DE69931168D1 - Elastomer-gebundene teile fuer plasmaverfahren, deren herstellung und verwendung - Google Patents

Elastomer-gebundene teile fuer plasmaverfahren, deren herstellung und verwendung

Info

Publication number
DE69931168D1
DE69931168D1 DE69931168T DE69931168T DE69931168D1 DE 69931168 D1 DE69931168 D1 DE 69931168D1 DE 69931168 T DE69931168 T DE 69931168T DE 69931168 T DE69931168 T DE 69931168T DE 69931168 D1 DE69931168 D1 DE 69931168D1
Authority
DE
Germany
Prior art keywords
elastomer
manufacture
plasma process
linked parts
linked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69931168T
Other languages
English (en)
Other versions
DE69931168T2 (de
Inventor
John Lilleland
S Hubacek
S Kennedy
A Maraschin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE69931168D1 publication Critical patent/DE69931168D1/de
Application granted granted Critical
Publication of DE69931168T2 publication Critical patent/DE69931168T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
DE69931168T 1998-06-30 1999-06-30 Elastomer-gebundene teile fuer plasmaverfahren, deren herstellung und verwendung Expired - Lifetime DE69931168T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/107,471 US6073577A (en) 1998-06-30 1998-06-30 Electrode for plasma processes and method for manufacture and use thereof
US107471 1998-06-30
PCT/US1999/014790 WO2000000999A1 (en) 1998-06-30 1999-06-30 Elastomer bonded parts for plasma processes and method for manufacture and use thereof

Publications (2)

Publication Number Publication Date
DE69931168D1 true DE69931168D1 (de) 2006-06-08
DE69931168T2 DE69931168T2 (de) 2007-03-08

Family

ID=22316783

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69939606T Expired - Lifetime DE69939606D1 (de) 1998-06-30 1999-06-30 Verfahren zum Ersetzen einer Elektrodenanordnung für Plasmabehandlungsverfahren
DE69920453T Expired - Lifetime DE69920453T2 (de) 1998-06-30 1999-06-30 Elektrode für plasmabehandlungsverfahren und verfahren zur herstellung und anwendung derselben
DE69931168T Expired - Lifetime DE69931168T2 (de) 1998-06-30 1999-06-30 Elastomer-gebundene teile fuer plasmaverfahren, deren herstellung und verwendung

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DE69939606T Expired - Lifetime DE69939606D1 (de) 1998-06-30 1999-06-30 Verfahren zum Ersetzen einer Elektrodenanordnung für Plasmabehandlungsverfahren
DE69920453T Expired - Lifetime DE69920453T2 (de) 1998-06-30 1999-06-30 Elektrode für plasmabehandlungsverfahren und verfahren zur herstellung und anwendung derselben

Country Status (11)

Country Link
US (4) US6073577A (de)
EP (3) EP1475820B1 (de)
JP (3) JP3450828B2 (de)
KR (3) KR100426149B1 (de)
CN (2) CN100585794C (de)
AU (2) AU4963699A (de)
DE (3) DE69939606D1 (de)
ES (2) ES2264263T3 (de)
MY (1) MY120364A (de)
TW (1) TW423072B (de)
WO (2) WO2000000999A1 (de)

