980-01-22
US470820 1983-02-28
US11418298P 1998-12-30 1998-12-30
US09/470,820 US6422927B1 (en) 1998-12-30 1999-12-23 Carrier head with controllable pressure and loading area for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
DE69932496D1 true DE69932496D1 (de) 2006-09-07
DE69932496T2 DE69932496T2 (de) 2007-02-01

Family

ID=26811889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69932496T Expired - Lifetime DE69932496T2 (de) 1998-12-30 1999-12-30 Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung

Country Status (3)

Country Link
US (3) US6422927B1 (de)
EP (1) EP1029633B1 (de)
DE (1) DE69932496T2 (de)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6776692B1 (en) 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
US6450868B1 (en) 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6506105B1 (en) 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6623343B2 (en) * 2000-05-12 2003-09-23 Multi Planar Technologies, Inc. System and method for CMP head having multi-pressure annular zone subcarrier material removal control
AU2001259745A1 (en) * 2000-05-12 2001-11-26 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
DE60138343D1 (de) * 2000-07-31 2009-05-28 Ebara Corp Substrathalter und Poliervorrichtung
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
US6790763B2 (en) * 2000-12-04 2004-09-14 Ebara Corporation Substrate processing method
US6786809B1 (en) * 2001-03-30 2004-09-07 Cypress Semiconductor Corp. Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography
US6910949B1 (en) * 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
KR100437456B1 (ko) * 2001-05-31 2004-06-23 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법
US6761619B1 (en) * 2001-07-10 2004-07-13 Cypress Semiconductor Corp. Method and system for spatial uniform polishing
KR100914988B1 (ko) * 2001-12-06 2009-09-02 가부시키가이샤 에바라 세이사꾸쇼 기판유지장치 및 폴리싱장치
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US7024268B1 (en) 2002-03-22 2006-04-04 Applied Materials Inc. Feedback controlled polishing processes
JP4777658B2 (ja) * 2002-11-22 2011-09-21 アプライド マテリアルズ インコーポレイテッド 研磨制御のための方法および器具
TWI323017B (en) * 2003-02-10 2010-04-01 Ebara Corp Substrate holding apparatus and polishing apparatus
DE10305711B4 (de) * 2003-02-12 2005-09-01 Infineon Technologies Ag Gimpelhalter und chemisch-mechanische Polieranlage mit einem solchen Gimpelhalter
US6945845B2 (en) * 2003-03-04 2005-09-20 Applied Materials, Inc. Chemical mechanical polishing apparatus with non-conductive elements
US7001245B2 (en) 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7025658B2 (en) * 2003-08-18 2006-04-11 Applied Materials, Inc. Platen and head rotation rates for monitoring chemical mechanical polishing
US7074109B1 (en) 2003-08-18 2006-07-11 Applied Materials Chemical mechanical polishing control system and method
US6991516B1 (en) 2003-08-18 2006-01-31 Applied Materials Inc. Chemical mechanical polishing with multi-stage monitoring of metal clearing
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
JP3889744B2 (ja) * 2003-12-05 2007-03-07 株式会社東芝 研磨ヘッドおよび研磨装置
US7118451B2 (en) * 2004-02-27 2006-10-10 Taiwan Semiconductor Manufacturing Co., Ltd. CMP apparatus and process sequence method
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
US7608173B2 (en) * 2004-12-02 2009-10-27 Applied Materials, Inc. Biased retaining ring
CN101022920A (zh) * 2004-05-13 2007-08-22 应用材料股份有限公司 具有导电部分的固定环
US7033257B2 (en) * 2004-07-21 2006-04-25 Agere Systems, Inc. Carrier head for chemical mechanical polishing
US7081042B2 (en) * 2004-07-22 2006-07-25 Applied Materials Substrate removal from polishing tool
US7048621B2 (en) * 2004-10-27 2006-05-23 Applied Materials Inc. Retaining ring deflection control
CN101934491B (zh) 2004-11-01 2012-07-25 株式会社荏原制作所 抛光设备
KR100674923B1 (ko) * 2004-12-03 2007-01-26 삼성전자주식회사 인접한 화소간에 출력회로를 공유하는 씨모스 이미지 센서
JP5112614B2 (ja) 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
US20070082479A1 (en) * 2005-10-06 2007-04-12 Applied Materials, Inc. Chemical mechanical polishing techniques for integrated circuit fabrication
US7407433B2 (en) * 2005-11-03 2008-08-05 Applied Materials, Inc. Pad characterization tool
NZ577810A (en) * 2006-12-19 2012-08-31 Cwf Hamilton & Co Ltd Waterjet unit impeller with a flexible section, which changes rating (pitch) at different speeds
JP2009038232A (ja) * 2007-08-02 2009-02-19 Toshiba Corp 半導体製造装置および半導体装置の製造方法
JP5042778B2 (ja) * 2007-10-31 2012-10-03 信越半導体株式会社 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置
WO2009066351A1 (ja) * 2007-11-20 2009-05-28 Shin-Etsu Handotai Co., Ltd. 研磨ヘッド及び研磨装置
KR101619416B1 (ko) * 2008-03-25 2016-05-10 어플라이드 머티어리얼스, 인코포레이티드 개량된 캐리어 헤드 멤브레인
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
DE102009030298B4 (de) 2009-06-24 2012-07-12 Siltronic Ag Verfahren zur lokalen Politur einer Halbleiterscheibe
EP2457689B1 (de) * 2009-07-22 2013-06-26 JTEKT Corporation Schlupfverhinderungsverfahren und -vorrichtung für werkstücke
DE102009051007B4 (de) * 2009-10-28 2011-12-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
KR101196652B1 (ko) * 2011-05-31 2012-11-02 주식회사 케이씨텍 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드
US9393668B2 (en) * 2012-07-12 2016-07-19 Taiwan Semiconductor Manufacturing Company Limited Polishing head with alignment gear
KR200465446Y1 (ko) 2012-09-09 2013-02-19 전용준 캐리어 헤드 하우징과 보유 링 간의 결합 상태 점검 기능을 갖는 화학 기계적 연마 장치의 캐리어 헤드
KR101410358B1 (ko) 2013-02-25 2014-06-20 삼성전자주식회사 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드
SG10201606197XA (en) * 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US10617968B2 (en) * 2016-08-24 2020-04-14 Joshua Davis Building blocks
CN111512425A (zh) 2018-06-27 2020-08-07 应用材料公司 化学机械抛光的温度控制
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
KR20210126097A (ko) * 2019-02-14 2021-10-19 액서스 테크놀로지, 엘엘씨 기판 캐리어 헤드 및 프로세싱 시스템
TW202110575A (zh) 2019-05-29 2021-03-16 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
US11945073B2 (en) 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
CN110640627B (zh) * 2019-09-20 2021-04-20 大连理工大学 一种用于金相试样磨抛机的工件夹具
US11541506B2 (en) * 2019-09-27 2023-01-03 Systems On Silicon Manufacturing Company Pte Ltd Chemical mechanical polishing (CMP) polishing head with improved vacuum sealing
US11833637B2 (en) 2020-06-29 2023-12-05 Applied Materials, Inc. Control of steam generation for chemical mechanical polishing
WO2022005884A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Temperature and slurry flow rate control in cmp
WO2022006160A1 (en) 2020-06-30 2022-01-06 Applied Materials, Inc. Apparatus and method for cmp temperature control
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
KR20220116311A (ko) 2020-10-13 2022-08-22 어플라이드 머티어리얼스, 인코포레이티드 접촉 연장부 또는 조절가능한 정지부를 갖는 기판 연마 장치
US11623321B2 (en) 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
EP4301550A1 (de) * 2021-03-04 2024-01-10 Applied Materials, Inc. Polierträgerkopf mit steuerung der schwebenden kante
CN113649945B (zh) 2021-10-20 2022-04-15 杭州众硅电子科技有限公司 一种晶圆抛光装置