Families Citing this family (169)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6073577A (en) * 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
US6673198B1 (en) * 1999-12-22 2004-01-06 Lam Research Corporation Semiconductor processing equipment having improved process drift control
US7220937B2 (en) * 2000-03-17 2007-05-22 Applied Materials, Inc. Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination
US8048806B2 (en) 2000-03-17 2011-11-01 Applied Materials, Inc. Methods to avoid unstable plasma states during a process transition
JP4592916B2 (ja) * 2000-04-25 2010-12-08 東京エレクトロン株式会社 被処理体の載置装置
JP2002093777A (ja) 2000-07-11 2002-03-29 Nisshinbo Ind Inc ドライエッチング装置
WO2002009241A2 (en) * 2000-07-20 2002-01-31 Tokyo Electron Limited Electrode for plasma processing system
US6753498B2 (en) 2000-07-20 2004-06-22 Tokyo Electron Limited Automated electrode replacement apparatus for a plasma processing system
AU2001273538A1 (en) * 2000-07-20 2002-02-05 Tokyo Electon Limited Electrode apparatus and method for plasma processing
US6412437B1 (en) * 2000-08-18 2002-07-02 Micron Technology, Inc. Plasma enhanced chemical vapor deposition reactor and plasma enhanced chemical vapor deposition process
WO2002023610A1 (fr) * 2000-09-14 2002-03-21 Tokyo Electron Limited Dispositif d'usinage par plasma, plaque d'electrodes, porte-electrodes et bague protectrice du dispositif
US6391787B1 (en) * 2000-10-13 2002-05-21 Lam Research Corporation Stepped upper electrode for plasma processing uniformity
US6716302B2 (en) 2000-11-01 2004-04-06 Applied Materials Inc. Dielectric etch chamber with expanded process window
US20020127853A1 (en) * 2000-12-29 2002-09-12 Hubacek Jerome S. Electrode for plasma processes and method for manufacture and use thereof
US6818096B2 (en) * 2001-04-12 2004-11-16 Michael Barnes Plasma reactor electrode
US20030106644A1 (en) * 2001-07-19 2003-06-12 Sirkis Murray D. Electrode apparatus and method for plasma processing
JP5095058B2 (ja) * 2001-08-30 2012-12-12 株式会社日立製作所 エッチング処理装置における耐プラズマ性高分子材料からなる膜の厚さの決定方法
US6827815B2 (en) * 2002-01-15 2004-12-07 Applied Materials, Inc. Showerhead assembly for a processing chamber
JP3876167B2 (ja) * 2002-02-13 2007-01-31 川崎マイクロエレクトロニクス株式会社 洗浄方法および半導体装置の製造方法
US20030185729A1 (en) * 2002-03-29 2003-10-02 Ho Ko Electrode assembly for processing a semiconductor substrate and processing apparatus having the same
ATE472172T1 (de) * 2002-04-17 2010-07-15 Lam Res Corp Verfahren zur herstellung einer silizium- elektrode für plasma-reaktionskammer
US6846726B2 (en) * 2002-04-17 2005-01-25 Lam Research Corporation Silicon parts having reduced metallic impurity concentration for plasma reaction chambers
JP3868341B2 (ja) * 2002-04-22 2007-01-17 日清紡績株式会社 耐熱性に優れたプラズマエッチング電極及びそれを装着したドライエッチング装置
JP4847009B2 (ja) * 2002-05-23 2011-12-28 ラム リサーチ コーポレーション 半導体処理プラズマ反応器用の多部品電極および多部品電極の一部を取り換える方法
WO2004001817A1 (en) 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7543547B1 (en) 2002-07-31 2009-06-09 Lam Research Corporation Electrode assembly for plasma processing apparatus
US6838012B2 (en) * 2002-10-31 2005-01-04 Lam Research Corporation Methods for etching dielectric materials
FR2850790B1 (fr) * 2003-02-05 2005-04-08 Semco Engineering Sa Semelle de collage electrostatique avec electrode radiofrequence et moyens thermostatiques integres
US7976673B2 (en) * 2003-05-06 2011-07-12 Lam Research Corporation RF pulsing of a narrow gap capacitively coupled reactor
CN1310285C (zh) * 2003-05-12 2007-04-11 东京毅力科创株式会社 处理装置
US7452824B2 (en) * 2003-05-16 2008-11-18 Applied Materials, Inc. Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters
US7470626B2 (en) * 2003-05-16 2008-12-30 Applied Materials, Inc. Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
US7910013B2 (en) 2003-05-16 2011-03-22 Applied Materials, Inc. Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
US7901952B2 (en) * 2003-05-16 2011-03-08 Applied Materials, Inc. Plasma reactor control by translating desired values of M plasma parameters to values of N chamber parameters
US7795153B2 (en) * 2003-05-16 2010-09-14 Applied Materials, Inc. Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of selected chamber parameters
US7247218B2 (en) * 2003-05-16 2007-07-24 Applied Materials, Inc. Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power
US20050050708A1 (en) * 2003-09-04 2005-03-10 Taiwan Semiconductor Manufacturing Co., Ltd. Embedded fastener apparatus and method for preventing particle contamination
US7137444B2 (en) * 2003-09-08 2006-11-21 Pacific Rubber & Packing, Inc. Heat-transfer interface device between a source of heat and a heat-receiving object
US7267741B2 (en) * 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
US7244336B2 (en) * 2003-12-17 2007-07-17 Lam Research Corporation Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
US7645341B2 (en) * 2003-12-23 2010-01-12 Lam Research Corporation Showerhead electrode assembly for plasma processing apparatuses
US9032095B1 (en) 2004-01-06 2015-05-12 Juniper Networks, Inc. Routing device having multiple logical routers
US20060054280A1 (en) * 2004-02-23 2006-03-16 Jang Geun-Ha Apparatus of manufacturing display substrate and showerhead assembly equipped therein
US20050230350A1 (en) * 2004-02-26 2005-10-20 Applied Materials, Inc. In-situ dry clean chamber for front end of line fabrication
US8083853B2 (en) 2004-05-12 2011-12-27 Applied Materials, Inc. Plasma uniformity control by gas diffuser hole design
US8317968B2 (en) * 2004-04-30 2012-11-27 Lam Research Corporation Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
US7712434B2 (en) * 2004-04-30 2010-05-11 Lam Research Corporation Apparatus including showerhead electrode and heater for plasma processing
US8074599B2 (en) 2004-05-12 2011-12-13 Applied Materials, Inc. Plasma uniformity control by gas diffuser curvature
US8328939B2 (en) 2004-05-12 2012-12-11 Applied Materials, Inc. Diffuser plate with slit valve compensation
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
WO2006002371A2 (en) 2004-06-24 2006-01-05 Malden Mills Industries, Inc. Engineered fabric articles
US20120260422A1 (en) 2005-06-23 2012-10-18 Mmi-Ipco, Llc Thermal blankets
US7429410B2 (en) * 2004-09-20 2008-09-30 Applied Materials, Inc. Diffuser gravity support
US7728823B2 (en) * 2004-09-24 2010-06-01 Apple Inc. System and method for processing raw data of track pad device
US20060108069A1 (en) * 2004-11-19 2006-05-25 Samsung Electronics Co., Ltd. Plasma reaction chamber and captive silicon electrode plate for processing semiconductor wafers