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141180A (en) 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4373991A (en) 1982-01-28 1983-02-15 Western Electric Company, Inc. Methods and apparatus for polishing a semiconductor wafer
FR2558095B1 (fr) 1984-03-14 1988-04-08 Ribard Pierre Perfectionnements apportes aux tetes de travail des machines de polissage et analogues
JPS6125768A (ja) 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
NL8503217A (nl) 1985-11-22 1987-06-16 Hoogovens Groep Bv Preparaathouder.
JPS63300858A (ja) 1987-05-29 1988-12-08 Hitachi Ltd 空気軸受式ワ−クホルダ
JPS63114870A (ja) 1987-10-22 1988-05-19 Nippon Telegr & Teleph Corp <Ntt> ウェハの真空吸着方法
US4918869A (en) 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JPH01216768A (ja) 1988-02-25 1989-08-30 Showa Denko Kk 半導体基板の研磨方法及びその装置
JPH079896B2 (ja) 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
JPH02224263A (ja) 1989-02-27 1990-09-06 Hitachi Ltd 半導体チップの冷却装置
JP2527232B2 (ja) 1989-03-16 1996-08-21 株式会社日立製作所 研磨装置
JPH0569310A (ja) 1991-04-23 1993-03-23 Mitsubishi Materials Corp ウエーハの鏡面研磨装置
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5498199A (en) 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
DE69333322T2 (de) 1992-09-24 2004-09-30 Ebara Corp. Poliergerät
JP3370112B2 (ja) 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5443416A (en) 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5643053A (en) 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5624299A (en) 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5423716A (en) 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US5449316A (en) 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423558A (en) 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
TW348279B (en) 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5643061A (en) 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
DE69717510T2 (de) 1996-01-24 2003-10-02 Lam Research Corp., Fremont Halbleiterscheiben-Polierkopf
JP3663728B2 (ja) 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
JP3663767B2 (ja) 1996-09-04 2005-06-22 信越半導体株式会社 薄板の鏡面研磨装置
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6056632A (en) 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5851140A (en) 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5957751A (en) 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6080050A (en) 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5961169A (en) 1998-07-27 1999-10-05 Strasbaugh Apparatus for sensing the presence of a wafer
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6050882A (en) 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate

Also Published As

Publication number Publication date
US6872122B2 (en) 2005-03-29
US6422927B1 (en) 2002-07-23
EP1029633A1 (de) 2000-08-23
US20020061720A1 (en) 2002-05-23
US20020151251A1 (en) 2002-10-17
US20040067719A1 (en) 2004-04-08
DE69932496T2 (de) 2007-02-01
EP1029633B1 (de) 2006-07-26
US6645044B2 (en) 2003-11-11

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