US7247579B2 (en) * 2004-12-23 2007-07-24 Lam Research Corporation Cleaning methods for silicon electrode assembly surface contamination removal
US7442114B2 (en) * 2004-12-23 2008-10-28 Lam Research Corporation Methods for silicon electrode assembly etch rate and etch uniformity recovery
US7507670B2 (en) * 2004-12-23 2009-03-24 Lam Research Corporation Silicon electrode assembly surface decontamination by acidic solution
US7480974B2 (en) * 2005-02-15 2009-01-27 Lam Research Corporation Methods of making gas distribution members for plasma processing apparatuses
US7430986B2 (en) * 2005-03-18 2008-10-07 Lam Research Corporation Plasma confinement ring assemblies having reduced polymer deposition characteristics
KR100708321B1 (ko) 2005-04-29 2007-04-17 주식회사 티씨케이 플라즈마 식각장치의 캐소드 전극 결합구조
US7428772B2 (en) * 2005-05-19 2008-09-30 Mmi-Ipco, Llc Engineered fabric articles
US20060272941A1 (en) * 2005-06-06 2006-12-07 Simpson Wayne R Large area elastomer bonded sputtering target and method for manufacturing
US7713379B2 (en) * 2005-06-20 2010-05-11 Lam Research Corporation Plasma confinement rings including RF absorbing material for reducing polymer deposition
US7431788B2 (en) * 2005-07-19 2008-10-07 Lam Research Corporation Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
US7588668B2 (en) * 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070056845A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Multiple zone sputtering target created through conductive and insulation bonding
US8679252B2 (en) * 2005-09-23 2014-03-25 Lam Research Corporation Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof
US7662253B2 (en) * 2005-09-27 2010-02-16 Lam Research Corporation Apparatus for the removal of a metal oxide from a substrate and methods therefor
EP1959480A4 (de) * 2005-11-25 2010-04-21 Sharp Kk Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren
US8789493B2 (en) * 2006-02-13 2014-07-29 Lam Research Corporation Sealed elastomer bonded Si electrodes and the like for reduced particle contamination in dielectric etch
JP4615464B2 (ja) * 2006-03-16 2011-01-19 東京エレクトロン株式会社 プラズマ処理装置用電極アッセンブリ及びプラズマ処理装置
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
KR101253333B1 (ko) * 2006-06-14 2013-04-10 주성엔지니어링(주) 변형 방지용 보강재를 가지는 플라즈마 발생용 전극 및이를 이용하는 기판처리장치
US7476289B2 (en) * 2006-06-29 2009-01-13 Applied Materials, Inc. Vacuum elastomer bonding apparatus and method
JP2008016727A (ja) * 2006-07-07 2008-01-24 Tokyo Electron Ltd 伝熱構造体及び基板処理装置
US9275887B2 (en) * 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
JP5183058B2 (ja) * 2006-07-20 2013-04-17 アプライド マテリアルズ インコーポレイテッド 急速温度勾配コントロールによる基板処理
US7718029B2 (en) * 2006-08-01 2010-05-18 Applied Materials, Inc. Self-passivating plasma resistant material for joining chamber components
US20080121521A1 (en) * 2006-08-15 2008-05-29 Chunghwa Picture Tubes, Ltd. Plasma sputtering target assembly and manufacturing method therefor
US20140021044A1 (en) * 2006-10-02 2014-01-23 Thermal Conductive Bonding, Inc. Elastomer Bonded Rotary Sputtering Target
US7482550B2 (en) * 2006-10-16 2009-01-27 Lam Research Corporation Quartz guard ring
US7875824B2 (en) * 2006-10-16 2011-01-25 Lam Research Corporation Quartz guard ring centering features
US7854820B2 (en) * 2006-10-16 2010-12-21 Lam Research Corporation Upper electrode backing member with particle reducing features
US20080087641A1 (en) * 2006-10-16 2008-04-17 Lam Research Corporation Components for a plasma processing apparatus
US8702866B2 (en) * 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
US7758718B1 (en) 2006-12-29 2010-07-20 Lam Research Corporation Reduced electric field arrangement for managing plasma confinement
JP5030604B2 (ja) * 2007-01-29 2012-09-19 セイコーインスツル株式会社 ウェハ外観検査装置
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
US7767028B2 (en) * 2007-03-14 2010-08-03 Lam Research Corporation Cleaning hardware kit for composite showerhead electrode assemblies for plasma processing apparatuses
US8375890B2 (en) 2007-03-19 2013-02-19 Micron Technology, Inc. Apparatus and methods for capacitively coupled plasma vapor processing of semiconductor wafers
KR101277108B1 (ko) 2007-03-30 2013-06-20 주식회사 원익아이피에스 비정질탄소막 증착공정에서의 챔버 세정 장치 및 이를이용한 챔버 세정 방법
US8221552B2 (en) * 2007-03-30 2012-07-17 Lam Research Corporation Cleaning of bonded silicon electrodes
US7578889B2 (en) * 2007-03-30 2009-08-25 Lam Research Corporation Methodology for cleaning of surface metal contamination from electrode assemblies
US8216418B2 (en) * 2007-06-13 2012-07-10 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
KR100920417B1 (ko) 2007-08-01 2009-10-14 주식회사 에이디피엔지니어링 센싱유닛 및 이를 가지는 기판처리장치
KR100813106B1 (ko) * 2007-09-19 2008-03-17 다이섹(주) 가압접합된 캐소드 및 그 제조방법
CN101809717B (zh) 2007-09-25 2012-10-10 朗姆研究公司 用于等离子处理设备的喷头电极总成的温度控制模块
US20090084317A1 (en) * 2007-09-28 2009-04-02 Applied Materials, Inc. Atomic layer deposition chamber and components
US8152954B2 (en) 2007-10-12 2012-04-10 Lam Research Corporation Showerhead electrode assemblies and plasma processing chambers incorporating the same
US8187414B2 (en) * 2007-10-12 2012-05-29 Lam Research Corporation Anchoring inserts, electrode assemblies, and plasma processing chambers
US8622021B2 (en) * 2007-10-31 2014-01-07 Lam Research Corporation High lifetime consumable silicon nitride-silicon dioxide plasma processing components
SG187386A1 (en) * 2007-12-19 2013-02-28 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus
WO2009078923A2 (en) * 2007-12-19 2009-06-25 Lam Research Corporation Film adhesive for semiconductor vacuum processing apparatus
KR101625516B1 (ko) * 2008-02-08 2016-05-30 램 리써치 코포레이션 플라즈마 프로세싱 장치 및 플라즈마 프로세싱 장치에서 반도체 기판을 처리하는 방법
US8187413B2 (en) * 2008-03-18 2012-05-29 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket
RU2010143546A (ru) * 2008-03-26 2012-05-10 ДжиТи СОЛАР, ИНКОРПОРЕЙТЕД (US) Реакторная система с золотым покрытием для осаждения поликристаллического кремния и способ
KR101623458B1 (ko) * 2008-03-26 2016-05-23 지티에이티 코포레이션 화학 증착 반응기의 가스 분배 시스템 및 방법
KR100978115B1 (ko) * 2008-04-10 2010-08-26 티씨비코리아(주) 플라즈마 챔버용 캐소드 전극의 제조방법 및 플라즈마 챔버용 캐소드 전극
US8679288B2 (en) 2008-06-09 2014-03-25 Lam Research Corporation Showerhead electrode assemblies for plasma processing apparatuses
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
KR101588482B1 (ko) * 2008-07-07 2016-01-25 램 리써치 코포레이션 플라즈마 처리 챔버에 사용하기 위한 진공 갭을 포함하는 플라즈마 대향 프로브 장치
US8206506B2 (en) 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
US8449679B2 (en) * 2008-08-15 2013-05-28 Lam Research Corporation Temperature controlled hot edge ring assembly
US8147648B2 (en) 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
US9017499B2 (en) * 2008-12-05 2015-04-28 The Boeing Company Bonded patches with bond line control
US8795455B2 (en) * 2008-12-05 2014-08-05 The Boeing Company Bonded patches with bond line control
US8734604B2 (en) * 2008-12-05 2014-05-27 The Boeing Company Bond line control process
US10022922B2 (en) 2008-12-05 2018-07-17 The Boeing Company Bonded patches with bond line control
US20100140222A1 (en) * 2008-12-10 2010-06-10 Sun Jennifer Y Filled polymer composition for etch chamber component
KR101698615B1 (ko) * 2008-12-10 2017-01-20 램 리써치 코포레이션 실리콘 전극 연마를 용이하게 하는 플래튼 및 어댑터 어셈블리
TWI511619B (zh) * 2009-07-03 2015-12-01 Advanced Micro Fab Equip Inc Electrode elements for plasma processing, internal components and methods for their manufacture and separation
SG170717A1 (en) * 2009-11-02 2011-05-30 Lam Res Corp Hot edge ring with sloped upper surface
US8369345B1 (en) 2009-11-13 2013-02-05 Juniper Networks, Inc. Multi-router system having shared network interfaces
US20130196109A1 (en) 2009-11-24 2013-08-01 Mmi-Ipco, Llc Insulated Composite Fabric
CN102652350B (zh) * 2009-12-18 2015-11-25 朗姆研究公司 从用于等离子体室内的上部电极清除金属污染物的方法
JP5544907B2 (ja) * 2010-02-04 2014-07-09 東京エレクトロン株式会社 ガスシャワー用の構造体及び基板処理装置
US8249900B2 (en) * 2010-02-10 2012-08-21 Morgan Stanley & Co. Llc System and method for termination of pension plan through mutual annuitization
JP2011181677A (ja) * 2010-03-01 2011-09-15 Tokyo Electron Ltd フォーカスリング及び基板載置システム
US8597462B2 (en) * 2010-05-21 2013-12-03 Lam Research Corporation Movable chamber liner plasma confinement screen combination for plasma processing apparatuses
JP2011256946A (ja) * 2010-06-09 2011-12-22 Tohoku Univ 減圧処理装置
US9728429B2 (en) * 2010-07-27 2017-08-08 Lam Research Corporation Parasitic plasma prevention in plasma processing chambers
US8444456B2 (en) * 2010-11-02 2013-05-21 Lam Research Corporation Electrode securing platens and electrode polishing assemblies incorporating the same
US8468709B2 (en) 2010-11-04 2013-06-25 The Boeing Company Quick composite repair template tool and method
US20120244684A1 (en) * 2011-03-24 2012-09-27 Kunihiko Suzuki Film-forming apparatus and method
US9129795B2 (en) 2011-04-11 2015-09-08 Quadrant Epp Ag Process for plasma treatment employing ceramic-filled polyamideimide composite parts
EP2525387A1 (de) * 2011-05-17 2012-11-21 Quadrant Epp Ag Verfahren zur Plasmabehandlung mit keramikgefüllten Polyamid-Imid-Verbundstoffteilen
KR20130115330A (ko) * 2011-05-24 2013-10-21 한국생산기술연구원 다층 샤워헤드 및 그 밀봉방법
US9245719B2 (en) 2011-07-20 2016-01-26 Lam Research Corporation Dual phase cleaning chambers and assemblies comprising the same
CN104067691B (zh) 2011-08-30 2017-04-19 沃特洛电气制造公司 高清晰度加热器和操作方法
TWI661746B (zh) * 2011-10-05 2019-06-01 應用材料股份有限公司 電漿處理設備及其蓋組件(一)
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9396912B2 (en) 2011-10-31 2016-07-19 Lam Research Corporation Methods for mixed acid cleaning of showerhead electrodes
US8545639B2 (en) 2011-10-31 2013-10-01 Lam Research Corporation Method of cleaning aluminum plasma chamber parts
JP2013254901A (ja) 2012-06-08 2013-12-19 Toshiba Corp シール材およびエッチング装置
KR20150053988A (ko) 2012-09-10 2015-05-19 엠엠아이-아이피씨오, 엘엘씨 절연 복합 패브릭
US8975817B2 (en) * 2012-10-17 2015-03-10 Lam Research Corporation Pressure controlled heat pipe temperature control plate
US8883029B2 (en) 2013-02-13 2014-11-11 Lam Research Corporation Method of making a gas distribution member for a plasma processing chamber
US20140356985A1 (en) 2013-06-03 2014-12-04 Lam Research Corporation Temperature controlled substrate support assembly
US9583377B2 (en) 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP6549135B2 (ja) * 2014-01-22 2019-07-24 モレキュラー デバイシーズ, エルエルシー 電気生理学のための置換可能な接地電極、電極再活性化装置、および関連する方法およびシステム
KR102278074B1 (ko) * 2014-06-30 2021-07-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
EP3213598B1 (de) 2014-10-31 2023-07-05 Watlow Electric Manufacturing Company Thermische dynamische reaktionsmesssysteme für heizgeräte
US9826574B2 (en) 2015-10-28 2017-11-21 Watlow Electric Manufacturing Company Integrated heater and sensor system
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
KR102652258B1 (ko) * 2016-07-12 2024-03-28 에이비엠 주식회사 금속부품 및 그 제조 방법 및 금속부품을 구비한 공정챔버
WO2018121896A1 (en) * 2016-12-27 2018-07-05 Evatec Ag Rf capacitive coupled dual frequency etch reactor
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
TWI756475B (zh) * 2017-10-06 2022-03-01 日商東京威力科創股份有限公司 抑制粒子產生之方法及真空裝置
US11094514B2 (en) * 2018-12-21 2021-08-17 Oumeida Applied Materials Technology Co., Ltd. Rotatable sputtering target
KR20210044568A (ko) 2019-10-15 2021-04-23 삼성전자주식회사 식각 장치
KR20210152072A (ko) * 2020-06-05 2021-12-15 삼성디스플레이 주식회사 기상 젯 증착 장치 및 기상 젯 노즐 유닛의 제조 방법
CN114188206B (zh) * 2020-09-15 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其上电极组件的调节方法
KR102242198B1 (ko) * 2021-01-12 2021-04-20 김기재 반도체 에칭 공정 장비에 사용되는 실리콘 전극의 본딩 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595484A (en) * 1985-12-02 1986-06-17 International Business Machines Corporation Reactive ion etching apparatus
US4960488A (en) * 1986-12-19 1990-10-02 Applied Materials, Inc. Reactor chamber self-cleaning process
US4792378A (en) * 1987-12-15 1988-12-20 Texas Instruments Incorporated Gas dispersion disk for use in plasma enhanced chemical vapor deposition reactor
US4820371A (en) * 1987-12-15 1989-04-11 Texas Instruments Incorporated Apertured ring for exhausting plasma reactor gases
TW221318B (de) * 1990-07-31 1994-02-21 Tokyo Electron Co Ltd
US5074456A (en) * 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
US6063233A (en) * 1991-06-27 2000-05-16 Applied Materials, Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US5636098A (en) * 1994-01-06 1997-06-03 Applied Materials, Inc. Barrier seal for electrostatic chuck
JP3290036B2 (ja) * 1994-10-18 2002-06-10 菱電セミコンダクタシステムエンジニアリング株式会社 ドライエッチング装置およびドライエッチング方法
JPH08225947A (ja) * 1994-12-16 1996-09-03 Canon Inc プラズマ処理方法及びプラズマ処理装置
KR100214267B1 (ko) * 1995-04-07 1999-08-02 김영환 반도체 소자 제조방법
US5569356A (en) * 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
US5744199A (en) * 1996-10-31 1998-04-28 Dow Corning Corporation Method of sealing openings in structural components of buildings for controlling the passage of smoke
US6073577A (en) * 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof

Also Published As

Publication number Publication date
KR20010053289A (ko) 2001-06-25
JP3408245B2 (ja) 2003-05-19
CN100585794C (zh) 2010-01-27
JP2002519862A (ja) 2002-07-02
KR20010071688A (ko) 2001-07-31
CN1312954A (zh) 2001-09-12
EP1105917A1 (de) 2001-06-13
EP1475820A1 (de) 2004-11-10
EP1092228A2 (de) 2001-04-18
KR100426149B1 (ko) 2004-04-06
DE69920453T2 (de) 2005-11-24
DE69920453D1 (de) 2004-10-28
KR100329974B1 (ko) 2002-03-27
US6194322B1 (en) 2001-02-27
MY120364A (en) 2005-10-31
AU4856299A (en) 2000-01-17
US6376385B2 (en) 2002-04-23
JP2003133296A (ja) 2003-05-09
US20010031557A1 (en) 2001-10-18
US6073577A (en) 2000-06-13
WO2000000998A3 (en) 2000-08-10
WO2000000999A9 (en) 2000-10-12
ES2264263T3 (es) 2006-12-16
TW423072B (en) 2001-02-21
JP2002519863A (ja) 2002-07-02
CN1574211A (zh) 2005-02-02
US6148765A (en) 2000-11-21
CN1167103C (zh) 2004-09-15
EP1475820B1 (de) 2008-09-17
JP3450828B2 (ja) 2003-09-29
EP1092228B1 (de) 2004-09-22
KR20030070142A (ko) 2003-08-27
DE69931168T2 (de) 2007-03-08
AU4963699A (en) 2000-01-17
DE69939606D1 (de) 2008-10-30
ES2229731T3 (es) 2005-04-16
EP1105917B1 (de) 2006-05-03
WO2000000999A1 (en) 2000-01-06
EP1105917A4 (de) 2003-05-21
KR100417846B1 (ko) 2004-02-05
WO2000000998A2 (en) 2000-01-06
JP4477292B2 (ja) 2010-06-09

Similar Documents

Publication Publication Date Title
DE69931168D1 (de) Elastomer-gebundene teile fuer plasmaverfahren, deren herstellung und verwendung
AU5490199A (en) Process for the purification of 1,3-propanediol
DE69921099D1 (de) Wärmeausdehnbare mikrokapseln, verfahren zur herstellung und verwendung derselben
DE69911091D1 (de) Entladungslampe und Verfahren zu deren Herstellung
AU3655899A (en) Modified immunoglobulin molecules and methods for use thereof
BR0008053B1 (pt) processo e aparelho para fabricaÇço de artigos absorventes descartÁveis.
ID28146A (id) Benzoilsikloheksanadion, proses pembuatan dan penggunaannya sebagai herbisida dan zat pengatur tumbuh
DE69903464T2 (de) Haftverschlüsse, deren herstellung und sie aufweisenden produkten
AU3531299A (en) Novel 4-phenylpiperidines for the treatment of pruritic dermatoses
DE69910762D1 (de) Antipicornavirale verbindungen, deren herstellung und verwendung
ATE302604T1 (de) Thienylazolylalkoxyethanamine, deren herstellung und deren verwendung als medikamente
EP1071716A4 (de) Verfahren zur konzentrierung eines proteins mit krankheitsbedingter konformation
DE60235547D1 (de) En daraus, deren herstellung und verwendung
DE69909345D1 (de) Phthalocyaninverbindung, deren Herstellungsverfahren und Verwendung
DE69904731T2 (de) Feinzerkleinerer und feinzerkleinerungsverfahren
DE59904632D1 (de) Epithilonderivate, verfahren zu deren herstellung und deren verwendung
DE59800590D1 (de) Polymere organosiliciumverbindungen, deren herstellung und verwendung
ATE251170T1 (de) Titanverbindungen, deren herstellung und verwendung
AU2398801A (en) Virus-free plasma protein compositions treated with porous membrane and process for producing the same
ID26243A (id) Proses penyiapan butanediol, butirolakton dan tetrahidrofuran
DE69841905D1 (de) Photovernetzbare folie,daraus hergestellte formmassen und verfahren zu deren herstellung
DE19882553T1 (de) Absorbierende Zusammensetzung, Verfahren zu deren Herstellung und absorbierende Produkte
AU3814599A (en) Use of erythropoietin for the treatment of haemochromatoses
DE59800550D1 (de) Schmierfettzusammensetzung, Verfahren zur Herstellung derselben sowie deren Verwendung
ATE321772T1 (de) Echinocandinderivate, deren herstellung und deren verwendung zur bekämpfung von pilzen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition